CN102543912B - Radiator and its preparation method - Google Patents
Radiator and its preparation method Download PDFInfo
- Publication number
- CN102543912B CN102543912B CN201010583423.2A CN201010583423A CN102543912B CN 102543912 B CN102543912 B CN 102543912B CN 201010583423 A CN201010583423 A CN 201010583423A CN 102543912 B CN102543912 B CN 102543912B
- Authority
- CN
- China
- Prior art keywords
- pedestal
- projection
- fin
- groove
- radiator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000002360 preparation method Methods 0.000 title description 4
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 52
- 238000000034 method Methods 0.000 claims abstract description 8
- 238000004519 manufacturing process Methods 0.000 claims abstract description 4
- 230000007613 environmental effect Effects 0.000 abstract description 3
- 239000000758 substrate Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A kind of radiator, comprise a pedestal and be located at the some fin on this pedestal, one of described pedestal and described both fin are provided with a projection, and another of the two is provided with the groove coordinated with this projection, described projection is combined with the mode of described groove by interference fit, thus cost-saving and environmental protection.The invention still further relates to a kind of manufacture method of radiator.
Description
Technical field
The present invention relates to a kind of radiator, particularly a kind of for the Radiator and its preparation method to electronic element radiating.
Background technology
Along with developing rapidly of electronic and information industry; the heat that the heat-generating electronic elements such as micro-chip processor produce is more and more many; in order to these heats are distributed the normal operation ensureing electronic component, industry can be sticked a radiator usually to dispel the heat to this heat-generating electronic elements on electronic component.
Existing radiator generally includes a substrate and is located at the some radiating fins on this substrate.The flanging that each radiating fin comprises a body and bends respectively to same direction from the both sides of this body.Described radiating fin is arranged in order along the longitudinal direction of substrate, and the end of the flanging of each radiating fin and the body of adjacent heat radiation fin contact with each other, and forms a faying face respectively in the top of this radiator and bottom.This substrate contacts with heat-generating electronic elements, described radiating fin is soldered on substrate by modes such as solderings, in soldering process, need to add solder and scaling powder, particularly in the welding process of different materials, as welding of aluminium and copper, also need to carry out nickel plating or other special processings, operation is comparatively complicated and cost is high.
Summary of the invention
In view of this, be necessary that providing a kind of has lower cost and Radiator and its preparation method easy to assembly in fact.
A kind of radiator, comprise a pedestal and be located at the some fin on this pedestal, one of described pedestal and described both fin are provided with a projection, and another of the two is provided with the groove coordinated with this projection, and described projection is combined with the mode of described groove by interference fit.
A kind of manufacture method of radiator, comprise the steps: to provide a pedestal and some fin, one of described pedestal and described both fin are provided with a projection, and another of the two is provided with a groove corresponding with this projection, by described projection interference fit in described groove, combine to make described fin and pedestal.
Compared with prior art, the pedestal of this radiator is combined with projection by groove in an interference fit with between fin, makes simple, and can make can reach tight and firm combination without the need to being coated with scolding tin between the two, thus cost-saving and environmental protection.
Accompanying drawing explanation
Fig. 1 is the three-dimensional assembly diagram of radiator in a preferred embodiment of the present invention.
Fig. 2 is the exploded view of radiator shown in Fig. 1.
Fig. 3 is the three-dimensional assembly diagram of the radiator of another embodiment of the present invention.
Fig. 4 is the exploded view of the radiator shown in Fig. 3.
Main element symbol description
Radiator 10,10a
Pedestal 12,12a
Fin 14,14a
Lower surface 120
Upper surface 122
Projection 124,124a
End face 125
Bottom surface 125a
Side 127,127a
Chamfering 128
Body 140
Flanging 142
Groove 144,144a
Embodiment
The invention will be further described in conjunction with the embodiments with reference to the accompanying drawings.
As shown in Figures 1 and 2, this radiator 10 some fin 14 of comprising a pedestal 12 and being located on this pedestal 12.
This pedestal 12 is roughly rectangular plate-like, and it has a smooth lower surface 120 and a upper surface 122 relative with this lower surface 120.This lower surface 120 is for fitting with a heat-generating electronic elements (not shown).The central authorities of this upper surface 122 are convexly equipped with a projection 124, and this projection 124 is formed by extruding or other modes, and this projection 124 extends through the relative both sides to this pedestal 12.In the present embodiment, the cross section of this projection 124 is roughly inverted isosceles trapezoid, this projection 124 comprise an end face 125 parallel with the upper surface 122 of this pedestal 12 and respectively by this end face 125 relative both sides downwards and the two sides 127 extended that slope inwardly, be connected by arc angling 128 between this end face 125 with side 127.Described two sides 127 are connected between the end face 125 of this projection 124 and the upper surface 122 of this pedestal 12, and are that gradually-reducing shape extends by the end face 125 of this projection 124 to the upper surface of this pedestal 12.During concrete enforcement, this projection 124 also can be other shapes such as semi-cylindrical or flat column.
These fin 14 form roughly rectangular sheet by punching press, and are arranged parallel to each other and are located on the upper surface 122 of this pedestal 12.Each fin 14 comprise a rectangle body 140 and by the top of this body 140 to the vertically extending flanging 142 in direction of another fin 14 be adjacent.The position of the corresponding described projection 124 in bottom of described body 140 is provided with a groove 144 matched with the projection 124 of described pedestal 12, described groove 144 is by taking out tooth or other modes are formed, the mating shapes of the shape of described groove 144 and the projection 124 of described pedestal 12, the size of described groove 144 is slightly less than the size of the projection 124 of this pedestal 12, and described groove 144 is combined by the mode of interference fit with between described projection 124.
During assembling, by external force, each fin 14 is interted on the projection 124 of this pedestal 12 by one end i.e. side direction of this pedestal 12 of the projection 124 of this pedestal 12 one by one, and an end interted to the flanging 142 of the fin 14 on this projection 124 is resisted against on the body 140 of last fin 14, to realize the location between adjacent two fin 14 after making.The pedestal 12 of this radiator 10 is combined with projection 124 by groove 144 in an interference fit with between fin 14, makes simple, and can make can reach tight and firm combination without the need to being coated with scolding tin between the two, thus cost-saving and environmental protection.Fin 14 due to this radiator 10 is single one by one to be worn on the projection 124 of this pedestal 12, the contact area that one very little is only needed in assembling process both making, namely can ensure to combine closely between projection 124 and groove 144, can prevent from again making described fin 14 produce larger distortion and affect the heat dispersion of this radiator 10 in projection 124 and groove 144 assembling process simultaneously.
As shown in Figures 3 and 4, be the radiator 10a (adding label) in another embodiment of the present invention.The difference of the radiator 10a in the present embodiment and the radiator 10 in previous embodiment is: described projection 124a is located at the bottom of described fin 14a, described groove 144a is located on the upper surface 122 of described pedestal 12a, the two sides 127a that described projection 124a comprises a bottom surface 125a parallel with the bottom of fin 14a and upwards extended by the relative both sides of this bottom surface 125a, described two sides 127 are that gradually-reducing shape extends by this bottom surface 125a to the direction of described fin 14a, during assembling, by external force by the projection 124a of described fin 14a by the groove 144a of this pedestal 12a one end one by one cunning establish card in the groove 144a of this pedestal 12a.
Claims (10)
1. a radiator, comprise a pedestal and be located at the some fin on this pedestal, it is characterized in that: described pedestal has a smooth upper surface, one of described pedestal and described both fin are provided with a projection, and another of the two is provided with the groove coordinated with this projection, described projection or groove are located at the central authorities of the upper surface of described pedestal, described projection is combined with the mode of described groove by interference fit, after described projection is combined with described groove, the bottom of described fin is held in the upper surface of described pedestal.
2. radiator as claimed in claim 1, is characterized in that: described projection is located on described pedestal, and described groove is located on described fin.
3. radiator as claimed in claim 1, is characterized in that: described fin by described pedestal side one by one cunning establish to this pedestal.
4. radiator as claimed in claim 2, it is characterized in that: the cross section of described projection is trapezoidal, they two sides comprising an end face and extended by the direction of pedestal described in two side direction of this end face, described two sides are that gradually-reducing shape extends by the end face of described projection to the direction of described pedestal.
5. radiator as claimed in claim 4, be is characterized in that: be connected by an arc angling between described end face with described side.
6. radiator as claimed in claim 2, is characterized in that: described groove is located at the bottom of described fin, and the top of each fin extends to form a flanging to the direction of another fin.
7. radiator as claimed in claim 1, is characterized in that: described projection is located on described fin, and described groove is located on described pedestal.
8. radiator as claimed in claim 7, it is characterized in that: the cross section of described projection is trapezoidal, they two sides comprising a bottom surface and extended by the direction of fin described in two side direction of this bottom surface, described two sides are that gradually-reducing shape extends by the bottom surface of described projection to the direction of described fin.
9. the manufacture method of a radiator, comprise the steps: to provide a pedestal and some fin, described pedestal has a smooth upper surface, one of described pedestal and described both fin are provided with a projection, and another of the two is provided with a groove corresponding with this projection, described projection or groove are located at the central authorities of the upper surface of described pedestal, by described projection interference fit in described groove, combine to make described fin and pedestal, after described projection is combined with described groove, the bottom of described fin is held in the upper surface of described pedestal.
10. the manufacture method of radiator as claimed in claim 9, it is characterized in that: when described projection is located on pedestal, when described groove is located on fin, described fin plugs on the projection of described pedestal by its groove one by one; When described groove is located on pedestal, when described projection is located on fin, the projection of described fin one by one cunning establishes card in the groove of described pedestal.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010583423.2A CN102543912B (en) | 2010-12-10 | 2010-12-10 | Radiator and its preparation method |
| US12/979,316 US20120145374A1 (en) | 2010-12-10 | 2010-12-27 | Heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010583423.2A CN102543912B (en) | 2010-12-10 | 2010-12-10 | Radiator and its preparation method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102543912A CN102543912A (en) | 2012-07-04 |
| CN102543912B true CN102543912B (en) | 2015-10-21 |
Family
ID=46198137
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010583423.2A Active CN102543912B (en) | 2010-12-10 | 2010-12-10 | Radiator and its preparation method |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20120145374A1 (en) |
| CN (1) | CN102543912B (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103369918B (en) * | 2012-04-03 | 2015-01-21 | 全亿大科技（佛山）有限公司 | Heat radiation device and assembling method thereof |
| CN104661488B (en) * | 2013-11-21 | 2018-03-09 | 奇鋐科技股份有限公司 | The manufacture method of radiating module |
| CN105283033A (en) * | 2014-07-21 | 2016-01-27 | 奇鋐科技股份有限公司 | Manufacture method of heat-dissipating module |
| CN105720022B (en) * | 2014-12-04 | 2019-06-14 | 国家电网公司 | A kind of extra-high voltage direct-current thyristor pushes back the radiator on road |
| CN110972444B (en) * | 2018-09-30 | 2022-09-06 | 泰科电子(上海)有限公司 | Heat sink and housing assembly |
| CN110972443B (en) * | 2018-09-30 | 2023-09-15 | 泰科电子(上海)有限公司 | Heat dissipating device and housing assembly |
| CN109644554A (en) * | 2018-10-31 | 2019-04-16 | 北京比特大陆科技有限公司 | Circuit board and supercomputer equipment |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7275587B2 (en) * | 2006-01-20 | 2007-10-02 | Hua-Shou Kuo | Combination cooler module |
| US7650929B2 (en) * | 2007-09-30 | 2010-01-26 | Tsung-Hsien Huang | Cooler module |
| US8251132B2 (en) * | 2008-03-27 | 2012-08-28 | Fu Zhun Precision Industry (Shenzhen) Co., Ltd. | Heat sink assembly and method for manufacturing the same |
-
2010
- 2010-12-10 CN CN201010583423.2A patent/CN102543912B/en active Active
- 2010-12-27 US US12/979,316 patent/US20120145374A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| CN102543912A (en) | 2012-07-04 |
| US20120145374A1 (en) | 2012-06-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170420 Address after: Guangdong, Chancheng Province West Industrial Zone, 35 North Road, Warburg, No. Patentee after: Quanyida Technology (Foshan) Co., Ltd. Address before: 518109 Guangdong city of Shenzhen province Baoan District Longhua Town Industrial Zone tabulaeformis tenth East Ring Road No. 2 two Co-patentee before: Foxconn Precision Industry Co., Ltd. Patentee before: Fuhuai (Shenzheng) Precision Industry Co., Ltd. |
|
| TR01 | Transfer of patent right |