TWM566351U - Heat-spreading board structure - Google Patents

Heat-spreading board structure Download PDF

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Publication number
TWM566351U
TWM566351U TW107208816U TW107208816U TWM566351U TW M566351 U TWM566351 U TW M566351U TW 107208816 U TW107208816 U TW 107208816U TW 107208816 U TW107208816 U TW 107208816U TW M566351 U TWM566351 U TW M566351U
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Taiwan
Prior art keywords
chamber
heat
plate structure
uniform temperature
structure according
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TW107208816U
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Chinese (zh)
Inventor
林勝煌
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奇鋐科技股份有限公司
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Priority to TW107208816U priority Critical patent/TWM566351U/en
Publication of TWM566351U publication Critical patent/TWM566351U/en

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Abstract

一種均溫板結構,係包含:一本體;所述本體具有:一第一部分、一第二部分、一毛細結構、一工作流體;該第一部分具有一第一腔室;該第二部分具有一第二腔室,該第二部分由該第一部分一端並向遠離該第一部分方向延伸所形成;該毛細結構設置於該第一、二腔室內部表面;該工作流體填充於該第一、二腔室內,透過本創作均溫板結構係可同時具有均溫及遠端散熱之效果者。A uniform temperature plate structure comprising: a body; the body has: a first portion, a second portion, a capillary structure, a working fluid; the first portion has a first chamber; the second portion has a a second chamber formed by one end of the first portion and extending away from the first portion; the capillary structure is disposed on the first and second chamber interior surfaces; the working fluid is filled in the first and second portions In the chamber, through the creation of the uniform temperature plate structure, the effect of uniform temperature and remote heat dissipation can be achieved at the same time.

Description

均溫板結構Temperature uniform plate structure

一種均溫板結構,尤指一種同時具有平面均溫及遠端散熱效果的均溫板結構。The utility model relates to a temperature equalizing plate structure, in particular to a temperature equalizing plate structure which has both a planar average temperature and a remote heat dissipation effect.

現行散熱元件中常使用的有散熱器、熱管、熱板、均溫板等散熱元件,其中散熱器主要作為輔助散熱使用,而熱管、熱板、均溫板等元件因具有熱傳導速率快故作為熱傳導元件,熱傳導元件主要因導熱係數高係直接作為與熱源接觸之主要元件,並另外結合散熱效果較強的散熱器作為增加散熱效率。 如上所述均溫板及熱管主要為導熱效果較佳之元件,需另外搭配散熱效果較佳之元件如散熱鰭片或散熱器使得以達到更佳之散熱,均溫板係為一種大面積面與面之熱傳導,熱管則為一種軸向遠端之熱傳導散熱,均溫板與熱管的工作原理相同,但熱傳導的方向則有所不同,一般有業者透過將均溫板與熱管兩者疊合或搭接或焊接進行熱傳導,令同時具有大面積熱傳導及遠端熱傳導之效果,但由於均溫板與熱管透過焊接結合兩者間具有間隙則勢必會產生熱阻降低熱傳效率。 故如何將均溫板及熱管或其他散熱元件之功效整合又不產生熱阻,則為現行該項業者最為重視之目標。Heat sinks, heat pipes, hot plates, temperature equalizing plates and other heat dissipating components are commonly used in current heat dissipating components. The heat sinks are mainly used as auxiliary heat sinks, and the heat pipes, hot plates, and uniform temperature plates are used as heat conduction because of their high heat transfer rate. The component, the heat conduction element is mainly used as the main component in contact with the heat source due to the high thermal conductivity, and additionally combined with the heat sink with strong heat dissipation effect to increase the heat dissipation efficiency. As mentioned above, the temperature equalizing plate and the heat pipe are mainly components with better heat conduction effect, and need to be additionally equipped with components with better heat dissipation effect such as heat dissipation fins or heat sinks to achieve better heat dissipation, and the temperature equalization plate is a large area surface and surface. Heat conduction, the heat pipe is a kind of axial heat transfer heat dissipation, the temperature plate and the heat pipe work in the same principle, but the direction of heat conduction is different. Generally, the industry overlaps or overlaps the temperature plate and the heat pipe. Or welding for heat conduction, so that the effect of large-area heat conduction and remote heat conduction at the same time, but because of the gap between the uniform temperature plate and the heat pipe through welding, it is bound to generate thermal resistance to reduce heat transfer efficiency. Therefore, how to integrate the effects of the temperature equalizing plate and the heat pipe or other heat dissipating components without generating thermal resistance is the most important goal of the current industry.

爰此,為解決上述習知技術之缺點,本創作之主要目的,係提供一種同時具有大面積均溫及遠端熱傳導的均溫板結構。 為達上述之目的,本創作係提供一種均溫板結構,係包含:一本體,所述本體由一第一板體及一第二板體相互疊合所組成,該本體具有:一第一部分、一第二部分、一毛細結構、一工作流體; 所述第一部分具有一第一腔室;該第二部分具有一第二腔室,該第二部分由該第一部分一端(或一側)向遠離該第一部分方向延伸所形成;該毛細結構設置於該第一、二腔室內部表面;該工作流體填充於該第一、二腔室內。 透過本創作之均溫板結構可透過第一部分及第二部分分別提供大面積均溫及遠端熱傳導散熱之整合效果,同時無熱阻現象發生,進而達到提升散熱效能者。Accordingly, in order to solve the above-mentioned shortcomings of the prior art, the main purpose of the present invention is to provide a uniform temperature plate structure having both a large area average temperature and a distal heat conduction. For the purpose of the above, the present invention provides a temperature equalizing plate structure, comprising: a body, the body is composed of a first plate body and a second plate body which are superposed on each other, the body has: a first part a second portion, a capillary structure, a working fluid; the first portion having a first chamber; the second portion having a second chamber, the second portion being one end (or one side) of the first portion Formed to extend away from the first portion; the capillary structure is disposed on the first and second chamber interior surfaces; the working fluid is filled in the first and second chambers. Through the creation of the uniform temperature plate structure, the first part and the second part respectively provide the integration effect of large-area uniform temperature and remote heat conduction heat dissipation, and no heat resistance phenomenon occurs, thereby achieving the improvement of heat dissipation performance.

本創作之上述目的及其結構與功能上的特性,將依據所附圖式之較佳實施例予以說明。 請參閱第1圖,係為本創作均溫板結構之第一實施例立體剖視圖,如圖所示,本創作之均溫板結構,係包含:一本體1; 所述本體1由一第一板體1a及一第二板體1b相互疊合所組成,該本體1具有:一第一部分11、一第二部分12、一毛細結構13、一工作流體14; 所述第一部分11具有一第一腔室111,所述第一部分11係呈扁平長方體狀,該第一部分11作為大面積熱傳導之使用。 所述第二部分12具有一第二腔室121,該第二部分12由該第一部分11一端(或一側)向遠離該第一部分11方向延伸所形成,所述第二部分12相較前述第一部分11之外部形狀,該第二部分12呈長條狀的長方體或圓柱體或任意幾何體其中任一。 所述毛細結構13設置於該第一、二腔室111、121內部表面,即表示所述第一、二部分111、121內部之腔室表面設置有所述毛細結構13,所述工作流體14則填充於該第一、二腔室111、121內。 所述第二部分12可針對使用者使用方式向各處延伸設置,所述第一、二部分11、12之設置主要為符合同時具有大面積均溫及遠端熱傳導之效果的結構整合,故第一部分11外型設置為扁平長方體狀即可提供大面積面與面的熱傳導均溫效果,而第二部分12外型設置呈長條狀的長方體或圓柱體或任意幾何體其中任一,主要目的在於提供將第一部分11之熱量同時傳遞至遠端進行熱交換散熱,則如此設計提供整合均溫板大面積及熱管遠端導熱之優點,改善了習知透過搭接或焊接之方式將均溫板與熱管組合使用產生熱阻現象的缺失。 請參閱第2、2a圖,係為本創作均溫板結構之第二實施例立體剖視圖,如圖所示,本實施例部分結構與前述第一實施例相同,故在此將不再贅述,惟本實施例與前述第二實施例之不同處在於,所述第一部分11一端延伸有一第三部分15,所述第三部分15具有一第三腔室151,所述毛細結構13亦延伸設置於該第三腔室151內部表面,部分工作流體14填充於該第三腔室151內,所述第二、三部分12、15部分與該第一部分11不在同一水平面,如此設置係可針對設置之處若有不同高度之阻礙物,所述第二、三部分12、15則可選擇設置避開阻礙物進行設置。 第2a圖係為本實施例另一實施態樣,如圖所示,所述第二、三部分12、15位於同一水平面但與第一部分11位於不同水平面,並且第二、三部分12、15由該第一部分11向外延伸後分別朝向該第一部分11的左、右或上、下兩側延伸。 請參閱第3圖,係為本創作均溫板結構之第三實施例立體剖視圖,如圖所示,本實施例部分結構與前述第一實施例相同,故在此將不再贅述,惟本實施例與前述第二實施例之不同處在於,所述第二部分12連接一第四部分16,所述第四部分16呈長型板狀與該第二部分12垂直連接,向所述第二部分12左、右兩側延伸,所述第四部分16具有一第四腔室161並該毛細結構13延伸設置於所述第四腔室161之內壁表面,所述第三部分15連接一第五部分17,所述第五部分17呈長型板狀與該第三部分15垂直連接,向所述第三部分15左、右兩側延伸,所述第五部分17具有一第五腔室171並該毛細結構13延伸設置於所述第五腔室171之內壁表面,所述第一、二、三、四、五部分11、12、15、16、17皆不位於同一水平面(呈現高度差)。 請參閱第4、4a圖,係為本創作均溫板結構之第四實施例立體剖視圖,如圖所示,本實施例部分結構與前述第一實施例相同,故在此將不再贅述,惟本實施例與前述第三實施例之不同處在於,所述本體1具有一第六部分18,所述第六部分18呈長型板狀兩端分別與該第一部分11及該第四部分16垂直連接,所述第六部分18具有一第六腔室181並該毛細結構13延伸設置於所述第六腔室181之內壁表面,所述第一~六腔室111、121、141、151、161、171、181係相互連通。 第4a圖係為本實施例另一實施態樣,如圖所示,所述第四部分16係由中央部位區分為兩部分,第四部分16一部分與所述第六部分18連接,第四部分16的另一部分與該第二部分12連接,即本實施態樣之第四部分16分別獨立與該第二、六部分12、18連接。 所述第四部分16靠近末端處垂直彎折延伸,並於該部分串套複數散熱鰭片2,本實施例之第四部分16與該第五部分17具有一高度差,該高度差可由設計者針對所欲設計之空間以及對應搭配之發熱源自由調整位置及高度,本實施例係運用高低差所產生之空間另外設置散熱鰭片2串套於該第四、五部分16、17外部,以及設置於該第一部分11之接觸發熱源部位的另一側,藉由該散熱鰭片2之設置增加散熱效果,並且由於各部位所設置之散熱鰭片2方向不同,可獲得不同方向輻射散熱效果不產生積熱現象。 透過本創作均溫板結構將均溫板設置為兩大部分並同時提供大面積及遠端熱傳導之導熱結構進而解決習知將均溫板及熱管透過搭接或焊接設置所產生之熱阻現象的缺失,並且該等部位內部之腔室相互連通可令熱傳導效能更為迅速者,並且除了提供大面積吸熱及遠端引導的熱傳導外,同時搭配其散熱元件(如散熱鰭片或散熱器等)亦可迅速迅速將熱量傳導給所搭配之散熱元件加速散熱效率。The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings. Please refer to FIG. 1 , which is a perspective cross-sectional view of a first embodiment of a temperature equalizing plate structure. As shown in the figure, the temperature equalizing plate structure of the present invention comprises: a body 1; The plate body 1a and the second plate body 1b are superposed on each other. The body 1 has a first portion 11, a second portion 12, a capillary structure 13, and a working fluid 14. The first portion 11 has a first portion A chamber 111, the first portion 11 is in the shape of a flat rectangular parallelepiped, and the first portion 11 is used as a large-area heat conduction. The second portion 12 has a second chamber 121 formed by extending one end (or one side) of the first portion 11 away from the first portion 11, the second portion 12 being compared with the foregoing The outer shape of the first portion 11 is any one of a long rectangular parallelepiped or a cylinder or any geometric shape. The capillary structure 13 is disposed on the inner surfaces of the first and second chambers 111, 121, that is, the surface of the chamber inside the first and second portions 111, 121 is provided with the capillary structure 13, and the working fluid 14 Then, it is filled in the first and second chambers 111 and 121. The second portion 12 can be extended to various places for the user to use, and the first and second portions 11 and 12 are mainly arranged to conform to the structural integration having the effects of large area average temperature and distal heat conduction. The first part 11 is provided with a flat rectangular shape to provide a heat transfer uniformity effect of a large area of surface and surface, and the second part 12 is provided with a long rectangular parallelepiped or a cylinder or any geometric shape, the main purpose In order to provide heat transfer of the first portion 11 to the remote end for heat exchange heat dissipation, the design provides the advantages of integrating the large area of the temperature equalizing plate and the heat conduction at the distal end of the heat pipe, and improving the conventional uniform temperature by means of lap joint or welding. The combination of the plate and the heat pipe creates a lack of thermal resistance. Please refer to the second embodiment and the second embodiment. The difference between this embodiment and the foregoing second embodiment is that the first portion 11 has a third portion 15 extending at one end thereof, the third portion 15 has a third chamber 151, and the capillary structure 13 is also extended. On the inner surface of the third chamber 151, a part of the working fluid 14 is filled in the third chamber 151, and the second and third portions 12, 15 are not in the same horizontal plane as the first portion 11, so that the setting can be set Where there are obstructions of different heights, the second and third portions 12, 15 may optionally be arranged to avoid obstacles. Figure 2a is another embodiment of the present embodiment. As shown, the second and third portions 12, 15 are located on the same horizontal plane but at different levels from the first portion 11, and the second and third portions 12, 15 The first portion 11 extends outwardly and extends toward the left and right sides or the upper and lower sides of the first portion 11, respectively. Referring to FIG. 3, it is a perspective view of a third embodiment of the present invention. The structure of the present embodiment is the same as that of the first embodiment, and therefore will not be described here. The difference between the embodiment and the foregoing second embodiment is that the second portion 12 is connected to a fourth portion 16, and the fourth portion 16 is vertically connected to the second portion 12 to the first portion. The two portions 12 extend to the left and right sides, the fourth portion 16 has a fourth chamber 161 and the capillary structure 13 extends over the inner wall surface of the fourth chamber 161, and the third portion 15 is connected a fifth portion 17, the fifth portion 17 is vertically connected to the third portion 15 and extends to the left and right sides of the third portion 15, and the fifth portion 17 has a fifth portion. The chamber 171 and the capillary structure 13 are disposed on the inner wall surface of the fifth chamber 171, and the first, second, third, fourth, and fifth portions 11, 12, 15, 16, and 17 are not located at the same horizontal plane. (present height difference). Please refer to FIG. 4, FIG. 4a, which is a perspective cross-sectional view of the fourth embodiment of the present invention. As shown in the figure, the structure of the embodiment is the same as that of the first embodiment, and therefore will not be described again. However, the difference between the embodiment and the foregoing third embodiment is that the body 1 has a sixth portion 18, and the sixth portion 18 has elongated plate-shaped ends and the first portion 11 and the fourth portion, respectively. 16 is vertically connected, the sixth portion 18 has a sixth chamber 181 and the capillary structure 13 extends over the inner wall surface of the sixth chamber 181, the first to sixth chambers 111, 121, 141 151, 161, 171, and 181 are connected to each other. Figure 4a is another embodiment of the present embodiment. As shown, the fourth portion 16 is divided into two parts by a central portion, and a portion of the fourth portion 16 is connected to the sixth portion 18, and fourth. The other portion of the portion 16 is coupled to the second portion 12, i.e., the fourth portion 16 of the present embodiment is independently coupled to the second and sixth portions 12, 18. The fourth portion 16 extends vertically and bends near the end, and the plurality of heat dissipation fins 2 are sleeved in the portion. The fourth portion 16 of the embodiment has a height difference from the fifth portion 17, and the height difference can be designed. For the space to be designed and the corresponding heat source to adjust the position and height, the present embodiment uses the space generated by the height difference to additionally provide the heat sink fins 2 outside the fourth and fifth portions 16, 17 And disposed on the other side of the first portion 11 contacting the heat source portion, the heat dissipation effect is increased by the arrangement of the heat dissipation fins 2, and radiation dissipation in different directions can be obtained due to different directions of the heat dissipation fins 2 disposed in each portion The effect does not produce heat accumulation. Through the creation of the uniform temperature plate structure, the temperature equalizing plate is set to two parts and simultaneously provides a large-area and remote heat-conducting heat-conducting structure to solve the thermal resistance phenomenon caused by the conventional tempering plate and the heat pipe through the overlapping or welding arrangement. The absence of these, and the internal chambers of these parts can make the heat conduction more efficient, and in addition to providing large-area heat absorption and remote-guided heat conduction, together with its heat-dissipating components (such as heat sink fins or heat sinks, etc.) ) It can also quickly and quickly transfer heat to the matching heat dissipating component to accelerate the heat dissipation efficiency.

1‧‧‧本體
1a‧‧‧第一板體
1b‧‧‧第二板體
11‧‧‧第一部分
111‧‧‧第一腔室
12‧‧‧第二部分
121‧‧‧第二腔室
13‧‧‧毛細結構
14‧‧‧工作流體
15‧‧‧第三部分
151‧‧‧第三腔室
16‧‧‧第四部分
161‧‧‧第四腔室
17‧‧‧第五部分
171‧‧‧第五腔室
18‧‧‧第六部分
181‧‧‧第六腔室
2‧‧‧散熱鰭片
1‧‧‧ Ontology
1a‧‧‧ first board
1b‧‧‧Second plate
11‧‧‧Part 1
111‧‧‧First chamber
12‧‧‧Part II
121‧‧‧Second chamber
13‧‧‧Capillary structure
14‧‧‧Working fluid
15‧‧‧Part III
151‧‧‧ third chamber
16‧‧‧Part IV
161‧‧‧fourth chamber
17‧‧‧Part V
171‧‧‧ fifth chamber
18‧‧‧Part VI
181‧‧‧ sixth chamber
2‧‧‧Heat fins

第1圖係為本創作均溫板結構之第一實施例立體剖視圖; 第2圖係為本創作均溫板結構之第二實施例立體剖視圖; 第2a圖係為本創作均溫板結構之第二實施例立體剖視圖; 第3圖係為本創作均溫板結構之第三實施例立體剖視圖; 第4圖係為本創作均溫板結構之第四實施例立體剖視圖; 第4a圖係為本創作均溫板結構之第四實施例立體剖視圖。1 is a perspective cross-sectional view showing a first embodiment of a uniform temperature plate structure; FIG. 2 is a perspective cross-sectional view showing a second embodiment of the creation of a uniform temperature plate structure; 2 is a perspective cross-sectional view showing a third embodiment of the present invention, and FIG. 4 is a perspective cross-sectional view showing a fourth embodiment of the structure of the temperature equalizing plate; A perspective cross-sectional view of a fourth embodiment of the present homogeneous temperature plate structure.

Claims (10)

一種均溫板結構,係包含: 一本體,所述本體由一第一板體及一第二板體相互疊合所組成,該本體具有: 一第一部分,具有一第一腔室; 一第二部分,具有一第二腔室,該第二部分由該第一部分一端向遠離該第一部分方向延伸所形成; 一毛細結構,設置於該第一、二腔室內部表面; 一工作流體,填充於該第一、二腔室內。A uniform temperature plate structure, comprising: a body, the body is composed of a first plate body and a second plate body superposed on each other, the body has: a first portion, having a first chamber; a second portion having a second chamber formed by an end of the first portion extending away from the first portion; a capillary structure disposed on the surface of the first and second chambers; a working fluid, filled In the first and second chambers. 如申請專利範圍第1項所述之均溫板結構,其中所述第一部分一端延伸有一第三部分,所述第三部分具有一第三腔室,所述毛細結構亦延伸設置於該第三腔室內部表面,部分工作流體填充於該第三腔室內。The temperature equalizing plate structure according to claim 1, wherein the first portion has a third portion extending at one end, the third portion has a third chamber, and the capillary structure is also extended to the third portion. Inside the chamber surface, a portion of the working fluid is filled in the third chamber. 如申請專利範圍第2項所述之均溫板結構,其中所述第二、三部分部分與該第一部分不在同一水平面。The uniform temperature plate structure of claim 2, wherein the second and third portions are not in the same horizontal plane as the first portion. 如申請專利範圍第2項所述之均溫板結構,其中所述第一部分係呈扁平長方體狀,該第二部分呈長條狀的長方體或圓柱體其中任一。The uniform temperature plate structure according to claim 2, wherein the first portion is in the shape of a flat rectangular parallelepiped, and the second portion is in the form of a long rectangular parallelepiped or a cylinder. 如申請專利範圍第2項所述之均溫板結構,其中所述第二部分連接一第四部分,所述第四部分呈長型板狀與該第二部分垂直連接,向所述第二部分左、右兩側延伸,所述第四部分具有一第四腔室並該毛細結構延伸設置於所述第四腔室之內壁表面,所述第三部分連接一第五部分,所述第五部分呈長型板狀與該第三部分垂直連接向所述第三部分左、右兩側延伸,所述第五部分具有一第五腔室並該毛細結構延伸設置於所述第五腔室之內壁表面。The temperature equalizing plate structure according to claim 2, wherein the second portion is connected to a fourth portion, and the fourth portion is formed in a long plate shape and vertically connected to the second portion, to the second portion Extending partially on the left and right sides, the fourth portion has a fourth chamber and the capillary structure extends on an inner wall surface of the fourth chamber, and the third portion is connected to a fifth portion, The fifth portion has a long plate shape and is vertically connected to the third portion to extend to the left and right sides of the third portion, the fifth portion has a fifth chamber and the capillary structure is extended to the fifth portion. The inner wall surface of the chamber. 如申請專利範圍第5項所述之均溫板結構,其中所述第一、二、三、四、五部分皆不位於同一水平面。The uniform temperature plate structure according to claim 5, wherein the first, second, third, fourth, and fifth portions are not located in the same horizontal plane. 如申請專利範圍第5項所述之均溫板結構,其中所述本體具有一第六部分,所述第六部分呈長型板狀兩端分別與該第一部分及該第四部分垂直連接,所述第六部分具有一第六腔室並該毛細結構延伸設置於所述第六腔室之內壁表面。The uniform temperature plate structure according to claim 5, wherein the body has a sixth portion, and the sixth portion has a long plate-shaped two ends respectively connected perpendicularly to the first portion and the fourth portion. The sixth portion has a sixth chamber and the capillary structure extends from an inner wall surface of the sixth chamber. 如申請專利範圍第7項所述之均溫板結構,其中所述所述第一~六腔室係相互連通。The uniform temperature plate structure according to claim 7, wherein the first to sixth chambers are in communication with each other. 如申請專利範圍第7項所述之均溫板結構,其中所述第四部分靠近末端處垂直彎折延伸,並於該部分串套複數散熱鰭片。The uniform temperature plate structure according to claim 7, wherein the fourth portion extends perpendicularly to the end portion, and the plurality of heat dissipation fins are sleeved in the portion. 如申請專利範圍第1項所述之均溫板結構,其中所述第一部分一側設置有複數散熱鰭片。The temperature equalizing plate structure according to claim 1, wherein a plurality of heat dissipating fins are disposed on one side of the first portion.
TW107208816U 2018-06-29 2018-06-29 Heat-spreading board structure TWM566351U (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10760855B2 (en) 2018-11-30 2020-09-01 Furukawa Electric Co., Ltd. Heat sink
TWI722690B (en) * 2018-11-30 2021-03-21 日商古河電氣工業股份有限公司 Heat sink
TWI748294B (en) * 2018-11-30 2021-12-01 日商古河電氣工業股份有限公司 Heat sink

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10760855B2 (en) 2018-11-30 2020-09-01 Furukawa Electric Co., Ltd. Heat sink
TWI722690B (en) * 2018-11-30 2021-03-21 日商古河電氣工業股份有限公司 Heat sink
TWI748294B (en) * 2018-11-30 2021-12-01 日商古河電氣工業股份有限公司 Heat sink

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