CN201074794Y - Heat radiating device of light emitting diode lamp - Google Patents

Abstract

The utility model discloses a heat radiator of light-emitting diode lamp, which is mainly formed by combining a predetermined number of heat radiation fins and a heat absorption conduit, and because both are fixedly arranged on the outer surface of the base plate of the lamp, the heat radiator has better heat radiation effect. In addition, the heat absorption conduit is a closed hollow tube filled with liquid, and the liquid can be used as a medium for absorbing and dissipating heat, so that the heat generated by the light emitting diode of the lamp can be quickly extracted from the high temperature in the lamp under the action of quick heat absorption of the liquid in the heat absorption conduit, and further the temperature is conducted to each heat dissipation fin to achieve the purpose of quickly cooling, thereby reducing the light attenuation speed of the light emitting diode and prolonging the service life of the light emitting diode.

Description

Heat dissipation device for light-emitting diode lamps

technical field

The utility model relates to a heat dissipation device of a lamp, in particular to a heat dissipation device of a light emitting diode lamp.

Background technique

In order to achieve the purpose of heat dissipation, general light-emitting diode (LED) lamps almost use the radiation conduction of heat energy inside the lamp, and then the heat energy is transferred and dissipated to the outside by the shell of the lamp. The efficiency is not good, and it is easy to cause the heat energy generated by the LEDs to be eliminated quickly, resulting in the accumulation of heat energy, which will not only easily lead to damage or meltdown of the wiring or lamp components, but also accelerate the light decay of the LEDs, greatly reducing its service life.

In order to improve the heat dissipation effect of LED lamps, people in the industry have conducted research on this. Taiwan utility model patent specification M300866 discloses a multi-heat pipe heat dissipation structure, as shown in Figure 1, which utilizes the addition of several heat pipes 10 and heat dissipation fins 11, so that the heat energy generated by the LED 12 can be transmitted to the outside of the lamp 1 by each heat pipe 10 and heat dissipation fins 11, so as to achieve the purpose of heat dissipation, but it is worth noting that using each heat pipe 10 and heat dissipation fins The sheet 11 absorbs and exports the heat energy of the lamp 1, which is actually not as ideal as imagined, because the speed of heat absorption and heat conduction of each heat pipe 10 is extremely slow, and the purpose of rapid cooling of the lamp 1 cannot be achieved. As a result, a large amount of heat energy accumulates in the In this light fixture 1, will influence the service life of LED 12.

Contents of the invention

The technical problem to be solved by the utility model is to provide a heat dissipation device for LED lamps, which can quickly absorb heat and conduct heat, so that the heat energy inside the lamp can be quickly transferred to the outside.

In order to solve the above-mentioned technical problems, the technical solution of the heat dissipation device of the light-emitting diode lamp of the present invention is to include:

A predetermined number of cooling fins are fixed on the outer surface of a base plate of a lamp, and a predetermined number of light-emitting diodes are arranged on the inner surface of the base plate;

A heat-absorbing conduit is a closed hollow tube filled with liquid, fixed on the outer surface of the base plate of the lamp, and connected with the above-mentioned heat dissipation fins.

The heat dissipation device of the light-emitting diode lamp of the utility model can play the role of rapid heat absorption and heat conduction, so that heat energy will not accumulate in the lamp, which will help reduce the light decay speed of the light-emitting diode and effectively prolong its service life.

Description of drawings

Below in conjunction with accompanying drawing and embodiment the utility model is described in further detail:

FIG. 1 is a schematic longitudinal sectional view of a heat dissipation device of an existing light-emitting diode lamp;

Fig. 2 is a schematic diagram of a longitudinal section of the utility model;

Fig. 3 is the three-dimensional schematic view of the utility model;

Fig. 4 is a schematic diagram of a longitudinal section of the utility model showing that the heat-absorbing conduit is in a straight shape;

Fig. 5 is a schematic diagram of a longitudinal section of the utility model showing that the heat-absorbing conduit is embedded;

Fig. 6 is a schematic diagram of a longitudinal section of the utility model showing two sets of heat-absorbing pipes and cooling fins fixed on the surface of the substrate;

Fig. 7 is a schematic longitudinal cross-sectional view of the utility model showing two sets of heat-absorbing pipes and heat-dissipating fins embedded in the substrate;

Fig. 8 is a schematic longitudinal cross-sectional view showing that the display substrate of the present invention is composed of a circuit board and a metal plate;

Reference numerals in the figure are: 1. lamp; 10. heat pipe; 11. cooling fin; 12. LED; 2. cooling fin; 3. heat-absorbing pipe; 31. liquid; .Light-emitting diode; 43. Lampshade; 5. Heat-absorbing pipe; 51. Liquid; 6. Heat-absorbing pipe; 61. Liquid; 7. Substrate; 71. Circuit board; 72. Metal plate.

Detailed ways

The heat dissipation device of the light-emitting diode lamp of the present utility model is mainly composed of a predetermined number of heat dissipation fins 2 and a heat-absorbing pipe 3 as shown in Fig. 2 and Fig. 3 .

A predetermined number of cooling fins 2 are fixed on the outer surface of the substrate 41 of a lamp 4, and the substrate 41 is provided with a predetermined number of light-emitting diodes 42 on the inner surface of the lamp 4, and is closed by a transparent lampshade 43. lamps.

In addition, the heat-absorbing conduit 3 is a closed hollow metal tube with a liquid 31 in it (the present embodiment is made into a U-shape as an example), and is fixed on the outer surface of the substrate 41 of the lamp 4, and is connected with each heat-dissipating fin. 2 are in a connected state, so that the heat-absorbing pipe 3 and each heat dissipation fin 2 can be closely integrated. In order to increase the efficiency of heat conduction therebetween, between the heat-absorbing conduit 3 and each heat-dissipating fin 2, between the heat-absorbing conduit 3 and the substrate 41, and between each heat-dissipating fin 2 and the substrate 41, heat-conducting paste can be recoated. , which will help the complete transfer of heat. In addition, it is worth noting that, as shown in FIG. 4 , the heat-absorbing conduit 5 can also be a hollow metal tube formed in a straight line with a liquid 51 inside, which does not affect its connection with the cooling fins 2 and the substrate 41 .

As shown in FIG. 5 , the heat-absorbing conduit 6 is partially embedded in the substrate 41 , so that the area where the heat-absorbing conduit 6 can contact the substrate 41 becomes larger, which helps to accelerate the absorption and conduction of heat energy.

In addition, as shown in Figure 6, on the outer surface of the base plate 41 of the lamp 4, two sets of identical heat-absorbing pipes 3 and heat dissipation fins 2 can be fixed at the same time, which absorb the internal heat energy of the lamp 4 and conduct the heat energy to the outside. The ability is the same as the previous embodiment; and as shown in Figure 7, two groups of heat-absorbing pipes 3 are partially embedded in the substrate 41, so that the area where each heat-absorbing pipe 3 can be in contact with the substrate 41 becomes Larger, helps to accelerate the absorption and conduction of heat energy.

In order to cooperate with the actual operation of the current light-emitting diode lamps, as shown in Figure 8, the substrate 7 can be composed of a circuit board 71 and a metal plate 72 overlapping, wherein the circuit board 71 is used for the installation and connection of the light-emitting diodes 42, and then the circuit The plate 71 is fixed on the metal plate 72 of the housing of the lamp 4 , and the heat energy can also be transmitted through the metal plate 72 of the housing of the lamp 4 .

As for the heat dissipation device of the light-emitting diode lamp of the present invention, the principle of heat dissipation is shown in Fig. 2, Fig. 4, and Fig. 5. The heat energy generated by the light-emitting diode 42 inside the lamp 4 can only be directly conducted to the direct contact with it. At this time, since the heat-absorbing conduits 3, 5, and 6 are connected to the substrate 41, the heat energy will be absorbed by each heat-absorbing conduit 3, 5, and 6, because each heat-absorbing conduit 3, 5, and 6 inside Liquids 31, 51, 61 are all contained, which can be used as heat-absorbing and heat-dissipating mediums. Utilizing the liquids 31, 51, 61 can accelerate the absorption and conduction of heat energy, that is to say, the heat generated by the light emitting diodes 42 of the lamps 4 is in each Under the effect of rapid heat absorption and conduction by the internal liquids 31, 51, 61 of the heat-absorbing conduits 3, 5, 6, the high temperature inside the lamp 4 can be quickly extracted, and the temperature is further conducted to each cooling fin 2 to achieve the purpose of rapid cooling.

Claims (7)

1. the heat abstractor of a led lamp is characterized in that, comprising:

The radiating fin of predetermined number all is installed on the outer surface of substrate of a light fixture, and described substrate then is provided with the light emitting diode of predetermined number on inner surface;

An endothermic catheter is the hollow tube that an inside is loaded with liquid and sealing, is installed on the outer surface of substrate of light fixture, and is connected with described each radiating fin.

2. the heat abstractor of led lamp according to claim 1 is characterized in that, the shape of described endothermic catheter is in-line.

3. the heat abstractor of led lamp according to claim 1 is characterized in that, the shape of described endothermic catheter is the U font.

4. the heat abstractor of led lamp according to claim 1 is characterized in that, the number of described endothermic catheter is more than one.

5. the heat abstractor of led lamp according to claim 1 is characterized in that, described substrate is by a wiring board and metallic plate overlapping composition.

6. the heat abstractor of led lamp according to claim 1 is characterized in that, described endothermic catheter is bonded on the outer surface of described substrate.

7. the heat abstractor of led lamp according to claim 1 is characterized in that, described endothermic catheter partly is embedded in described substrate.

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