CN209419991U - Radiator, circuit board and calculating equipment - Google Patents
Radiator, circuit board and calculating equipment Download PDFInfo
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- CN209419991U CN209419991U CN201821776863.8U CN201821776863U CN209419991U CN 209419991 U CN209419991 U CN 209419991U CN 201821776863 U CN201821776863 U CN 201821776863U CN 209419991 U CN209419991 U CN 209419991U
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Abstract
The embodiment of the present disclosure belongs to heat dissipation for circuit board field, and provides a kind of radiator, circuit board and calculate equipment.Wherein radiator includes heat dissipation bottom sheet and radiating fin, is provided with heat-conducting piece on the contact surface of heat dissipation bottom sheet and welding circuit board；Wherein, the compatibility of heat-conducting piece and solder is better than the compatibility of heat dissipation bottom sheet and solder.The embodiment of the present disclosure does not need to carry out spreader surface whole plating, but the heat-conducting piece with good heating conduction and solder affinity is press-fitted into heat dissipation bottom sheet, and assembly is simple and electroless plating pollution generates；Since heat-conducting piece itself has excellent heating conduction and solder affinity, preferable with the amalgamation of solder, reliability is higher, and also relatively good to the heat dissipation performance of circuit board；In addition, due to using press-fitted mode, therefore heat-conducting piece is respectively connect with radiator that face contact is abundant, good heat conductivity；Meanwhile back-off structure can be designed on groove structure, prevent as be press-fitted it is insecure caused by heat-conducting piece fall off.
Description
Technical field
This disclosure relates to field of radiating more particularly to a kind of radiator, circuit board and calculating equipment.
Background technique
Currently, the welding procedure between radiator and pcb board, mostly uses and hangs up weldering after spreader surface is integrally electroplated
Material, the technique then welded with pcb board.But certain pollutant can be generated during radiator is electroplated, and with
The tightening of various countries' environmental protection policy, this electroplating technology be gradually eliminated in the future, therefore it is expected that cooperation production firm can be more next
It less, also can be higher and higher for commodity price.
It should be noted that the above description of the technical background be intended merely to it is convenient to the technical solution of the disclosure carry out it is clear,
Complete explanation, and facilitate the understanding of those skilled in the art and illustrate.Cannot merely because these schemes in the disclosure
Background technology part is expounded and thinks that above-mentioned technical proposal is known to those skilled in the art.
Summary of the invention
The embodiment of the present disclosure proposes a kind of radiator, circuit board and calculates equipment, to solve existing radiator needs
Solder is hung after whole plating, so that pollutant can be led to the problem of.
In order to achieve the above object, the embodiment of the present disclosure proposes a kind of radiator, including heat dissipation bottom sheet and radiating fin, institute
It states and is provided with heat-conducting piece on the contact surface of heat dissipation bottom sheet and welding circuit board；Wherein, the compatibility of the heat-conducting piece and solder is excellent
In the compatibility of the heat dissipation bottom sheet and solder.
Further, in one embodiment, accommodating structure is offered in the heat dissipation bottom sheet, and the heat-conducting piece is press-fitted
In the accommodating structure.
Further, in one embodiment, the accommodating structure is groove structure.
Further, in one embodiment, the groove structure is at least one；And the groove structure is along institute
State the communicating structure that the side length direction of heat dissipation bottom sheet opens up.
Further, in one embodiment, the groove structure is arranged in the heat dissipation bottom sheet, and along the heat dissipation
The inner circumferential of egative film opens up.
Further, in one embodiment, back-off structure is provided at the slot wedge of the groove structure；It is led when described
When warmware is press-fitted into the groove structure, the back-off structure realizes the fixation to the heat-conducting piece.
Further, in one embodiment, the position that groove structure is offered in the heat dissipation bottom sheet is higher than the heat dissipation
Other positions on egative film.
Further, in one embodiment, the material of the heat-conducting piece is copper, nickel or gold.
Further, in one embodiment, the heat-conducting piece is the metalwork for being electroplate with nickel layer.
Further, in one embodiment, the solder is tin, tin alloy or zinc, kirsite.
In order to achieve the above object, the embodiment of the present disclosure also proposes a kind of circuit board, including pcb board and is welded on described
The radiator as described in above-mentioned any embodiment on pcb board.
In order to achieve the above object, the embodiment of the present disclosure also proposes a kind of calculating equipment, including as described in above-described embodiment
At least one circuit board.
Radiator, circuit board disclosed in the embodiment of the present disclosure and calculating equipment do not need to carry out spreader surface whole
Body plating, but the heat-conducting piece with good heating conduction and solder affinity is press-fitted into heat dissipation bottom sheet, directly with dissipate
Hot device is connected, and assembly is simple and electroless plating pollution generates；Since heat-conducting piece itself has excellent heating conduction and solder affine
Property, therefore it is preferable with the amalgamation of solder, reliability is higher, and also relatively good to the heat dissipation performance of circuit board；In addition, due to adopting
With press-fitted mode, and heat-conducting piece can be using flake, therefore heat-conducting piece is respectively connect with radiator that face contact is abundant, heating conduction
It is good；Meanwhile when using groove structure accommodating heat-conducting piece, back-off structure can be designed on groove structure, is prevented due to press-fitted
Heat-conducting piece caused by insecure falls off.
Referring to following description and accompanying drawings, the particular implementation of the disclosure is disclosed in detail, specifies the original of the disclosure
Reason can be in a manner of adopted.It should be understood that embodiment of the present disclosure is not so limited in range.In appended power
In the range of the spirit and terms that benefit requires, embodiment of the present disclosure includes many changes, modifications and is equal.
The feature for describing and/or showing for a kind of embodiment can be in a manner of same or similar one or more
It uses in a other embodiment, is combined with the feature in other embodiment, or the feature in substitution other embodiment.
It should be emphasized that term "comprises/comprising" refers to the presence of feature, one integral piece, step or component when using herein, but simultaneously
It is not excluded for the presence or additional of one or more other features, one integral piece, step or component.
Detailed description of the invention
In order to illustrate more clearly of the embodiment of the present disclosure or technical solution in the prior art, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Disclosed some embodiments for those skilled in the art without any creative labor, can be with root
Other attached drawings are obtained according to these attached drawings.
Fig. 1 is the structural schematic diagram of the radiator of the first embodiment of the disclosure；
Fig. 2 is the structural schematic diagram of the heat-conducting piece of the rectangular tab structure corresponding to embodiment illustrated in fig. 1；
Fig. 3 is the structural schematic diagram of the radiator of second of embodiment of the disclosure；
Fig. 4 is the structural schematic diagram of the radiator of the third embodiment of the disclosure；
Fig. 5 is the structural schematic diagram of the radiator of the 4th kind of embodiment of the disclosure；
Fig. 6 is the structural schematic diagram of the radiator of the 5th kind of embodiment of the disclosure；
Fig. 7 is the structural schematic diagram of the radiator of the 6th kind of embodiment of the disclosure；
Fig. 8 is the structural schematic diagram of the radiator of the 7th kind of embodiment of the disclosure；
Fig. 9 is the structural schematic diagram of the radiator (not being press-fitted heat-conducting piece) of the 8th kind of embodiment of the disclosure；
Figure 10 is the structural schematic diagram of the radiator (press-fitted to have heat-conducting piece) of embodiment illustrated in fig. 9；
Figure 11 is the structural schematic diagram of the circuit board of the embodiment of the present disclosure.
Drawing reference numeral:
1- heat dissipation bottom sheet；
2- radiating fin；21- riser；22- handgrip；
3- heat-conducting piece；
4- accommodating structure；
5- groove structure；
6- back-off structure；
100-PCB plate；
The first radiator of 200-；
The second radiator of 300-.
Specific embodiment
Below in conjunction with the attached drawing in the embodiment of the present disclosure, the technical solution in the embodiment of the present disclosure is carried out clear, complete
Site preparation description, it is clear that described embodiment is only disclosure a part of the embodiment, instead of all the embodiments.It is based on
Embodiment in the disclosure, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment belongs to the range of disclosure protection.
Below with reference to several representative embodiments of the disclosure, the principle and spirit of the disclosure are illustrated in detail.
The embodiment of the present disclosure proposes a kind of novel radiator, is arranged using in the egative film of radiator with excellent
The mode of heating conduction and the heat-conducting piece of solder affinity replaces previous spreader surface entirety electroplating technique, has dress
With simple, solderability it is good and not will cause plating pollution the advantages of.Also, the revealed radiator of the embodiment of the present disclosure can be with
It applies on almost all of pcb board, since the amalgamation of heat-conducting piece and solder is preferable, therefore high solderability may be implemented.
Fig. 1 is the structural schematic diagram of the radiator of the embodiment of the present disclosure.As shown in Figure 1, the radiator packet in the present embodiment
Heat dissipation bottom sheet 1 and radiating fin 2 are included, the heat dissipation bottom sheet 1 and the contact surface of welding circuit board are provided with heat-conducting piece 3.Wherein, institute
State compatibility of the compatibility better than the heat dissipation bottom sheet 1 and solder of heat-conducting piece 3 and solder.
In existing welding procedure, the metal body of radiator generally uses aluminium material, in order to realize radiator and PCB
The welding of plate needs integrally to be electroplated one layer of nickel outside metal body, realizes the welding with pcb board by nickel layer.As background
Mentioned in technology, electroplating technology can generate certain pollutant, not only pollute environment, and these pollutants are once retained in
On cooling fin, it is possible to will affect the heat dissipation effect of radiator, or further influence the efficiency of chip.The embodiment of the present disclosure
It is proposed in such a way that heat-conducting piece is set on a heat sink, realized and welded by heat-conducting piece and solder and pcb board, by thermally conductive
The excellent heating conduction of part and solder affinity replace previous spreader surface entirety electroplating technique, and assembly is simple and can
Weldering property is preferable.
In the embodiment of the present application, it should be noted that solder can have glutinous for tin, tin alloy, zinc or kirsite etc.
The composition of resultant force and welding force, it can realize any solder of welding, solder affinity simultaneously with heat-conducting piece and pcb board
Instruct the welding performance of warmware and solder.Wherein, most common solder be tin, at this time it will be appreciated by those skilled in the art that
It is that the solder affinity of metal is the tining performance of metal.Also, the disclosure does not do any restriction to the material of solder, only
It can be achieved on the function of welding between heat-conducting piece and pcb board, it is believed that within disclosure signified scope.This implementation
In example, heat-conducting piece 3 has good heating conduction and solder affinity, therefore can be using metals such as copper, gold or nickel.But
Nickel price is very expensive, to be significantly larger than the cost that radiator is integrally electroplated with it with its cost for manufacturing heat-conducting piece, and golden
The higher therefore optimal embodiment of cost be using copper material as heat-conducting piece.
In the present embodiment, the contact surface of heat dissipation bottom sheet 1 and welding circuit board is provided with heat-conducting piece 3.Those skilled in the art
It is understood that the heat dissipation bottom sheet 1 of radiator and circuit board realize the contact surface of welding, part heat dissipation bottom sheet can be,
It can be whole heat dissipation bottom sheets.When whole heat dissipation bottom sheets are as welding surface, heat-conducting piece 3 can be set to thin slice, one side weldering
It connects in heat dissipation bottom sheet, another side and circuit board are realized and welded.
When heat dissipation bottom sheet 1 and circuit board realize that the contact surface of welding is part heat dissipation bottom sheet, one kind is achieved in that:
Accommodating structure is offered in heat dissipation bottom sheet, and the heat-conducting piece is press-fitted in the accommodating structure.Embodiment as shown in Figure 2,
Accommodating structure 4 is offered in heat dissipation bottom sheet 1, and (dotted line is identified in Fig. 2, though being identified as planar structure, actually has accommodating space
Groove structure), and the heat-conducting piece 3 is press-fitted in the accommodating structure 4.In the present embodiment, since heat-conducting piece 3 is to be press-fitted
In accommodating structure 4, therefore the shape of heat-conducting piece 3 and accommodating structure 4 must be consistent, and the dimension scale of the two also almost phase
Together, the size of the latter's heat-conducting piece 3 is slightly larger than the size of accommodating structure, and crimping insertion just may be implemented.
In the present embodiment, as shown in Fig. 2, heat-conducting piece 3 can be fried batter in a thin layer shape or thin strip, are allowed to more easily
In being press-fitted into the accommodating structure 4 opened up in heat dissipation bottom sheet 1.Any limit is not done to the concrete shape of heat-conducting piece in the application
It is fixed, in addition to laminated structure, such as may be designed in block structure or column structure etc..In the application, thin copper can be used
Piece is as heat-conducting piece, and copper thin slice itself has very high solderability, preferable with the amalgamation of scolding tin, also, copper itself
For the material of high-termal conductivity, connection type of the copper sheet using crimping insertion, high reliablity, and due to being press-fitted mode, therefore it is thin
Copper sheet respectively connect with radiator face contact sufficiently, good heat conductivity.
In embodiment illustrated in fig. 2, accommodating structure 4 is the groove structure of rectangle, and is provided with the middle part of heat dissipation bottom sheet 1
Position, but the location and shape that the disclosure does not open up accommodating structure 4 do any restriction.This is because thermally conductive in the application
Part 3 has excellent tining performance (illustrating using tin as solder in the present embodiment) and heating conduction, therefore only needing will be thermally conductive
Part 3 is fixedly connected in heat dissipation bottom sheet 1, and there is heat-conducting piece 3 enough surface areas to carry out tining, realizes the scolding tin with pcb board
Fixation also had enough areas to realize effectively heat dissipation in this way, tining welding both may be implemented.Also, implement in the application
In example, accommodating structure is not meant to as enclosed construction, or non-close structure.For enclosed construction, as Fig. 2
Rectangular canal structure in illustrated embodiment may be set to be square groove structure, circular groove structure (such as Fig. 3 in fact
It is shown) etc., corresponding heat-conducting piece is square thin slice and circle sheet etc. at this time.In this embodiment, the groove knot opened up
Structure can be one, or two even more, such as can open up two parallel in heat dissipation bottom sheet, connect with increasing
Contacting surface product.
In one embodiment, as shown in figure 4, accommodating structure 4 can also be setting in the heat dissipation bottom sheet 1, and
The rectangular canal structure opened up along the inner circumferential of the heat dissipation bottom sheet 1.At this point, heat-conducting piece 3 is shown in Fig. 4 corresponding to accommodating knot
The rectangular tab structure of structure 4.This mode opened up along heat dissipation bottom sheet inner circumferential, increases the contact surface of heat-conducting piece and pcb board,
And welding surface is more uniformly spread, so that welding is more secured.Certainly, this mode opened up along heat dissipation bottom sheet inner circumferential, and
It is not limited to rectangular configuration, is also possible to circular configuration, square structure and trapezium structure etc..For example, when accommodating structure 4 be along
When the circular configuration that heat dissipation bottom sheet inner circumferential opens up, then heat-conducting piece 3 is circular ring structure.
For non-close structure, as shown in figure 5, accommodating structure 4 can be and open up along the side length of heat dissipation bottom sheet
The groove structure of perforation.In the present embodiment, accommodating structure 4 is using the groove structure 5 that 1 middle part of heat dissipation bottom sheet is arranged in.Such as Fig. 5 institute
Showing in embodiment, groove structure 5 is one, it is opened up along the direction of D-D ', but the application is without being limited thereto, it can also be along D-
The direction of D ' open up it is two or more, either as shown in fig. 6, opening up one or more along the direction vertical with the direction of D-D '
It is a.The application does not limit the direction and quantity of groove structure 5, but from technique complexity and cost consideration, Fig. 5 institute
Show that way of example is better embodiment.Also, in the application, groove structure 5 can be used extrusion process and directly radiate
It is squeezed out on device original surface, realization is also easier.
In order to increase connection reliability, as shown in fig. 7, back-off structure 6 can be designed further on groove structure 5, prevent
It is insecure due to being press-fitted, cause falling off for heat-conducting piece (such as scale copper).In the application, as shown in fig. 6, groove structure can be
The integral structure of edge designs along groove, having of being also possible to that edge along groove as shown in Figure 8 is evenly distributed are certain
The single back-off structure of spacing.In embodiment illustrated in fig. 8, back-off structure is 4, and the both sides of the edge of groove structure 5 are evenly distributed
Two are designed as, and is arranged close to the end of groove structure.Certainly, the application is not to the distributional pattern sum number of back-off structure
Amount limits, it is only necessary to which it can effectively realize the fixation to heat-conducting piece.
In another embodiment, it in order to increase connection reliability, can also set groove structure 5 to above groove
Open width is slightly less than the structure of trench bottom surfaces width, the back-off structure with groove structure one is formed, thus in heat-conducting piece 3
When being press-fitted in groove structure 5, guarantee being connected and fixed for heat-conducting piece.
Fig. 9 is the structural schematic diagram of one embodiment of the radiator of the embodiment of the present disclosure.As shown in figure 9, the present embodiment
In, groove structure 5 is provided with the intermediate position of heat dissipation bottom sheet 1, and the position for offering groove structure 5 is higher than the heat dissipation bottom sheet
Other positions on 1.That is, the heat dissipation bottom sheet in the present embodiment is not even curface, intermediate position is convex with one
Platform is more conducive to squeezing out groove structure at intermediate position in this way, be more favorable to the press-fitted of heat-conducting piece and with pcb board
Soldering connection.Figure 10 is embodiment illustrated in fig. 9 heat-conducting piece 3 (being thin copper bar in the present embodiment) is press-fitted in groove structure 5
Schematic diagram, it can be seen that after heat-conducting piece 3 is press-fitted into groove structure 5, each to connect face contact abundant, and stability has guarantor
Barrier.
As shown in Fig. 1-Figure 10, the radiating fin 2 of the radiator of the embodiment of the present disclosure includes one group disposed in parallel perpendicular
Piece, the top of each riser 21 are connected with the heat dissipation bottom sheet 1.In a kind of preferred embodiment, as shown in Fig. 9-Figure 10,
In the bottom end of a riser be provided with handgrip 22, in order to machine or manually to the lifting of radiator.When it is implemented, handgrip
22 can be the sheet for being connected to the top of riser or ring bodies etc..Preferably, the position of intermediate riser is arranged in handgrip 22,
It when in favor of being lifted to radiator, being firmly evenly distributed, preventing from damaging radiator.In addition, shown in Fig. 9-Figure 10
There is a boss in the middle part of the heat dissipation bottom sheet of the radiator of embodiment, be more conducive to squeezing out groove structure.
By the description above to radiator disclosed in the embodiment of the present application, it is known that disclosed in the embodiment of the present application
The novel frame mode of radiator does not need to carry out whole plating to spreader surface, and will have Thermal conductivity and
The heat-conducting piece of solder affinity is press-fitted into heat dissipation bottom sheet, is directly connected with radiator, and assembly is simple, and connection reliability height,
Solderability is good；In addition, due to using press-fitted mode, therefore that face contact is respectively connect with radiator is abundant, thermally conductive for laminar heat-conducting piece
Performance is good；Meanwhile when using groove structure, back-off structure can be designed on groove structure, is prevented insecure due to being press-fitted
Caused by heat-conducting piece fall off.
The embodiment of the present application also discloses a kind of circuit board, as shown in figure 11, the circuit board in the present embodiment, in addition to including
Pcb board 100 further includes being connect with pcb board 100 by soldering, the first radiator 200 to radiate to the pcb board 100.
In current heat dissipation design, radiator generally is respectively connected with to improve heat dissipation effect on two surfaces up and down of pcb board, and
And in actual design, chip part is designed in single side, and the connection type of chip and radiator generally uses thermally conductive gluing
The mode of knot, this is because chip non-refractory itself, and be not suitable for using soldering mode.Therefore, the embodiment of the present application discloses
The first radiator 200 be typically welded to pcb board not chip another side.As shown in figure 11, using reality as shown in Figure 10
Apply the first radiator 200 in example, be welded on the one side of the not no chip of pcb board 100, by this one side of pcb board layers of copper or
Heat on chip pin is conducted to radiator and radiates；Another side is (for example, whole using existing second radiator 300
The radiator of plating) it is directly bonded by heat-conducting glue to radiate with the chip on pcb board.
The embodiment of the present application also discloses a kind of calculating equipment, at least one circuit including embodiment as shown in figure 11
Plate.In one embodiment, the calculating equipment can be supercomputer server, and supercomputer server includes at least one piece calculation power
Plate, calculating includes multiple operation chips in the one side of power plate.Using the radiator of the embodiment of the present disclosure, it is welded in and is calculated on power plate
In the one side for not having operation chip, realize to the heat dissipation for calculating power plate.
Radiator, circuit board disclosed in the embodiment of the present disclosure and calculating equipment do not need to carry out spreader surface whole
Body plating, but the heat-conducting piece with good heating conduction and solder affinity is press-fitted into heat dissipation bottom sheet, directly with dissipate
Hot device is connected, and assembly is simple and electroless plating pollution generates；Since heat-conducting piece itself has excellent heating conduction and solder affine
Property, therefore it is preferable with the amalgamation of solder, reliability is higher, and also relatively good to the heat dissipation performance of circuit board；In addition, due to adopting
With press-fitted mode, and heat-conducting piece can be using flake, therefore heat-conducting piece is respectively connect with radiator that face contact is abundant, heating conduction
It is good；Meanwhile when using groove structure accommodating heat-conducting piece, back-off structure can be designed on groove structure, is prevented due to press-fitted
Heat-conducting piece caused by insecure falls off.
When in the application, although term " first ", " second " etc. may be used in this application to describe respectively
Element, but these elements should not be limited by these terms.These terms are only used to by an element and another element region
It does not open.For example, in the case where not changing the meaning of description, first element can be called second element, and same, second
Element can be called first element, as long as " second yuan that " first element " occurred is unanimously renamed and occurred
Part " unanimously renames.First element and second element are all elements, but can not be identical element.
Word used herein is only used for description embodiment and is not used in limitation claim.Such as embodiment with
And used in the description of claim, unless context clearly illustrates, otherwise "one" (a) of singular, "one"
(an) and " described " (the) is intended to include equally plural form.Similarly, term "and/or" as used in this specification
Refer to comprising one or more associated any and all possible combinations listed.In addition, when being used for the application
When middle, term " includes " (comprise) and its modification " comprising " (comprises) and/or refer to including (comprising) etc. old
The presence of feature, entirety, step, operation, element and/or the component stated, but be not excluded for one or more other features,
Entirety, step, operation, element, component and/or these grouping presence or addition.
Above-mentioned technical description can refer to attached drawing, these attached drawings form a part of the application, and by description attached
The embodiment according to described embodiment is shown in figure.Although the description of these embodiments is enough in detail so that this field
Technical staff can be realized these embodiments, but these embodiments are non-limiting；Other implementations thus can be used
Example, and variation can also be made in the case where not departing from the range of described embodiment.
In addition, using term to provide the thorough understanding of described embodiment in above-mentioned technical description.However, and being not required to
Will excessively detailed details to realize described embodiment.Therefore, the foregoing description of embodiment be in order to illustrate and describe and
It presents.The embodiment and example disclosed according to these embodiments presented in foregoing description is provided separately, with
Addition context simultaneously helps to understand described embodiment.Description above, which is not used in, accomplishes exhaustive or by described reality
Apply the precise forms that example is restricted to the disclosure.According to the above instruction, it is several modification, selection be applicable in and variation be feasible.?
In some cases, processing step well known is not described in avoid described embodiment is unnecessarily influenced.
It applies specific embodiment in the disclosure to be expounded the principle and embodiment of the disclosure, above embodiments
Explanation be merely used to help understand disclosed method and its core concept；At the same time, for those skilled in the art,
According to the thought of the disclosure, there will be changes in the specific implementation manner and application range, in conclusion in this specification
Hold the limitation that should not be construed as to the disclosure.
Claims (12)
1. a kind of radiator, including heat dissipation bottom sheet and radiating fin, which is characterized in that the heat dissipation bottom sheet and welding circuit board
Heat-conducting piece is provided on contact surface；
Wherein, the compatibility of the heat-conducting piece and solder is better than the compatibility of the heat dissipation bottom sheet and solder.
2. radiator according to claim 1, which is characterized in that offer accommodating structure, and institute in the heat dissipation bottom sheet
Heat-conducting piece is stated to be press-fitted in the accommodating structure.
3. radiator according to claim 2, which is characterized in that the accommodating structure is groove structure.
4. radiator according to claim 3, which is characterized in that the groove structure is at least one；
And the groove structure is the communicating structure opened up along the side length direction of the heat dissipation bottom sheet.
5. radiator according to claim 3, which is characterized in that the groove structure is arranged in the heat dissipation bottom sheet,
And it is opened up along the inner circumferential of the heat dissipation bottom sheet.
6. radiator according to claim 3 or 4, which is characterized in that be provided at the slot wedge of the groove structure
Back-off structure；
When the heat-conducting piece is press-fitted into the groove structure, the back-off structure realizes the fixation to the heat-conducting piece.
7. radiator according to claim 3 or 4, which is characterized in that offer groove structure in the heat dissipation bottom sheet
Position is higher than other positions in the heat dissipation bottom sheet.
8. radiator according to claim 1-5, which is characterized in that the material of the heat-conducting piece be copper, nickel or
Gold.
9. radiator according to claim 1-5, which is characterized in that the heat-conducting piece is the gold for being electroplate with nickel layer
Belong to part.
10. radiator according to claim 1-5, which is characterized in that the solder be tin, tin alloy or zinc,
Kirsite.
11. a kind of circuit board, which is characterized in that including pcb board and be welded on the pcb board as claim 1-10 appoint
Radiator described in one.
12. a kind of calculating equipment, which is characterized in that including at least one circuit board as claimed in claim 11.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821776863.8U CN209419991U (en) | 2018-10-31 | 2018-10-31 | Radiator, circuit board and calculating equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821776863.8U CN209419991U (en) | 2018-10-31 | 2018-10-31 | Radiator, circuit board and calculating equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209419991U true CN209419991U (en) | 2019-09-20 |
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ID=67932237
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| Application Number | Title | Priority Date | Filing Date |
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| CN201821776863.8U Active CN209419991U (en) | 2018-10-31 | 2018-10-31 | Radiator, circuit board and calculating equipment |
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| CN (1) | CN209419991U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109565929A (en) * | 2018-10-31 | 2019-04-02 | 北京比特大陆科技有限公司 | Radiator, circuit board and calculating equipment |
-
2018
- 2018-10-31 CN CN201821776863.8U patent/CN209419991U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109565929A (en) * | 2018-10-31 | 2019-04-02 | 北京比特大陆科技有限公司 | Radiator, circuit board and calculating equipment |
| CN109565929B (en) * | 2018-10-31 | 2021-02-19 | 北京比特大陆科技有限公司 | Radiator, circuit board and computing device |
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