TWM529148U - Stereo type radiation heat dissipator - Google Patents

Description

Three-dimensional radiation radiator

This creation is about radiation radiators, especially a three-dimensional radiation radiator.

The radiation radiator used in the heat dissipation of electronic devices is generally coated on a surface of a substrate (made mostly of metal) or adhered to a heat radiation material; the working mode is to contact the substrate with a heat source in the electronic device. The heat source absorbs the heat energy to the substrate, and the heat energy is radiated to the environment by the radiant heat transfer on the substrate.

The largest source of heat in an electronic device is typically a processor chip that is flat and attached to a circuit board. In addition to the processor chip, the circuit board is provided with a large number of other electronic components. The protruding height of these other electronic components on the circuit board is mostly higher than that of the processor chip, so the substrate will interfere with other when attaching the processor chip. Electronic components. In view of this, the creator has made great efforts to solve the above problems by focusing on the above-mentioned prior art, and has devoted himself to the application of the theory, that is, the goal of the creator's improvement.

This creation provides a three-dimensional radiation radiator.

The present invention provides a three-dimensional radiation heat sink comprising a heat conducting plate, a fin and a heat radiating layer. The fins extend from the edge of the thermally conductive plate and the fins are bent relative to the thermally conductive plate. The heat radiating layer covers at least a portion of one of the sides of the airfoil.

Preferably, the fins are disposed around the thermally conductive plate.

Preferably, the plurality of fins are plural, and each fin is non-parallel to any other fin. The fins are arranged apart from each other. The lateral direction of the fin may extend out of an extension. The fins are arranged around the heat conducting plate.

Preferably, each of the fins may have an obtuse angle with the heat conducting plate, and the heat radiating layers are disposed opposite to each other. Each of the fins may also have an acute angle with the heat conducting plate, and the heat radiating layers are disposed opposite to each other.

Preferably, a plurality of holes are formed in the joint between the fin and the heat conducting plate. The side edges of the fins are formed with a plurality of missing holes.

Preferably, the heat radiating layers may be a pair, and the pair of heat radiating layers respectively cover the two sides of the fins. Thermal radiation may extend over at least a portion of the surface of the thermally conductive plate. The heat radiation layer contains a plurality of heat radiation particles. The heat radiation particles are one of graphene particles, graphene fragments, nanocarbon spheres or boron nitride.

The three-dimensional radiation radiator of the present invention can overcome the problem that the heat-conducting plate does not have sufficient plane extending space by means of the heat-conducting flat plate relative to the flap bending configuration.

Referring to FIG. 1, a first embodiment of the present invention provides a three-dimensional radiation heat sink including a heat conducting flat plate 110 and at least one fin 120.

In this embodiment, the heat conducting plate 110 is a rectangular plate, and the heat conducting plate 110 can be made of metal, such as an aluminum plate or a copper plate; the heat conducting plate 110 can also be made of non-metal such as ceramic, flake graphene or glass plate. .

In the present embodiment, the three-dimensional radiation heat sink of the present invention includes a plurality of fins 120, and each of the fins 120 integrally extends from the edge of the heat conducting flat plate 110. The fins 120 are disposed apart from each other and are arranged around the heat conducting plate 110. Each of the fins 120 is bent with respect to the heat conducting flat plate 110 to respectively form an obtuse angle with the heat conducting flat plate 110, and each of the fins 120 and the other arbitrary fins 120 are non-parallel. One side of each of the fins 120 preferably extends laterally from an extension 121.

In the embodiment, the heat radiation layer 200 contains a plurality of heat radiation particles. The heat radiation particles are one of materials having good heat radiation characteristics such as graphene particles, graphene fragments, C60 nanocarbon spheres or boron nitride. The heat radiating layer 200 is preferably attached to the inner side of the three-dimensional radiation heat sink to cover the inner side of each of the fins 120, and thus the heat radiating layers 200 are preferably disposed to face each other. Moreover, the heat radiating layer 200 preferably extends over at least a portion of the top surface of the thermally conductive flat plate 110.

Referring to FIG. 2 to FIG. 4, the three-dimensional radiation radiator of the present invention is applied to a circuit board 10, a heating element 11 is disposed on the circuit board 10, and electronic components 12 are disposed adjacent to the vicinity of the heating element 11, at least one A portion of the electronic component 12 protrudes from the circuit board 10 by a height greater than a height of the heat generating component 11 protruding from the circuit board 10.

The heat-emitting element 11 is attached to the bottom surface of the heat-conducting plate 110. When the heat-generating element 11 is in operation, the heat-conducting plate 110 can absorb the heat energy generated by the heat-generating element 11 and conduct it to the respective fins 120 and then radiate to the environment through the heat-radiating layer 200 in a radiant heat transfer manner. in the air.

Referring to FIG. 5, a second embodiment of the present invention provides a three-dimensional radiation heat sink including a heat conducting flat plate 110 and at least one fin 120. The configuration is as large as the first embodiment described above, and the present embodiment is the same as the first embodiment, and details are not described herein again. This embodiment differs from the first embodiment in that the side edges of each of the fins 120 are not provided with the extensions 121, so that a large space can be reserved between adjacent fins 120 for thermal convection.

Referring to FIG. 6, a third embodiment of the present invention provides a three-dimensional radiation heat sink including a heat conducting flat plate 110 and at least one fin 120.

In this embodiment, the heat conducting plate 110 is a circular plate, and the heat conducting plate 110 can be made of metal, such as an aluminum plate or a copper plate; the heat conducting plate 110 can also be made of non-metal such as ceramic, flake graphene or glass. .

In the present embodiment, the three-dimensional radiation heat sink of the present invention includes a plurality of fins 120, and each of the fins 120 integrally extends from the edge of the heat conducting flat plate 110. The fins 120 are disposed apart from each other and are arranged around the heat conducting plate 110. Each of the fins 120 is bent with respect to the heat conducting flat plate 110 to respectively form an obtuse angle with the heat conducting flat plate 110, and each of the fins 120 and the other arbitrary fins 120 are non-parallel.

In the embodiment, the heat radiation layer 200 contains a plurality of heat radiation particles. The heat radiation particles are one of materials having good heat radiation characteristics such as graphene particles, graphene fragments, C60 nanocarbon spheres or boron nitride. The heat radiating layer 200 is preferably attached to the inner side of the three-dimensional radiation heat sink to cover the inner side of each of the fins 120, and thus the heat radiating layers 200 are preferably disposed to face each other. Moreover, the heat radiating layer 200 preferably extends over at least a portion of the top surface of the thermally conductive flat plate 110.

Referring to FIG. 7, a fourth embodiment of the present invention provides a three-dimensional radiation heat sink including a heat conducting plate 110 and a single fin 120.

In this embodiment, the heat conducting plate 110 is a circular plate, and the heat conducting plate 110 can be made of metal, such as an aluminum plate or a copper plate; the heat conducting plate 110 can also be made of non-metal such as ceramic, flake graphene or glass. .

In the present embodiment, the fins 120 extend integrally from the edge of the heat conducting flat plate 110. The fins 120 are annularly disposed around the heat conducting flat plate 110. The fins 120 are bent in a tapered shape with respect to the heat conducting flat plate 110 to form an obtuse angle with the heat conducting flat plate 110.

In the embodiment, the heat radiation layer 200 contains a plurality of heat radiation particles. The heat radiation particles are one of materials having good heat radiation characteristics such as graphene particles, graphene fragments, C60 nanocarbon spheres or boron nitride. The heat radiating layer 200 is preferably attached to the inner side of the three-dimensional radiation heat sink to cover the inner side of the fin 120, so that the forward directions of the respective portions of the heat radiating layer 200 are preferably arranged. Moreover, the heat radiating layer 200 preferably extends over at least a portion of the top surface of the thermally conductive flat plate 110.

Referring to FIG. 8, a fifth embodiment of the present invention provides a three-dimensional radiation heat sink including a heat conducting flat plate 110 and a pair of fins 120.

In this embodiment, the heat conducting plate 110 is a circular plate, and the heat conducting plate 110 can be made of metal, such as an aluminum plate or a copper plate; the heat conducting plate 110 can also be made of non-metal such as ceramic, flake graphene or glass. .

In the present embodiment, each of the fins 120 integrally extends from the edge of the heat conducting flat plate 110. The fins 120 are disposed apart from each other and disposed opposite to each other on the heat conducting flat plate 110. Each of the fins 120 is bent relative to the heat conducting flat plate 110, and each of the fins 120 is respectively placed at an acute angle with the heat conducting flat plate 110.

In the embodiment, the heat radiation layer 200 contains a plurality of heat radiation particles. The heat radiation particles are one of materials having good heat radiation characteristics such as graphene particles, graphene fragments, C60 nanocarbon spheres or boron nitride. The heat radiation layer 200 is preferably attached to the outer side of the three-dimensional radiation heat sink to cover the outer side surface of the air foil 120, so that the pair of heat radiation layers 200 are disposed opposite each other.

Referring to FIG. 9 and FIG. 10 , a sixth embodiment of the present invention provides a three-dimensional radiation heat sink including a heat conducting flat plate 110 and at least one fin 120 .

In the present embodiment, the heat conducting plate 110 and the fins 120 are preferably made of the same film sheet 100. A plurality of holes 101 are formed in the film sheet 100 to facilitate tearing or bending of the film sheet 100. A portion of the holes 101 are arranged on the film sheet 100 to define the edges of the heat conducting plate 110, and the remaining holes 101 are arranged to radiate outwardly from the edge of the heat conducting plate 110 to the cutting line 102 at the edge of the film sheet 100.

The cutting line 102 can be used to tear the film sheet 100 to form the flap 120. The hole 101 of the cutting line 102 is torn to form a notch 103 at the edge of the flap 120. The junction of the fin 120 and the heat conducting plate 110 has a hole 101 for allowing the bent film sheet 100 to have an angle between the fin 120 and the heat conducting plate 110.

In the embodiment, the heat radiation layer 200 contains a plurality of heat radiation particles. The heat radiation particles are one of materials having good heat radiation characteristics such as graphene particles, graphene fragments, C60 nanocarbon spheres or boron nitride. The heat radiation layer 200 is preferably attached to both sides of the film sheet 100, so that both the inner side and the outer side of the three-dimensional radiation heat sink are covered with the heat radiation layer 200. The heat radiating layers 200 on the inner side of the fins 120 are opposed to each other, and the heat radiating layers 200 on the outer side of the fins 120 are disposed opposite to each other.

The three-dimensional radiation radiator of the present invention can overcome the problem that the heat-conducting flat plate 110 does not have sufficient plane extending space by means of the heat-conducting flat plate 110 being bent relative to the fins 120. Moreover, the fins 120 are in a non-parallel configuration, whereby a pair of mutually parallel heat radiating layers 200 can be prevented from absorbing heat energy radiated from the opposing radiation.

The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the scope of the patents of the present invention. Other equivalent variations of the patent spirit using the present invention are all within the scope of the patent.

10‧‧‧ boards

11‧‧‧heating components

12‧‧‧Electronic components

100‧‧‧film sheet

101‧‧‧ hole

102‧‧‧ cutting line

103‧‧‧ hole

110‧‧‧thermal plate

120‧‧‧ wing

121‧‧‧Extension

200‧‧‧thermal radiation layer

1 is a perspective view of a three-dimensional radiation heat sink according to a first embodiment of the present invention.

2 to 4 are views showing the state of use of the three-dimensional radiation radiator of the first embodiment of the present invention.

Fig. 5 is a perspective view showing the three-dimensional radiation radiator of the second embodiment of the present invention.

Fig. 6 is a perspective view showing the three-dimensional radiation radiator of the third embodiment of the present invention.

Fig. 7 is a perspective view showing the three-dimensional radiation radiator of the fourth embodiment of the present invention.

Figure 8 is a schematic view of a three-dimensional radiation radiator of the fifth embodiment of the present invention.

Figure 9 is a perspective view showing one of the three-dimensional radiation radiators of the sixth embodiment of the present invention.

FIG. 10 is another perspective view of the three-dimensional radiation radiator of the sixth embodiment of the present invention.

110‧‧‧thermal plate

120‧‧‧ wing

121‧‧‧Extension

200‧‧‧thermal radiation layer

Claims (14)

A three-dimensional radiation heat sink comprising: a heat conducting plate; a fin extending from an edge of the heat conducting plate, wherein the fin is bent relative to the heat conducting plate; and a heat radiating layer covering one side of the fin At least part of it. The three-dimensional radiation heat sink of claim 1, wherein the airfoil is disposed around the heat conducting plate. The three-dimensional radiation heat sink according to claim 1, wherein the plurality of fins are plural, and each of the fins is non-parallel to any other of the fins. The three-dimensional radiation heat sink of claim 3, wherein the fins are disposed apart from each other. The three-dimensional radiation heat sink of claim 3, wherein at least one of the fins extends laterally out of an extension. The three-dimensional radiation heat sink of claim 3, wherein the fins are arranged around the heat conducting flat plate. The three-dimensional radiation heat sink according to claim 6, wherein each of the fins has an obtuse angle with the heat conducting flat plate, and the heat radiating layers are disposed opposite to each other. The three-dimensional radiation heat sink of claim 6, wherein each of the fins has an acute angle with the heat conducting plate, and the heat radiating layers are disposed opposite to each other. The three-dimensional radiation radiator of claim 1, wherein a plurality of holes are formed in the joint of the fin and the heat conducting plate. The three-dimensional radiation heat sink of claim 1, wherein the side edges of the airfoil are formed with a plurality of missing holes. The three-dimensional radiation heat sink according to claim 1, wherein the heat radiation layer is a pair, and the pair of heat radiation layers respectively cover two sides of the fin. The three-dimensional radiation heat sink of claim 1, wherein the heat radiation layer extends over at least a portion of the surface of the heat conductive plate. The three-dimensional radiation heat sink of claim 1, wherein the heat radiation layer contains a plurality of heat radiation particles. The stereoscopic radiation heat sink of claim 13, wherein the heat radiation particles are one of graphene particles, graphene fragments, nanocarbon spheres or boron nitride.