CN221629704U

CN221629704U - LED heat dissipation backboard

Info

Publication number: CN221629704U
Application number: CN202323377346.7U
Authority: CN
Inventors: 肖炼朋; 矫远君; 乔猛
Original assignee: Suzhou Yuanchengwei Electronic Technology Co ltd
Current assignee: Suzhou Yuanchengwei Electronic Technology Co ltd
Priority date: 2023-12-12
Filing date: 2023-12-12
Publication date: 2024-08-30
Anticipated expiration: 2033-12-12

Abstract

The utility model discloses an LED heat dissipation backboard, which comprises a contact bottom plate and a heat dissipation plate arranged at the top of the contact bottom plate, wherein a connecting plate is arranged at the top of the contact bottom plate, six groups of vertical plates are arranged at the top of the connecting plate, the heat dissipation plate is arranged at the top of each group of vertical plates, a transverse plate is fixedly arranged at the inner side of the heat dissipation plate, a heat conduction plate is arranged between the transverse plates, empty slots are arranged between the heat conduction plates, and a heat pipe is arranged at the inner side.

Description

LED heat dissipation backboard

Technical Field

The utility model relates to a heat dissipation backboard, in particular to an LED heat dissipation backboard, and belongs to the technical field of LEDs.

Background

The LED, which is a commonly used light emitting device, emits light by emitting energy through electron and hole recombination, has wide application in the illumination field, can efficiently convert electric energy into light energy, has wide application in modern society, such as illumination, flat panel display, medical devices, etc., and the electronic element has long appeared in 1962, can only emit red light with low luminosity in early stage, then develops other versions of monochromatic light, and can emit light in visible light, infrared and ultraviolet, the luminosity is also improved to equivalent luminosity, and the application is also used as an indicator light, a display panel, etc. at first, along with the continuous progress of technology, the LED has been widely applied to displays and illumination.

The LED can generate a large amount of heat when in use, and the heat is gathered in a large amount, so that the problem of service life reduction caused by the use of the device in a high-temperature environment can be caused, and meanwhile, the deformation and damage of an LED external shell can be caused by overheating, the integral tightness of the device is influenced, and the problem of damage of the LED by foreign objects can be caused

Disclosure of utility model

The present utility model is directed to an LED heat dissipation back plate, so as to solve the above-mentioned problems in the prior art.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the LED heat dissipation backboard comprises a contact bottom plate and a heat dissipation plate arranged at the top of the contact bottom plate, wherein a connecting plate is arranged at the top of the contact bottom plate, six groups of vertical plates are arranged at the top of the connecting plate, and the heat dissipation plate is arranged at the top of each group of vertical plates;

A transverse plate is fixedly arranged on the inner side of the heat dissipation plate, a heat conduction plate is arranged between the transverse plates, and empty slots are arranged between the heat conducting plates, and the inner side is provided with a heat pipe.

Preferably, a clamping groove is arranged on the back surface of the contact bottom plate, and a contact plate is arranged in the clamping groove.

Preferably, the heat absorbing pipe is arranged at the top of the contact plate positioned in the contact bottom plate, and the heat absorbing pipe is connected with the heat pipe.

Preferably, the bolt holes are arranged on two sides of the contact bottom plate, and rubber pads are arranged on the inner sides of the bolt holes.

Preferably, a heat conducting silicon wafer is arranged in the clamping groove.

Compared with the prior art, the utility model has the beneficial effects that:

According to the LED radiating backboard, the contact area between the device and air can be well increased through the heat-conducting plate and the cross plate, the device can be helped to quickly and effectively radiate heat, the radiating efficiency of the device is increased, the problem that an LED is overheated during use is avoided, the problem that an overheated LED shell is damaged is avoided, the heat-absorbing efficiency of the device is increased through the heat pipe and the heat-absorbing pipe, and the heat-absorbing efficiency of the device is increased through the heat-absorbing slot, so that the heat-conducting efficiency of the device and the LED is increased.

Drawings

FIG. 1 is a schematic diagram of the overall structure of the present utility model;

FIG. 2 is a schematic diagram of the front structure of the present utility model;

FIG. 3 is a schematic view of the bottom structure of the present utility model;

Fig. 4 is a schematic view of the internal structure of the heat sink according to the present utility model.

In the figure: 1. a contact base; 2. a connecting plate; 3. a heat dissipation plate; 4. a riser; 5. a hollow groove; 6. bolt holes; 7. a cross plate; 8. a heat conductive plate; 9. a contact plate; 10. a clamping groove; 11. a heat pipe; 12. a heat absorbing pipe.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-4, the utility model provides an LED heat dissipation back plate, which comprises a contact bottom plate 1 and a heat dissipation plate 3 arranged on the top of the contact bottom plate 1, wherein a connecting plate 2 is arranged on the top of the contact bottom plate 1, six groups of risers 4 are arranged on the top of the connecting plate 2, and the heat dissipation plate 3 is arranged on the top of each group of risers 4.

The heat-conducting plate (7) is arranged between the transverse plate (8) and the heat-radiating plate (3), and a hollow groove (5) is arranged between the heat-conducting plates (7), the heat pipe (11) is arranged at the inner side of the heat-radiating plate (3), the heat pipe (11) is contacted with the heat-conducting plate (7) inside, the heat pipe (11) fully utilizes the heat conduction principle and the rapid heat transfer property of the phase-change medium, and the heat of a heating object is rapidly transferred to the outside of a heat source through the heat pipe, so that the heat conduction capacity of the heat-conducting plate exceeds that of any known metal.

In the utility model, the following components are added: the back of the contact bottom plate 1 is provided with a clamping groove 10, the clamping groove 10 is used for a heat conduction gasket, the inside of the clamping groove 10 is provided with a contact plate 9, and the contact plate 9 can contact a heat conduction silicon wafer.

In the utility model, the following components are added: the top of the contact plate 9, which is positioned inside the contact bottom plate 1, is provided with a heat absorbing pipe 12, and the heat absorbing pipe 12 is connected with a heat pipe 11, and the heat absorbing pipe 12 can be used for transmitting heat absorbed by the bottom contact plate 9.

In the utility model, the following components are added: the bolt holes 6 are arranged on two sides of the contact bottom plate 1, the bolt holes 6 can be used for installing bolts conveniently, and rubber pads are arranged on the inner sides of the bolt holes 6.

In the utility model, the following components are added: the heat conducting silicon chip is arranged in the clamping groove 10, and increases the contact area between the device and the led, so that heat is conducted better.

In the description of the present utility model, it should be understood that the orientation or positional relationship indicated is based on the orientation or positional relationship shown in the drawings, and is merely for convenience in describing the present utility model and simplifying the description, and does not indicate or imply that the apparatus or element referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.

In the present utility model, unless explicitly specified and defined otherwise, for example, it may be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intermediaries, or in communication with each other or in interaction with each other, unless explicitly defined otherwise, the meaning of the terms described above in this application will be understood by those of ordinary skill in the art in view of the specific circumstances.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The LED heat dissipation backboard comprises a contact bottom plate (1) and a heat dissipation plate (3) arranged at the top of the contact bottom plate (1), and is characterized in that a connecting plate (2) is arranged at the top of the contact bottom plate (1), six groups of vertical plates (4) are arranged at the top of the connecting plate (2), and the heat dissipation plate (3) is arranged at the top of each group of vertical plates (4);

The heat pipe is characterized in that a transverse plate (8) is fixedly arranged on the inner side of the heat radiating plate (3), a heat conducting plate (7) is arranged between the transverse plates (8), a hollow groove (5) is formed between the heat conducting plates (7), and a heat pipe (11) is arranged on the inner side of the heat radiating plate (4).

2. The LED heat sink back plate of claim 1, wherein: the back of the contact bottom plate (1) is provided with a clamping groove (10), and the inside of the clamping groove (10) is provided with a contact plate (9).

3. The LED heat sink back plate of claim 2, wherein: the top of the contact plate (9) positioned inside the contact bottom plate (1) is provided with a heat absorption pipe (12), and the heat absorption pipe (12) is connected with the heat pipe (11).

4. The LED heat sink back plate of claim 1, wherein: the two sides of the contact bottom plate (1) are provided with bolt holes (6), and the inner sides of the bolt holes (6) are provided with rubber pads.

5. The LED heat sink back plate of claim 2, wherein: and a heat conducting silicon chip is arranged in the clamping groove (10).