TWM497421U - Structure improvement of heat dissipation system for electronic device - Google Patents

Description

Improved structure for heat dissipation system of electronic components

The present invention relates to a structural design of a heat dissipation system for electronic components; in particular, an arrangement of a heat-conducting unit protruding a cover body and a heat pipe path to increase the heat dissipation area of an electronic component and to assist in improving the heat of an electronic component A new type of discharge efficiency.

It has been customary to apply a plurality of arranged fins or fin structures to dissipate the waste heat generated by the electronic components or the computer's central processing unit to maintain their operational efficiency or to avoid a crash. Conventional techniques have disclosed an integrally formed aluminum extruded cut-off heat sink, or a separate manufacturing of the heat sink panel from the heat sink fins, which is assembled or welded into a unitary structure. For example, Taiwan Patent No. 86116954 "Heat Dissipation Fin Assembly Method and Products" patent application provides a typical embodiment. As those skilled in the art know, this technique is cumbersome in manufacturing, processing, and difficulty.

Conventional techniques have also disclosed a means of providing a shaft hole in a fin or fin through which a shaft or tube is passed to assemble and assemble into a unitary structure. For example, a typical embodiment is provided in the "Coupling Structure of Heat Sink" No. 91209087 or the "Fixed Fin Structure Improvement" Patent No. 94,052, 324.

Conventional techniques have also disclosed a concept of providing a groove or slot on the side or upper and lower ends of the fin or fin, a corresponding step or snap fit, to assemble the assembly into a unitary structure. For example, No. 92211053 "Heat sink structure", No. 91213373 "Fixed fin fixed structure improvement", No. 86221373 "Combined heat sink fin structure", No. 93218949 "Heat sink group fastening structure", or No. 91208823 A feasible embodiment has also been provided for the "combination structure of heat sink fins" and the like.

Typically, these references show the structural techniques involved in applying thermal dissipation structures to electronic components. Conventional heat sink or fin structures often tend to use more complex structural combinations such as shafts or tubes, slots, complex protrusions, or snap fits. If the redesigning design considers the heat dissipation system to make it different from the conventional one, it will change its use form, which is different from the old one. For example, the structural design of the device conforms to a simplified and convenient combination of conditions, the application of the heat-conducting unit to protrude the cover body, the combination of the heat pipe, and/or the protection against dust, electromagnetic interference, etc.; or according to the position of each electronic component The path of the heat dissipation system increases the heat dissipation area of the electronic component and improves the heat dissipation efficiency; and these problems are not disclosed in the above reference materials.

Therefore, the main purpose of the present invention is to provide an improved structure for the heat dissipation system of electronic components, which provides a structure and a simple combination, and has the functions of dustproof protection, electromagnetic interference prevention, and heat dissipation efficiency. The heat dissipation system includes a heat conduction unit disposed on an electronic component (defined as a heat source component) that generates waste heat; a cover body and a cover system respectively coat the heat source component and the electronic component. The cover has an opening that allows at least a partial area of the heat conducting unit to protrude; and a heat pipe containing a cooling fluid is disposed through the cover and the secondary cover. Therefore, the thermal energy of the heat source element can be directly transmitted to the heat pipe or the cover body and the sub cover body output through the heat conduction unit; to establish a position (and/or a sub cover body) according to the position of the electronic component or the heat source component, and Heat pipe path to establish a role in reducing thermal resistance and increasing heat dissipation area.

According to the improved structure of the heat dissipation system for electronic components of the present invention, the heat conduction unit is in the form of a block having a first end and a second end; the first end is superposed on the heat source element. Corresponding to the second end of the heat conducting unit, the rigid wall of the cover system is defined as a plate-like body or a box body having an upper wall surface; and the opening is formed on the upper wall surface, so that the second end of the heat conducting unit protrudes from the cover Body, joining the heat pipe. Therefore, the structural form of the conductive unit protruding opening connected to the heat pipe can significantly reduce the thermal resistance, so that the thermal energy of the electronic component is directly transmitted to the heat pipe through the heat conducting unit for rapid output.

According to the improved structure of the heat dissipation system for electronic components of the present invention, the heat pipe has a first side, a second side and at least one side; the first side or the side of the heat pipe is connected to the second end of the heat conducting unit; The first side or the side of the heat pipe is selectively connected to the upper wall surface or the side wall area of the auxiliary cover body to establish a large heat dissipation area, and the heat pipe or the heat is quickly transmitted to other areas to be discharged to prevent heat concentration. .

Referring to Figures 1, 2 and 3, the improved structure of the heat dissipation system for electronic components includes a heat conducting unit 10 disposed on an electronic component that generates waste heat during operation; in the embodiment, the meeting An electronic component that generates waste heat is defined as a heat source component 20. Basically, the heat source element 20 and other electronic components 25 that do not generate waste heat are disposed on a circuit board 40.

In the embodiment taken, the heat conducting unit 10 selects a material capable of conducting thermal energy to form a geometrically contoured block structure having a first end 11 and a second end 12; the first end 11 and The second end 12 is respectively formed with a structure of the planes 13, 14, and the first end 11 (or the plane 13) is superposed on the heat source element 20 to conduct waste heat (or heat energy) generated when the heat source element 20 operates. .

The heat dissipation system also includes a cover 30 and a cover 35 that respectively enclose the heat source element 20 and the electronic component 25; the cover 30 is combined with the heat transfer unit 10. In detail, the cover body 30 and the sub-lid body 35 respectively have a rigid wall 31, 36, and the cover body 30 and the sub-lid body 35 define a casing (or plate-like body) structure having internal spaces 32, 37.

In the embodiment taken, the cover 30 (or rigid wall 31) has an upper wall surface 33 and an opening 34 formed in the upper wall surface 33. And, the second end 12 of the heat conducting unit 10 protrudes from the opening 34 to engage a heat pipe 50. It should be noted that the heat transfer unit 10 protrudes from the opening 34 directly to the structural design of the heat pipe 50, so that the heat transfer unit 10 can directly transfer the waste heat (or thermal energy) generated when the electronic component 20 operates to the heat pipe 50 to quickly output the type. It is obvious that the effect of reducing the thermal resistance can be obtained.

It can be understood that the structural combination of the heat conducting unit 10 and the cover 30 significantly increases the heat dissipation area of the heat source element 20; and the cover 30 and the sub-cover 35 also provide the heat source element 20 and the electronic component 25. Grounding and dust protection, magnetic conduction or electromagnetic interference.

Figures 1, 2 and 3 show that the heat dissipation system also includes the heat pipe 50; the heat pipe 50 is combined on the cover body 30 and the sub-cover body 35 and contains a cooling fluid 55. Specifically, the heat pipe 50 has a first side 51, a second side 52, and at least one side 53 which are welded or bonded, combined at the second end 12 (or plane 14) and the sub-cover of the heat conducting unit 10. The rigid wall 36 of the body 35; in this embodiment, the heat pipe 50 is joined to one of the upper wall faces 38 of the secondary cover 35. Therefore, the waste heat or heat generated by the operation of the heat source element 20 can be directly conducted to the cover body 30 and the heat pipe 50 (or the sub-cover body 35) via the heat conduction unit 10, and is cooled and exchanged and output through the heat pipe 50. That is to say, the heat pipe 50 can quickly guide the heat energy away from the heat source region and guide the heat energy to other lower temperature regions to prevent heat concentration.

It should be noted that the cover 30 (and/or the sub-cover 35) and the heat pipe 50 path are arranged according to the position of the heat source element 20 (and/or the electronic component 25), so that the waste heat or heat generated by the heat source element 20 is generated. It can be conducted to the heat pipe 50 or the cover body 30 and the auxiliary cover body 35 via the heat conduction unit 10, and is arranged along with the path of the heat pipe 50 to output waste heat to reduce the heat resistance and increase the heat dissipation area of the heat dissipation system. That is to say, the waste heat (or thermal energy) generated by the heat source element 20 is not only directly transmitted to the heat pipe 50 through the heat conducting unit 10 connected thereto, but also includes a cover body 30 and a sub-cover body 35 which are connected by the heat pipe 50. Therefore, the heat dissipation area of this heat dissipation system is significantly increased.

Please refer to Figure 4 for a modified embodiment. The arrangement of the heat pipes 50 is shown as joining the rigid walls 36 of the secondary cover 35 with the side edges 53; in the illustrated embodiment, the heat pipe sides 53 are joined to the side wall regions of the secondary cover rigid walls 36.

Typically, the improved structure of the heat dissipation system for electronic components has the following considerations and advantages compared with the old method under the conditions of dust protection and electromagnetic interference prevention: 1. The heat dissipation The system and related component structure, operational use, etc., have been redesigned, and different from the practitioner; and, changed its use type, and is different from the old method. For example, the heat source unit 20 is coupled to the heat conducting unit 10, the cover body 30, or the heat conducting unit 10 includes a first end 11 and a second end 12, and the opening 34 is provided in the cover body 30 to protrude the second end 12 of the heat conducting unit. The cover body 30, combined with the structural design of the heat pipe 50, forms a contact area of a large area, reduces the structural structure of the heat resistance and the like, and improves its heat dissipation or waste heat discharge effect. 2. The cover 30 (and/or sub-cover 35) and the heat pipe 50 are arranged in accordance with the position of the heat source element 20 (and/or the electronic component 25) such that waste heat or heat generated by the heat source element 20 can pass through the heat transfer unit 10. And the heat pipe 50 path arrangement or the connection cover 30, the sub-cover 35 and the like are discharged, so that the heat dissipation area of the heat dissipation system is obviously increased. 3. The heat conducting unit 10 cooperates with the cover body 30 to make the second end 12 protrude from the opening 14, the path arrangement of the combined heat pipe 50 or the structural design of the auxiliary cover body 35, and the removal of the conventional heat dissipation structure tends to apply the shaft or tube, and insert More complicated structural combinations such as grooves, complex protrusions or snaps. It is apparent that a structural design that is more compact and convenient to combine than the prior art is provided.

Therefore, this creation department provides an effective improved structure for the heat dissipation system of electronic components. Its spatial form is different from the conventional ones, and it has the advantages unmatched in the old law. It shows considerable progress. It has fully met the requirements of the new patent.

However, the above is only a feasible embodiment of the present invention, and is not intended to limit the scope of the present invention, that is, the equivalent changes and modifications made by the scope of the patent application of the present invention are covered by the scope of the creative patent. .

10‧‧‧thermal unit

11‧‧‧ first end

12‧‧‧ second end

13, 14‧‧ ‧ plane

20‧‧‧Heat source components

25‧‧‧Electronic components

30‧‧‧ cover

31, 36‧‧‧ rigid walls

32, 37‧‧‧ internal space

33, 38‧‧‧ upper wall

34‧‧‧ openings

35‧‧‧Sub-cover

40‧‧‧ boards

50‧‧‧heat pipe

51‧‧‧ first side

52‧‧‧ second side

53‧‧‧ side

55‧‧‧Cooling fluid

Figure 1 is a schematic diagram showing the structure of an embodiment of the present creation.

Fig. 2 is a schematic exploded view of the structure of Fig. 1; showing the arrangement of electronic components, heat source components, heat conducting units, covers, sub-covers, and heat pipes.

Fig. 3 is a schematic cross-sectional view showing the structure of the present invention; the combination of the electronic component, the heat source component, the heat conduction unit, the cover body, the sub-cover body and the heat pipe are depicted.

Figure 4 is a schematic view showing the structural combination of another embodiment of the present invention; depicting the cooperation of the heat pipe path and the cover body and the sub-cover body.

10‧‧‧thermal unit

11‧‧‧ first end

12‧‧‧ second end

13, 14‧‧ ‧ plane

20‧‧‧Heat source components

25‧‧‧Electronic components

30‧‧‧ cover

31, 36‧‧‧ rigid walls

32‧‧‧Internal space

33, 38‧‧‧ upper wall

34‧‧‧ openings

35‧‧‧Sub-cover

40‧‧‧ boards

50‧‧‧heat pipe

51‧‧‧ first side

52‧‧‧ second side

53‧‧‧ side

Claims (9)

An improved structure for a heat dissipation system for an electronic component, comprising: a heat conduction unit disposed on a heat source component that generates waste heat; a cover body and a secondary cover body respectively covering the heat source component and other electronic components that do not generate waste heat; And the auxiliary cover body respectively has a rigid wall, and the cover body and the auxiliary cover body form a box structure having an inner space; the cover body has an opening for allowing the heat conduction unit to protrude at least partially from the cover body; and the cooling fluid is included The heat pipe is disposed through the heat conduction unit; and the cover body and the heat pipe path are arranged according to the position of the heat source element, so that the heat energy of the heat source element can be directly conducted to the heat pipe output through the heat conduction unit. An improved structure for a heat dissipation system for an electronic component according to claim 1, wherein the rigid wall of the sub-cover has an upper wall surface and a side wall; and the heat pipe path is also connected to the upper wall surface and the side wall of the sub-lid body. At least one of them. An improved structure for a heat dissipation system for an electronic component according to claim 1, wherein the heat pipe has a first side, a second side, and at least one side; and the first side and the side of the heat pipe One of the heat conduction units is connected. An improved structure for a heat dissipation system for an electronic component according to claim 2, wherein the heat pipe has a first side, a second side, and at least one side; and the first side and the side of the heat pipe One of the sub-covers is connected. An improved structure for a heat dissipating system for an electronic component according to claim 1 or 2 or 3 or 4, wherein the thermally conductive unit is a thermally conductive material having a geometrically contoured block structure having a a first end and a second end; the first end is superposed on the heat source element; the cover rigid wall has an upper wall surface, the opening is formed on the upper wall surface; and the second end of the heat conduction unit protrudes the opening Join the heat pipe. An improved structure for a heat dissipation system for an electronic component according to claim 5, wherein the first end and the second end of the heat conduction unit are respectively formed with a plane; and the plane of the second end is joined to the heat pipe. The heat dissipation system improved structure for an electronic component according to claim 3, wherein one of the heat pipe welding and bonding is disposed on the heat conduction unit. An improved structure for a heat dissipation system for an electronic component according to claim 4, wherein one of the heat pipe welding and bonding is disposed on the sub-cover. The heat dissipation system improvement structure for an electronic component according to claim 5, wherein the heat source component and the electronic component are disposed on a circuit board.