CN210107093U

CN210107093U - High-heat-dissipation LED

Info

Publication number: CN210107093U
Application number: CN201921016195.3U
Authority: CN
Inventors: 石文勤
Original assignee: Zhangzhou Aike Suolan Electronics Co Ltd
Current assignee: Zhangzhou Aike Suolan Electronics Co Ltd
Priority date: 2019-07-02
Filing date: 2019-07-02
Publication date: 2020-02-21
Anticipated expiration: 2029-07-02

Abstract

The utility model relates to the technical field of light-emitting diodes, and discloses a high-heat-dissipation LED, which solves the problems that the prior LED easily generates a large amount of heat, only radiates the heat through pins, the heat radiation area is limited, the heat radiation effect is not good, and the independent diode body is easy to generate uneven heat radiation, and burns out a circuit board, and comprises a diode body, wherein the circuit board is arranged at the bottom end of the diode body, a heat conduction device is arranged at the bottom end of the circuit board, a heat radiation device is arranged at the bottom end of the heat conduction device, the diode body comprises a lamp holder, a heat radiation fin, a bulge and pins, the heat conduction device comprises a heat conduction silica gel sheet, a connecting sheet, a waterproof layer, an aluminum sheet and fins, the bulge and the pins on the heat radiation fin of the utility model radiate the heat of the, the heat radiating device radiates heat to the heat conducting device to protect the circuit board, and the service life of the LED is prolonged.

Description

High-heat-dissipation LED

Technical Field

The utility model relates to a light emitting diode technical field specifically is a high radiating LED.

Background

The light emitting diode is called As LED for short, and is made of compounds containing gallium (Ga), arsenic (As), phosphorus (P), nitrogen (N) and the like, when electrons and holes are compounded, visible light can be radiated, so that the light emitting diode can be made into circuits and instruments As indicator lamps or form character or digital display, gallium arsenide diodes emit red light, gallium phosphide diodes emit green light, silicon carbide diodes emit yellow light, gallium nitride diodes emit blue light, organic light emitting diodes OLED and inorganic light emitting diodes LED are distinguished by chemical properties, the existing LED light emitting diodes easily generate a large amount of heat, only pins are used for radiating, the radiating area is limited, the radiating effect is poor, and the problem of circuit board burning is caused by the fact that independent diode bodies are easy to radiate unevenly.

Therefore, how to design a high-heat-dissipation LED becomes a problem to be solved currently.

SUMMERY OF THE UTILITY MODEL

This to the above-mentioned condition, for overcoming prior art's defect, the utility model provides a high radiating LED, the effectual current LED emitting diode that has solved produces a large amount of heats easily, only through pin radiating, heat radiating area is limited, and the radiating effect is not good to and the inhomogeneous condition of heat dissipation appears easily in independent diode body heat dissipation, the problem of burning out the circuit board.

In order to achieve the above object, the utility model provides a following technical scheme: the LED lamp comprises a diode body, wherein a circuit board is installed at the bottom end of the diode body, a heat conduction device is installed at the bottom end of the circuit board, and a heat dissipation device is installed at the bottom end of the heat conduction device; the LED lamp comprises a diode body and is characterized in that the diode body comprises a lamp holder, radiating fins, protrusions and pins, the radiating fins are arranged inside the lamp holder, the protrusions are uniformly fixed at the bottom ends of the radiating fins, and the pins are arranged on two sides of the middle of the bottom end of the lamp holder.

Preferably, the heat conduction device comprises a heat conduction silica gel sheet, a connecting sheet, a waterproof layer, an aluminum sheet and fins, wherein the connecting sheet is arranged on two sides of the heat conduction silica gel sheet, the waterproof layer is arranged at the bottom end of the heat conduction silica gel sheet, the aluminum sheet is arranged at the bottom end of the waterproof layer, and the fins are fixed at the bottom end of the aluminum sheet.

Preferably, heat abstractor includes shell, inlet tube, water pump, condenser pipe, outlet pipe and cooling tube, and the inlet tube is installed to the outside one side of shell, and the water pump is installed to inside inlet tube one side that is close to of shell, and the inside water pump that is located of shell one side position department installs the condenser pipe, and the outlet pipe is installed to the outside opposite side of shell, is connected through the cooling tube between inlet tube and the outlet pipe.

Preferably, the aluminum sheet and the outer side of the fin are coated with an anti-oxidation layer.

Preferably, heat dissipation holes are uniformly formed in one side of the circuit board.

The utility model has the advantages that: the LED lamp has the advantages that the LED lamp is ingenious in design and reasonable in design, the protrusions and the pins on the radiating fins radiate the diode body together, the heat conducting device conducts heat quickly and conducts heat uniformly under the action of the heat conducting device, the heat radiating device radiates heat to the heat conducting device to protect the circuit board, and the service life of the LED lamp is prolonged.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:

fig. 1 is a schematic diagram of the overall structure of a high heat dissipation LED of the present invention.

Fig. 2 is a schematic diagram of the diode body structure of the present invention.

Fig. 3 is a schematic structural view of the heat conduction device of the present invention.

Fig. 4 is a schematic structural view of the heat dissipation device of the present invention.

Reference numbers in the figures: 1. a circuit board; 2. a diode body; 3. a heat conducting device; 4. a heat sink; 21. a lamp socket; 22. a heat sink; 23. a protrusion; 24. a pin; 31. a heat-conducting silica gel sheet; 32. connecting sheets; 33. a waterproof layer; 34. aluminum sheets; 35. a fin; 41. a housing; 42. a water inlet pipe; 43. a water pump; 44. a condenser tube; 45. a water outlet pipe; 46. a heat radiation pipe.

Detailed Description

The following describes the present invention in further detail with reference to the accompanying fig. 1-4.

Embodiment one, given by fig. 1, the utility model discloses a diode body 2, circuit board 1 is installed to 2 bottoms of diode body, heat conduction device 3 is installed to 1 bottom of circuit board, heat abstractor 4 is installed to 3 bottoms of heat conduction device, with 2 welding of diode body on circuit board 1, heat conduction device 3 is on heat conduction device 3 that diode body 2 dispels, the last heat that is gone up of heat conduction device 3 is dispelled by heat abstractor 4 again, under heat abstractor 3's effect, can prevent effectively that the inhomogeneous condition of 2 heats of diode body from appearing on the circuit board 1, heat conduction device 3 heat conduction is fast heat conduction even, heat abstractor 4 green pollution-free.

In the second embodiment, based on the first embodiment, as shown in fig. 2, the diode body 2 includes a lamp holder 21, a heat sink 22, a protrusion 23 and pins 24, the heat sink 22 is installed inside the lamp holder 21, the protrusion 23 is uniformly fixed at the bottom end of the heat sink 22, the pins 24 are installed on both sides of the middle portion of the bottom end of the lamp holder 21, heat is conducted only through the pins 24, and heat dissipation is slow due to slow heat conduction, so that the heat sink 22 is installed inside the lamp holder 21, the heat on the heat sink 22 is quickly conducted to the circuit board 1 by the protrusion 23, and the heat dissipation of the diode body 2 is accelerated by the pins 24 and.

Embodiment three, on the basis of embodiment one, given by fig. 3, heat conduction device 3 includes heat conduction silica gel piece 31, connection piece 32, waterproof layer 33, aluminum sheet 34 and fin 35, connection piece 32 is all installed to heat conduction silica gel piece 31 both sides, waterproof layer 33 is installed to heat conduction silica gel piece 31 bottom, aluminum sheet 34 is installed to waterproof layer 33 bottom, aluminum sheet 34 bottom mounting has fin 35, connection piece 32 links together heat conduction silica gel piece 31 and circuit board 1, heat conduction silica gel piece 31 is derived the heat of circuit board 1 surface and pin 24 one end fast, aluminum sheet 34 dispels the heat to heat conduction silica gel piece 31, the thermal diffusivity and the price/performance ratio of aluminum sheet 34 are higher, fin 35 can accelerate the heat dissipation of aluminum sheet 34, waterproof layer 33 prevents under heat abstractor 4's effect, there is steam to get into circuit board 1.

Fourth embodiment, on the basis of the first embodiment, as shown in fig. 4, the heat dissipation device 4 includes a housing 41, a water inlet pipe 42, a water pump 43, a condenser pipe 44, a water outlet pipe 45 and a heat dissipation pipe 46, the water inlet pipe 42 is installed on one side outside the housing 41, the water pump 43 is installed inside the housing 41 near one side of the water inlet pipe 42, the condenser pipe 44 is installed inside the housing 41 at one side of the water pump 43, the water outlet pipe 45 is installed on the other side outside the housing 41, the water inlet pipe 42 is connected with the water outlet pipe 45 through the heat dissipation pipe 46, the heat dissipation pipe 46 is in contact with the fins 35, the cold water inside the heat dissipation pipe 46 sucks heat quickly, under the action of the water pump 43 inside the housing 41, the water inside the heat dissipation pipe 46 is sent into the condenser pipe 44 from the water inlet.

In the fifth embodiment, on the basis of the third embodiment, the outer sides of the aluminum sheets 34 and the fins 35 are coated with the anti-oxidation layer, and the anti-oxidation layer protects the surfaces of the aluminum sheets 34 and the fins 35 and prevents the surfaces of the aluminum sheets 34 and the fins 35 from being oxidized and rusted.

Sixth embodiment, on the basis of the first embodiment, heat dissipation holes are uniformly formed in one side of the circuit board 1, and the heat dissipation holes formed in the surface of the circuit board 1 accelerate heat dissipation of the surface of the circuit board 1, so that heat is prevented from being dissipated.

The working principle is as follows: when the utility model is used, the diode body 2 is welded on the circuit board 1, only the pin 24 conducts heat, the slow heat conduction leads to slow heat dissipation, therefore, the heat radiating fin 22 is arranged in the lamp holder 21, the bulge 23 quickly guides the heat on the heat radiating fin 22 to the circuit board 1, the pin 24 and the heat radiating fin 22 accelerate the heat dissipation of the diode body 2 together, the heat conduction device 3 guides the heat dissipated from the diode body 2 to the heat conducting device 3, the connecting sheet 32 connects the heat conducting silica gel sheet 31 with the circuit board 1, the heat conducting silica gel sheet 31 quickly guides the heat on the surface of the circuit board 1 and one end of the pin 24, the aluminum sheet 34 dissipates the heat of the heat conducting silica gel sheet 31, the heat dissipation performance-price ratio of the aluminum sheet 34 is higher, the fin 35 can accelerate the heat dissipation of the aluminum sheet 34, the waterproof layer 33 prevents that under the effect of the heat dissipating device 4, vapor enters the, the cooling tube 46 contacts with the fin 35, the inside cold water of cooling tube 46 is fast to the heat intake, under the effect of water pump 43 in the shell 41, the cooling tube 46 water is fast sent into the condenser pipe 44 from inlet tube 42 and is cooled off, after the condensation of condenser pipe 44, cold water is discharged from outlet pipe 45 and is sent into the cooling tube 46, under heat conduction device 3's effect, can prevent effectively that the inhomogeneous condition of diode body 2 heat from appearing on the circuit board 1, heat conduction device 3 heat conduction is fast heat conduction even, heat abstractor 4 green is pollution-free.

Compared with the prior art, the utility model has the following benefits: the LED lamp has the advantages that the LED lamp is ingenious in design and reasonable in design, the protrusions and the pins on the radiating fins radiate the diode body together, the heat conducting device conducts heat quickly and conducts heat uniformly under the action of the heat conducting device, the heat radiating device radiates heat to the heat conducting device to protect the circuit board, and the service life of the LED lamp is prolonged.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A high-heat-dissipation LED comprises a diode body (2), and is characterized in that: the bottom end of the diode body (2) is provided with a circuit board (1), the bottom end of the circuit board (1) is provided with a heat conduction device (3), and the bottom end of the heat conduction device (3) is provided with a heat dissipation device (4); diode body (2) include lamp stand (21), fin (22), arch (23) and pin (24), and lamp stand (21) internally mounted has fin (22), and fin (22) bottom is evenly fixed with arch (23), and pin (24) are all installed to lamp stand (21) bottom middle part both sides.

2. The high heat dissipation LED according to claim 1, wherein: heat-conducting device (3) are including heat conduction silica gel piece (31), connection piece (32), waterproof layer (33), aluminum sheet (34) and fin (35), and connection piece (32) are all installed to heat conduction silica gel piece (31) both sides, and waterproof layer (33) are installed to heat conduction silica gel piece (31) bottom, and aluminum sheet (34) are installed to waterproof layer (33) bottom, and aluminum sheet (34) bottom mounting has fin (35).

3. The high heat dissipation LED according to claim 1, wherein: heat abstractor (4) are including shell (41), inlet tube (42), water pump (43), condenser pipe (44), outlet pipe (45) and cooling tube (46), inlet tube (42) are installed to shell (41) outside one side, inside inlet tube (42) one side of being close to of shell (41) is installed water pump (43), inside being located water pump (43) one side position department of shell (41) and installing condenser pipe (44), outlet pipe (45) are installed to shell (41) outside opposite side, be connected through cooling tube (46) between inlet tube (42) and outlet pipe (45).

4. The high heat dissipation LED according to claim 2, wherein: and the outer sides of the aluminum sheets (34) and the fins (35) are coated with anti-oxidation layers.

5. The high heat dissipation LED according to claim 1, wherein: radiating holes are uniformly formed in one side of the circuit board (1).