TWM516708U - Water cooling equipment - Google Patents

Water cooling equipment Download PDF

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Publication number
TWM516708U
TWM516708U TW104216169U TW104216169U TWM516708U TW M516708 U TWM516708 U TW M516708U TW 104216169 U TW104216169 U TW 104216169U TW 104216169 U TW104216169 U TW 104216169U TW M516708 U TWM516708 U TW M516708U
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Taiwan
Prior art keywords
heat exchange
storage body
liquid storage
stator
heat
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TW104216169U
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Chinese (zh)
Inventor
Jian-Wu Yin
rong-xian Zhang
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Asia Vital Components Co Ltd
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Application filed by Asia Vital Components Co Ltd filed Critical Asia Vital Components Co Ltd
Priority to TW104216169U priority Critical patent/TWM516708U/en
Publication of TWM516708U publication Critical patent/TWM516708U/en

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  • Motor Or Generator Cooling System (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

水冷裝置Water cooling device

本創作有關於一種水冷裝置,尤指一種具有增加儲液本體結構強度及達到定子防水的效果的水冷裝置。The present invention relates to a water cooling device, and more particularly to a water cooling device having the effect of increasing the structural strength of the liquid storage body and achieving the waterproof effect of the stator.

按,隨著電子設備計算效能日漸增強,其內部所設置之電子元件於運作時會產生大量熱量,通常需於電子元件上設置散熱器或散熱鰭片藉以增加散熱面積進而提升散熱效能,但由於散熱器與散熱鰭片所達到之散熱效果有限,故現行習知技術便有採用水冷裝置作為增強散熱效能之解決方式。According to the increasing computing power of electronic devices, the electronic components installed in the internal device generate a large amount of heat during operation, and it is usually necessary to provide a heat sink or a heat dissipating fin on the electronic component to increase the heat dissipation area and thereby improve the heat dissipation performance, but The heat dissipation effect achieved by the heat sink and the heat sink fins is limited. Therefore, the current conventional technology has adopted a water cooling device as a solution for enhancing the heat dissipation performance.

而習知水冷裝置是將吸收到發熱元件(處理器或圖形處理器)的熱量與水冷裝置內部的一冷卻液體熱交換,然後透過水冷裝置內部的一泵浦來循環冷卻液體,並該水冷裝置透過複數管體連接一散熱器,令冷卻液體可於散熱器與水冷裝置兩者間進行熱交換循環散熱,藉以對發熱元件快速散熱。The conventional water-cooling device heat-exchanges the heat absorbed by the heat-generating component (processor or graphics processor) with a cooling liquid inside the water-cooling device, and then circulates the cooling liquid through a pump inside the water-cooling device, and the water-cooling device A heat sink is connected through the plurality of tubes, so that the cooling liquid can be heat-dissipated between the heat sink and the water-cooling device to dissipate heat, thereby rapidly dissipating the heat-generating components.

然現行水冷裝置中之泵浦運轉時,該定子組件相同會產生熱量,又因該定子組件於習知技術中係與冷卻流體隔離,故僅為以空冷之方式自行作冷卻,但其冷卻效果並不佳,該定子組件過度積熱則會造成燒毀,定子組件之積熱問題進一步影響該水冷裝置之使用壽命。However, in the current water-cooling device, the stator assembly generates heat at the same time, and since the stator assembly is isolated from the cooling fluid in the prior art, it is cooled by air cooling only, but the cooling effect is achieved. Poorly, the excessive accumulation of heat in the stator assembly can cause burnout, and the heat accumulation problem of the stator assembly further affects the service life of the water cooling device.

由上所知習知技術中,為了防止泵浦之定子組件因接受到液體而造成損壞,故將定子組件設置於水冷裝置之外側,而引導冷卻流體於水冷裝置中循環之轉子組件則設置於該水冷裝置之腔室內部,該兩者間透過該水冷裝置之外殼對應產生激磁而運轉,並由於水冷裝置之外殼必須考量本身結構體之強度,故具有一定厚度,因此該轉子組件與該定子組件間,則因該水冷模組之外殼厚度產生之間距而影響該泵浦之運轉效率,使得影響水冷模組之整體散熱效能及整體水冷裝置體積過大的問題者。In the prior art, in order to prevent the pumped stator assembly from being damaged by receiving the liquid, the stator assembly is disposed on the outer side of the water cooling device, and the rotor assembly for guiding the cooling fluid to circulate in the water cooling device is disposed on The inside of the chamber of the water-cooling device runs between the two through the outer casing of the water-cooling device to generate excitation, and since the outer casing of the water-cooling device must take into consideration the strength of the structure itself, it has a certain thickness, so the rotor assembly and the stator Between the components, the operating efficiency of the pump is affected by the distance between the thicknesses of the water-cooling modules, which affects the overall heat dissipation performance of the water-cooling module and the excessive volume of the overall water-cooling device.

爰此,為有效解決上述之問題,本創作之主要目的在提供一種透過該定子與儲液本體一體包射成型,以有效增加儲液本體的結構強度的水冷裝置。Accordingly, in order to effectively solve the above problems, the main object of the present invention is to provide a water-cooling device which integrally forms a package with the liquid storage body to effectively increase the structural strength of the liquid storage body.

本創作之另一目的提供一種可達到定子與電路板防水,進而更可達到保護定子及減少整體體積的水冷裝置。Another object of the present invention is to provide a water-cooling device that can achieve waterproofing of the stator and the circuit board, thereby further protecting the stator and reducing the overall volume.

本創作之另一目的提供一種可減少(縮短)定子與對應轉子彼此之間的厚度間距,以有效大幅提升泵浦的運轉效率的水冷裝置。Another object of the present invention is to provide a water-cooling device which can reduce (short) the thickness interval between the stator and the corresponding rotor to effectively increase the operating efficiency of the pump.

本創作之另一目的提供一種可透過冷卻液體間接對泵浦運轉的定子達到冷卻散熱的效果的水冷裝置。Another object of the present invention is to provide a water-cooling device that can indirectly effect cooling and heat dissipation of a pump-operated stator through a cooling liquid.

為達上述目的,本創作係提供一種水冷裝置,係包括一儲液本體、一泵浦及一熱交換元件,該儲液本體係具有一入口、一出口、一容設空間及一熱交換腔室,該熱交換腔室連通該容設空間與該入口及該出口,該容設空間凹設形成於該熱交換腔室內的該儲液本體一側上,且該熱交換腔室係供一冷卻液體通過其內,該泵浦用以循環該冷卻液體,並該泵浦包含一定子與一轉子,該定子係一體包射成型在該儲液本體內,且該定子與該容設空間及該熱交換腔室相隔離,該轉子連接一推動器,該轉子與該推動器分別設在該容設空間與該熱交換腔室內,且暴露在該冷卻液體中,而該熱交換元件係連接該儲液本體,且該熱交換元件具有一熱接觸面與一熱交換面,該熱交換面與該熱交換腔室內的冷卻液體接觸;透過本創作此設計,得有效達到增加儲液本體的結構強度,且還能達到定子與電路板防水的效果,以及達到保護定子與電路板與提升泵浦的運轉效率的效果者。To achieve the above objective, the present invention provides a water-cooling device comprising a liquid storage body, a pump and a heat exchange element, the liquid storage system having an inlet, an outlet, a receiving space and a heat exchange chamber a heat exchange chamber is connected to the receiving space and the inlet and the outlet, the receiving space is recessed on a side of the liquid storage body in the heat exchange chamber, and the heat exchange chamber is provided a cooling liquid is passed through the pump for circulating the cooling liquid, and the pump comprises a stator and a rotor, the stator system is integrally formed in the liquid storage body, and the stator and the receiving space and The heat exchange chamber is isolated, the rotor is connected to a pusher, and the rotor and the pusher are respectively disposed in the receiving space and the heat exchange chamber, and are exposed in the cooling liquid, and the heat exchange element is connected The liquid storage body, and the heat exchange element has a thermal contact surface and a heat exchange surface, and the heat exchange surface is in contact with the cooling liquid in the heat exchange chamber; through the design of the present invention, the liquid storage body is effectively increased. Structural strength The stator and the circuit board can achieve a waterproof effect, and improve the operating efficiency of the pump and an effect by the stator to protect the circuit board.

本創作另提供一種水冷裝置,係包括一儲液本體、一泵浦及一熱交換元件,該儲液本體具有一入口、一出口、一容設空間、一貫孔及一實心包覆結構,該實心包覆結構一體形成在該儲液本體內中央處,且與相對該儲液本體共同界定一連通該出口的熱交換腔室與一連通該入口的泵室,該貫孔貫穿該實心包覆結構,該泵室位於該熱交換腔室上方處,並經由該貫孔連通該熱交換腔室,該容設空間凹設形成於該泵室內的該儲液本體一側上,且該泵室係供一冷卻液體通過其內,該泵浦用以循環該冷卻液體,其包含一定子與一轉子,該定子係一體包射成型在該實心包覆結構內,且位於該泵室與該熱交換腔室之間,並該定子係與該容設空間、該熱交換腔室及該泵室相隔離,該轉子連接一推動器,該轉子與該推動器分別設在該容設空間與該泵室內,且暴露在該冷卻液體中,而熱交換元件係連接該儲液本體,且該熱交換元件具有一熱接觸面與一熱交換面,該熱交換面與該熱交換腔室內的冷卻液體接觸;透過本創作此設計,得有效達到增加儲液本體的結構強度,且還能達到定子與電路板散熱及防水的效果藉以達到保護定子與電路板的效果者。The present invention further provides a water cooling device, comprising a liquid storage body, a pump and a heat exchange component, the liquid storage body having an inlet, an outlet, a receiving space, a consistent hole and a solid covering structure, The solid cladding structure is integrally formed at the center of the liquid storage body, and together with the liquid storage body, defines a heat exchange chamber communicating with the outlet and a pump chamber communicating with the inlet, the through hole penetrating the solid coating a pump chamber is located above the heat exchange chamber, and communicates with the heat exchange chamber through the through hole, the receiving space is recessed on a side of the liquid storage body in the pump chamber, and the pump chamber Providing a cooling liquid therethrough, the pump for circulating the cooling liquid, comprising a stator and a rotor integrally formed in the solid cladding structure and located in the pump chamber and the heat Between the exchange chambers, the stator system is isolated from the accommodating space, the heat exchange chamber and the pump chamber, the rotor is connected to a pusher, and the rotor and the pusher are respectively disposed in the accommodating space and the Inside the pump chamber and exposed to the cooling In the body, the heat exchange element is connected to the liquid storage body, and the heat exchange element has a thermal contact surface and a heat exchange surface, and the heat exchange surface is in contact with the cooling liquid in the heat exchange chamber; It is effective to increase the structural strength of the liquid storage body, and also achieve the effect of heat dissipation and waterproofing of the stator and the circuit board, thereby achieving the effect of protecting the stator and the circuit board.

1‧‧‧水冷裝置1‧‧‧Water cooling unit

11‧‧‧儲液本體11‧‧‧Liquid body

111‧‧‧入口111‧‧‧ Entrance

112‧‧‧出口112‧‧‧Export

113‧‧‧容設空間113‧‧‧ Included space

114‧‧‧熱交換腔室114‧‧‧Heat exchange chamber

115‧‧‧側壁
1151‧‧‧上側壁
115‧‧‧ side wall
1151‧‧‧ upper side wall

1152‧‧‧下側壁1152‧‧‧lower side wall

116‧‧‧實心包覆結構116‧‧‧Solid cladding structure

117‧‧‧貫孔117‧‧‧through holes

118‧‧‧泵室118‧‧‧ pump room

119‧‧‧頂板119‧‧‧ top board

13‧‧‧泵浦13‧‧‧ pump

131‧‧‧定子131‧‧‧ Stator

1311‧‧‧矽鋼片組1311‧‧‧矽Steel sheet group

1312‧‧‧線圈組1312‧‧‧ coil set

133‧‧‧轉子133‧‧‧Rotor

1331‧‧‧軸心1331‧‧‧Axis

1332‧‧‧磁性件1332‧‧‧Magnetic parts

134‧‧‧推動器134‧‧‧ Pusher

135‧‧‧電路板135‧‧‧ circuit board

14‧‧‧熱交換元件14‧‧‧Heat exchange components

141‧‧‧熱接觸面141‧‧‧Hot contact surface

142‧‧‧熱交換面142‧‧‧Heat exchange surface

143‧‧‧墊圈143‧‧‧Washers

144‧‧‧散熱鰭片144‧‧‧heat fins

1441‧‧‧第一端1441‧‧‧ first end

1442‧‧‧第二端1442‧‧‧ second end

2‧‧‧發熱元件2‧‧‧heating components

3‧‧‧散熱器3‧‧‧heatsink

31‧‧‧散熱器入口31‧‧‧ radiator inlet

32‧‧‧散熱器出口32‧‧‧ radiator outlet

34‧‧‧第一可繞管34‧‧‧The first can be wound around

35‧‧‧第二可繞管35‧‧‧Secondary

4‧‧‧風扇4‧‧‧Fan

第1圖係顯示本創作之第一較佳實施例之分解立體示意圖。Figure 1 is an exploded perspective view showing the first preferred embodiment of the present invention.

第2圖係顯示本創作之第一較佳實施例之組合立體示意圖。Figure 2 is a perspective view showing the combination of the first preferred embodiment of the present invention.

第3圖係顯示本創作之第一較佳實施例之剖面示意圖。Figure 3 is a schematic cross-sectional view showing a first preferred embodiment of the present invention.

第4圖係顯示本創作之第二較佳實施例之液冷系統分解立體示意圖。Figure 4 is an exploded perspective view showing the liquid cooling system of the second preferred embodiment of the present invention.

第5圖係顯示本創作之第三較佳實施例之分解立體示意圖。Figure 5 is an exploded perspective view showing a third preferred embodiment of the present invention.

第6圖係顯示本創作之第三較佳實施例之組合局部剖面示意圖。Figure 6 is a partial cross-sectional view showing the combination of the third preferred embodiment of the present invention.

本創作之上述目的及其結構與功能上的特性,將依據所附圖式之較佳實施例予以說明。The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings.

本創作係提供一種水冷裝置,請參閱第1、2圖示,係顯示本創作之第一較佳實施例之分解與組合立體示意圖,並輔以參閱第3圖示。該水冷裝置1係應用於一發熱元件2(如中央處理器或圖形處理器;參閱第4圖)上,且該水冷裝置1包括一儲液本體11、一泵浦13及一熱交換元件14,該儲液本體11係以塑膠材質所構成,且該儲液本體11具有一入口111、一出口112、一容設空間113、一側壁115、一熱交換腔室114及一實心包覆結構116,該側壁115係從該儲液本體11本身向下延伸所構成,並前述儲液本體11與側壁115共同界定所述熱交換腔室114,該熱交換腔室114連通該容設空間113與入口111及出口112,且前述熱交換腔室114內供一冷卻液體通過其內。而該實心包覆結構116位於該熱交換腔室114上方,該容設空間113凹設形成於該熱交換腔室114內的儲液本體11的一側上,該容設空間113位於該熱交換腔室114上方且相鄰對應的實心包覆結構116。The present invention provides a water-cooling device, please refer to the first and second figures, which is an exploded and assembled perspective view of the first preferred embodiment of the present invention, and is supplemented by the third figure. The water cooling device 1 is applied to a heating element 2 (such as a central processing unit or a graphics processor; see FIG. 4), and the water cooling device 1 includes a liquid storage body 11, a pump 13, and a heat exchange element 14. The liquid storage body 11 is made of a plastic material, and the liquid storage body 11 has an inlet 111, an outlet 112, a receiving space 113, a side wall 115, a heat exchange chamber 114 and a solid covering structure. 116, the side wall 115 is formed to extend downward from the liquid storage body 11 itself, and the liquid storage body 11 and the side wall 115 jointly define the heat exchange chamber 114, and the heat exchange chamber 114 communicates with the receiving space 113. And the inlet 111 and the outlet 112, and a cooling liquid is supplied therein through the heat exchange chamber 114. The solid covering structure 116 is located above the heat exchange chamber 114. The receiving space 113 is recessed on one side of the liquid storage body 11 formed in the heat exchange chamber 114. The receiving space 113 is located at the heat. A corresponding solid cladding structure 116 is over the chamber 114 and adjacent thereto.

前述入口111與出口112係分別設置在該儲液本體11的兩側邊上,該熱交換元件14係連接對應的儲液本體11之側壁115,亦即該儲液本體11之側壁115的底部連接相對的熱交換元件14的一端面,以密封該熱交換腔室114,並該熱交換腔室114位於該熱交換元件14與儲液本體11之間。該側壁115與熱交換元件14之間具有一墊圈143,該墊圈143用以增加儲液本體11與熱交換元件14之間的結合密度,防止熱交換腔室114內的冷卻液體滲漏。其中前述熱交換元件14與儲液本體11的連接結合方式係以嵌接方式做說明,但並不侷限於此,於具體實施時,也可選擇為焊接、黏接或螺鎖的結合方式,合先陳明。The inlet port 111 and the outlet port 112 are respectively disposed on two sides of the liquid storage body 11, and the heat exchange element 14 is connected to the side wall 115 of the corresponding liquid storage body 11, that is, the bottom of the side wall 115 of the liquid storage body 11. An end face of the opposite heat exchange element 14 is connected to seal the heat exchange chamber 114, and the heat exchange chamber 114 is located between the heat exchange element 14 and the liquid storage body 11. Between the side wall 115 and the heat exchange element 14, there is a gasket 143 for increasing the bonding density between the liquid storage body 11 and the heat exchange element 14 to prevent leakage of the cooling liquid in the heat exchange chamber 114. The connection manner of the heat exchange element 14 and the liquid storage body 11 is described in the manner of engagement, but is not limited thereto. In the specific implementation, a combination of welding, bonding or screw locking may be selected. Heming Chen Ming.

另者,前述熱交換元件14由高導熱金屬如鋁、銅或金或銀等製成,且具有前述熱接觸面141、一熱交換面142與複數散熱鰭片144,該熱接觸面141係緊貼合在相對的發熱元件2(如中央處理器或圖形處理器)上,該熱接觸面141用以將接收到該發熱元件2產生的熱量傳導至該熱交換面142上,該熱交換面142位於該熱交換腔室114內,且熱交換面142與熱交換腔室114內的冷卻液體接觸。而該等散熱鰭片144係設於該熱交換面142上,且於本較佳實施之該等散熱鰭片144係放射狀的間隔排列做說明,但並不侷限於此。該每一散熱鰭片144具有一第一端1441及一第二端1442,該每一散熱鰭片144的第一端1441對應該推動器134,該第二端1442放射狀地延伸遠離該推動器134,藉此透過該等散熱鰭片144設置在該熱交換面142上可有效大幅增加熱交換面積的效果。所以當該熱交換元件14的熱接觸面141將吸收到前述發熱元件2的熱量傳導至熱交換面142上,令該熱交換面142與其上複數散熱鰭片144會與冷卻液體進行熱交換後,使該冷卻液體便將該熱交換面142與該等散熱鰭片144上的熱量帶離並從該儲液本體11之出口112流出,藉以達到散熱的效果。In addition, the heat exchange element 14 is made of a highly thermally conductive metal such as aluminum, copper or gold or silver, and has the aforementioned thermal contact surface 141, a heat exchange surface 142 and a plurality of heat dissipation fins 144. Adhering to the opposite heating element 2 (such as a central processing unit or a graphics processor) for conducting heat generated by the heating element 2 to the heat exchange surface 142, the heat exchange The face 142 is located within the heat exchange chamber 114 and the heat exchange face 142 is in contact with the cooling liquid within the heat exchange chamber 114. The heat dissipating fins 144 are disposed on the heat exchange surface 142, and the heat dissipating fins 144 are arranged at a radial interval in the preferred embodiment, but are not limited thereto. Each of the heat dissipation fins 144 has a first end 1441 and a second end 1442. The first end 1441 of each of the heat dissipation fins 144 corresponds to the pusher 134. The second end 1442 extends radially away from the push. The 134 is disposed on the heat exchange surface 142 through the heat dissipation fins 144 to effectively increase the heat exchange area. Therefore, when the thermal contact surface 141 of the heat exchange element 14 conducts heat absorbed to the heat generating component 2 to the heat exchange surface 142, the heat exchange surface 142 and the plurality of heat dissipation fins 144 are heat exchanged with the cooling liquid. The cooling liquid is carried away from the heat exchange surface 142 and the heat on the heat dissipation fins 144 and flows out from the outlet 112 of the liquid storage body 11 to achieve the heat dissipation effect.

再者,前述泵浦13用以循環該冷卻液體,該泵浦13包含一定子131、一轉子133及一推動器134,該定子131係一體包射成型在該儲液本體11內,亦即定子131與儲液本體11一起射出成型的同時,該定子131整個會被包覆在該儲液本體11的實心包覆結構116內,令該儲液本體11與其內包覆的定子131構成為一體,所以藉由本創作之儲液本體11與定子131一體包射成型的設計,可有效增加儲液本體11的結構強度,以及更可達到定子131防水及保護定子131的效果。而相較於習知之水冷裝置的定子是需透過一薄外蓋來蓋住,且因習知的薄外蓋本身結構厚度薄使得整體結構強度不佳外,該薄外蓋蓋合在水冷裝置上的蓋合緊密度也不佳,以致於容易導致薄外蓋脫落,以及容易讓水滲入定子內造成定子短路的問題。Furthermore, the pump 13 is configured to circulate the cooling liquid. The pump 13 includes a stator 131, a rotor 133 and a pusher 134. The stator 131 is integrally formed in the liquid storage body 11, that is, While the stator 131 is injection molded together with the liquid storage body 11, the stator 131 is entirely covered in the solid cladding structure 116 of the liquid storage body 11, and the liquid storage body 11 and the stator 131 covered therein are configured as The integrated design of the liquid storage body 11 and the stator 131 of the present invention can effectively increase the structural strength of the liquid storage body 11 and achieve the effect of waterproofing the stator 131 and protecting the stator 131. The stator of the conventional water-cooling device needs to be covered by a thin outer cover, and the thin outer cover is closed on the water-cooling device because the thin structure of the thin outer cover itself is thin and the overall structural strength is not good. The tightness of the cover is not so good that it tends to cause the thin cover to fall off, and the problem that the water penetrates into the stator and causes the stator to be short-circuited.

此外,透過實心包覆結構116包覆該定子131的厚度可設計較薄化,使得可有效減少整體體積,以及可減少(縮短)定子131與對應轉子133彼此之間的厚度間距,以有效大幅提升泵浦的運轉效率。並因泵浦13運轉時,定子131產生的熱量會傳導給該實心包覆結構116,令該實心包覆結構116吸收到的熱量可透過熱交換腔室114其內的冷卻液體做熱交換散熱,藉此可避免定子131積熱,相對地也能有效提升水冷裝置的使用壽命的效果。In addition, the thickness of the stator 131 covered by the solid cladding structure 116 can be designed to be thinner, so that the overall volume can be effectively reduced, and the thickness gap between the stator 131 and the corresponding rotor 133 can be reduced (shortened) to be effectively large. Improve pump operating efficiency. When the pump 13 is operated, the heat generated by the stator 131 is transmitted to the solid cladding structure 116, so that the heat absorbed by the solid cladding structure 116 can be heat-exchanged through the cooling liquid in the heat exchange chamber 114. Thereby, the heat accumulation of the stator 131 can be avoided, and the effect of the service life of the water cooling device can be effectively improved.

續參閱第1、3圖示,前述定子131係與容設空間113及熱交換腔室114相隔離,且該定子131包含一矽鋼片組1311及一纏繞於該矽鋼片組1311上的線圈組1312,該矽鋼片組1311於本較佳實施係為複數矽鋼片彼此堆疊所構成,但並不侷限於此,於具體時施時,前述矽鋼片組1311可改設計成為一單一矽鋼條且大致呈U字形狀,或其他任何形狀。一電路板135係電性連接該線圈組1312,該電路板135與該矽鋼片組1311及其上的該線圈組1312一起被包覆在該儲液本體11的實心包覆結構116內,且該矽鋼片組1311與其上的線圈組1312(即定子131)及電路板135位於該熱交換腔室114與容設空間113外,並透過該儲液本體11的實心包覆結構116阻擋隔離該熱交換腔室114內的冷卻液體接觸該定子131,簡言之,就是定子131未接觸冷卻液體。此外,前述電路板135於具體實施實並不侷限設置在定子131的下方處,也可選擇設置在相鄰該定子131的一旁位置。Referring to FIGS. 1 and 3, the stator 131 is separated from the housing space 113 and the heat exchange chamber 114, and the stator 131 includes a silicon steel sheet set 1311 and a coil group wound around the silicon steel sheet group 1311. In the preferred embodiment, the steel sheet group 1311 is formed by stacking a plurality of silicon steel sheets, but the present invention is not limited thereto. The steel sheet group 1311 can be modified into a single steel strip and roughly It has a U shape, or any other shape. A circuit board 135 is electrically connected to the coil assembly 1312, and the circuit board 135 is wrapped in the solid cladding structure 116 of the liquid storage body 11 together with the silicon steel sheet set 1311 and the coil assembly 1312 thereon, and The steel sheet group 1311 and the coil group 1312 (ie, the stator 131) and the circuit board 135 are located outside the heat exchange chamber 114 and the receiving space 113, and are blocked by the solid covering structure 116 of the liquid storage body 11. The cooling liquid in the heat exchange chamber 114 contacts the stator 131, in short, the stator 131 is not in contact with the cooling liquid. In addition, the foregoing circuit board 135 is not limited to being disposed below the stator 131, and may be disposed adjacent to a position adjacent to the stator 131.

前述轉子133連接該推動器134,該轉子133與推動器134分別設在該容設空間113與熱交換腔室114內,該轉子133與推動器134暴露在該冷卻液體,藉此該轉子133是隔著所述儲液本體11對應所述定子131,以驅動轉子133帶動該推動器134轉動,進而使該推動器134擾動該熱交換腔室114內的冷卻液體,而由該入口111流入的冷卻液體被推動器134帶動朝對應該出口112流出。並該轉子133具有一軸心1331與一磁性件1332,該軸心1331的一端連接相對該推動器134,其另一端則軸設在該容設空間113的底部,而該磁性件1332(如磁鐵)套設於該軸心1331的另一端上,該磁性件1332隔著該儲液本體11的實心包覆結構116對應該定子131。The rotor 133 is connected to the pusher 134. The rotor 133 and the pusher 134 are respectively disposed in the receiving space 113 and the heat exchange chamber 114. The rotor 133 and the pusher 134 are exposed to the cooling liquid, whereby the rotor 133 Corresponding to the stator 131 via the liquid storage body 11 to drive the rotor 133 to drive the pusher 134 to rotate, thereby causing the pusher 134 to disturb the cooling liquid in the heat exchange chamber 114 to flow from the inlet 111. The cooling liquid is driven by the pusher 134 toward the corresponding outlet 112. The rotor 133 has a shaft center 1331 and a magnetic member 1332. One end of the shaft center 1331 is connected to the pusher 134, and the other end is axially disposed at the bottom of the receiving space 113, and the magnetic member 1332 (such as The magnet is sleeved on the other end of the shaft 1331, and the magnetic member 1332 corresponds to the stator 131 via the solid covering structure 116 of the liquid storage body 11.

因此透過本創作此水冷裝置1的設計,使該定子131整個被包覆在該儲液本體11的實心包覆結構116內,藉以有效增強儲液本體11本身結構強度,相對地便可達到保護定子131的效果,進而因儲液本體11為實心包覆結構116的密封性佳,使得可有效避免水或異物(如鹽霧或灰塵或其他液體)滲入侵蝕定子131。Therefore, the design of the water-cooling device 1 is such that the stator 131 is entirely covered in the solid covering structure 116 of the liquid storage body 11, so as to effectively enhance the structural strength of the liquid storage body 11 and relatively protect it. The effect of the stator 131, and further the good sealing property of the liquid storage body 11 by the solid covering structure 116, makes it possible to effectively prevent water or foreign matter such as salt spray or dust or other liquid from penetrating into the eroding stator 131.

在替代實施例中,前述熱交換元件14內也可不需要複數散熱鰭片,而直接藉由熱交換面142將接收的熱量與冷卻液體做熱交換散熱。In an alternative embodiment, the plurality of heat dissipating fins may not be required in the heat exchange element 14 to directly dissipate heat received by the heat exchange surface 142 and the cooling liquid.

請參閱第4圖,係為本創作之第二較佳實施例之分解與組合立體示意圖,並輔以參閱第1、3圖。而該本較佳實施主要是將前述第一較佳實施之水冷裝置1連接一散熱器3連接構成一液冷系統。該本較佳實施之水冷裝置1的結構與連結關係及其功效大致與前述第一較佳實施例之水冷裝置1相同,故在此不重新贅述。並如圖所示,前述散熱器3係遠離該儲液本體11,該儲液本體11是連接對應該散熱器3。Please refer to FIG. 4, which is a schematic exploded view of the second preferred embodiment of the present invention, and is supplemented by reference to Figures 1 and 3. The preferred embodiment of the present invention is mainly to connect the water-cooling device 1 of the first preferred embodiment to a heat sink 3 to form a liquid cooling system. The structure and connection relationship of the water-cooling device 1 of the present preferred embodiment and its function are substantially the same as those of the water-cooling device 1 of the first preferred embodiment, and therefore will not be described again. As shown in the figure, the heat sink 3 is remote from the liquid storage body 11, and the liquid storage body 11 is connected to the heat sink 3.

前述散熱器3具有一散熱器入口31、一散熱器出口32、一第一可繞管34及一第二可繞管35,該第一可繞管34的一端連接相對的儲液本體11的入口111,其另一端則連接該散熱器出口32,該第二可繞管35的一端連接相對該儲液本體11的出口112,其另一端則連接該散熱器入口31,藉此該散熱器3透過該第一、二可繞管34、35分別連接所述儲液本體11之入口111與出口112,以使於該熱交換腔室114內的推動器134帶動該冷卻液體在熱交換腔室114與散熱器3內循環流動散熱。The heat sink 3 has a heat sink inlet 31, a heat sink outlet 32, a first windable tube 34 and a second windable tube 35. One end of the first windable tube 34 is connected to the opposite liquid storage body 11. The other end of the inlet 111 is connected to the radiator outlet 32. One end of the second retractable tube 35 is connected to the outlet 112 of the liquid storage body 11, and the other end is connected to the radiator inlet 31, whereby the radiator 3 through the first and second retractable tubes 34, 35 respectively connected to the inlet 111 and the outlet 112 of the liquid storage body 11, so that the pusher 134 in the heat exchange chamber 114 drives the cooling liquid in the heat exchange chamber The chamber 114 and the radiator 3 circulate and dissipate heat.

另者,所述散熱器3可連接一風扇4幫助該散熱器3快速散熱。如圖所示,當該熱交換元件14的熱接觸面141將吸收到對應所述發熱元件2的熱量傳導至熱交換腔室114的熱交換面142上,以透過該熱交換腔室114內的冷卻液體與熱交換面142進行熱交換後,令冷卻液體由該儲液本體11的出口112排出後經由該第二可繞管35流入至該散熱器入口31,並通過該散熱器3散熱後,從散熱器出口32經過該第一可繞管34,然後從該入口111流入到該熱交換腔室114內。藉由冷卻液體這樣的循環已對發熱元件2散熱。In addition, the heat sink 3 can be connected to a fan 4 to help the heat sink 3 to dissipate heat rapidly. As shown, when the thermal contact surface 141 of the heat exchange element 14 conducts heat absorbed to the heat generating component 2 to the heat exchange surface 142 of the heat exchange chamber 114 to pass through the heat exchange chamber 114 After the cooling liquid exchanges heat with the heat exchange surface 142, the cooling liquid is discharged from the outlet 112 of the liquid storage body 11 , flows into the heat sink inlet 31 through the second windable tube 35 , and is radiated through the heat sink 3 . Thereafter, the first retractable tube 34 passes from the radiator outlet 32 and then flows into the heat exchange chamber 114 from the inlet 111. The heat generating element 2 is dissipated by a cycle such as cooling the liquid.

因此藉由本創作之水冷裝置1連接散熱器3構成液冷系統的設計,使得有效達到較佳的散熱效果。此外,由於該水冷裝置1的定子131與儲液本體11一體包射成型的設計,使得有效增加儲液本體11的結構強度,進而還有效達到定子131防水及保護定子131的效果。Therefore, the design of the liquid cooling system is constructed by connecting the heat sink 3 to the water cooling device 1 of the present invention, so that a better heat dissipation effect can be effectively achieved. In addition, since the stator 131 of the water-cooling device 1 and the liquid storage body 11 are integrally formed by injection molding, the structural strength of the liquid storage body 11 is effectively increased, and the effect of the stator 131 being waterproof and protecting the stator 131 is effectively achieved.

請參閱第5、6圖,係為本創作之第三較佳實施例之分解與組合立體示意圖。而本較佳實施例之水冷裝置1主要是將前述第一較佳實施例的水冷裝置1改設計為有上、下腔室(即泵室118、熱交換腔室114)、轉子133與推動器134容設於上腔室(即泵室118)內及被實心包覆結構16包覆的定子131設於儲液殼體11內的上、下腔室之間。Please refer to Figures 5 and 6, which are exploded and combined perspective views of a third preferred embodiment of the present invention. The water-cooling device 1 of the preferred embodiment is mainly designed to modify the water-cooling device 1 of the first preferred embodiment to have upper and lower chambers (ie, pump chamber 118, heat exchange chamber 114), rotor 133 and push. The stator 131 accommodated in the upper chamber (ie, the pump chamber 118) and the stator 131 covered by the solid cladding structure 16 is disposed between the upper and lower chambers in the liquid storage housing 11.

而本較佳實施例之水冷裝置1包括前述儲液本體11、泵浦13及熱交換元件14,該儲液本體11具有一入口111、一出口112、一容設空間113、一上、下側壁1151、1152、一貫孔117、一連通該入口111的泵室118、一連通該出口112的熱交換腔室114及一實心包覆結構116,其中該上、下側壁1151、1152係從該儲液本體11本身分別向上與向下延伸所構成,並該實心包覆結構116一體形成在該儲液本體11內中央處,且該實心包覆結構116分別與儲液殼體11的上、下側壁1151、1152共同界定所述泵室118與熱交換腔室114。所述貫孔117貫穿該實心包覆結構116,該泵室118位於對應該熱交換腔室114的上方處,且泵室118經由該貫孔117連通該熱交換腔室114,令該泵室118內的冷卻液體經由該貫孔117流入到熱交換腔室114內。其中前述所述定子131係與容設空間113、熱交換腔室114、貫孔117及泵室118相隔離。The water-cooling device 1 of the preferred embodiment includes the liquid storage body 11, the pump 13, and the heat exchange element 14. The liquid storage body 11 has an inlet 111, an outlet 112, a receiving space 113, and an upper and lower portions. a side wall 1151, a 1152, a constant hole 117, a pump chamber 118 communicating with the inlet 111, a heat exchange chamber 114 communicating with the outlet 112, and a solid cladding structure 116, wherein the upper and lower sidewalls 1151, 1152 are from The liquid storage body 11 itself is formed to extend upward and downward, respectively, and the solid covering structure 116 is integrally formed at the center of the liquid storage body 11, and the solid covering structure 116 is respectively connected to the upper side of the liquid storage housing 11. The lower sidewalls 1151, 1152 collectively define the pump chamber 118 and the heat exchange chamber 114. The through hole 117 extends through the solid cladding structure 116. The pump chamber 118 is located above the corresponding heat exchange chamber 114, and the pump chamber 118 communicates with the heat exchange chamber 114 via the through hole 117 to make the pump chamber The cooling liquid in the 118 flows into the heat exchange chamber 114 through the through hole 117. The stator 131 is isolated from the accommodation space 113, the heat exchange chamber 114, the through hole 117, and the pump chamber 118.

並前述泵室118供所述冷卻液體通過其內,該容設空間113凹設形成在該泵室118內的該儲液本體1一側上,且位於該泵室118的底面且相鄰對應該實心包覆結構116,前述入口111與出口112係分別設置在對應該泵室118與熱交換腔室114的儲液本體11的一側邊上。所以透過實心包覆結構116包覆該定子131的厚度可設計較薄化,不僅能提供保護定子131、避免冷卻液體接觸定子131及減少整體體積的效果外,且還能減少(縮短)定子131與對應轉子133彼此之間的厚度間距,以有效大幅提升泵浦13的運轉效率。此外,因泵浦13運轉時,定子131產生的熱量會傳導給該實心包覆結構116,使該實心包覆結構116吸收到的熱量可透過上方的泵室118或/及下方的熱交換腔室114其內的冷卻液體做熱交換散熱,藉此可達到間接對定子131散熱,以避免定子131積熱的效果,進而還能有效提升水冷裝置的使用壽命的效果。And the pump chamber 118 is configured to pass the cooling liquid therethrough. The receiving space 113 is recessed on the side of the liquid storage body 1 in the pump chamber 118, and is located on the bottom surface of the pump chamber 118 and adjacent to each other. The structure 116 should be solidly covered, and the inlet 111 and the outlet 112 are respectively disposed on one side of the liquid storage body 11 corresponding to the pump chamber 118 and the heat exchange chamber 114. Therefore, the thickness of the stator 131 covered by the solid cladding structure 116 can be designed to be thinner, which not only provides the effect of protecting the stator 131, avoiding the contact of the cooling liquid with the stator 131, and reducing the overall volume, but also reduces (shorts) the stator 131. The thickness interval between the rotors 133 and the corresponding rotors 133 is effective to greatly increase the operating efficiency of the pump 13. In addition, when the pump 13 is operated, the heat generated by the stator 131 is transmitted to the solid cladding structure 116, so that the heat absorbed by the solid cladding structure 116 can pass through the upper pump chamber 118 or/and the lower heat exchange chamber. The cooling liquid in the chamber 114 is heat-exchanged and heat-dissipated, thereby indirectly dissipating heat to the stator 131 to avoid the effect of accumulating heat of the stator 131, thereby further improving the service life of the water-cooling device.

於本較佳實施例的熱交換元件14的結構與連結關係與其功效大致與前述第一較佳實施例的熱交換元件14(即所包含的熱接觸面141、熱交換面142及複數散熱鰭片144)相同,故在此不重新贅述相同處,兩較佳實施例的熱交換元件14些許不同處在於:本較佳實施例的前述熱交換元件14係連接對應的儲液本體11之下側壁1152,亦即該儲液本體11之下側壁1152的底部連接相對的熱交換元件14之一端面,以密封該熱交換腔室114,且該熱交換面142可與熱交換腔室114內的冷卻液體接觸,該熱交換元件14的熱接觸面141則緊貼合在相對的發熱元件2(如中央處理器或圖形處理器;如第4圖)上,並該熱交換腔室114位於該熱交換元件14與儲液本體11的實心包覆結構116之間。該下側壁1152與熱交換元件14之間具有一墊圈143,該墊圈143用以增加儲液本體11與熱交換元件14之間的結合密度,防止熱交換腔室114內的冷卻液體滲漏。其中前述熱交換元件14與儲液本體11的連接結合方式係以嵌接方式做說明,但並不侷限於此。The structure and connection relationship of the heat exchange element 14 of the preferred embodiment and its efficiency are substantially the same as those of the heat exchange element 14 of the first preferred embodiment (ie, the included thermal contact surface 141, the heat exchange surface 142, and the plurality of heat sink fins). The sheet 144) is the same, so the same is not repeated here. The heat exchange elements 14 of the two preferred embodiments are somewhat different in that the heat exchange elements 14 of the preferred embodiment are connected to the corresponding liquid storage body 11 The side wall 1152, that is, the bottom of the lower side wall 1152 of the liquid storage body 11 is connected to one end surface of the opposite heat exchange element 14 to seal the heat exchange chamber 114, and the heat exchange surface 142 can be combined with the heat exchange chamber 114. Contact of the cooling liquid, the thermal contact surface 141 of the heat exchange element 14 is in close contact with the opposite heating element 2 (such as a central processing unit or a graphics processor; as shown in Fig. 4), and the heat exchange chamber 114 is located The heat exchange element 14 is between the solid cladding structure 116 of the liquid storage body 11. The lower side wall 1152 and the heat exchange element 14 have a gasket 143 for increasing the bonding density between the liquid storage body 11 and the heat exchange element 14 to prevent leakage of the cooling liquid in the heat exchange chamber 114. The connection manner of the heat exchange element 14 and the liquid storage body 11 is described in the manner of engagement, but is not limited thereto.

另者,上側壁1151係與一頂板119相連接,以密封該泵室118,並該頂板119在本實施表示跟儲液本體1為分離元件,跟該儲液本體1結合後構成儲液本體1的一部分,結合連接方式可例如螺鎖、黏接或焊接或其他可易於思及的結合方式等等。該頂板119與上側壁1151之間具有一另一墊圈143,該另一墊圈143用以增加儲液本體11與頂板119之間的結合密度,防止泵室118內的冷卻液體滲漏。而本較佳實施例的泵浦13的結構與連結關係及其功效大致與前述第一較佳實施例的泵浦13相同,故在此不重新贅述相同處,兩較佳實施例的泵浦13些許不同處在於:本較佳實施例的泵浦13的定子131係一體包射成型在該儲液本體1的實心包覆結構116內,且位於該泵室118與對應的熱交換腔室114之間,亦即定子131與儲液本體11一起射出成型的同時,該定子131整個會被包覆在該儲液本體11中間的實心包覆結構116內,令該儲液本體11與其內包覆的定子131構成為一體,所以藉由本創作之儲液本體11與定子131一體包射成型的設計,可有效增加儲液本體11的結構強度,以及更可達到定子131防水及保護定子131的效果。In addition, the upper side wall 1151 is connected to a top plate 119 to seal the pump chamber 118, and the top plate 119 is a separate component from the liquid storage body 1 in the present embodiment, and is combined with the liquid storage body 1 to form a liquid storage body. A part of the combination of the joints may be, for example, screwed, glued or welded or other combination that can be easily thought of and the like. The top plate 119 and the upper side wall 1151 have a further gasket 143 for increasing the bonding density between the liquid storage body 11 and the top plate 119 to prevent leakage of the cooling liquid in the pump chamber 118. The structure and connection relationship of the pump 13 of the preferred embodiment and its function are substantially the same as those of the pump 13 of the first preferred embodiment. Therefore, the pumping of the two preferred embodiments will not be repeated here. A slight difference is that the stator 131 of the pump 13 of the preferred embodiment is integrally formed in the solid cladding structure 116 of the liquid storage body 1 and is located in the pump chamber 118 and the corresponding heat exchange chamber. 114, that is, while the stator 131 is injection molded together with the liquid storage body 11, the stator 131 is entirely covered in the solid cladding structure 116 in the middle of the liquid storage body 11, so that the liquid storage body 11 and the inner portion thereof The coated stator 131 is integrally formed. Therefore, the design of the liquid storage body 11 and the stator 131 can be effectively increased, and the structural strength of the liquid storage body 11 can be effectively increased, and the stator 131 can be waterproofed and the stator 131 can be protected. Effect.

再者,而該定子131的電路板135與該矽鋼片組1311及其上的該線圈組1312一起被包覆在該儲液本體11的實心包覆結構116內,且該矽鋼片組1311與其上的線圈組1312(即定子131)及電路板135位於該熱交換腔室114與泵室118之間,並透過該儲液本體11的實心包覆結構116阻擋隔離該熱交換腔室114與泵室118內的冷卻液體接觸該定子131,簡言之,就是定子131未接觸冷卻液體。此外,所述泵浦13的轉子133與推動器134則分別設在該容設空間113與該泵室118內,且該轉子133與推動器134暴露在該冷卻液體中。Moreover, the circuit board 135 of the stator 131 is wrapped in the solid cladding structure 116 of the liquid storage body 11 together with the silicon steel sheet set 1311 and the coil assembly 1312 thereon, and the silicon steel sheet group 1311 and the same The coil assembly 1312 (ie, the stator 131) and the circuit board 135 are located between the heat exchange chamber 114 and the pump chamber 118, and block the heat exchange chamber 114 from being separated by the solid cladding structure 116 of the liquid storage body 11. The cooling liquid in the pump chamber 118 contacts the stator 131, in short, the stator 131 is not in contact with the cooling liquid. Further, the rotor 133 and the pusher 134 of the pump 13 are respectively disposed in the accommodation space 113 and the pump chamber 118, and the rotor 133 and the pusher 134 are exposed in the cooling liquid.

因此透過本創作此水冷裝置1的設計,使該定子131整個被包覆在該儲液本體11的實心包覆結構116內,藉以有效增強儲液本體11本身結構強度,相對地便可達到保護定子131的效果,進而因儲液本體11為實心包覆結構116的密封性佳,使得可有效避免水或異物(如鹽霧或灰塵或其他液體)滲入侵蝕定子131。Therefore, the design of the water-cooling device 1 is such that the stator 131 is entirely covered in the solid covering structure 116 of the liquid storage body 11, so as to effectively enhance the structural strength of the liquid storage body 11 and relatively protect it. The effect of the stator 131, and further the good sealing property of the liquid storage body 11 by the solid covering structure 116, makes it possible to effectively prevent water or foreign matter such as salt spray or dust or other liquid from penetrating into the eroding stator 131.

在替代實施例中,前述熱交換元件14內也可不需要複數散熱鰭片,而直接藉由熱交換面142將接收的熱量與冷卻液體做熱交換散熱。In an alternative embodiment, the plurality of heat dissipating fins may not be required in the heat exchange element 14 to directly dissipate heat received by the heat exchange surface 142 and the cooling liquid.

在替代實施例中,本創作的水冷裝置1可連接一散熱器連接構成一液冷系統。前述散熱器係遠離該儲液本體11,該散熱器可透過複數可繞管分別連接對應連接該儲液本體11的入口111與儲液本體11的出口112,以使泵室118內的推動器134帶動該冷卻液體在熱交換腔室114與散熱器內循環流動散熱。此外,所述散熱器還可連接一風扇幫助該散熱器快速散熱。In an alternate embodiment, the water-cooling device 1 of the present invention can be connected to a radiator to form a liquid cooling system. The heat sink is remote from the liquid storage body 11 , and the heat sink can respectively connect the inlet 111 corresponding to the liquid storage body 11 and the outlet 112 of the liquid storage body 11 through a plurality of tubes, so that the pusher in the pump chamber 118 The 134 drives the cooling liquid to circulate and dissipate heat in the heat exchange chamber 114 and the heat sink. In addition, the heat sink can be connected to a fan to help the heat sink to dissipate heat quickly.

以上所述,本創作相較於習知具有下列之優點:As mentioned above, this creation has the following advantages over the prior art:

1. 透過定子131整個被包覆在該儲液本體11的實心包覆結構116內,藉以有效增強儲液本體11本身結構強度的效果。1. The stator 131 is entirely covered in the solid cladding structure 116 of the liquid storage body 11 to effectively enhance the structural strength of the liquid storage body 11 itself.

2. 具有達到保護定子131及避免水或異物(如鹽霧或灰塵或其他液體)滲入侵蝕定子131的效果。2. It has the effect of protecting the stator 131 and preventing water or foreign matter such as salt spray or dust or other liquid from penetrating into the eroding stator 131.

3. 可達到減少整體體積,及減少(縮短)定子131與對應轉子133彼此之間的厚度間距,以有效大幅提升泵浦的運轉效率。3. It is possible to reduce the overall volume and reduce (short) the thickness distance between the stator 131 and the corresponding rotor 133 to effectively increase the pumping efficiency.

惟以上所述者,僅係本創作之較佳可行之實施例而已,舉凡利用本創作上述之方法、形狀、構造、裝置所為之變化,皆應包含於本案之權利範圍內。However, the above descriptions are only preferred embodiments of the present invention, and variations of the methods, shapes, structures, and devices described above are intended to be included in the scope of the present invention.

1‧‧‧水冷裝置 1‧‧‧Water cooling unit

11‧‧‧儲液本體 11‧‧‧Liquid body

113‧‧‧容設空間 113‧‧‧ Included space

114‧‧‧熱交換腔室 114‧‧‧Heat exchange chamber

115‧‧‧側壁 115‧‧‧ side wall

116‧‧‧實心包覆結構 116‧‧‧Solid cladding structure

13‧‧‧泵浦 13‧‧‧ pump

131‧‧‧定子 131‧‧‧ Stator

1311‧‧‧矽鋼片組 1311‧‧‧矽Steel sheet group

1312‧‧‧線圈組 1312‧‧‧ coil set

133‧‧‧轉子 133‧‧‧Rotor

1331‧‧‧軸心 1331‧‧‧Axis

1332‧‧‧磁性件 1332‧‧‧Magnetic parts

134‧‧‧推動器 134‧‧‧ Pusher

135‧‧‧電路板 135‧‧‧ circuit board

14‧‧‧熱交換元件 14‧‧‧Heat exchange components

141‧‧‧熱接觸面 141‧‧‧Hot contact surface

142‧‧‧熱交換面 142‧‧‧Heat exchange surface

143‧‧‧墊圈 143‧‧‧Washers

144‧‧‧散熱鰭片 144‧‧‧heat fins

1441‧‧‧第一端 1441‧‧‧ first end

1442‧‧‧第二端 1442‧‧‧ second end

Claims (13)

一種水冷裝置,係包括:
一儲液本體,係具有一入口、一出口、一容設空間及一熱交換腔室,該熱交換腔室連通該容設空間與該入口及該出口,該容設空間凹設形成於該熱交換腔室內的該儲液本體一側上,且該熱交換腔室係供一冷卻液體通過其內;
一泵浦,用以循環該冷卻液體,其包含一定子與一轉子,該定子係一體包射成型在該儲液本體內,且該定子與該容設空間及該熱交換腔室相隔離,該轉子連接一推動器,該轉子與該推動器分別設在該容設空間與該熱交換腔室內,且暴露在該冷卻液體中;及
一熱交換元件,連接該儲液本體,且該熱交換元件具有一熱接觸面與一熱交換面,該熱交換面與該熱交換腔室內的冷卻液體接觸。
A water cooling device comprising:
a liquid storage body having an inlet, an outlet, a receiving space and a heat exchange chamber, wherein the heat exchange chamber communicates with the receiving space and the inlet and the outlet, and the receiving space recess is formed in the a side of the liquid storage body in the heat exchange chamber, and the heat exchange chamber is provided with a cooling liquid therethrough;
a pump for circulating the cooling liquid, comprising a stator and a rotor, the stator is integrally formed in the liquid storage body, and the stator is isolated from the receiving space and the heat exchange chamber, The rotor is connected to a pusher, the rotor and the pusher are respectively disposed in the receiving space and the heat exchange chamber, and exposed to the cooling liquid; and a heat exchange element is connected to the liquid storage body, and the heat is connected The exchange element has a thermal contact surface and a heat exchange surface that is in contact with the cooling liquid within the heat exchange chamber.
如申請專利範圍第1項所述之水冷裝置,其中該儲液本體具有一實心包覆結構,該定子整個被包覆在該實心包覆結構內。The water-cooling device of claim 1, wherein the liquid storage body has a solid cladding structure, and the stator is entirely covered in the solid cladding structure. 如申請專利範圍第2項所述之水冷裝置,其中該定子包含一矽鋼片組及一纏繞於該矽鋼片組上的線圈組,一電路板與該矽鋼片組及其上的該線圈組一起被包覆在該儲液本體的該實心包覆結構內,該定子與該電路板係位於該熱交換腔室外,且該儲液本體的該實心包覆結構阻擋隔離該熱交換腔室內的冷卻液體接觸該定子,並該入口與該出口分別設置在該儲液本體的兩側邊。The water cooling device of claim 2, wherein the stator comprises a set of silicon steel sheets and a coil group wound on the set of silicon steel sheets, and a circuit board together with the steel sheet group and the coil group thereon Enclosed in the solid cladding structure of the liquid storage body, the stator and the circuit board are located outside the heat exchange chamber, and the solid cladding structure of the liquid storage body blocks the cooling of the heat exchange chamber The liquid contacts the stator, and the inlet and the outlet are respectively disposed on both sides of the liquid storage body. 如申請專利範圍第1項所述之水冷裝置,其中該轉子具有一軸心與一磁性件,該軸心一端連接該推動器,其另一端則軸設在該容設空間的底部,並該磁性件套設於該軸心的另一端上,且該磁性件隔著該儲液本體對應該定子。The water-cooling device of claim 1, wherein the rotor has an axial center and a magnetic member, the axial end is connected to the pusher at one end, and the other end is axially disposed at the bottom of the receiving space, and The magnetic member is sleeved on the other end of the shaft, and the magnetic member corresponds to the stator via the liquid storage body. 如申請專利範圍第1項所述之水冷裝置,其中該儲液本體具有一側壁,該側壁係從該儲液本體本身向下延伸所構成,且連接相對該熱交換元件,以密封該熱交換腔室,並該熱交換腔室位於該熱交換元件與該儲液本體之間。The water-cooling device of claim 1, wherein the liquid storage body has a side wall extending downward from the liquid storage body itself and connected to the heat exchange element to seal the heat exchange. a chamber, and the heat exchange chamber is located between the heat exchange element and the liquid storage body. 如申請專利範圍第1項所述之水冷裝置,其中該熱交換元件更包含複數散熱鰭片,該等散熱鰭片係設於該熱交換面上,且該每一散熱鰭片具有一第一端對應該推動器,及一第二端放射狀地延伸遠離該推動器。The water-cooling device of claim 1, wherein the heat exchange element further comprises a plurality of heat-dissipating fins, wherein the heat-dissipating fins are disposed on the heat exchange surface, and each of the heat-dissipating fins has a first The end corresponds to the pusher and a second end extends radially away from the pusher. 如申請專利範圍第1項所述之水冷裝置,其中該熱接觸面係緊貼於相對的一發熱元件上,該熱接觸面用以將接收到該發熱元件產生的熱量傳導至該熱交換面上。The water-cooling device of claim 1, wherein the thermal contact surface is in close contact with an opposite heating element, and the thermal contact surface is configured to conduct heat generated by the heating element to the heat exchange surface. on. 如申請專利範圍第6項所述之水冷裝置,其中該儲液本體連接一散熱器,該散熱器係藉由一第一可繞管連接該儲液本體的入口及一第二可繞管連接該儲液本體的出口,且該散熱器係遠離該儲液本體。The water-cooling device of claim 6, wherein the liquid storage body is connected to a heat sink, and the heat sink is connected to the inlet of the liquid storage body by a first connectable pipe and a second connectable pipe An outlet of the liquid storage body, and the heat sink is away from the liquid storage body. 一種水冷裝置,係包括:
一儲液本體,係具有一入口、一出口、一容設空間、一貫孔及一實心包覆結構,該實心包覆結構一體形成在該儲液本體內中央處,且與相對該儲液本體共同界定一連通該出口的熱交換腔室與一連通該入口的泵室,該貫孔貫穿該實心包覆結構,該泵室位於該熱交換腔室上方處,並經由該貫孔連通該熱交換腔室,該容設空間凹設形成於該泵室內的該儲液本體一側上,且該泵室係供一冷卻液體通過其內;
一泵浦,用以循環該冷卻液體,其包含一定子與一轉子,該定子係一體包射成型在該實心包覆結構內,且位於該泵室與該熱交換腔室之間,並該定子係與該容設空間、該熱交換腔室及該泵室相隔離,該轉子連接一推動器,該轉子與該推動器分別設在該容設空間與該泵室內,且暴露在該冷卻液體中;及
一熱交換元件,連接該儲液本體,且該熱交換元件具有一熱接觸面與一熱交換面,該熱交換面與該熱交換腔室內的冷卻液體接觸。
A water cooling device comprising:
a liquid storage body having an inlet, an outlet, a receiving space, a consistent hole and a solid covering structure, the solid covering structure being integrally formed at a center of the liquid storage body and opposite to the liquid storage body Cooperating to define a heat exchange chamber communicating with the outlet and a pump chamber communicating with the inlet, the through hole penetrating the solid cladding structure, the pump chamber being located above the heat exchange chamber, and communicating the heat through the through hole An exchange chamber, the recessed space is formed on a side of the liquid storage body in the pump chamber, and the pump chamber is provided with a cooling liquid therethrough;
a pump for circulating the cooling liquid, comprising a stator and a rotor integrally formed in the solid cladding structure and located between the pump chamber and the heat exchange chamber, and The stator system is separated from the accommodating space, the heat exchange chamber and the pump chamber, the rotor is connected to a pusher, and the rotor and the pusher are respectively disposed in the accommodating space and the pump chamber, and are exposed to the cooling And a heat exchange element connected to the liquid storage body, and the heat exchange element has a thermal contact surface and a heat exchange surface, the heat exchange surface being in contact with the cooling liquid in the heat exchange chamber.
如申請專利範圍第9項所述之水冷裝置,其中該定子包含一矽鋼片組及一纏繞於該矽鋼片組上的線圈組,一電路板與該矽鋼片組及其上的該線圈組一起被包覆在該儲液本體的該實心包覆結構內,該定子與該電路板係位於該熱交換腔室與該泵室之間,且該實心包覆結構阻擋隔離該熱交換腔室與該泵室內的冷卻液體接觸該定子,並該入口與該出口分別設置在對應該泵室與熱交換腔室的該儲液本體的一側邊上。The water cooling device of claim 9, wherein the stator comprises a set of silicon steel sheets and a coil group wound on the set of silicon steel sheets, and a circuit board together with the steel sheet group and the coil group thereon Covered in the solid cladding structure of the liquid storage body, the stator and the circuit board are located between the heat exchange chamber and the pump chamber, and the solid cladding structure blocks the heat exchange chamber from being isolated The cooling liquid in the pump chamber contacts the stator, and the inlet and the outlet are respectively disposed on one side of the liquid storage body corresponding to the pump chamber and the heat exchange chamber. 如申請專利範圍第9項所述之水冷裝置,其中該儲液本體具有一上、下側壁,該上、下側壁係從該儲液本體本身分別向上與向下延伸所構成,且該上側壁與對應一頂板相連接,以密封該泵室,該下側壁連接相對該熱交換元件,以密封該熱交換腔室,並該熱交換腔室位於該熱交換元件與該實心包覆結構之間。The water-cooling device of claim 9, wherein the liquid storage body has an upper and a lower side wall, and the upper and lower side walls are respectively formed upwardly and downwardly from the liquid storage body itself, and the upper side wall Connected to a corresponding top plate to seal the pump chamber, the lower side wall is coupled to the heat exchange element to seal the heat exchange chamber, and the heat exchange chamber is located between the heat exchange element and the solid cladding structure . 如申請專利範圍第9項所述之水冷裝置,其中該熱交換元件更包含複數散熱鰭片,該等散熱鰭片係設於該熱交換面上。The water-cooling device of claim 9, wherein the heat exchange element further comprises a plurality of heat-dissipating fins, and the heat-dissipating fins are disposed on the heat exchange surface. 如申請專利範圍第9項所述之水冷裝置,其中該熱接觸面係緊貼於相對的一發熱元件上,該熱接觸面用以將接收到該發熱元件產生的熱量傳導至該熱交換面上。The water-cooling device of claim 9, wherein the thermal contact surface is in close contact with an opposite heating element, and the thermal contact surface is configured to conduct heat generated by the heating element to the heat exchange surface. on.
TW104216169U 2015-10-08 2015-10-08 Water cooling equipment TWM516708U (en)

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106292964A (en) * 2016-09-26 2017-01-04 奇鋐科技股份有限公司 Liquid cooling apparatus and system
CN107436652A (en) * 2016-05-25 2017-12-05 奇鋐科技股份有限公司 Water cooling plant
CN107438348A (en) * 2016-05-27 2017-12-05 奇鋐科技股份有限公司 Water cooling plant
TWI617912B (en) * 2016-05-25 2018-03-11 Asia Vital Components Co Ltd Water cooling device
US9986632B2 (en) 2016-02-24 2018-05-29 Cooler Master Co., Ltd. Water cooling system
TWI664524B (en) * 2017-12-04 2019-07-01 奇鋐科技股份有限公司 Water-cooling radiator sturcture
TWI711136B (en) * 2017-07-24 2020-11-21 奇鋐科技股份有限公司 Heat exchange structure of heat dissipation device

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9986632B2 (en) 2016-02-24 2018-05-29 Cooler Master Co., Ltd. Water cooling system
CN107436652A (en) * 2016-05-25 2017-12-05 奇鋐科技股份有限公司 Water cooling plant
TWI617912B (en) * 2016-05-25 2018-03-11 Asia Vital Components Co Ltd Water cooling device
CN107438348A (en) * 2016-05-27 2017-12-05 奇鋐科技股份有限公司 Water cooling plant
CN107438348B (en) * 2016-05-27 2023-12-15 奇鋐科技股份有限公司 Water cooling device
CN106292964A (en) * 2016-09-26 2017-01-04 奇鋐科技股份有限公司 Liquid cooling apparatus and system
TWI711136B (en) * 2017-07-24 2020-11-21 奇鋐科技股份有限公司 Heat exchange structure of heat dissipation device
TWI664524B (en) * 2017-12-04 2019-07-01 奇鋐科技股份有限公司 Water-cooling radiator sturcture

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