CN210668363U - Water-cooling heat dissipation type COB light source and LED lamps and lanterns - Google Patents
Water-cooling heat dissipation type COB light source and LED lamps and lanterns Download PDFInfo
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- CN210668363U CN210668363U CN201921668062.4U CN201921668062U CN210668363U CN 210668363 U CN210668363 U CN 210668363U CN 201921668062 U CN201921668062 U CN 201921668062U CN 210668363 U CN210668363 U CN 210668363U
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Abstract
The utility model discloses a water-cooling heat dissipation type COB light source and an LED lamp, wherein the water-cooling heat dissipation type COB light source comprises a substrate, a bowl cup is arranged on the front side of the substrate, an LED chip is pasted in the bowl cup, and a fluorescent glue layer covers the LED chip; a water cooling plate is arranged on the back surface of the substrate or a first water cooling pipeline is arranged in the substrate; an upper metal layer used for connecting the substrate is arranged at the top of the water cooling plate, a lower metal layer used for supporting the water cooling plate is arranged at the bottom of the water cooling plate, and a second water cooling pipeline is arranged inside the water cooling plate; the water inlet of the first water cooling pipeline is positioned on the side surface of the substrate, and the water outlet of the first water cooling pipeline is positioned in the center of the bottom of the substrate; the water inlet of second water-cooling pipeline is located the side of water-cooling board, the delivery port of second water-cooling pipeline is located the bottom center of water-cooling board, through addding water-cooling pipeline, has improved the radiating effect of COB light source to the selectability of base plate material has been increased.
Description
Technical Field
The utility model relates to a lighting apparatus technical field, in particular to water-cooling heat dissipation type COB circle and LED lamps and lanterns.
Background
COB light source is the integrated area source technique of high light efficiency of directly pasting the LED chip on the mirror surface metal substrate of high reflectance, COB encapsulation is directly on pasting the base plate of light source with the chip, COB light source directly links to each other with heat sink during the use, need not to carry out surface mounting technique and carry out surface mounting, and the LED chip still has 70% -80% electric energy dress to become heat energy when turning into the emergent of visible light with the electric energy, can see out that LED bare chip directly pastes on the base plate from the packaging mode of COB device, heat loss only relies on the heat conductivity of base plate. At present, a COB packaging substrate mainly comprises a metal core printed circuit board, a metal matrix composite substrate and a ceramic substrate, wherein for a substrate material, the ceramic substrate is low in heat conductivity and poor in heat dissipation, and the metal in the metal core printed circuit board and the metal matrix composite substrate must be matched with the expansion coefficients of a surface insulating layer and a chip, otherwise, thermal failure is generated.
Thus, the prior art has yet to be improved and enhanced.
SUMMERY OF THE UTILITY MODEL
In view of the foregoing prior art, an object of the utility model is to provide a water-cooling heat dissipation type COB light source and LED lamps and lanterns through addding the water-cooling pipeline, have improved the radiating effect, and needn't be limited to the performance of base plate material, have increased the alternative of base plate material.
In order to achieve the purpose, the utility model adopts the following technical proposal:
a water-cooling heat dissipation type COB light source comprises a substrate, wherein a bowl cup is arranged on the front surface of the substrate, an LED chip is attached to the interior of the bowl cup, and a fluorescent glue layer covers the LED chip; a water cooling plate is arranged on the back surface of the substrate or a first water cooling pipeline is arranged in the substrate; an upper metal layer used for being connected with the substrate is arranged at the top of the water cooling plate, a lower metal layer used for supporting the water cooling plate is arranged at the bottom of the water cooling plate, and a second water cooling pipeline is arranged inside the water cooling plate; the water inlet of the first water cooling pipeline is positioned on the side surface of the substrate, and the water outlet of the first water cooling pipeline is positioned in the center of the bottom of the substrate; the water inlet of the second water cooling pipeline is positioned on the side surface of the water cooling plate, and the water outlet of the second water cooling pipeline is positioned in the center of the bottom of the water cooling plate.
In the water-cooling heat dissipation type COB light source, go up the metal level and include first metal level and second metal level, first metal level with the second metal level is through first logical groove separation.
In the water-cooling heat dissipation type COB light source, the lower metal layer includes third metal level and fourth metal level, the third metal level with the fourth metal level passes through the separation of second through-groove.
In the water-cooling heat dissipation type COB light source, the water outlet of the second water-cooling pipeline is located at the center of the second through groove.
In the water-cooling heat dissipation type COB light source, first water-cooling pipeline with second water-cooling pipeline is the coiled circulation form water-cooling pipeline.
In the water-cooling heat dissipation type COB light source, the first water-cooling pipeline and the second water-cooling pipeline are glass pipelines.
In the water-cooling heat dissipation type COB light source, the bowl cup is circular, just the inner wall of bowl cup is domatic form, around forming reflective cavity.
An LED lamp comprises the water-cooling heat dissipation type COB light source.
Compared with the prior art, the utility model provides a water-cooling type COB light source and LED lamps and lanterns, water-cooling type COB light source includes the base plate, the front of base plate is provided with the bowl cup, paste in the bowl cup and be equipped with the LED chip, the LED chip covers there is the fluorescence glue film; a water cooling plate is arranged on the back surface of the substrate or a first water cooling pipeline is arranged in the substrate; an upper metal layer used for being connected with a substrate is arranged at the top of the water cooling plate, a lower metal layer used for supporting the water cooling plate is arranged at the bottom of the water cooling plate, and a second water cooling pipeline is arranged inside the water cooling plate; the water inlet of the first water cooling pipeline is positioned on the side surface of the substrate, and the water outlet of the first water cooling pipeline is positioned in the center of the bottom of the substrate; the water inlet of second water-cooling pipeline is located the side of water-cooling board, the delivery port of second water-cooling pipeline is located the bottom center of water-cooling board, through addding water-cooling pipeline, has improved the radiating effect of COB light source to the selectivity of base plate material has been increased.
Drawings
Fig. 1 is a perspective view of a first embodiment of a water-cooling heat dissipation type COB light source provided by the present invention;
fig. 2 is a perspective view of a water-cooling plate according to a first embodiment of the COB light source with water-cooling and heat-dissipating provided by the present invention;
fig. 3 is a schematic view of a bottom of a water-cooling plate according to a first embodiment of the water-cooling heat dissipation type COB light source provided by the present invention;
fig. 4 is a schematic cross-sectional view of a first embodiment of a water-cooling heat dissipation type COB light source provided by the present invention;
fig. 5 is a perspective view of a substrate of a second embodiment of a water-cooling heat dissipation type COB light source provided by the present invention;
fig. 6 is a perspective view of a second embodiment of a water-cooling heat dissipation type COB light source provided by the present invention;
fig. 7 is the utility model provides a base plate bottom sketch map of second embodiment in water-cooling heat dissipation type COB light source.
Detailed Description
An object of the utility model is to provide a water-cooling heat dissipation type COB light source and LED lamps and lanterns through addding the water-cooling pipeline, have improved the radiating effect, and needn't be limited to the performance of base plate material, have increased the alternative of base plate material.
In order to make the objects, technical solutions and effects of the present invention clearer and clearer, the following description of the present invention will refer to the accompanying drawings and illustrate embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.
Referring to fig. 1, fig. 2, fig. 3 and fig. 4 together, the water-cooling heat dissipation type COB light source provided by the present invention includes a substrate 1, a bowl 11 is disposed on the front surface of the substrate, an LED chip is attached to the interior of the bowl, and a fluorescent glue layer 12 covers the LED chip; the back of the substrate is provided with a water cooling plate 2; an upper metal layer 21 for connecting a substrate is arranged at the top of the water cooling plate 2, a lower metal layer 22 for supporting the water cooling plate is arranged at the bottom of the water cooling plate 2, and a second water cooling pipeline 20 is arranged inside the water cooling plate 2; the water inlet 201 of the second water cooling pipeline 20 is located on the side surface of the water cooling plate 2, the water outlet 202 of the second water cooling pipeline 20 is located in the center of the bottom of the water cooling plate 2, the heat dissipation capability of the COB light source can be effectively improved by additionally arranging a water cooling pipe, the problem of aging of components caused by heat accumulation is avoided, and the service life of the device is prolonged; in addition, when the substrate material is selected, the specific thermal conductivity and thermal expansion rate of the substrate material are not limited, and the selectivity of the substrate material is increased.
In specific implementation, in the first embodiment provided by the present invention, a water-cooling plate 2 is disposed on the back surface of the substrate 1, an upper metal layer 21 is disposed on the top of the water-cooling plate 2, and the upper metal layer 21 is used for being connected to the substrate 1 so as to be integrated with a COB light source; a lower metal layer 22 is arranged at the bottom of the water cooling plate 2, and the lower metal layer 22 is used for supporting the water cooling plate 2 to be connected with other devices; the upper metal layer 21 and the lower metal layer 22 also function to protect the water-cooled panel 2 and prevent damage by direct contact of the water-cooled panel 2.
The inside of the water cooling plate 2 is used for arranging a second water cooling pipeline 20 to form an insulating layer, the water inlet 201 of the second water cooling pipeline 20 is arranged on the side surface of the water cooling plate 2, the water outlet 202 of the second water cooling pipeline 20 is arranged at the bottom of the water cooling plate 2, when hot air generated during the work of the LED chip is guided out from the substrate, condensed water in the second water cooling pipeline 20 can rapidly cool the hot air and sink the hot air, so that the air circulation and the heat guiding are facilitated, and the heat dissipation capability of the COB light source is improved; the arrangement of the water cooling pipeline is not limited to the specific thermal conductivity and thermal expansion rate of the substrate material, and the selectivity of the substrate material is increased.
Further, with reference to fig. 4, the upper metal layer 21 includes a first metal layer 211 and a second metal layer 212, the first metal layer 211 and the second metal layer 212 are separated by a first through groove 23, the upper metal layer includes two portions, a gap is formed between the two portions, and a contact area between the water-cooling plate and air is increased, so as to facilitate heat dissipation.
Further, the lower metal layer 22 includes a third metal layer 221 and a fourth metal layer 222, the third metal layer 221 and the fourth metal layer 222 are separated by the second through groove 24, the water outlet 202 of the second water-cooling pipe 20 is located at the center of the second through groove 24, the lower metal layer 22 is divided into two parts, a gap is formed between the two parts, so that the water outlet 202 of the second water-cooling pipe 20 is conveniently arranged, a certain space is provided for the arrangement of the water outlet 202 of the second water-cooling pipe, and the contact area between the water-cooling plate 2 and the air is also increased, so that the heat is conveniently led out.
In a second embodiment of the present invention, referring to fig. 5, 6 and 7, a first water cooling pipe 10 is disposed inside the base plate 1, the water inlet 101 of the first water-cooling pipeline 10 is positioned at the side surface of the substrate 1, the water outlet 102 of the first water-cooling pipeline 10 is positioned at the center of the bottom of the substrate 1, namely, the water-cooling pipeline can be directly arranged inside the base plate 1, namely, the first water-cooling pipeline 10 is arranged inside the base plate 1, the water inlet 101 of the first water-cooling pipeline 10 is positioned on the side surface of the substrate 1, the water outlet 102 of the first water-cooling pipeline 10 is positioned at the center of the bottom of the substrate 1, the first water-cooling duct 10 is directly disposed inside the substrate 1 by etching technology to be integrated with the COB device, improve can also effectively reduce the volume of COB light source when COB light source radiating effect, the setting installation of the COB light source of being convenient for.
Furthermore, in the present invention, the first water-cooling pipeline 10 and the second water-cooling pipeline 20 are both spiral reflux-shaped water-cooling pipelines, and the arrangement of the spiral reflux-shaped water-cooling pipelines increases the contact area of water-cooling heat dissipation, facilitates the circulation of hot air flow, and prevents heat collection; first water-cooling pipeline 10 with second water-cooling pipeline 20 is the glass pipeline, first water-cooling pipeline 10 with second water-cooling pipeline 20 adopts just high temperature glass to make, fixes through the mode of some glue, has optimized the radiating effect of COB light source.
Specifically, the front of base plate 1 is provided with bowl cup 11, pastes dress LED chip in the bottom of bowl cup 11, bowl cup 11 is circular, just the inner wall 110 of bowl cup 11 is the sloping face form, around forming anti-light cavity, promptly anti-light cavity is the loudspeaker form that the lower part is narrow, the upper portion is wide to reflect the light that the LED chip sent as far as, improve the light-emitting rate of product.
Additionally, the utility model provides a LED lamps and lanterns is still provided, this LED lamps and lanterns include as above water-cooling heat dissipation type COB light source, because the above has carried out detailed description to this water-cooling heat dissipation type COB light source, no longer give consideration to here.
To sum up, in the water-cooling heat dissipation type COB light source and the LED lamp, the water-cooling heat dissipation type COB light source comprises a substrate, a bowl cup is arranged on the front side of the substrate, an LED chip is attached to the interior of the bowl cup, and a fluorescent glue layer covers the LED chip; a water cooling plate is arranged on the back surface of the substrate or a first water cooling pipeline is arranged in the substrate; an upper metal layer used for being connected with a substrate is arranged at the top of the water cooling plate, a lower metal layer used for supporting the water cooling plate is arranged at the bottom of the water cooling plate, and a second water cooling pipeline is arranged inside the water cooling plate; the water inlet of the first water cooling pipeline is positioned on the side surface of the substrate, and the water outlet of the first water cooling pipeline is positioned in the center of the bottom of the substrate; the water inlet of second water-cooling pipeline is located the side of water-cooling board, the delivery port of second water-cooling pipeline is located the bottom center of water-cooling board, through addding water-cooling pipeline, has improved the radiating effect of COB light source to the selectivity of base plate material has been increased.
It should be understood that equivalent alterations and modifications can be made by those skilled in the art according to the technical solution of the present invention and the inventive concept thereof, and all such alterations and modifications should fall within the scope of the appended claims.
Claims (8)
1. A water-cooling heat dissipation type COB light source is characterized by comprising a substrate, wherein a bowl cup is arranged on the front side of the substrate, an LED chip is attached to the interior of the bowl cup, and a fluorescent glue layer covers the LED chip; a water cooling plate is arranged on the back surface of the substrate or a first water cooling pipeline is arranged in the substrate; an upper metal layer used for being connected with the substrate is arranged at the top of the water cooling plate, a lower metal layer used for supporting the water cooling plate is arranged at the bottom of the water cooling plate, and a second water cooling pipeline is arranged inside the water cooling plate; the water inlet of the first water cooling pipeline is positioned on the side surface of the substrate, and the water outlet of the first water cooling pipeline is positioned in the center of the bottom of the substrate; the water inlet of the second water cooling pipeline is positioned on the side surface of the water cooling plate, and the water outlet of the second water cooling pipeline is positioned in the center of the bottom of the water cooling plate.
2. The water-cooled heat dissipation type COB light source of claim 1, wherein the upper metal layer includes a first metal layer and a second metal layer, the first metal layer and the second metal layer being separated by a first through groove.
3. The water-cooled heat dissipation type COB light source of claim 1, wherein the lower metal layer includes a third metal layer and a fourth metal layer, the third metal layer and the fourth metal layer being separated by a second through groove.
4. The water-cooled heat dissipation type COB light source according to claim 3, wherein a water outlet of the second water-cooled pipeline is located at the center of the second through groove.
5. The water-cooled heat dissipation type COB light source of claim 1, wherein the first water-cooled pipeline and the second water-cooled pipeline are both spiral-circulation-shaped water-cooled pipelines.
6. The water-cooled heat dissipation type COB light source of claim 1, wherein the first water-cooled pipeline and the second water-cooled pipeline are both glass pipelines.
7. The water-cooled heat dissipation type COB light source of claim 1, wherein the bowl cup is circular, and the inner wall of the bowl cup is sloping, surrounds and forms a reflective cavity.
8. An LED lamp, characterized by comprising the water-cooling COB light source according to any one of claims 1-7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921668062.4U CN210668363U (en) | 2019-09-30 | 2019-09-30 | Water-cooling heat dissipation type COB light source and LED lamps and lanterns |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921668062.4U CN210668363U (en) | 2019-09-30 | 2019-09-30 | Water-cooling heat dissipation type COB light source and LED lamps and lanterns |
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| Publication Number | Publication Date |
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| CN210668363U true CN210668363U (en) | 2020-06-02 |
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| CN201921668062.4U Active CN210668363U (en) | 2019-09-30 | 2019-09-30 | Water-cooling heat dissipation type COB light source and LED lamps and lanterns |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114766230A (en) * | 2022-05-24 | 2022-07-22 | 深圳市美斯特光电技术有限公司 | Spectrum-adjustable plant lighting lamp and spectrum adjusting method thereof |
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2019
- 2019-09-30 CN CN201921668062.4U patent/CN210668363U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114766230A (en) * | 2022-05-24 | 2022-07-22 | 深圳市美斯特光电技术有限公司 | Spectrum-adjustable plant lighting lamp and spectrum adjusting method thereof |
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