M362342 _ — 五、新型說明： .【新型所屬之技術領域】 本創作係提供一種發光二極體燈具，尤指一種具 有高散熱效率的發光二極體路燈結構。 【先前技術】 由於發光二極體（LED)具有高亮度、省電及壽 命長的優點，因而，包含封裝發光二極體（LED)的 發光二極體燈具已廣泛被使用在顯示或是照明用的 產BO上。就照明用途而言，設置在街道兩旁用以提供 夜間照明的水銀路燈，亦有漸漸被發光二極體燈具取 代的趨勢。 發光一極體在運作時會產生高熱，此熱量必須移 除才能確保發光二極體燈具的高照明功率與使用壽 命，因而’高功率發光二極體燈源一般都設有散熱裝 置用以將燈具内部產生的熱量散發至外界環境。習用 發光一極體燈源的散熱裝置一般包含散熱器，該散熱 器透過金屬座體連接至發光二極體所安裝的電路板 或是基板上’使得發光二極體產生的高熱可經由金屬 座體傳遞至散熱器，再由散熱器散發至外界環境。然 而，為了避免散熱裝置的體積太大而不利該發光二極 體燈具的安裝，習用散熱裝置所配置的散熱器數量通 常難以提升，此外，金屬座體與散熱器之間的傳熱路 M362342 徑不完善，造成散熱效果尚無法令人滿意。 . 【新型内容】 本創作者有鑑於此，遂悉心加以研究設計，於今 有本創作產生。緣此，本創作之主要目的在提供一種 發光一極體燈具，該發光二極體燈具可構成路燈用以 提供照明，同時該發光二極體燈具有高散熱效率及體 積小的散熱結構。 瞻 依據本創作構成的發光二極體燈具，係包含一燈 殼、一發光二極體光源組件、一散熱本體、複數第一 熱管及一散熱器；該發光二極體光源組件收納在該燈 殼内部且包含一金屬基板，該基板具有相對的一第一 面及一第二面，該第一面提供至少一發光二極體結 合，該散熱本體收納在該燈殼内部且具有一結合面， 該結合面提供該基板之第二面結合，該散熱本體之内 ® 部具有複數相互隔開的第一收納孔，各第一收納孔具 有一縱向軸線且鄰近該結合面，且各第一收納孔之面 白"亥散熱本體之結合面的孔壁部分與該基板之第二 面之間隙係小於〇· 5麵；各第一熱管具有套入該散熱 本體之第-收納？匕的一第一部分及位該散熱本體外 側的一第二部份；該散熱器係裝在該數第一熱管之第 一部份上。 在一實施例中，該散熱本體之結合面上設有與該 M362342 ； 第一收納孔連通的開口，使得第一收納孔之面向該散 、 熱本體之結合面的孔壁部分與該基板之第二面之間 隙為〇，且各第一熱管第一部分之外表面之局部係露 在該散熱本體之開口處而與該基板接觸。 在一較佳實施例中，該散熱本體之内部進一步具 有複數相互隔開且平行的第二收納孔，各第二收納孔 之延伸方向係與該縱向轴線概呈垂直且延伸貫穿該 參 散熱本體之二侧面；又該發光二極體燈具進一步包含 複數第二熱管，各第二熱管具有套入該散熱本體之第 二收納孔的一第一部分及位該散熱本體外侧的一第 二部份，該第二部份上裝設一散熱器。又該第一收納 孔與第二收納孔之斷面最好係個別概呈圓形。 在一實施例中，該發光二極體燈具進一步包含一 電源供應器及一散熱裝置，該散熱裝置包含一散熱本 • 體及穿過該散熱本體之複數熱管，該散熱本體具有一 結合面，各熱管具有位在該散熱本體外側的至少一端 部，該端部上裝設一散熱器；該電源供應器具有一基 板及複數電子組件，該數電子組件係裝設在該散熱本 體之結合面。 關於本創作之其他目的、優點及特徵，將可由以 ' 下較佳實施例的詳細說明並參照所附圖式來了解。 【實施方式】 M362342 \ 本創作可有多種不同的結構實施例。現將僅為例 、 子但非用以限制的具體實施例，並參照所附圖式就本 創作之較佳結構内容說明如下： 參閱第一圖及第二圖，顯示依據本創作第一實施 例構成的發光二極體燈具6 ;發光二極體燈具6包含 一燈殼5、收納在燈殼5内的一發光二極體光源組件 2及一散熱組件1。本實施例中，發光二極體燈具6 • 係安裝在電線桿4上而構成一提供夜間照明的路燈。 在本實施例中，該燈殼5係由一上蓋51與一包 含二蓋板的下蓋52相對結合而成，該上蓋51與下蓋 52上係個別設有複數可散熱的孔53，且該燈殼5的 一端具有一電線桿安裝孔54，該安裝孔54内部具有 一安裝板55用以提供電線桿4的上端41結合定位， 又在該下蓋52上具有一透光開口 56。 • 該發光二極體光源組件2包含至少一基板21及 複數發光二極體22 ;在本實施例中，該發光二極體 光源組件2包含相併接在一起的複數基板21，各基 板21係由金屬材料製成且具有相對的一第一面211 及一第二面212,該第一面211上安裝一電路板23 (見第三圖），而該複數發光二極體22係設在該數 基板21上且與各電路板23形成電性連接；各基板 21上設有複數延伸貫穿該第一面211與第二面212 M362342 的穿孔213 ;另在該發光二極體光源組件2之外部以 一透光的玻璃罩24及一框體25覆蓋，該透光的玻璃 罩24對應地位在該下蓋52的透光開口 56上（見第 五圖），使得發光二極體22發射的燈光可經由該開 口 56向下照射* 參閱第二圖、第五圖及第七圖，該散熱組件1包 含一散熱本體11、複數第一熱管12、複數第二熱管 15及複數散熱器13;在本實施例中，該散熱本體π 係由例如銅、鋁等可導熱之金屬材料製成的長方塊 體’該散熱本體11具有可與該基板21之第二面212 相互結合的一平坦結合面Π2及位在該結合面112左 右兩端的二侧面116、117，該結合面Π2上設有複 數結合孔115，該基板21係利用複數連接件3穿入 s亥基板21之穿孔213並延伸入該數結合孔us中而 結合在該散熱本體11之結合面112上；該散熱本體 U之内部具有複數相互隔開且平行的第一收納孔 1 11，各第一收納孔111具有一縱向軸線，在本實施 例中，各第一收納孔Hi之斷面概呈圓形且鄰近該結 合面112 ;參閱第五圖，各第一收納孔U1外周圍之 面向該散熱本體11之結合面112的部分與該基板21 之第一面212之間隙（d)小於〇. 5 raro，亦即在〇. 5 咖至〇 (即相連通）之範圍。 M362342 /亥政熱本體11之内部進一步具有複數相互隔開 且平行的第二收納孔118，各第二收納孔118之延伸 方向係與該縱向軸線概呈垂直且延伸貫穿該散熱本 體11之二侧面116、in，在本實施例中，各第二收 納孔118之斷面概呈圓形。 本實施例令，各第一熱管12具有一外表面124、 收納在散熱本體第一收納孔lu内的一第一部分123 及位在散熱本體11外側的一第二部份121 (見第五 圖及第六圖）；當各第一熱管12收納在第一收納孔 内後，第一部分123之外表面124之面向散熱本 體11之結合面112的部份係鄰近基板21之第二面 212;而各第二熱管15具有收納在散熱本體第二收納 孔118内的中間部分151及位在散熱本體n外側的 一第一端152及一第二端153 ;本實施例中，各第一 熱管12與第二熱管15係由例如鋼之金屬材料製成的 圓管且内部充填例如超導液的傳熱介質（未圖示）。 各散熱器13係由例如銅材和鋁材製成的複數鰭 片131相隔開地連結組成；在本實施例中，係在該數 第一熱管12的第二部份121以及該數第二熱管π的 第一端152及第二端153上個別裝設一散熱器13， 各散熱器13係可利用空氣對流來散發熱量；又各散 熱器13之一端面上係設有二導熱塊17，該二導熱塊 M362342 17之間以連接桿16連結，使得傳遞至各散熱器ι3 之熱量能更快速的擴散至整個散熱器，在本實施例 中，各散熱器13之導熱塊17上設有具穿孔171的連 接板172用以和燈殼5結合。 在本實施例中，該發光二極體燈具6進一步包含 一電源供應器8及一散熱裴置7,散熱裝置7包含一 月欠熱本體71、穿過散熱本體71之複數熱管π及二 散熱器73 ;散熱本體71具有一結合面711，各熱管 72具有位在散熱本體71外侧的二端部721，而各散 熱器73係由複數鰭片731連結組成且裝設在熱管” 的一端部721 ;電源供應器8具有一基板81及複數 電子組件82，該基板81係利用支桿83結合在該散 熱本體71之結合面711上，且該基板w上具有電子 線路（未圖示），該數電子組件82係直接裝在該散 熱本體71之結合面711上，藉以提高散熱效果。 參閱第八圖及第九圖，顯示依據本創作第二實施 例構成之發光二極體燈具6 (該實施例中，關於和第 實細*例說明者相同或同等之構件，將附上同一標號 並省略細部結構說明）；該第二實施例與第一實施例 之差異在於該散熱本體11之結合面112上設有與該 第一收納孔111連通的開口 114，使得第一收納孔m 之面向該散熱本體11之結合面112的孔壁部分與該 M362342 基板21之第二面212之間隙（d)為0(即相連通）， \ 且使得插入該第一收納孔111内之各第一熱管第一 部分123之外表面124之局部係露在該散熱本體11 之開口 114處而與該基板21接觸，使得發光二極體 所產生的熱量能迅速地透過該第一熱管12及第一熱 管内部的傳熱介質帶離該基板21，接著再經由該熱 管12二端之二組散熱鰭片13與空氣自然對流，達成 _ 吸熱快、熱阻小及去熱迅速之效果。 依據本創作構成的發光二極體燈具6，其中，該 散熱組件1之散熱本體11提供該發光二極體基板21 便利地組裝，且該散熱本體11與第一熱管12及第二 熱管15具有寬大之接觸區域而能有效地將該發光二 極體22產生之熱量傳遞到熱管12、15,尤其，該第 一熱管12之外表面之局部係與該基板21相鄰近或接 • 觸，使得發光二極體所產生的熱量能迅速地透過該等 熱管帶離該基板21，使得發光二極體具有高散熱效 率，故本創作已能達成預期的設計目的與實施效果。 在前述說明書中，本創作僅是就特定實施例做描 述，而依本創作的設計特徵係可做多種變化或修改是 可了解的。是以，對於熟悉此項技藝人士可作之明顯 替換與修改，仍將併入於本創作所主張的專利範圍之 M362342 【圖式簡單說明】 改圖係依據本創作第一實施例構成的發光二極體 &具之立體圖’並顯示該燈具組裝在—電線桿上： 第一圓係第一圖之燈具的元件分解略圖； 第三圖係顯示第二圖之一基板上設有電路板與複數 發光二極體的立體圖； 第四圓係第二圖之燈具組合後的上視圖； > 第五圊係沿第四圖之5_5線所取的剖視圖； 第六圚係沿第四圖之6_6線所取的剖視圖； 第七圖係第二圖之散熱組件與發光二極體光源組件 的元件分解圖； 第八圖係依據本創作第二實施例構成的發光二極體 燈具之散熱組件與發光二極體光源組件的元件分解 圖：及M362342 _ — V. New description: . [New technical field] This creation provides a light-emitting diode lamp, especially a light-emitting diode street lamp structure with high heat dissipation efficiency. [Prior Art] Since the light-emitting diode (LED) has the advantages of high brightness, power saving, and long life, the light-emitting diode lamp including the packaged light-emitting diode (LED) has been widely used for display or illumination. Used on the production of BO. For lighting purposes, mercury street lights, which are placed on both sides of the street to provide nighttime lighting, are also gradually being replaced by light-emitting diode lamps. The light-emitting diode generates high heat during operation, and this heat must be removed to ensure the high illumination power and service life of the light-emitting diode lamp. Therefore, the high-power light-emitting diode light source is generally provided with a heat sink for The heat generated inside the luminaire is radiated to the outside environment. The heat sink of the conventional light source of the light source generally comprises a heat sink which is connected to the circuit board or the substrate mounted on the light emitting diode through the metal seat body, so that the high heat generated by the light emitting diode can pass through the metal seat. The body is transferred to the radiator and then radiated to the outside environment by the radiator. However, in order to avoid the bulk of the heat sink being too large to facilitate the installation of the light-emitting diode lamp, the number of heat sinks configured by the conventional heat sink is generally difficult to increase, and the heat transfer path M362342 between the metal seat and the heat sink is Imperfect, resulting in unsatisfactory heat dissipation. [New Content] In view of this, the creators have carefully studied and designed the original creations. Therefore, the main purpose of the present invention is to provide a light-emitting diode lamp which can constitute a street lamp for providing illumination, and the light-emitting diode lamp has a heat dissipation structure with high heat dissipation efficiency and small volume. The light-emitting diode lamp according to the present invention comprises a lamp housing, a light-emitting diode light source assembly, a heat-dissipating body, a plurality of first heat pipes and a heat sink; the light-emitting diode light source assembly is received in the light The inside of the casing includes a metal substrate, the substrate has a first surface and a second surface, the first surface provides at least one light emitting diode assembly, and the heat dissipation body is received inside the lamp housing and has a bonding surface The bonding surface provides a second surface of the substrate, and the inner portion of the heat dissipation body has a plurality of first receiving holes spaced apart from each other, each of the first receiving holes has a longitudinal axis adjacent to the bonding surface, and each first The gap between the hole wall portion of the joint surface of the accommodating hole and the second surface of the substrate is smaller than the 〇·5 surface; each of the first heat pipes has the first storage of the heat dissipation body. a first portion of the crucible and a second portion of the outer side of the heat dissipating body; the heat sink is mounted on the first portion of the first plurality of heat pipes. In an embodiment, the joint surface of the heat dissipating body is provided with an opening communicating with the M362342; the first receiving hole, such that the wall portion of the first receiving hole facing the bonding surface of the heat and the heat body and the substrate The gap of the second surface is 〇, and a part of the outer surface of the first portion of each of the first heat pipes is exposed at the opening of the heat dissipation body to be in contact with the substrate. In a preferred embodiment, the interior of the heat dissipation body further has a plurality of second receiving holes spaced apart from each other and parallel, and each of the second receiving holes extends in a direction perpendicular to the longitudinal axis and extends through the heat dissipation portion. The light emitting diode lamp further includes a plurality of second heat pipes, each of the second heat pipes having a first portion that fits into the second receiving hole of the heat dissipating body and a second portion that is outside the heat dissipating body A heat sink is mounted on the second portion. Further, the cross sections of the first receiving hole and the second receiving hole are preferably substantially circular in shape. In one embodiment, the LED device further includes a power supply and a heat dissipating device, the heat dissipating device includes a heat dissipating body and a plurality of heat pipes passing through the heat dissipating body, the heat dissipating body having a bonding surface Each of the heat pipes has at least one end portion located outside the heat dissipating body, and a heat sink is disposed on the end portion; the power supply device has a substrate and a plurality of electronic components, and the digital electronic components are mounted on the joint surface of the heat dissipating body. Other objects, advantages and features of the present invention will become apparent from the Detailed Description of the <RTIgt; [Embodiment] M362342 \ This creation can have a variety of different structural embodiments. The preferred embodiments of the present invention will be described below with reference to the accompanying drawings. Referring to the first and second figures, the first implementation according to the present invention is shown. The light-emitting diode lamp 6 is configured as an example; the light-emitting diode lamp 6 includes a lamp housing 5, a light-emitting diode light source assembly 2 and a heat-dissipating assembly 1 housed in the lamp housing 5. In this embodiment, the light-emitting diode lamp 6 is mounted on the utility pole 4 to form a street lamp that provides night illumination. In the present embodiment, the lamp housing 5 is formed by an upper cover 51 and a lower cover 52 including two cover plates. The upper cover 51 and the lower cover 52 are respectively provided with a plurality of holes 53 for dissipating heat, and One end of the lamp housing 5 has a utility pole mounting hole 54. The mounting hole 54 has a mounting plate 55 for providing the upper end 41 of the utility pole 4 for positioning and a transparent opening 56 for the lower cover 52. The light emitting diode light source assembly 2 includes at least one substrate 21 and a plurality of light emitting diodes 22; in the embodiment, the light emitting diode light source assembly 2 includes a plurality of substrates 21 that are connected together, and each substrate 21 The first surface 211 and the second surface 212 are opposite to each other. The first surface 211 is mounted with a circuit board 23 (see FIG. 3), and the plurality of LEDs 22 are provided. The plurality of substrates 21 are electrically connected to the circuit boards 23; the substrate 21 is provided with a plurality of through holes 213 extending through the first surface 211 and the second surface 212 M362342; and the light emitting diode assembly The outer portion of the cover 2 is covered by a light-transmissive glass cover 24 and a frame 25 corresponding to the light-transmitting opening 56 of the lower cover 52 (see FIG. 5), so that the light-emitting diode The emitted light can be illuminated downward through the opening 56. Referring to the second, fifth and seventh figures, the heat dissipating component 1 comprises a heat dissipating body 11, a plurality of first heat pipes 12, a plurality of second heat pipes 15 and a plurality of heat sinks. In the embodiment, the heat dissipation body π is made of, for example, copper, aluminum, or the like. a long block made of a hot metal material, the heat dissipating body 11 has a flat joint surface 2 which can be coupled with the second surface 212 of the substrate 21, and two side surfaces 116, 117 which are located at the left and right ends of the joint surface 112. The bonding surface 2 is provided with a plurality of bonding holes 115. The substrate 21 is inserted into the through holes 213 of the substrate 21 by a plurality of connecting members 3 and extends into the plurality of bonding holes us to be coupled to the bonding surface 112 of the heat dissipation body 11. The first heat dissipation body U has a plurality of first receiving holes 11 which are spaced apart from each other and are parallel to each other. Each of the first receiving holes 111 has a longitudinal axis. In this embodiment, each of the first receiving holes Hi has a cross section. The circular portion is adjacent to the bonding surface 112. Referring to the fifth embodiment, the gap (d) between the portion of the outer surface of each of the first receiving holes U1 facing the bonding surface 112 of the heat dissipation body 11 and the first surface 212 of the substrate 21 is smaller than Ra. 5 raro, that is, in the range of 咖. 5 coffee to 〇 (that is, connected). The inside of the M362342/Huizhen hot body 11 further has a plurality of second receiving holes 118 spaced apart from each other and parallel to each other. The extending direction of each of the second receiving holes 118 is perpendicular to the longitudinal axis and extends through the heat dissipating body 11 The side surfaces 116 and in, in the present embodiment, each of the second receiving holes 118 has a circular cross section. In this embodiment, each of the first heat pipes 12 has an outer surface 124, a first portion 123 received in the first receiving hole lu of the heat dissipation body, and a second portion 121 located outside the heat dissipation body 11 (see the fifth figure). And the sixth surface); after the first heat pipe 12 is received in the first receiving hole, the portion of the outer surface 124 of the first portion 123 facing the bonding surface 112 of the heat dissipation body 11 is adjacent to the second surface 212 of the substrate 21; Each of the second heat pipes 15 has an intermediate portion 151 disposed in the second receiving hole 118 of the heat dissipating body and a first end 152 and a second end 153 disposed outside the heat dissipating body n. In this embodiment, each of the first heat pipes The second heat pipe 15 and the second heat pipe 15 are made of a circular tube made of a metal material such as steel and filled with a heat transfer medium such as a superconducting liquid (not shown). Each of the heat sinks 13 is composed of a plurality of fins 131 made of, for example, a copper material and an aluminum material, and is connected to each other. In this embodiment, the second portion 121 of the first heat pipe 12 and the second portion are A heat sink 13 is separately disposed on the first end 152 and the second end 153 of the heat pipe π. Each of the heat sinks 13 can use air convection to dissipate heat; and one end face of each heat sink 13 is provided with two heat conducting blocks 17 The two heat conducting blocks M362342 17 are connected by a connecting rod 16 so that the heat transferred to each of the heat sinks ι3 can be more quickly diffused to the entire heat sink. In this embodiment, the heat conducting blocks 17 of the heat sinks 13 are disposed. A connecting plate 172 having a through hole 171 is provided for bonding with the lamp housing 5. In this embodiment, the LED device 6 further includes a power supply 8 and a heat dissipating device 7. The heat dissipating device 7 includes a one-month heat-reducing body 71, a plurality of heat pipes π and two heat-dissipating through the heat-dissipating body 71. The heat dissipating body 71 has a joint surface 711, and each heat pipe 72 has two end portions 721 located outside the heat radiating body 71, and each heat sink 73 is composed of a plurality of fins 731 and is disposed at one end of the heat pipe. The power supply 8 has a substrate 81 and a plurality of electronic components 82. The substrate 81 is coupled to the bonding surface 711 of the heat dissipation body 71 by a struts 83, and the substrate w has an electronic circuit (not shown). The electronic component 82 is directly mounted on the bonding surface 711 of the heat dissipation body 71, thereby improving the heat dissipation effect. Referring to the eighth and ninth drawings, the LED device 6 constructed according to the second embodiment of the present invention is shown ( In this embodiment, the same or equivalent members as those of the first embodiment will be denoted by the same reference numerals and the detailed description will be omitted. The difference between the second embodiment and the first embodiment lies in the heat dissipating body 11 Bonding surface 112 An opening 114 communicating with the first receiving hole 111 is provided, such that a gap (d) between the hole wall portion of the first receiving hole m facing the bonding surface 112 of the heat dissipation body 11 and the second surface 212 of the M362342 substrate 21 is 0 (ie, connected), and a portion of the outer surface 124 of each of the first heat pipe first portions 123 inserted into the first receiving hole 111 is exposed at the opening 114 of the heat dissipation body 11 to be in contact with the substrate 21, The heat generated by the light-emitting diode can be quickly separated from the substrate 21 by the heat transfer medium inside the first heat pipe 12 and the first heat pipe, and then the heat-dissipating fins 13 and the air are passed through the two ends of the heat pipe 12 The natural convection achieves the effect of fast heat absorption, small heat resistance and rapid heat removal. According to the present invention, the light-emitting diode lamp 6 is provided, wherein the heat-dissipating body 11 of the heat-dissipating component 1 provides the light-emitting diode substrate 21 conveniently. The heat dissipating body 11 has a wide contact area with the first heat pipe 12 and the second heat pipe 15 to effectively transfer the heat generated by the light emitting diode 22 to the heat pipes 12 and 15, in particular, the first heat pipe 12 Part of the outer surface Adjacent to or touching the substrate 21, the heat generated by the light-emitting diode can be quickly removed from the substrate 21 through the heat pipes, so that the light-emitting diode has high heat dissipation efficiency, so the creation can achieve the expected The purpose of the design and the effect of the implementation. In the foregoing description, the present invention is only described for a specific embodiment, and the design features according to the present invention can be understood by various changes or modifications. The person can make obvious substitutions and modifications, and will still be incorporated into the scope of the patent claimed by the author. M362342 [Simplified illustration] The diagram is based on the first embodiment of the creation of the light-emitting diode & 'And shows that the luminaire is assembled on the pole: the component of the first circle is the exploded view of the luminaire; the third figure shows the perspective view of the circuit board and the complex LED on the substrate of the second figure The fourth circle is the upper view of the combination of the lamps in the second figure; > the fifth line is taken along the line 5_5 of the fourth figure; the sixth line is taken along the line 6_6 of the fourth figure. The seventh figure is an exploded view of the heat dissipating component and the light emitting diode light source assembly of the second figure; the eighth figure is the heat dissipating component and the light emitting diode light source component of the light emitting diode lamp constructed according to the second embodiment of the present invention. Component decomposition diagram: and
第九圓係顯示第八圖發光二極體燈具之與第五圖相 同之剖視圖。 11. 散熱本體 112.結合面 115.結合孔 12. 15.熱管 123.第一部分 【主要元件符號說明】 1.散熱組件 111. 118.收納孔 114.開口 116. 117.側面 121.第二部份 M362342 2.發光二極體光源組件The ninth circle shows the same cross-sectional view as the fifth figure of the eighth embodiment of the light-emitting diode lamp. 11. Heat-dissipating body 112. Bonding surface 115. Bonding hole 12. 15. Heat pipe 123. First part [Description of main component symbols] 1. Heat-dissipating component 111. 118. Storage hole 114. Opening 116. 117. Side 121. M362342 2. Light-emitting diode light source assembly
124.外表面 131.鰭片 152.第一端 16.連接桿 171.穿孔 211.第一面 213.穿孔 23.電路板 25.框體 4. 電線桿 5. 燈殼 52.下蓋 54.安裝孔 6. 發光二極體燈具 71. 散熱本體 72. 熱管 73. 散熱器 8.電源供應器 82.電子組件 13.散熱器 151.中間部分 153.第二端 17.導熱塊 172.連接板 21. 基板 212.第二面 22. 發光二極體 24.玻璃罩 3.連接件 41.上端 51.上蓋 53.孔 55.安裝板 7.散熱裝置 711.結合面 721.端部 731.鰭片 81.基板 83.支桿 12124. outer surface 131. fin 152. first end 16. connecting rod 171. perforation 211. first side 213. perforation 23. circuit board 25. frame 4. electric pole 5. lamp housing 52. lower cover 54. Mounting hole 6. Light-emitting diode lamp 71. Heat-dissipating body 72. Heat pipe 73. Heat sink 8. Power supply 82. Electronic component 13. Radiator 151. Middle portion 153. Second end 17. Thermal block 172. 21. Substrate 212. Second side 22. Light-emitting diode 24. Glass cover 3. Connector 41. Upper end 51. Upper cover 53. Hole 55. Mounting plate 7. Heat sink 711. Bonding surface 721. End 731. Fin Sheet 81. Substrate 83. Strut 12