TWM532141U - Radiative heat-dissipation type electronic device - Google Patents

Description

Radiation cooling electronic device

This creation is about a heat sink, especially a closed electronic device with a radiative heat dissipation mechanism.

A typical electronic device usually generates a large amount of thermal energy during operation. In order to prevent the temperature of the electronic device from exceeding the allowable operating temperature, most electronic devices must be provided with a heat dissipation mechanism to dissipate heat energy into the environment.

The general heat dissipation mechanism is to remove thermal energy from the heat source in the electronic device by means of heat conduction, and then radiate the heat energy into the environment by means of heat convection. Most metals have good thermal and thermal convection characteristics, so metal casings are a common heat sinking mechanism.

Since the metal casing has the disadvantage of shielding electromagnetic waves, the electronic device used for communication purposes interferes with the radio signal, so the electronic device for some communication purposes cannot be applied to the full metal casing, and most of the casing is made of insulating plastic. . Furthermore, outdoor electronic devices are generally designed as a sealed outer casing because of their waterproofing requirements. There is a lack of thermal energy passage between the inner space of the sealed and non-metallic outer casing and the external environment, so the thermal energy therein is not easily dissipated by heat conduction or heat convection.

Another sealed and non-metallic enclosure is common in speakers. Most of the speakers are wooden enclosures, and the enclosures must be sealed to allow the air to dampen in the enclosures, thus causing the enclosures to be closed and non-metallic. In a metal case, the heat inside the speaker is not easily dissipated by heat conduction or heat convection.

In view of this, the creator has made great efforts to solve the above problems by focusing on the above-mentioned prior art, and has devoted himself to the application of the theory, that is, the goal of the creator's improvement.

The present invention provides a closed electronic device having a radiation heat dissipation mechanism.

The present invention provides a radiation-dissipating electronic device comprising a housing, a heat generating element and a heat radiating layer. An enclosed space is formed in the outer casing, and at least a portion of the outer casing forms a heat penetration zone. The heating element is housed in an enclosed space. The heat radiation layer covers a surface of the heat generating component, and at least a portion of the heat radiation layer is disposed toward the heat penetration zone.

The heat penetration zone is preferably made of a non-metallic material. The heat penetration zone can be made of plastic. The heat penetration zone can also be made of wood. The heat penetration zone can also be made of glass.

The outer casing may be flat and at least a portion of the heat penetration zone is forwardly parallel to the forward configuration of the outer casing. The outer casing may also be cylindrical and at least a portion of the heat penetration zone is located on the side of the outer casing.

The heat radiation layer contains a plurality of heat radiation particles. The heat radiation particles may be one of graphene particles, graphene fragments, nanocarbon spheres or boron nitride.

The heat radiating layer is preferably disposed parallel to at least a portion of the heat penetration zone. The surface area of the heat penetration zone preferably accounts for more than half of the surface area of the outer casing.

The radiant heat-dissipating electronic device of the present invention can radiate heat generated by the heat-generating component through the heat-transfer region to the outside of the casing by the radiant heat transfer by the heat-radiating layer and the heat-transfer region on the outer casing. Therefore, it can be applied to an electronic device having a closed non-metallic casing.

Referring to FIG. 1 to FIG. 2, the first embodiment of the present invention provides a radiant heat dissipation type electronic device. In this embodiment, the radiant heat dissipation type electronic device may preferably be a wireless network base station or a television set box. It comprises a housing 100, a control circuit board 200, a heating element 300 and a heat radiation layer 400.

The outer casing 100 is flat, and at least a portion of the outer casing 100 is made of a non-metallic material to form a heat penetration zone 110, and a closed space 101 is formed in the outer casing 100. In this embodiment, the outer casing 100 is preferably made of plastic, so that the entire outer casing 100 can serve as the heat penetration zone 110; however, the present invention is not limited thereto. For example, the outer casing 100 may also include a part made of metal. However, at least one of the sides of the flat casing 100 must be made of plastic as the heat penetration zone 110, but the present invention is not limited thereto. For example, the heat penetration zone 110 may also be made of a glass non-metal material. At least a portion of the heat penetration zone 110 is positively parallel to the forward direction of the entirety of the outer casing 100. In the present embodiment, the two sides of the flat casing 100 are respectively formed as a part of the heat penetration zone 110, so that the heat penetration zone 110 includes at least the sections, and the forward direction is parallel to the entire forward direction of the casing 100.

The control circuit board 200 is housed in the enclosed space 101 in the outer casing 100, and the control circuit board 200 is preferably overlapped with the body of the outer casing 100 between the two sides of the outer casing 100, thus causing the positive direction of the control circuit board 200 Parallel to the forward direction of the outer casing 100 as a whole.

The heat generating component 300 is housed in the enclosed space 101 in the outer casing 100. In the embodiment, the heat generating component 300 is preferably a chip-shaped processor chip, and the heat generating component 300 is stacked on one side of the control circuit board 200. The heat generating component 300 faces the one side of the flat casing 100, and thus faces a portion of the heat penetration zone 110 formed by the face. However, the form of the heat generating element 300 is not limited, and for example, the heat generating element 300 may be a circuit board, a metal heat conductive sheet, or a metal heating element such as a coil.

The heat radiation layer 400 includes a plurality of heat radiation particles, and the heat radiation particles may be one of a material having good heat radiation characteristics such as graphene particles, graphene fragments, nano carbon spheres or boron nitride. The heat radiation layer 400 covers the surface of the heat generating component 300, that is, the heat radiation layer 400 faces the heat penetration region 110 of one side of the outer casing 100, and in the present embodiment, the heat radiation layer 400 preferably has heat penetration with the portion. The through regions 110 are arranged in parallel with each other.

Referring to FIG. 3, a second embodiment of the present invention provides a radiant heat dissipation electronic device. In this embodiment, the radiant heat dissipation electronic device is preferably a speaker, and includes a housing 100, a control circuit board 200, and a The heating element 300 and a heat radiation layer 400.

In the present embodiment, the outer casing 100 has a columnar shape, and the outer casing 100 is mainly made of wood. The portion made of wood can serve as the heat penetration zone 110, that is, the surface area of the heat penetration zone 110 accounts for more than half of the surface area of the outer casing 100. The heat penetration zone 110 is preferably located on the side of the outer casing 100 such that the heat penetration zone 110 is positively parallel to the overall lateral direction of the outer casing 100.

The control circuit board 200 is housed in the enclosed space 101 in the outer casing 100, and the control circuit board 200 is preferably disposed on one of the inner side walls of the outer casing 100. The heating element 300 is received in the enclosed space 101 in the outer casing 100. The heating element 300 may be a chip, a resistor, a vacuum tube or a coil, or the like, which is disposed on the control circuit board 200, or a metal thermal conductive sheet or Another board, this creation is not limited to its type. The heat radiation layer 400 includes a plurality of heat radiation particles, and the heat radiation particles may be one of a material having good heat radiation characteristics such as graphene particles, graphene fragments, nano carbon spheres or boron nitride. The heat radiation layer 400 covers the surface of the heat generating component 300, and the heat radiation layer 400 faces the heat penetration region 110 formed by the other side wall of the outer casing 100 opposite to the control circuit board 200, and in the present embodiment, heat radiation Layer 400 is preferably disposed parallel to the heat transmissive regions 110 of this portion.

In the radiant heat dissipation electronic device of the present invention, the heat generating component 300 is attached with the heat radiating layer 400, and at least a portion of the outer casing 100 is formed with a heat transmitting region 110 corresponding to the heat radiating layer 400, and the heat radiating layer 400 can be The radiant heat transfer radiates the heat generated by the heat generating component 300 through the heat penetration region 110 to the outside of the outer casing 100. Therefore, the radiant heat sink electronic device of the present invention can be applied to any closed non-metal casing electronic device that is not suitable for heat conduction or heat convection heat dissipation.

The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the scope of the patents of the present invention. Other equivalent variations of the patent spirit using the present invention are all within the scope of the patent.

100‧‧‧ Shell

101‧‧‧Enclosed space

110‧‧‧Heat penetration zone

200‧‧‧Control circuit board

300‧‧‧heating components

400‧‧‧thermal radiation layer

1 is a perspective view of a radiation-dissipating electronic device according to a first embodiment of the present invention.

2 is a cross-sectional view of the radiation-dissipating electronic device of the first embodiment of the present invention.

3 is a perspective view of a radiation-dissipating electronic device according to a second embodiment of the present invention.

100‧‧‧ Shell

101‧‧‧Enclosed space

110‧‧‧Heat penetration zone

200‧‧‧Control circuit board

300‧‧‧heating components

400‧‧‧thermal radiation layer

Claims (11)

A radiation dissipating electronic device comprising: an outer casing having an enclosed space formed therein, at least a portion of the outer casing forming a heat transmissive region; a heat generating component housed in the enclosed space; and a heat radiating layer Covering a surface of the heat generating component, and at least a portion of the heat radiating layer is disposed toward the heat penetration region. The radiant heat dissipation electronic device of claim 1, wherein the heat penetration region is made of a non-metal material. The radiation-dissipating electronic device of claim 2, wherein the heat penetration zone is made of plastic. The radiant heat sink electronic device of claim 2, wherein the heat penetration zone is made of wood. The radiant heat sink electronic device of claim 2, wherein the heat penetration zone is made of glass. The radiant heat sink electronic device of claim 1, wherein the outer casing is flat and at least a portion of the heat penetration zone is forwardly parallel to a forward configuration of the outer casing. The radiation-dissipating electronic device of claim 1, wherein the outer casing is columnar, and at least a portion of the heat penetration zone is located on a side of the outer casing. The radiation-dissipating electronic device of claim 1, wherein the heat radiation layer comprises a plurality of heat radiation particles. The radiation-dissipating electronic device according to claim 8, wherein the heat radiation particles are one of graphene particles, graphene fragments, nanocarbon balls or boron nitride. The radiation-dissipating electronic device of claim 1, wherein the heat radiation layer and at least a portion of the heat penetration region are disposed in parallel with each other. The radiant heat sink electronic device of claim 1, wherein the heat penetration zone has a surface area that is more than half of a surface area of the outer casing.