TWM507004U - Heat conductive module for electronic device - Google Patents

Description

Thermal module for electronic components

The present invention relates to a structural design of a heat conduction/heat dissipation module for electronic components; in particular, a novel application of a combination of a heat conductive foil layer, a cover body, a heat pipe and a metal layer to assist heat discharge of an electronic component.

It has been customary to apply a plurality of arranged fins or fin structures to dissipate the waste heat generated by the electronic components or the computer's central processing unit to maintain their operational efficiency or to avoid a crash. Conventional techniques have disclosed an integrally formed aluminum extruded cut-off heat sink, or a separate manufacturing of the heat sink panel from the heat sink fins, which is assembled or welded into a unitary structure. For example, Taiwan Patent No. 86116954 "Heat Dissipation Fin Assembly Method and Products" patent application provides a typical embodiment. As those skilled in the art know, this technique is cumbersome in manufacturing, processing, and difficulty.

Conventional techniques have also disclosed a means of providing a shaft hole in a fin or fin through which a shaft or tube is passed to assemble and assemble into a unitary structure. For example, a typical embodiment is provided in the "Coupling Structure of Heat Sink" No. 91209087 or the "Fixed Fin Structure Improvement" Patent No. 94,052, 324.

Conventional techniques have also disclosed a concept of providing a groove or slot on the side or upper and lower ends of the fin or fin, a corresponding step or snap fit, to assemble the assembly into a unitary structure. For example, Patent No. 91213373 "Improvement of Heat Sink Fixed Structure", No. 86221373 "Combined Heat Sink Structure", No. 93218949 "Fixed Heat Block Assembly Structure", or No. 91208823 "Combination Structure of Heat Sink" Cases and the like have also provided feasible embodiments.

Typically, these references show the structural techniques involved in applying thermal dissipation structures to electronic components. Conventional heat sink or fin structures often tend to use more complex structural combinations such as shafts or tubes, slots, complex protrusions, or snap fits. If the redesigning design considers the heat dissipation structure to make it different from the conventional one, it will change its use form, which is different from the old one. For example, the structural design of the device conforms to a simplified condition, or is convenient for combination, and has the functions of dustproof protection, electromagnetic interference prevention, and heat dissipation efficiency; in particular, further fitting a metal foil layer capable of generating rapid thermal conduction Structure, increased heat dissipation area and/or efficiency of electronic components, etc.; and these issues are not disclosed in the above references.

Therefore, the main purpose of the present invention is to provide a heat conduction module for electronic components, which provides a structure, a simple combination, meets cost conditions, improves heat conduction, heat dissipation efficiency, and achieves uniform temperature. The invention comprises an electronic component and a cover body covering the electronic component; the cover body is provided with a geometrically contoured thermal conductive foil layer, the thermal conductive foil layer is formed into a thin layer structure, and the heat dissipation efficiency is greater than or equal to the heat dissipation efficiency of the copper; and the thermal conductive foil layer A metal layer and a heat pipe containing a cooling fluid are combined. Therefore, the thermal energy of the electronic component can be conducted to the heat pipe and the metal layer via the thermal conductive foil layer or the cover body, and the output is fast.

According to the thermally conductive module for electronic components of the present invention, the metal layer forms a geometrically contoured configuration; and the area of the metal layer is larger than the area of the cover. And the metal layer defines a heat source region stacked on the cover body and a connection heat source region to form a cantilever type region (or a non-heat source region); the metal layer is provided with at least one pillar; the pillar The object is positioned between the non-heat source region of the metal layer and a circuit board such that the pillar supports the non-heat source region of the metal layer.

According to the present invention, a thermally conductive module for an electronic component includes an electronic component (defined as a heat source component) that generates waste heat and an electronic component (defined as a non-heat source component) that does not generate waste heat. The heat conductive foil layer is disposed on the heat source element in cooperation with the cover body, and a pair of cover body covers the non-heat source element. And arranging a heat pipe or a metal layer through each of the cover body and the sub-cover body; therefore, the heat energy of the heat source element can be transmitted to the sub-cover body through the heat-conducting foil layer and the cover body, and the heat pipe and the metal layer are quickly outputted; The cover body (and/or the sub-cover body), the metal layer and the heat pipe path are arranged according to the positions of the heat source element and the non-heat source element to establish an effect of increasing the heat dissipation area or the heat dissipation range.

Referring to Figures 1, 2 and 3, the thermally conductive module for electronic components of the present invention includes an electronic component, generally indicated by reference numeral 20; basically, the electronic component 20 is disposed on a circuit board 40. In the embodiment taken, the electronic component 20 is covered by a cover 30; the cover 30 provides grounding for the electronic component 20 and provides dust protection, magnetization or electromagnetic interference. The cover 30 has a rigid wall 31 defining a cover 30 that forms a box (or plate-like) configuration with an interior space 32. The cover 30 also includes an inner wall surface 33 and an outer wall surface 34; the inner wall surface 33 and the outer wall surface 34 respectively form a planar structure. And, a thermal conductive foil layer 90 is disposed between the electronic component 20 and the cover 30.

In a preferred embodiment, the thermally conductive foil layer 90 is disposed on the cover 30. In detail, the thermal conductive foil layer 90 selects a heat conductive material or a metal material (for example, gold, silver, copper or the like) to form a geometrically contoured thin layer structure, which is better than a general metal. The conductive, thermally conductive, and uniform temperature effects, or the thermally conductive (or conductive) efficiency of the thermally conductive foil layer 90 is greater than or equal to the thermal conductivity of the copper; and the thermally conductive foil layer 90 includes or defines a first surface 91 and a second surface 92. The first surface 91 faces the electronic component 20, and the second surface 92 is disposed or bonded to the cover 30 (or the inner wall surface 33). Therefore, the thermal conductive foil layer 90 can rapidly diffuse and conduct heat energy or waste heat generated by the electronic component 20 to the cover 30.

The figure shows the combination of the outer wall surface 34 of the cover and a heat pipe 50. It can be understood that the cover 30 cooperates with the structural form of the thermal conductive foil layer 90, which significantly increases the heat dissipation area and heat dissipation efficiency of the electronic component 20 to conduct waste heat (or thermal energy) generated when the electronic component 20 operates.

Figures 1, 2 and 3 also show the combination of the heat pipe 50 on the cover 30; the heat pipe 50 contains a cooling fluid 55. Specifically, the heat pipe 50 is welded or bonded to the outer wall surface 34 of the cover 30. Therefore, the waste heat (or thermal energy) generated by the operation of the electronic component 20 can be quickly conducted through the heat conductive foil layer 90, diffused to the cover body 30, and cooled and exchanged and output through the heat pipe 50. That is, the heat pipe 50 can quickly guide thermal energy away from the heat source region and direct thermal energy to a metal layer 60 or other lower temperature region to prevent heat concentration.

In a possible embodiment, the heat pipe 50 has a first side 51, a second side 52 and at least one side 53 connecting the first side 51 and the second side 52. The first side 51 of the heat pipe 50 is coupled to the outer wall surface 34 of the cover 30; and the second side 52 of the heat pipe 50 is provided with a geometrically contoured metal layer 60. The figure shows that the metal layer 60 is formed into a film or sheet structure for forming a large contact area or heat dissipation area with the outside; the metal layer 60 has a first surface 61 and a second surface 62; the first surface 61 is connected to the heat pipe second. The edge 52, and in conjunction with the rapid conduction of the heat pipe 50, rapidly discharges the above heat or heat.

In a modified embodiment, a portion or all of the metal layer 60 may be provided with a coating of heat radiating material to establish a radiant heat sinking effect.

Please refer to Figure 4 for a deriving embodiment. The metal layer 60 is disposed between the cover 30 and the heat pipe 50 such that the first layer 61 and the second surface 62 of the metal layer are respectively connected to the outer wall surface 34 of the cover and the first side 51 of the heat pipe.

Referring to Figure 5, a modified embodiment is depicted. The heat conductive foil layer 90 is disposed at a position between the lid body 30 and the heat pipe 50. That is, the first surface 91 of the thermal conductive foil layer is connected to the outer wall surface 34 of the cover, the second surface 92 is connected to the first side 51 of the heat pipe, and the second side 52 of the heat pipe is provided with the structural form of the first surface 61 of the metal layer.

Figure 6 shows a possible embodiment. The thermally conductive foil layer 90 is disposed at a position between the cover 30 and the metal layer 60. That is, the first surface 91 of the thermal conductive foil layer is disposed on the outer wall surface 34 of the cover; the second surface 92 of the thermal conductive foil layer is coupled to the first surface 61 of the metal layer. The second side 62 of the metal layer combines the structural form of the first side 61 of the heat pipe.

Please refer to Figures 7, 8 and 9 for another specific embodiment. The electronic component 20 of the package cover 30 is disposed on the circuit board 40; the thermally conductive foil layer 90 is disposed between the electronic component 20 and the cover 30. That is, the first surface 91 of the heat conductive foil layer faces the electronic component 20; the second surface 92 of the heat conductive foil layer is connected to the inner wall surface 33 of the cover. The metal layer 60 is disposed between the cover 30 and the heat pipe 50. In detail, the metal layer 60 is connected to the cover outer wall surface 34 and the heat pipe first side 51, respectively.

The figure shows a structural form in which the metal layer 60 forms a geometric profile; and the area of the metal layer 60 is larger than the area of the cover 30 (outer wall surface 34). In the embodiment taken, the metal layer 60 is a rectangular-shaped plate-like body; the first layer 61 of the metal layer is stacked on the outer wall surface 34 of the cover 30; the second surface 62 of the metal layer is joined to the first of the heat pipe 50. Side 51. And, the metal layer 60 defines a heat source region 63 stacked on the cover body 30 (outer wall surface 34) and a connection heat source region 63 to form a cantilever type region (or non-heat source region 64).

The metal layer 60 is also depicted as being provided with at least one pillar 70; the pillar 70 is positioned between the non-heat source region 64 of the metal layer 60 and the circuit board 40 such that the pillar 70 supports the pillar 70 The non-heat source region 64 of the metal layer 60 does not cause sagging when the metal layer 60 and the lid 30 or the heat pipe 50 are combined.

In a possible embodiment, a portion or all of the metal layer 60 is provided with a coating (not shown); the coating is selected from a thermal radiation material such that the metal layer 60 has a desired radiation. The role of heat dissipation.

It is assumed that the coating is disposed in the non-heat source region 64 of the metal layer 60; when waste heat (or thermal energy) generated by the operation of the electronic component 20 is rapidly conducted through the thermally conductive foil layer 90, and diffused to the heat source region 63 of the cover 30 and the metal layer 60, The heat energy is conducted from the heat source region 63 to the non-heat source region 64. The coated heat radiating material radiates heat, and the heat pipe 50 is quickly conducted, cooled and exchanged, and the output is obviously obtained. More ideal cooling efficiency. In particular, the area of the metal layer 60 is significantly larger than the area of the cover 30 (outer wall surface 34), so that the heat conductive module has a better heat dissipation effect than the prior art; and, in conjunction with the diffusion heat conduction of the heat conductive foil layer 90 The effect is to obtain a more uniform temperature equalization effect than the prior art.

Please refer to Figure 10 for a derived embodiment. The thermally conductive foil layer 90 is disposed at a position between the electronic component 20 and the cover 30. The first surface 91 of the thermally conductive foil layer is shown facing the electronic component 20, and the second surface 92 of the thermally conductive foil layer is connected to the inner wall surface 33 of the cover; and the heat pipe 50 is disposed between the cover 30 and the metal layer 60. That is, the first side 51 of the heat pipe is disposed on the outer wall surface 34 of the cover, the second side 52 of the heat pipe is connected to the first surface 61 of the metal layer; and the structure of the pillar 70 supporting the metal layer 60 (or the non-heat source area 64) state.

Referring to Figure 11, a modified embodiment is depicted. The thermally conductive foil layer 90 is disposed between the cover 30 and the metal layer 60, and the metal layer 60 is disposed between the thermally conductive foil layer 90 and the heat pipe 50. That is, the first surface 91 of the thermal conductive foil layer is disposed on the outer wall surface 34 of the cover, the second surface 92 is connected to the first surface 61 of the metal layer, the second surface 62 of the metal layer is connected to the first side 51 of the heat pipe, and the pillar 70 supports the metal The structural form of layer 60 (or non-heat source region 64).

Referring to Figure 12, another derived embodiment is shown. The heat conductive foil layer 90 is disposed at a position between the lid body 30 and the heat pipe 50. The first surface 91 of the thermally conductive foil layer is shown on the outer wall surface 34 of the cover, and the second surface 92 is connected to the heat pipe 50. And, the heat pipe 50 is disposed at a position between the heat conductive foil layer 90 and the metal layer 60. That is, the first side 51 of the heat pipe is disposed on the second surface 92 of the thermal conductive foil layer, the second side 52 of the heat pipe is combined or connected to the first surface 61 of the metal layer; and the pillar 70 supports the metal layer 60 (or the non-heat source area) 64) The structural form.

Referring to Figures 13, 14, and 15, it is assumed that the electronic component 20 disposed on the circuit board 40 includes an electronic component (defined as the heat source component 20A) that generates waste heat and an electronic component (defined as the non-heat source component 20B) that does not generate waste heat. . The heat conductive foil layer 90 is fitted to the cover 30 and disposed on the heat source element 20A. A pair of cover bodies 35 are provided to cover the non-heat source element 20B. And, the heat pipe 50 is disposed to pass or connect each of the cover body 30 and the sub-cover body 35; therefore, the heat energy of the heat source element 20A can be conducted to the cover body 30 and the sub-cover body 35 via the heat-conductive foil layer 90, and through the heat pipe 50 and The metal layer 60 is quickly outputted; for establishing a position according to the heat source element 20A and the non-heat source element 20B, the cover 30 (and/or the sub-cover 35), the metal layer 60 and the heat pipe 50 are arranged to establish an increased heat dissipation. The role of area or heat dissipation range.

In detail, the sub-cover 35 also has a rigid wall 36 defining a sub-cover 35 to form a casing (or plate-like body) structure having an internal space 37; the sub-cover 35 has an inner wall surface 38 and an outer wall surface 39; and, the sub-cover outer wall surface 39 can be configured to engage the heat pipe 50. In the embodiment taken, the inner wall surface 38 and the outer wall surface 39 of the sub-lid body 35 are also in a planar configuration.

The first surface 91 of the thermal conductive foil layer is shown facing the heat source element 20A, and the second surface 92 of the thermal conductive foil layer is joined to the inner wall surface 33 of the cover; and the heat pipe 50 is disposed on the cover 30 (and/or the sub-cover 35) and the metal layer 60. The location between. Therefore, the first side 51 or the side 53 of the heat pipe can be connected to the outer wall surface 34 of the cover (and/or the outer wall 39 of the sub cover); and the second side 52 of the heat pipe is connected to the structural form of the first face 61 of the metal layer.

It can be understood that the structural type of the sub-cover 35 assists in increasing the heat dissipation area of the heat source element 20A; and the sub-cover 35 also provides grounding and dust-proof protection, magnetic conduction or electromagnetic interference prevention for the non-heat source element 20B. effect.

It should be noted that the cover 30 (and/or the sub-cover 35) and the heat pipe 50 path and the metal layer 60 are arranged according to the positions of the heat source element 20A and/or the non-heat source element 20B, so that the heat source element 20A is generated. The waste heat or heat energy can be quickly conducted through the thermal conductive foil layer 90, diffused to the cover body 30 and the sub-cover body 35, and combined with the heat pipe 50 path and the metal layer 60 output to increase the heat dissipation area of the heat dissipation system. That is to say, the waste heat (or thermal energy) generated by the heat source element 20A is not only discharged through the heat conductive foil layer 90 and the cover body 30, the sub cover body 35, and the heat pipe 50; but also includes the metal layer 60 in which the heat pipes 50 are arranged in a row. Therefore, the heat dissipation area of this heat transfer system is significantly increased.

Referring to Figure 16, a derived embodiment is shown. The first surface 91 of the thermal conductive foil layer faces the heat source element 20A, and the second surface 92 engages the inner wall surface 33 of the cover; and the metal layer 60 is disposed at a position between the cover 30 and the heat pipe 50 such that the first faces 61 of the metal layer are stacked The cover outer wall surface 34, the sub-cover outer wall surface 39, and the second layer 62 of the metal layer are connected to the first side 51 of the heat pipe.

Referring to FIG. 17, a position in which the thermally conductive foil layer 90 is disposed between the cover 30 and the heat pipe 50 is depicted. The first surface 91 of the thermally conductive foil layer is shown on the outer wall surface 34 of the cover, and the second surface 92 is connected to the heat pipe 50. And, the heat pipe 50 is disposed at a position between the heat conductive foil layer 90 and the metal layer 60. That is, the first side 51 of the heat pipe is disposed on the second surface 92 of the thermal conductive foil layer, and the heat pipe 50 is routed through the sub-lid body 35 (or the sub-cover rigid wall 36), and the first side 51 is connected to the sub-lid 35. The outer wall surface 39 and the second side 52 of the heat pipe are connected to the structural form of the first surface 61 of the metal layer.

Fig. 18 shows that the thermally conductive foil layer 90 is disposed between the cover 30 and the metal layer 60, and the metal layer 60 is disposed between the thermally conductive foil layer 90 and the heat pipe 50. That is, the first surface 91 of the thermal conductive foil layer is disposed on the outer surface 34 of the cover, the second surface 92 is connected to the first surface 61 of the metal layer, and the first surface 61 of the metal layer is stacked or connected to the outer surface 39 of the sub-cover, the metal layer The two sides 62 are connected to the structural form of the first side 51 of the heat pipe.

Typically, the thermal module used for electronic components has the following considerations and advantages compared with the old ones under the conditions of dust protection, electromagnetic interference prevention and manufacturing cost: 1 The structure of the heat-conducting module and related components, operational use, etc., have been redesigned, and are different from the conventional ones; and, changing its use type, is different from the old one. For example, the electronic component 20 is matched with the thermal conductive foil layer 90, the cover 30, or the thermally conductive foil layer 90 includes a first surface 91 and a second surface 92, and fits the inner wall surface 33, the outer wall surface 34 of the cover 30, or a combined heat pipe. 50, the structural design of the metal layer 60 and the like, the obvious removal of the conventional heat dissipation structure tends to apply a more complicated structural combination type such as a shaft or a tube, a slot, a complex protrusion or a snap fastener, and It provides a structural design that is simpler and more convenient to combine than conventional techniques. 2. In particular, the metal foil layer 90 is arranged to connect the structural structure of the cover 30, the heat pipe 50 or the metal layer 60, and has a function of rapidly diffusing heat conduction, which relatively improves the heat dissipation efficiency of the electronic component 20, and is also known. The art is more ideal for uniform temperature effects. Moreover, the structural design of the cover body 30 (and/or the sub-lid body 35) and the heat pipe 50 path and the metal layer 60 according to the position of the heat source element 20A and the non-heat source element 20B makes the heat dissipation area of the heat conduction system significantly increased. The formation of a larger area of contact type also improves its heat dissipation or waste heat discharge effect.

Therefore, this creative department provides an effective thermal module for electronic components. Its spatial type is different from the conventional ones, and it has the advantages unmatched in the old law. It shows considerable progress. Fully meet the requirements of the new patent.

However, the above is only a feasible embodiment of the present invention, and is not intended to limit the scope of the present invention, that is, the equivalent changes and modifications made by the scope of the patent application of the present invention are covered by the scope of the creative patent. .

20‧‧‧Electronic components

20A‧‧‧Heat source components

20B‧‧‧ Non-heat source components

30‧‧‧ cover

31, 36‧‧‧ rigid walls

32, 37‧‧‧ internal space

33, 38‧‧‧ inner wall

34, 39‧‧‧ outer wall

35‧‧‧Sub-cover

40‧‧‧ boards

50‧‧‧heat pipe

51‧‧‧ first side

52‧‧‧ second side

53‧‧‧ side

55‧‧‧Cooling fluid

60‧‧‧metal layer

61‧‧‧ first side

62‧‧‧ second side

90‧‧‧thermal foil layer

91‧‧‧ first surface

92‧‧‧ second surface

Figure 1 is a schematic diagram showing the structure of an embodiment of the present creation.

Fig. 2 is a schematic exploded view of the structure of Fig. 1; showing the structure of the electronic component, the cover, the heat conductive foil layer disposed between the electronic component and the cover, the heat pipe and the metal layer.

Fig. 3 is a schematic cross-sectional view showing the structure of Fig. 1; a combination of an electronic component, a cover, a thermally conductive foil layer disposed between the electronic component and the cover, a heat pipe and a metal layer, and the like.

Fig. 4 is a schematic cross-sectional view showing a structural combination of the present invention; showing a combination of an electronic component, a thermally conductive foil layer, a cover body, and a metal layer disposed between the cover body and the heat pipe.

Figure 5 is a schematic cross-sectional view showing another structural combination of the present invention; depicting a combination of an electronic component, a cover, a thermally conductive foil layer disposed between the cover and the heat pipe, and a metal layer.

Figure 6 is a schematic cross-sectional view showing another structural combination of the present invention; showing a combination of an electronic component, a cover, a thermally conductive foil layer, and a metal layer disposed between the thermally conductive foil layer and the heat pipe.

Figure 7 is a schematic view showing the structural combination of one embodiment of the present invention; the case where the area of the metal layer is larger than the area of the cover and the column of the metal layer is provided.

Figure 8 is a schematic exploded view of the structure of Figure 7; showing the structure of the electronic component, the cover body, the heat-conductive foil layer disposed between the heat-conducting unit and the cover, the metal layer and the heat pipe.

Figure 9 is a schematic cross-sectional view of the structure of Figure 7; depicting the combination of the electronic component, the cover, the thermally conductive foil layer disposed between the electronic component and the cover, the metal layer and the heat pipe.

Figure 10 is a schematic cross-sectional view of one of the functional combinations of the present invention; showing the combination of electronic components, a thermally conductive foil layer, a cover, a heat pipe, and a metal layer.

Figure 11 is a schematic cross-sectional view showing another structural combination of the present invention; depicting a combination of an electronic component, a cover, a thermally conductive foil layer disposed between the cover and the metal layer, and a heat pipe.

Fig. 12 is a schematic cross-sectional view showing another structural combination of the present invention; showing a combination of an electronic component, a cover body, a heat conductive foil layer disposed between a cover body and a heat pipe, and a metal layer.

Figure 13 is a schematic view showing the structural combination of another embodiment of the present invention; showing the arrangement of the heat pipe connecting the heat source element and the non-heat source element.

Figure 14 is a schematic exploded view of the structure of Fig. 13; showing the structure of the heat source element, the cover body, the heat conductive foil layer disposed between the electronic component and the cover body, and the non-heat source component provided with the sub-cover body, the heat pipe and the metal layer. .

Figure 15 is a schematic cross-sectional view of the structure of Figure 13; depicting a heat source element, a cover, a thermally conductive foil layer disposed between the electronic component and the cover, and a non-heat source component providing a sub-cover, a heat pipe, and a metal layer. Combination situation.

Figure 16 is a schematic cross-sectional view showing one of the structures of the present invention; the heat source element, the cover body, the heat conductive foil layer are disposed between the electronic component and the cover body, the non-heat source component is provided with the sub cover body, the metal layer is disposed on the cover body, and The combination between heat pipes.

Figure 17 is a schematic cross-sectional view showing another structural combination of the present invention; depicting a combination of a heat source element, a cover body, a heat conductive foil layer disposed between the cover body and the heat pipe, and a non-heat source component setting sub-cover body, a metal layer, and the like. .

Figure 18 is a schematic cross-sectional view showing another structural combination of the present invention; showing a combination of a heat source member, a cover body, a heat conductive foil layer disposed between the cover body and the metal layer, and a non-heat source component providing a sub-cover body, a heat pipe, and the like. .

20‧‧‧Electronic components

30‧‧‧ cover

31‧‧‧Rigid wall

32‧‧‧Internal space

34‧‧‧ outer wall

40‧‧‧ boards

50‧‧‧heat pipe

51‧‧‧ first side

52‧‧‧ second side

53‧‧‧ side

60‧‧‧metal layer

61‧‧‧ first side

62‧‧‧ second side

90‧‧‧thermal foil layer

91‧‧‧ first surface

92‧‧‧ second surface

Claims (14)

A heat conduction module for an electronic component, comprising: an electronic component; a cover body having a rigid wall defining an inner space to cover the electronic component; the cover body having an inner wall surface and an outer wall surface; At least one of the heat pipe and the metal layer of the cooling fluid is disposed on the cover; the heat pipe has a first side, a second side, and a side connecting the first side and the second side; a geometrically contoured metal layer connecting the a heat pipe; the metal layer comprises a first surface and a second surface; a thermal conductive foil layer connecting at least one of the inner wall surface and the outer wall surface of the cover; the thermal conductive foil layer is selected from a metal material to form a geometrically contoured thin layer structure, including the first The surface and the second surface; and the thermally conductive foil layer have a thermal conductivity that is at least greater than or equal to the thermal conductivity of the copper. The heat conducting module for an electronic component according to claim 1, wherein the first surface of the heat conductive foil layer faces the electronic component; the second surface of the heat conductive foil layer is connected to the inner wall surface of the cover; and the outer wall of the cover is connected to the first side of the heat pipe. And the second side of the heat pipe combines the first side of the metal layer. The heat conducting module for electronic components according to claim 1, wherein the first surface of the heat conductive foil layer faces the electronic component; the second surface of the heat conductive foil layer is connected to the inner wall surface of the cover; and the outer wall surface of the cover is connected to the metal layer. The first side of the heat pipe is combined with the second side of the metal layer. The heat conducting module for an electronic component according to claim 1, wherein the first surface of the heat conductive foil layer is disposed on the outer wall surface of the cover; the second surface of the heat conductive foil layer is connected to the first side of the heat pipe; and the second heat pipe is provided. Combine the first side of the metal layer. The heat conducting module for an electronic component according to claim 1, wherein the first surface of the heat conductive foil layer is provided with a connection outer wall surface; the second surface of the heat conductive foil layer is connected to the first surface of the metal layer; and the metal layer The first side of the combined heat pipe on both sides. The heat conducting module for electronic components according to claim 1, wherein the first surface of the heat conductive foil layer faces the electronic component; the second surface of the heat conductive foil layer is connected to the inner wall surface of the cover; and the outer wall surface of the cover is connected to the metal layer. The second side of the metal layer is combined with the first side of the heat pipe; the area of the metal layer is larger than the area of the outer wall surface of the cover, and the metal layer defines a heat source region stacked on the cover body and a heat source region connected to form a cantilever type non-heat source And the metal layer is provided with at least one pillar; the pillar is located between the non-heat source region of the metal layer and a circuit board, so that the pillar supports the non-heat source region of the metal layer. The heat conducting module for an electronic component according to claim 1, wherein the first surface of the heat conductive foil layer faces the electronic component; the second surface of the heat conductive foil layer is connected to the inner wall surface of the cover; and the outer wall of the cover is connected to the first side of the heat pipe. The second side of the heat pipe combines the first side of the metal layer; the area of the metal layer is larger than the area of the outer wall surface of the cover, the metal layer defines a heat source area and a non-heat source area connecting the heat source areas; and the metal layer is provided with at least one pillar; The pillar is located between the non-heat source region of the metal layer and a circuit board such that the pillar supports the non-heat source region of the metal layer. The heat conducting module for electronic components according to claim 1, wherein the first surface of the heat conductive foil layer is disposed on the outer wall surface of the cover; the second surface of the heat conductive foil layer is connected to the first surface of the metal layer; The first side of the heat pipe is combined on the first side; the area of the metal layer is larger than the area of the outer wall surface of the cover, and the metal layer defines a heat source region stacked on the cover body and the heat conductive foil layer and a heat source region connected to form a cantilever type non-heat source region. And the metal layer is provided with at least one pillar; the pillar is located between the non-heat source region of the metal layer and a circuit board, so that the pillar supports the non-heat source region of the metal layer. The heat conducting module for electronic components according to claim 1, wherein the first surface of the heat conductive foil layer is disposed on the outer wall surface of the cover; the second surface of the heat conductive foil layer is connected to the first side of the heat pipe; the second side of the heat pipe Combining the first side of the metal layer; the area of the metal layer is larger than the area of the outer wall surface of the cover; the metal layer defines a heat source area and a non-heat source area connecting the heat source areas; and the metal layer is provided with at least one pillar; the columnar shape The level is between the non-heat source region of the metal layer and a circuit board such that the pillar supports the non-heat source region of the metal layer. The heat conducting module for electronic components according to claim 1, wherein the electronic component comprises a heat source component that generates heat energy and a non-heat source component that does not generate heat energy; and the non-heat source component is covered by a cover body. The secondary cover body has a rigid wall defining an auxiliary cover body to form an internal space covering the non-heat source component; the secondary cover body has an inner wall surface and an outer wall surface; the first surface of the thermal conductive foil layer faces the heat source element; The two surfaces are connected to the inner wall surface of the cover; the outer wall surface of the cover is connected to the first side of the heat pipe; the second side of the heat pipe is combined with the first side of the metal layer; and the heat pipe is arranged to connect each of the cover body and the auxiliary cover body. The heat conducting module for electronic components according to claim 1, wherein the electronic component comprises a heat source component that generates heat energy and a non-heat source component that does not generate heat energy; and the non-heat source component is covered by a cover body. The secondary cover body has a rigid wall defining an auxiliary cover body to form an internal space covering the non-heat source component; the secondary cover body has an inner wall surface and an outer wall surface; the first surface of the thermal conductive foil layer faces the heat source element; The two surfaces are connected to the inner wall surface of the cover; the outer wall surface of the cover and the outer wall surface of the sub-cover are connected to the first side of the metal layer; and the second side of the metal layer is combined with the first side of the heat pipe. The heat conducting module for electronic components according to claim 1, wherein the electronic component comprises a heat source component that generates heat energy and a non-heat source component that does not generate heat energy; and the non-heat source component is covered by a cover body. The auxiliary cover body has a rigid wall, and the auxiliary cover body defines an inner space to cover the non-heat source component; the auxiliary cover body has an inner wall surface and an outer wall surface; the first surface of the thermal conductive foil layer is disposed on the outer wall surface of the cover; The second surface of the foil layer is connected to the first side of the heat pipe; the second side of the heat pipe is combined with the first side of the metal layer; and the heat pipe is connected to the rigid wall of the secondary cover body. The heat conducting module for electronic components according to claim 1, wherein the electronic component comprises a heat source component that generates heat energy and a non-heat source component that does not generate heat energy; and the non-heat source component is covered by a cover body. The auxiliary cover body has a rigid wall, and the auxiliary cover body defines an inner space to cover the non-heat source component; the auxiliary cover body has an inner wall surface and an outer wall surface; the first surface of the thermal conductive foil layer is disposed on the outer wall surface of the cover; The second surface of the foil layer is connected to the first surface of the metal layer; the second surface of the metal layer is combined with the first side of the heat pipe; and the first surface of the metal layer is disposed to be connected to the outer wall surface of the sub-cover. The thermally conductive module for an electronic component according to any one of claims 1 to 13, wherein the metal layer is at least partially disposed with a coating of a heat radiating substance.