TWI711136B - Heat exchange structure of heat dissipation device - Google Patents

Abstract

A heat exchange structure of heat dissipation device includes a main body and a cooling chip. The main body has at least one first space in communication with at least one first opening and at least one second opening. The first space has an open side and a cooling fluid therein. The cooling chip has a cold face and a hot face. The hot face is mated with the open side of the main body. The cold face is in contact with at least one heat source. In the heat exchange structure of the heat dissipation device, the cooling chip is directly used instead of the metal-made heat conduction substrate of the conventional water-cooling heat dissipation device. The cooling chip serves to directly actively cool the heat source. The heat of the hot face of the cooling chip is absorbed by the cooling fluid inside the main body to dissipate the heat. Accordingly, the heat dissipation performance is enhanced as a whole.

Description

Heat exchange structure of heat sink

A heat exchange structure of a heat sink, especially a heat exchange structure of a heat sink that uses a refrigerating chip as an active cooling interface to cool the heat source.

Traditional heat dissipation devices or heat dissipation modules for deheating heat sources are mainly composed of a single or multiple heat dissipation units combined with each other. The heat dissipation units include radiators, temperature equalizing plates, heat pipes, etc., among which are made of copper or aluminum. The finished uniform temperature plate and heat pipe are mainly used for heat absorption and heat conduction.

In addition, the heat dissipation device also has a structure for dissipating heat from the heat source through water cooling. This water cooling method is mainly achieved by arranging a thermally conductive bottom plate made of copper or aluminum with better thermal conductivity on the bottom, and one side of the thermally conductive bottom plate is directly In contact with the heat source, a plurality of fins or fin posts are arranged on the other side of the heat-conducting bottom plate to increase the heat dissipation area, and the side with plural fins or fin posts is arranged correspondingly to a body with a water-containing chamber, and The water-containing chamber filled with cooling liquid in the body achieves the heat dissipation effect.

The water-cooled heat sink cools and removes the heat absorbed by the aforementioned heat-conducting bottom plate by circulating the cooling liquid, thereby achieving the effect of heat dissipation, but when the heat of the heat source is too high, if the water-cooling heat sink cannot quickly heat the heat When the heat absorbed by the bottom plate is eliminated, the heat dissipation effect will inevitably not be achieved. Therefore, although the water-cooled heat sink has a better heat dissipation effect than the air-cooled heat sink, but with the electronic equipment With the improvement of equipment performance, the heat generated by internal electronic components will inevitably increase. How to provide a water-cooled module with better heat dissipation performance is a problem that people familiar with the art want to solve.

Therefore, in order to solve the above-mentioned shortcomings of the conventional technology, the main purpose of the invention is to provide a heat exchange structure that can greatly enhance the water-cooled heat sink.

To achieve the above objective, the invention provides a heat exchange structure for a heat sink, which includes: a body and a cold chip; the body has at least one first space and connects at least one first hole and at least one second hole The first space has an open side; the refrigeration chip has a cold surface and a hot surface, the hot surface is butted with the open side of the body, and the cold surface is in contact with at least one heat source.

Through the invention, the cooling chip directly replaces the heat-conducting bottom plate of the conventional water-cooled heat sink to directly dissipate and de-heat the heat source. The cold surface of the cooling chip is actively cooled, which has better cooling efficiency, and the hot surface is in the body. The cooling fluid in the first space of the part performs cooling and deheating, which can provide better cooling efficiency.

1: The heat exchange structure of the heat sink

11: body

11a: Part One

11b: Part Two

111: First Space

111a: first chamber

111b: second chamber

111c: second space

1111: open side

112: first port

113: Second Orifice

12: Refrigeration chip

121: cold noodles

122: hot noodles

1221: heat dissipation structure

1222: runner

2: Cooling fluid

3: Heat source

4: pump

5: Water tank unit

6: The first tube body

7: Second tube body

8: Third tube body

Figure 1 is a perspective exploded view of the body of the first embodiment of the heat exchange structure of the heat sink of the invention; Figure 2 is a sectional view of the body assembly of the first embodiment of the heat exchange structure of the heat sink of the invention; Figure 3 is The state diagram of the first embodiment of the heat exchange structure of the heat sink of the invention; Fig. 4 is a combined cross-sectional view of the second embodiment of the heat exchange structure of the heat sink of the invention; Fig. 5 is the heat exchange structure of the heat exchange structure of the heat sink of the invention A perspective exploded view of the third embodiment; Figure 6 is a combined cross-sectional view of the third embodiment of the heat exchange structure of the heat sink of the invention; Fig. 7 is an exploded perspective view of the fourth embodiment of the heat exchange structure of the heat sink of the invention; Fig. 8 is a combined cross-sectional view of the fourth embodiment of the heat exchange structure of the heat sink of the invention; Fig. 9a is the heat dissipation of the invention Fig. 9b is a three-dimensional view of the refrigeration chip of the heat exchange structure of the heat-exchange structure of the invention; Fig. 9c is a three-dimensional view of the refrigeration chip of the heat exchange structure of the heat-dissipation device of the invention.

The above objectives of the invention and its structural and functional characteristics will be described based on the preferred embodiments of the accompanying drawings.

Please refer to Figures 1, 2 and 3, which are a three-dimensional exploded and combined cross-sectional view and a schematic diagram of the use state of the first embodiment of the heat exchange structure of the heat dissipation device of the invention. As shown in the figure, the heat exchange structure 1 of the heat dissipation device of the invention is It comprises: a body 11 and a cold chip 12; the body 11 has at least one first space 111 and is connected to at least one first hole 112 and at least one second hole 113, and the first space 111 has an open side 1111, the first space 111 has a cooling fluid 2.

The refrigerating chip 12 has a cold surface 121 and a hot surface 122, the hot surface 122 is butted with the open side 1111 of the body 1, the cold surface 121 is in contact with at least one heat source 3, and the hot surface 122 A plurality of heat dissipation structures 1221 are extended, and the heat dissipation structures 1221 are formed by a plurality of fins.

The body 11 of the heat sink of this embodiment is a water-cooled head structure, and the body 11 is a water-cooled housing. The cooling chip 12 replaces the conventional heat-conducting copper base plate, and the cooling chip 12 encloses the The open end 1111 of the body 11 and the hot surface 122 of the refrigerating chip 12 correspond to the first space 111. When heat dissipation is performed, the cooling fluid 2 in the first space 111 enters the first space through the first opening 112. In the space 111, The second hole 113 discharges the first space 111 away from the main body 11, and the cold surface 121 of the refrigerating chip 12 directly corresponds to the heat source 3 for cooling and deheating, and the hot surface 122 of the refrigerating chip 12 is generated After the heat is transferred to the heat dissipation structures 1221, the cooling fluid 2 in the first space 111 inside the main body 11 performs heat exchange cooling. The cooling efficiency provided by the cold surface 121 of the cooling chip 12 is better than that of general water cooling. The cooling efficiency of the type heat dissipation device can greatly improve the overall heat dissipation efficiency. In this embodiment, a pump 4 and at least one water tank unit 5 are connected externally. The pump 4 passes through a first tube 6 and a second tube The body 7 is connected to the body 11 and the water tank unit 5 respectively. The water tank unit 5 is connected to the body 11 through a third pipe body 8. The pump 4 is used to drive the cooling fluid 2 inside the first space 111 to enter and exit the body 11 When used, the water tank unit 5 is used for cooling the cooling fluid 2.

Please refer to Figure 4, which is a combined cross-sectional view of the second embodiment of the heat exchange structure of the heat dissipation device of the invention. As shown in the figure, part of the structure of this embodiment is the same as the foregoing first embodiment, so it will not be repeated here. However, the difference between this embodiment and the aforementioned first embodiment is that the first space 111 has at least a first chamber 111a and a second chamber 111b, and the first and second chambers 111a, 111b are arranged up and down correspondingly , The first and second chambers 111a, 111b communicate with the first and second ports 112, 113, the first chamber 111a has a pump 4, and the second chamber 111a should be open On the side 1111, the hot surface 122 of the refrigerating chip 12 is arranged corresponding to the second chamber 111b and the refrigerating chip 12 closes the open side 1111.

The main body 11 of this embodiment is a water-cooled heat dissipation device. The pump 4 is arranged in the first chamber 111a, and the pump 4 drives the cooling fluid in the first and second chambers 111a, 111b 2 Enter the body 11 to exchange heat on the hot surface 122 of the refrigerating chip 12.

Please refer to Figures 5 and 6, which are a three-dimensional exploded and combined cross-sectional view of the third embodiment of the heat exchange structure of the heat sink of the invention. As shown in the figure, part of the structure of this embodiment is the same as that of the aforementioned first embodiment, so here will Without repeating details, the difference between this embodiment and the aforementioned first embodiment is that the body 11 has a first part 11a and a second part 11b. The first and second parts 11a and 11b are horizontally connected and arranged correspondingly, and the second The portion 11b has a second space 111c, the first space 111 of the first portion 111a is provided with a pump 4, and the refrigerating chip 12 is connected to the second space 111c of the second portion 11b correspondingly and closes the second space 111c. Space 111c, the first orifice 112 is provided in the first part 11a and connected to the first space 111, and the second orifice 113 is provided in the second part 11b and connected to the second space 111c, and is provided in the first space The pump 4 of 111 is mainly used to guide the cooling fluid 2 in the first and second spaces 111, 111c to perform a heat exchange cycle. When the hot surface 122 of the refrigerating chip 12 connected to the second part 11b generates heat, it can The cooling fluid 2 is used to deheat, and the cold surface 121 of the cooling chip 12 can provide a cooling temperature lower than that of the cooling fluid 2 to cool and deheat the heat source 3, thereby achieving better heat dissipation efficiency.

Please refer to Figures 7 and 8, which are a three-dimensional exploded and combined cross-sectional view of the fourth embodiment of the heat exchange structure of the heat sink of the invention. As shown in the figure, part of the structure of this embodiment is the same as that of the aforementioned first embodiment, so here It will not be repeated, but the difference between this embodiment and the aforementioned first embodiment is that the hot surface 122 extends a plurality of heat dissipation structures 1221, and the heat dissipation structures 1221 are composed of a plurality of fins, and the fins have at least first Channel 1222, one end of the fins is correspondingly provided with a pump 4, and the pump 4 guides the cooling fluid 2 to perform heat exchange work with the fins, and flows through the channels 1222 to the second orifice 113 Leave the body 11 for a cooling cycle.

Please refer to Figures 9a, 9b, and 9c, which are the three-dimensional views of the cooling chip of the heat exchange structure of the heat dissipation device of the invention. As shown in the figure, this embodiment mainly discloses that the cooling chip has a plurality of extensions on the hot surface 122 to increase the heat exchange efficiency. The heat dissipation structure 1221, the heat dissipation structure 1221 can be a plurality of fin posts as shown in Fig. 9a, or a plurality of fins as shown in Fig. 9a Figure 9b may be a combination of multiple fin posts and fins. As shown in Figure 9c, the fins extend radially from the outside of the fin posts.

The invention mainly uses the refrigerating chip 12 with direct cooling effect as the copper base plate used to replace the heat conduction of the water-cooled heat sink to directly cool the heat source 3 and deheat, which can reduce heat conduction. This step directly cools the heat source 3 Cooling down effectively increases the overall heat dissipation performance of the water-cooled heat sink and prevents the heat source 3 from accumulating heat.

In this embodiment, the description of the unit for guiding the cooling fluid in the water-cooled heat sink is based on the pump, but it is not meant to be limited, and may be other structural units that can drive the cooling fluid.

1: The heat exchange structure of the heat sink

11: body

1111: open side

112: first port

113: Second Orifice

12: Refrigeration chip

121: cold noodles

122: hot noodles

1221: heat dissipation structure

3: Heat source

Claims (4)

A heat exchange structure of a heat dissipation device includes: a body having at least one first space and connecting at least one first opening and at least one second opening, the first space having an open side, the first The space has a cooling fluid; the uniform cold chip has a cold surface and a hot surface, the hot surface is butted with the open side of the body, and the cold surface is in contact with at least one heat source; a plurality of heat dissipation structures that can increase heat exchange efficiency , Extending on the hot surface, the heat dissipation structures can be plural fin posts or plural fins or a combination of plural fin posts and fins, the fins are outward from the outside of the fin posts Radiation extension; a pump, the pump is connected to the body and a water tank unit through a first tube body and a second tube body, the water tank unit is connected to the body through a third tube body, the pump It is used to drive the cooling fluid inside the first space into and out of the body, and the water tank unit is used to cool the cooling fluid. According to the heat exchange structure of the heat dissipating device described in claim 1, wherein the first space has at least a first chamber and a second chamber, and the first and second chambers are arranged correspondingly above and below The first and second chambers communicate with the first and second orifices, and there is a pump in the first chamber. For the heat exchange structure of the heat dissipation device described in the first item of the scope of patent application, the hot surface extends a plurality of heat dissipation structures, and the heat dissipation structures are formed by a plurality of fin posts. According to the heat exchange structure of the heat dissipating device described in item 1 of the scope of patent application, the main body has a first part and a second part, and the first and second parts are horizontally connected and arranged correspondingly, The second part has a second space, the first space of the first part is provided with a pump, and the cooling chip is connected to the second space of the second part correspondingly.

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