TWM497419U - Heat dissipation module structure improvement for electronic device - Google Patents

Description

Improved structure of heat dissipation module for electronic components

The present invention relates to a structural design of a heat dissipation module for an electronic component; in particular, a novel application in which a heat conduction unit protrudes from a cover body and a heat pipe to assist heat discharge of an electronic component.

It has been customary to apply a plurality of arranged fins or fin structures to dissipate the waste heat generated by the electronic components or the computer's central processing unit to maintain their operational efficiency or to avoid a crash. Conventional techniques have disclosed an integrally formed aluminum extruded cut-off heat sink, or a separate manufacturing of the heat sink panel from the heat sink fins, which is assembled or welded into a unitary structure. For example, Taiwan Patent No. 86116954 "Heat Dissipation Fin Assembly Method and Products" patent application provides a typical embodiment. As those skilled in the art know, this technique is cumbersome in manufacturing, processing, and difficulty.

Conventional techniques have also disclosed a means of providing a shaft hole in a fin or fin through which a shaft or tube is passed to assemble and assemble into a unitary structure. For example, a typical embodiment is provided in the "Coupling Structure of Heat Sink" No. 91209087 or the "Fixed Fin Structure Improvement" Patent No. 94,052, 324.

Conventional techniques have also disclosed a concept of providing a groove or slot on the side or upper and lower ends of the fin or fin, a corresponding step or snap fit, to assemble the assembly into a unitary structure. For example, No. 92211053 "Heat sink structure", No. 91213373 "Fixed fin fixed structure improvement", No. 86221373 "Combined heat sink fin structure", No. 93218949 "Heat sink group fastening structure", or No. 91208823 A feasible embodiment has also been provided for the "combination structure of heat sink fins" and the like.

Typically, these references show the structural techniques involved in applying thermal dissipation structures to electronic components. Conventional heat sink or fin structures often tend to use more complex structural combinations such as shafts or tubes, slots, complex protrusions, or snap fits. If the redesigning design considers the heat dissipation structure to make it different from the conventional one, it will change its use form, which is different from the old one. For example, its structural design conforms to a streamlined condition, or it is convenient to combine, and has the functions of dustproof protection, electromagnetic interference prevention, and heat dissipation efficiency; and these problems are not disclosed in the above reference materials.

Therefore, the main purpose of the present invention is to provide an improved structure for a heat dissipation module for electronic components, which provides a structure and a simple combination, and has the functions of dustproof protection, electromagnetic interference prevention, and heat dissipation efficiency. The heat dissipation module includes a heat conduction unit disposed on an electronic component. A cover system having an opening encloses the electronic component and causes the thermally conductive unit to protrude at least in part from the opening; and a heat pipe containing a cooling fluid is coupled to the thermally conductive unit. Therefore, the structural form of the conductive unit protruding opening connected to the heat pipe can significantly reduce the thermal resistance, so that the thermal energy of the electronic component is directly transmitted to the heat pipe through the heat conducting unit for rapid output.

According to the improved structure of the heat dissipation module for electronic components of the present invention, the heat conduction unit is in the form of a block having a first end and a second end; the first end is superposed on the electronic component. Corresponding to the second end of the heat conducting unit, the rigid wall of the cover system is defined as a plate-like body or a box body having an upper wall surface; and the opening is formed on the upper wall surface, so that the second end of the heat conducting unit protrudes from the cover Body, joining the heat pipe.

Referring to Figures 1, 2 and 3, the improved heat dissipation module structure for electronic components includes a heat conducting unit 10 disposed on an electronic component 20. Basically, the electronic component 20 is disposed on a circuit board 40. In the embodiment taken, the heat conducting unit 10 selects a material capable of conducting thermal energy to form a geometrically contoured block structure having a first end 11 and a second end 12; the first end 11 and The second ends 12 are respectively formed with a structure of the planes 13, 14, and the first end 11 (or the plane 13) is superposed on the electronic component 20 to conduct waste heat (or thermal energy) generated when the electronic component 20 operates. .

The heat dissipation module also includes a cover 30 that encloses the electronic component 20 and is combined with the heat transfer unit 10. In detail, the cover 30 has a rigid wall 31 defining a cover 30 to form a box (or plate-like body) structure having an internal space 32; the cover 30 (or the rigid wall 31) has an upper portion The wall surface 33 and an opening 34 formed in the upper wall surface 33. And, the second end 12 of the heat conducting unit 10 protrudes from the opening 34 to engage a heat pipe 50.

It should be noted that the heat transfer unit 10 protrudes from the opening 34 directly to the structural design of the heat pipe 50, so that the heat transfer unit 10 can directly transfer the waste heat (or thermal energy) generated when the electronic component 20 operates to the heat pipe 50 to quickly output the type. It is obvious that the effect of reducing the thermal resistance can be obtained.

It can be understood that the structural combination of the heat conducting unit 10 and the cover 30 significantly increases the heat dissipation area of the electronic component 20; and the cover 30 also provides grounding and dustproof protection, magnetic conduction or Prevent electromagnetic interference and other effects.

Figures 1, 2 and 3 also show that the heat dissipation module also includes the heat pipe 50; the heat pipe 50 is combined on the second end 12 (or plane 14) of the heat conduction unit 10 and contains a cooling fluid 55. Specifically, the heat pipe 50 is welded or bonded to the second end 12 (or plane 14) of the heat conducting unit 10. Therefore, the waste heat (or thermal energy) generated by the operation of the electronic component 20 can be directly conducted to the cover body 30 and the heat pipe 50 via the heat conduction unit 10, and is cooled and exchanged and output through the heat pipe 50. That is to say, the heat pipe 50 can quickly guide the heat energy away from the heat source region and guide the heat energy to other lower temperature regions to prevent heat concentration.

Typically, the improved structure of the heat dissipation module for electronic components has the following considerations and advantages compared with the old method under the conditions of dust protection and electromagnetic interference prevention: 1. The structure of the heat-dissipating module and related components, operating conditions, etc., have been re-designed, and are different from the practitioners; and, changing its use type, is different from the old method. For example, the electronic component 20 is coupled to the heat-conducting unit 10, the cover 30, or the heat-conducting unit 10 includes a first end 11 and a second end 12, and the cover 30 is provided with an opening 34 to make the second end 12 of the heat-conducting unit protrude. The cover body 30, combined with the structural design of the heat pipe 50, forms a contact area of a large area and reduces the structural structure of the heat resistance portion, etc., thereby improving its heat dissipation or waste heat discharge effect. 2. The heat conducting unit 10 cooperates with the cover 30 to make the second end 12 protrude from the opening 14. The structural design of the combined heat pipe 50 removes the conventional heat dissipation structure and tends to apply a shaft or a tube, a slot, a complex protrusion or The fasteners correspond to a more complicated structural combination such as fastening. It is apparent that a structural design that is more compact and convenient to combine than the prior art is provided.

Therefore, this creation department provides an effective heat-dissipating module improved structure for electronic components, and its spatial pattern is different from the conventional ones, and has the advantages unmatched in the old method, showing considerable progress. Cheng has fully met the requirements of the new patent.

However, the above is only a feasible embodiment of the present invention, and is not intended to limit the scope of the present invention, that is, the equivalent changes and modifications made by the scope of the patent application of the present invention are covered by the scope of the creative patent. .

10‧‧‧thermal unit

11‧‧‧ first end

12‧‧‧ second end

13, 14‧‧ ‧ plane

20‧‧‧Electronic components

30‧‧‧ cover

31‧‧‧Rigid wall

32‧‧‧Internal space

33‧‧‧Upper wall

34‧‧‧ openings

40‧‧‧ boards

50‧‧‧heat pipe

55‧‧‧Cooling fluid

Figure 1 is a schematic diagram showing the structure of an embodiment of the present creation.

Fig. 2 is a schematic exploded view of the structure of Fig. 1; showing the arrangement of electronic components, heat conducting units, covers, and heat pipes.

Fig. 3 is a schematic cross-sectional view showing the structure of the present invention; the combination of the electronic component, the heat conducting unit, the cover body and the heat pipe is depicted.

10‧‧‧thermal unit

11‧‧‧ first end

12‧‧‧ second end

13, 14‧‧ ‧ plane

20‧‧‧Electronic components

30‧‧‧ cover

31‧‧‧Rigid wall

32‧‧‧Internal space

33‧‧‧Upper wall

34‧‧‧ openings

40‧‧‧ boards

50‧‧‧heat pipe

Claims (6)

An improved structure for a heat dissipation module for an electronic component, comprising: a heat conduction unit disposed on an electronic component; a cover body having a rigid wall defining a cover body to form a box structure having an internal space, covering the electronic component The cover has an upper wall surface and an opening formed on the upper wall surface; and the heat conduction unit protrudes from the opening at least in part, and a heat pipe containing the cooling fluid is combined. The improved structure of the heat dissipation module for an electronic component according to the first aspect of the invention, wherein the heat conduction unit is a material capable of conducting thermal energy to form a geometrically contoured block structure having a first end and a a second end; the first end is superposed on the electronic component; and the second end protrudes from the opening to engage the heat pipe. An improved structure for a heat dissipation module for an electronic component according to claim 2, wherein the first end and the second end are respectively formed with a plane; and the plane of the second end is joined to the heat pipe. The heat dissipation module improved structure for an electronic component according to claim 1 or 2 or 3, wherein the heat pipe is welded to the heat conduction unit. The heat dissipation module improved structure for an electronic component according to claim 1 or 2 or 3, wherein the heat pipe is bonded to the heat conduction unit. A heat dissipation module improvement structure for an electronic component according to claim 1 or 2 or 3, wherein the electronic component is disposed on a circuit board.