TWM497420U - Heat dissipation system for electronic device - Google Patents

Description

Heat dissipation system for electronic components

The present invention relates to a structural design of a heat dissipation system for electronic components; in particular, an arrangement of a heat transfer unit protruding cover body and a metal layer combined with a heat pipe to increase the heat dissipation area of an electronic component and to assist in improving an electronic component The new type of heat removal efficiency.

It has been customary to apply a plurality of arranged fins or fin structures to dissipate the waste heat generated by the electronic components or the computer's central processing unit to maintain their operational efficiency or to avoid a crash. Conventional techniques have disclosed an integrally formed aluminum extruded cut-off heat sink, or a separate manufacturing of the heat sink panel from the heat sink fins, which is assembled or welded into a unitary structure. For example, Taiwan Patent No. 86116954 "Heat Dissipation Fin Assembly Method and Products" patent application provides a typical embodiment. As those skilled in the art know, this technique is cumbersome in manufacturing, processing, and difficulty.

Conventional techniques have also disclosed a means of providing a shaft hole in a fin or fin through which a shaft or tube is passed to assemble and assemble into a unitary structure. For example, a typical embodiment is provided in the "Coupling Structure of Heat Sink" No. 91209087 or the "Fixed Fin Structure Improvement" Patent No. 94,052, 324.

Conventional techniques have also disclosed a concept of providing a groove or slot on the side or upper and lower ends of the fin or fin, a corresponding step or snap fit, to assemble the assembly into a unitary structure. For example, No. 92211053 "Heat sink structure", No. 91213373 "Fixed fin fixed structure improvement", No. 86221373 "Combined heat sink fin structure", No. 93218949 "Heat sink group fastening structure", or No. 91208823 A feasible embodiment has also been provided for the "combination structure of heat sink fins" and the like.

Typically, these references show the structural techniques involved in applying thermal dissipation structures to electronic components. Conventional heat sink or fin structures often tend to use more complex structural combinations such as shafts or tubes, slots, complex protrusions, or snap fits. If the redesigning design considers the heat dissipation system to make it different from the conventional one, it will change its use form, which is different from the old one. For example, the structural design of the device conforms to a simplified and convenient combination condition, and the heat conducting unit is used to protrude the cover body, combine the metal layer, the heat pipe, and/or have the functions of dustproof protection, electromagnetic interference, etc.; or according to each electronic component. Position, the path of the heat dissipation system is arranged to increase the heat dissipation area of the electronic component, reduce the thermal resistance, and improve the heat dissipation efficiency; and these problems are not disclosed in the above reference materials.

Therefore, the main purpose of the present invention is to provide a heat dissipation system for electronic components, which provides a simple structure and combination, has dustproof protection, prevents electromagnetic interference, and improves heat dissipation efficiency. The heat dissipation system includes a heat conduction unit disposed on an electronic component (defined as a heat source component) that generates waste heat; a cover body and a cover system respectively coat the heat source component and the electronic component. The cover has an opening for allowing at least a partial area of the heat conducting unit to protrude; a metal layer forming a geometric profile is provided to combine the heat conducting unit and the secondary cover; and a heat pipe containing a cooling fluid is disposed on the metal layer. Therefore, the thermal energy of the heat source element can be directly transmitted to the metal layer and the heat pipe (or the cover body, the sub cover body) through the heat conduction unit; to establish a position according to the position of the electronic component or the heat source component, to arrange the cover body, the metal layer and The heat pipe path is used to establish a function of reducing thermal resistance and increasing heat dissipation area.

According to the heat dissipation system for electronic components of the present invention, the heat conducting unit is in the form of a piece having a first end and a second end; the first end is superposed on the heat source element. Corresponding to the second end of the heat conducting unit, the rigid wall of the cover system is defined as a plate-like body or a box body having an upper wall surface; and the opening is formed on the upper wall surface, so that the second end of the heat conducting unit protrudes from the cover Body, bonding the metal layer. Therefore, the structural form of the conductive unit protruding opening connected to the heat pipe can significantly reduce the thermal resistance, so that the thermal energy of the electronic component is directly transmitted to the heat pipe through the heat conducting unit for rapid output.

According to the improved structure of the heat dissipation system for electronic components of the present invention, the metal layer has a first surface and a second surface; the first surface of the metal layer is connected to the second end and/or the sub-cover of the heat-conducting unit; The second side of the layer is provided in combination with the heat pipe. The metal layer is formed into a film or sheet structure for forming a large contact area or a heat dissipating area with the outside, and the heat pipe is used to transfer heat energy or heat to other areas to be quickly discharged to prevent heat concentration.

Referring to Figures 1, 2 and 3, the heat dissipation system for electronic components of the present invention includes a heat transfer unit 10 disposed on an electronic component that generates waste heat during operation; in the embodiment employed, the waste heat is generated. The electronic component is defined as the heat source component 20. Basically, the heat source element 20 and other electronic components 25 that do not generate waste heat are disposed on a circuit board 40.

In the embodiment taken, the heat conducting unit 10 selects a material capable of conducting thermal energy to form a geometrically contoured block structure having a first end 11 and a second end 12; the first end 11 and The second end 12 is respectively formed with a structure of the planes 13, 14, and the first end 11 (or the plane 13) is superposed on the heat source element 20 to conduct waste heat (or heat energy) generated when the heat source element 20 operates. .

The heat dissipation system also includes a cover 30 and a cover 35 that respectively enclose the heat source element 20 and the electronic component 25; the cover 30 is combined with the heat transfer unit 10. In detail, the cover body 30 and the sub-lid body 35 respectively have a rigid wall 31, 36, and the cover body 30 and the sub-lid body 35 define a casing (or plate-like body) structure having internal spaces 32, 37.

In the embodiment taken, the cover 30 (or rigid wall 31) has an upper wall surface 33 and an opening 34 formed in the upper wall surface 33; the secondary cover 35 or its rigid wall 36 also has an upper wall surface 38. And, the second end 12 of the heat conducting unit 10 protrudes from the opening 34 to engage a geometrically contoured metal layer 60.

It should be noted that the heat transfer unit 10 protrudes from the opening 34 directly to the structural design of the metal layer 60, so that the heat conduction unit 10 can directly transfer the waste heat (or thermal energy) generated when the electronic component 20 operates to the output form of the metal layer 60. It is obvious that the effect of reducing the thermal resistance can be obtained.

The metal layer 60 has a first surface 61 and a second surface 62. The first surface 61 of the metal layer 60 connects the second end 12 of the heat conducting unit 10 and/or the upper wall surface 38 of the secondary cover 35. The second face 62 of the metal layer 60 is provided with a heat pipe 50 in combination.

It is possible that the first face 61 of the metal layer 60 can be welded or bonded to the second end 12 of the heat conducting unit and/or the upper wall 38 of the secondary cover 35. The metal layer 60 is formed as a film or sheet structure having an area larger than the area of the cover 30 or the sub-cover 35 for forming a large contact area or a heat dissipating area with the outside, and the thermal energy of the heat pipe 50 is combined with the heat transfer. Or the heat is quickly discharged.

It can be understood that the structural combination of the heat conducting unit 10 and the cover 30 and the metal layer 60 significantly increases the heat dissipation area of the heat source element 20; and, the cover 30 and the sub-cover 35 also face the heat source element 20 and The electronic component 25 provides grounding and protection against dust, magnetic conduction or electromagnetic interference.

Figures 1, 2 and 3 show that the heat dissipation system also includes the heat pipe 50; the heat pipe 50 is combined on the second side 62 of the metal layer and contains the cooling fluid 55. Specifically, the heat pipe 50 can be welded or bonded to bond the metal layer 60. Therefore, the waste heat or heat generated by the operation of the heat source element 20 can be directly conducted to the metal layer 60 and the heat pipe 50 (or the sub-cover 35) via the heat conduction unit 10, and is cooled and exchanged and output through the heat pipe 50. That is to say, the heat pipe 50 can quickly guide the heat energy away from the heat source region and guide the heat energy to other lower temperature regions to prevent heat concentration.

In a modified embodiment, a portion or all of the metal layer 60 may be provided with a coating of heat radiating material (not shown) to establish a radiant heat dissipation effect.

It should be noted that the cover 30 (and/or the sub-cover 35) and the metal layer 60 and the heat pipe 50 are arranged according to the position of the heat source element 20 (and/or the electronic component 25), so that the heat source element 20 is generated. The waste heat or heat energy can be directly transmitted to the metal layer 60, the heat pipe 50 or the cover body 30, the sub-cover body 35 via the heat conduction unit 10, and the metal layer 60 and the heat pipe 50 are arranged in a path to output waste heat to obtain a reduced thermal resistance and an increase. The role of the heat dissipation area of the heat dissipation system. That is, the waste heat (or thermal energy) generated by the heat source element 20 is not only directly transmitted to the cover body 30, the heat pipe 50, and the metal layer 60 through the heat conduction unit 10 connected thereto; but also includes the sub cover 35 in which the metal layer 60 is arranged and connected. . Therefore, the heat dissipation area of this heat dissipation system is significantly increased.

Typically, this heat dissipation system for electronic components has the following considerations and advantages compared with the old ones under the conditions of dust protection and electromagnetic interference prevention: 1. The heat dissipation system and Related component structure, operational use, etc., have been redesigned, and different from the practitioner; and, changed its use type, and is different from the old method. For example, the heat source unit 20 is coupled to the heat conducting unit 10, the cover body 30, or the heat conducting unit 10 includes a first end 11 and a second end 12, and the opening 34 is provided in the cover body 30 to protrude the second end 12 of the heat conducting unit. The cover body 30 directly combines the structural design of the metal layer 60 and the heat pipe 50 to form a contact area of a large area and reduce the structural structure of the heat resistance portion, etc., thereby improving the heat dissipation or waste heat discharge effect. 2. The cover 30 (and/or the sub-cover 35), the metal layer 60 and the heat pipe 50 are arranged according to the position of the heat source element 20 (and/or the electronic component 25), so that the waste heat or heat generated by the heat source element 20 can be The heat transfer unit 10 and the metal layer 60, the heat pipe 50 path arrangement or the connection cover 30, the sub-cover 35 and the like are discharged, so that the heat dissipation area of the heat dissipation system is obviously increased. 3. The heat conducting unit 10 cooperates with the cover body 30 to make the second end 12 protrude from the opening 14, and the structural design of the metal layer 60 or the sub-cover body 35 is arranged in the path of the combined heat pipe 50. The removal of the conventional heat dissipation structure tends to apply the shaft or More complicated structural combinations such as tubes, slots, complex protrusions or snaps. It is apparent that a structural design that is more compact and convenient to combine than the prior art is provided.

Therefore, this creation department provides an effective heat dissipation system for electronic components. Its spatial type is different from the well-known ones, and it has the advantages unmatched in the old law. It shows considerable progress and has been fully charged. A copy of the requirements of the new patent.

However, the above is only a feasible embodiment of the present invention, and is not intended to limit the scope of the present invention, that is, the equivalent changes and modifications made by the scope of the patent application of the present invention are covered by the scope of the creative patent. .

10‧‧‧thermal unit

11‧‧‧ first end

12‧‧‧ second end

13, 14‧‧ ‧ plane

20‧‧‧Heat source components

25‧‧‧Electronic components

30‧‧‧ cover

31, 36‧‧‧ rigid walls

32, 37‧‧‧ internal space

33, 38‧‧‧ upper wall

34‧‧‧ openings

35‧‧‧Sub-cover

40‧‧‧ boards

50‧‧‧heat pipe

55‧‧‧Cooling fluid

60‧‧‧metal layer

61‧‧‧ first side

62‧‧‧ second side

Figure 1 is a schematic diagram showing the structure of an embodiment of the present creation.

Fig. 2 is a schematic exploded view of the structure of Fig. 1; showing the arrangement of electronic components, heat source components, heat conducting units, covers, sub-covers, metal layers, and heat pipes.

Fig. 3 is a schematic cross-sectional view showing the structure of the present invention; the combination of the electronic component, the heat source component, the heat conduction unit, the cover body, the sub-cover body, the metal layer and the heat pipe are depicted.

10‧‧‧thermal unit

11‧‧‧ first end

12‧‧‧ second end

13, 14‧‧ ‧ plane

20‧‧‧Heat source components

25‧‧‧Electronic components

30‧‧‧ cover

31, 36‧‧‧ rigid walls

32, 37‧‧‧ internal space

33, 38‧‧‧ upper wall

34‧‧‧ openings

35‧‧‧Sub-cover

40‧‧‧ boards

50‧‧‧heat pipe

60‧‧‧metal layer

61‧‧‧ first side

62‧‧‧ second side

Claims (13)

A heat dissipation system for an electronic component, comprising: a heat conduction unit disposed on a heat source component that generates waste heat; a cover body and a secondary cover body respectively covering a heat source component and other electronic components that do not generate waste heat; a cover body and a pair The cover body respectively has a rigid wall, and the cover body and the auxiliary cover body form a box structure having an inner space; the cover body has an opening for allowing at least a partial area of the heat conduction unit to protrude; a metal layer forming a geometric contour Combining the heat conduction unit; a heat pipe including a cooling fluid is disposed on the metal layer; and at least one of the cover body, the metal layer and the heat pipe path is arranged according to a position of the heat source element, and the heat energy of the heat source element is passed through the heat conduction unit Directly conducted to the metal layer output. A heat dissipation system for an electronic component according to claim 1, wherein the rigid wall of the sub-cover has an upper wall surface; and the metal layer is connected to the upper wall surface of the sub-lid. The heat dissipation system for an electronic component according to claim 1 or 2, wherein the heat conduction unit is a thermally conductive material having a geometrically contoured block structure having a first end and a first a second end; the first end is superposed on the heat source element; the cover rigid wall has an upper wall surface, the opening is formed on the upper wall surface; and the second end of the heat conduction unit protrudes the opening to engage the metal layer. A heat dissipation system for an electronic component according to claim 3, wherein the first end and the second end of the heat conduction unit are respectively formed with a plane; and the plane of the second end is joined to the metal layer. The heat dissipation system for an electronic component according to claim 3, wherein the metal layer has a first surface and a second surface; the first surface of the metal layer is connected to the second end of the heat conduction unit; the metal layer The second side is provided with the heat pipe; the metal layer is set to one of a film and a sheet structure; and the metal layer has an area larger than the cover area. The heat dissipation system for an electronic component according to claim 4, wherein the metal layer has a first surface and a second surface; the first surface of the metal layer is connected to the second end of the heat conduction unit; the metal layer The second side is provided with the heat pipe; the metal layer is set to one of a film and a sheet structure; and the metal layer has an area larger than the cover area. A heat dissipation system for an electronic component according to claim 1 or 2, wherein one of a part and a whole of the metal layer is provided with a coating of a heat radiating substance. A heat dissipation system for an electronic component according to claim 5, wherein one of a part and a whole of the metal layer is provided with a coating of a heat radiating substance. A heat dissipation system for an electronic component according to claim 6, wherein one of a part and a whole of the metal layer is provided with a coating of a heat radiating substance. The heat dissipation system for electronic components according to claim 3, wherein one of the metal layer is welded and bonded on the heat conduction unit; and one of the heat pipe welding and bonding is disposed on the metal layer on. The heat dissipation system for electronic components according to claim 6, wherein one of the metal layer is welded and bonded on the heat conduction unit; and one of the heat pipe welding and bonding is disposed on the metal layer. on. The heat dissipation system for an electronic component according to claim 7, wherein one of the metal layer is welded and bonded on the heat conduction unit; and one of the heat pipe welding and bonding is disposed on the metal layer. on. A heat dissipation system for an electronic component according to claim 1 or 2, wherein the heat source component and the electronic component are disposed on a circuit board.