TWM497418U - Heat dissipation device structure improvement for electronic device - Google Patents

Description

Improved structure for heat sink of electronic components

The present invention relates to a structural design of a heat dissipating device for electronic components; in particular, a novel application in which a heat conducting unit protrudes from a cover body and a heat pipe and a metal layer to assist heat discharge of an electronic component.

It has been customary to apply a plurality of arranged fins or fin structures to dissipate the waste heat generated by the electronic components or the computer's central processing unit to maintain their operational efficiency or to avoid a crash. Conventional techniques have disclosed an integrally formed aluminum extruded cut-off heat sink, or a separate manufacturing of the heat sink panel from the heat sink fins, which is assembled or welded into a unitary structure. For example, Taiwan Patent No. 86116954 "Heat Dissipation Fin Assembly Method and Products" patent application provides a typical embodiment. As those skilled in the art know, this technique is cumbersome in manufacturing, processing, and difficulty.

Conventional techniques have also disclosed a means of providing a shaft hole in a fin or fin through which a shaft or tube is passed to assemble and assemble into a unitary structure. For example, a typical embodiment is provided in the "Coupling Structure of Heat Sink" No. 91209087 or the "Fixed Fin Structure Improvement" Patent No. 94,052, 324.

Conventional techniques have also disclosed a concept of providing a groove or slot on the side or upper and lower ends of the fin or fin, a corresponding step or snap fit, to assemble the assembly into a unitary structure. For example, No. 92211053 "Heat sink structure", No. 91213373 "Fixed fin fixed structure improvement", No. 86221373 "Combined heat sink fin structure", No. 93218949 "Heat sink group fastening structure", or No. 91208823 A feasible embodiment has also been provided for the "combination structure of heat sink fins" and the like.

Typically, these references show the structural techniques involved in applying thermal dissipation structures to electronic components. Conventional heat sink or fin structures often tend to use more complex structural combinations such as shafts or tubes, slots, complex protrusions, or snap fits. If the design of the heat sink is considered to be different from the conventional one, it will change its use form, which is different from the old one. For example, the structural design conforms to a streamlined and convenient combination, and/or has dustproof protection, prevents electromagnetic interference, and improves heat dissipation efficiency; or cooperates with a structure that generates radiation heat dissipation and increases heat dissipation of electronic components. Areas and other means; and these topics are not disclosed in the above references.

Therefore, the main purpose of the present invention is to provide an improved structure for a heat sink of an electronic component, which provides a structure and a simple combination, and has the functions of dustproof protection, electromagnetic interference prevention, and heat dissipation efficiency. The heat sink includes a heat conducting unit disposed on an electronic component. A cover system having an opening covers the electronic component, and the heat conducting unit protrudes from the opening at least in part; a heat pipe containing a cooling fluid is connected to the heat conducting unit. And a metal layer forming a geometric profile is combined on the heat pipe, and an area of the metal layer is larger than an area of the cover. Therefore, the thermal energy of the electronic component can be conducted to the cover body and the heat pipe through the heat conduction unit, and is quickly conducted to the metal layer output through the heat pipe to establish a function of reducing thermal resistance, increasing heat dissipation area, and dissipating heat efficiency.

According to the present invention, in an improved structure for a heat sink of an electronic component, the heat conducting unit is in the form of a block having a first end and a second end; the first end is superposed on the electronic component. Corresponding to the second end of the heat conducting unit, the rigid wall of the cover system is defined as a plate-like body or a box body having an upper wall surface; and the opening is formed on the upper wall surface to protrude the second end of the heat conducting unit, Join the heat pipe. Therefore, the structural form of the conductive unit protruding opening connected to the heat pipe can significantly reduce the thermal resistance, so that the thermal energy generated by the electronic component is directly transmitted to the heat pipe through the heat conducting unit for rapid output.

According to the improved structure of the heat sink for electronic components, the heat pipe has a first side and a second side; a first side of the heat pipe is connected to the second end of the heat conducting unit; and a metal layer is disposed on the second side of the heat pipe . The metal layer is formed into a film or sheet structure for forming a large contact area or a heat dissipating area with the outside, and the heat pipe is used to transfer heat energy or heat to other areas to be quickly discharged to prevent heat concentration.

Referring to Figures 1, 2 and 3, the improved structure of the heat sink for electronic components of the present invention comprises a heat conducting unit 10 disposed on an electronic component 20. Basically, the electronic component 20 is disposed on a circuit board 40. In the embodiment taken, the heat conducting unit 10 selects a material capable of conducting thermal energy to form a geometrically contoured block structure having a first end 11 and a second end 12; the first end 11 and the first end The two ends 12 are respectively formed with a structure of a flat surface 13, 14, and the first end 11 (or the flat surface 13) is superposed on the electronic component 20 to conduct waste heat (or thermal energy) generated when the electronic component 20 operates.

The heat dissipation module also includes a cover 30 combined with the heat transfer unit 10. In detail, the cover 30 has a rigid wall 31 defining a cover 30 to form a box (or plate-like) structure having an internal space 32, covering the electronic component 20; the cover 30 (or The rigid wall 31) has an upper wall surface 33 and an opening 34 formed in the upper wall surface 33. And, the second end 12 of the heat conducting unit 10 protrudes from the opening 34 and directly engages a heat pipe 50 to reduce the thermal resistance.

That is to say, the heat transfer unit 10 protrudes from the opening 34 directly to the structural design of the heat pipe 50, so that the heat transfer unit 10 can directly transfer the waste heat (or heat energy) generated when the electronic component 20 operates to the heat pipe 50, and the type of the quick output is obvious. The effect of reducing the thermal resistance can be obtained.

It can be understood that the structural combination of the heat conducting unit 10 and the cover 30 significantly increases the heat dissipation area of the electronic component 20; and the cover 30 also provides grounding and dustproof protection, magnetic conduction or Prevent electromagnetic interference and other effects.

Figures 1, 2 and 3 show that the heat sink also includes the heat pipe 50; the heat pipe 50 is combined on the second end 12 (or plane 14) of the heat transfer unit 10 and contains a cooling fluid 55. Specifically, the heat pipe 50 is welded or bonded to the second end 12 (or plane 14) of the heat conducting unit 10. Therefore, the waste heat (or thermal energy) generated by the operation of the electronic component 20 can be directly conducted to the cover body 30 and the heat pipe 50 via the heat conduction unit 10, and is cooled and exchanged and output through the heat pipe 50. In other words, the heat pipe 50 can quickly guide the heat energy away from the heat source region and guide the heat energy to other lower temperature regions to prevent heat concentration.

In a preferred embodiment, the heat pipe 50 has a first side 51 and a second side 52; the first side 51 of the heat pipe 50 is coupled to the second end 12 (or plane 14) of the heat conducting unit 10; The second side 52 of the heat pipe 50 is provided with a geometrically contoured metal layer 60. The figure shows that the metal layer 60 is formed into a film or sheet structure for forming a large contact area or a heat dissipating area with the outside world, and in conjunction with the rapid conduction of the heat pipe 50, the above heat energy or heat is quickly discharged.

Figures 1, 2 and 3 also show that the area of the metal layer 60 is larger than the area of the cover 30 (or upper wall 33). In the embodiment taken, the metal layer 60 is a plate-like body having a rectangular outline.

In a possible embodiment, a portion or all of the metal layer 60 is provided with a coating (not shown); the coating is selected from a heat radiating material to make the metal layer 60 more desirable. The role of radiant heat dissipation.

Typically, the improved structure of the heat sink for electronic components has the following considerations and advantages under the conditions of dust protection and electromagnetic interference prevention: 1. The heat dissipation Modules and related component structures, operational use cases, etc., have been re-designed, and different from the practitioners; and, changed its use type, and is different from the old method. For example, the electronic component 20 is coupled to the heat-conducting unit 10, the cover 30, or the heat-conducting unit 10 includes a first end 11 and a second end 12, and the cover 30 is provided with an opening 34 to make the second end 12 of the heat-conducting unit protrude. The cover body 30, the combined heat pipe 50, and the second side 52 of the heat pipe are provided with the structural design of the combined metal layer 60, and the contact structure of a large area and the structural structure of the portion such as the thermal resistance are reduced, thereby improving the heat dissipation thereof. Waste heat removal effect. 2. The heat conducting unit 10 cooperates with the cover body 30 to make the second end 12 protrude from the opening 14, combines the heat pipe 50 and the metal layer 60 or arranges the structural design of the coating, and removes the conventional heat dissipation structure, which tends to apply the shaft or the tube, More complex structural combinations such as slots, complex protrusions, or snaps. It is apparent that a structural design that is more compact and convenient to combine than the prior art is provided. 3. The heat conducting unit 10 cooperates with the cover 30 so that the second end 12 protrudes from the opening 14, combines the heat pipe 50 and the metal layer 60 or the tissue pattern of the coating, so that the metal layer 60 establishes a more skill than the prior art. The radiation type heat dissipation effect is good; and the area of the metal layer 60 is significantly larger than the area of the cover body 30, and the structural structure of the contact area such as a large area is formed, thereby improving the heat dissipation or waste heat of the metal layer 60. Discharge effect.

Therefore, this creation provides an effective heat-dissipating device for electronic components. Its spatial form is different from the conventional ones, and it has the advantages unmatched in the old method. It shows considerable progress. It has fully met the requirements of the new patent.

However, the above is only a feasible embodiment of the present invention, and is not intended to limit the scope of the present invention, that is, the equivalent changes and modifications made by the scope of the patent application of the present invention are covered by the scope of the creative patent. .

10‧‧‧thermal unit

11‧‧‧ first end

12‧‧‧ second end

13, 14‧‧ ‧ plane

20‧‧‧Electronic components

30‧‧‧ cover

31‧‧‧Rigid wall

32‧‧‧Internal space

33‧‧‧Upper wall

34‧‧‧ openings

40‧‧‧ boards

50‧‧‧heat pipe

51‧‧‧ first side

52‧‧‧ second side

55‧‧‧Cooling fluid

60‧‧‧metal layer

Figure 1 is a schematic diagram showing the structure of an embodiment of the present creation.

Fig. 2 is a schematic exploded view of the structure of Fig. 1; showing the arrangement of electronic components, a heat conducting unit, a cover, a heat pipe, and a metal layer.

Fig. 3 is a schematic cross-sectional view showing the structure of the present invention; the combination of the electronic component, the heat conducting unit, the cover body, the heat pipe and the metal layer is depicted.

10‧‧‧thermal unit

11‧‧‧ first end

12‧‧‧ second end

13, 14‧‧ ‧ plane

20‧‧‧Electronic components

30‧‧‧ cover

31‧‧‧Rigid wall

32‧‧‧Internal space

33‧‧‧Upper wall

34‧‧‧ openings

40‧‧‧ boards

50‧‧‧heat pipe

51‧‧‧ first side

52‧‧‧ second side

60‧‧‧metal layer

Claims (9)

An improved structure for a heat dissipating device for an electronic component, comprising: a heat conducting unit disposed on an electronic component; a cover body having a rigid wall defining a cover body to form a box structure having an internal space, covering the electronic component; The cover body has an upper wall surface and an opening formed on the upper wall surface; and the heat conduction unit protrudes from the opening at least in part, and a heat pipe including a cooling fluid is disposed; and the heat pipe is combined with a geometrically contoured metal layer. An improved structure for a heat dissipating device for an electronic component according to claim 1, wherein the heat conducting unit is a thermally conductive material having a geometrically contoured block structure having a first end and a first a second end; the first end is superposed on the electronic component; and the second end protrudes from the opening to engage the heat pipe. An improved structure for a heat sink for an electronic component according to claim 2, wherein the first end and the second end are respectively formed with a plane; and the plane of the second end is joined to the heat pipe. An improved structure for a heat sink for an electronic component according to claim 1 or 2 or 3, wherein the heat pipe has a first side and a second side; the first side of the heat pipe is connected to the heat conducting unit; The second side is provided with a combination of the metal layer; and the metal layer is provided as one of a film and a sheet structure. An improved structure for a heat sink for an electronic component according to claim 1 or 2 or 3, wherein an area of the metal layer is larger than a cover area; and one of a partial area and a whole area of the metal layer is disposed There is a coating; the coating is composed of a heat radiating substance. The improved structure of a heat sink for an electronic component according to claim 4, wherein the metal layer has an area larger than a cover area; and one of a partial region and a whole region of the metal layer is disposed with a coating; The coating is composed of a heat radiating substance. A heat sink improvement structure for an electronic component according to claim 1 or 2 or 3, wherein the heat pipe is welded to the heat transfer unit. The heat sink improvement structure for an electronic component according to claim 1 or 2 or 3, wherein the heat pipe is bonded to the heat transfer unit. A heat sink improvement structure for an electronic component according to claim 1 or 2 or 3, wherein the electronic component is disposed on a circuit board.