JP3220706U - Electronic device heat dissipation structure - Google Patents
Electronic device heat dissipation structure Download PDFInfo
- Publication number
- JP3220706U JP3220706U JP2019000109U JP2019000109U JP3220706U JP 3220706 U JP3220706 U JP 3220706U JP 2019000109 U JP2019000109 U JP 2019000109U JP 2019000109 U JP2019000109 U JP 2019000109U JP 3220706 U JP3220706 U JP 3220706U
- Authority
- JP
- Japan
- Prior art keywords
- electronic device
- dissipation structure
- heat dissipation
- heat
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 26
- 230000005855 radiation Effects 0.000 claims abstract description 81
- 239000002184 metal Substances 0.000 claims abstract description 48
- 238000010521 absorption reaction Methods 0.000 claims abstract description 18
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 20
- 229910021389 graphene Inorganic materials 0.000 claims description 13
- 229910052799 carbon Inorganic materials 0.000 claims description 7
- 239000011807 nanoball Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 description 8
- 239000007770 graphite material Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 239000011805 ball Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 229910021392 nanocarbon Inorganic materials 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
Abstract
【課題】熱放射式の電子機器放熱構造を提供し、これは金属筐体を有する電子機器に適用される。【解決手段】電子機器放熱構造は、金属筐体１００、回路基板２００、熱放射放出層４１０および熱放射吸収層４２０を含む。回路基板２００は金属筐体１００内に収容され、回路基板２００の１つの面に発熱源３００が設置される。熱放射放出層４１０は、発熱源３００を覆う。熱放射吸収層４２０は金属筐体１００の内壁に貼り付けられ、熱放射放出層４１０と向かい合って配置される。熱放射吸収層４２０により、熱放射放出層４１０から発散された放射熱エネルギーを、効果的に金属筐体１００に伝達する。【選択図】図１The present invention provides a heat radiation electronic device heat dissipation structure, which is applied to an electronic device having a metal housing. An electronic device heat dissipation structure includes a metal casing (100), a circuit board (200), a thermal radiation emitting layer (410) and a thermal radiation absorbing layer (420). The circuit board 200 is accommodated in the metal casing 100, and the heat source 300 is installed on one surface of the circuit board 200. The thermal radiation emitting layer 410 covers the heat source 300. The heat radiation absorption layer 420 is attached to the inner wall of the metal housing 100 and is disposed to face the heat radiation emission layer 410. The thermal radiation absorbing layer 420 effectively transfers the radiant heat energy emitted from the thermal radiation emitting layer 410 to the metal housing 100. [Selected figure] Figure 1
Description
本考案は放熱装置に関し、特に熱放射式の電子機器放熱構造であり、金属筐体を有する電子機器に適用される。 The present invention relates to a heat dissipation device, and more particularly to a heat dissipation type electronic device heat dissipation structure, which is applied to an electronic device having a metal casing.
従来の熱伝導または熱対流による放熱構造は、発熱源および外部環境の間に媒体を配置して、発熱源が生成する熱エネルギーを外部環境に発散させる必要があり、したがってその応用は装置の空間に制限される。 The conventional heat conduction or convection heat dissipation structure needs to place the medium between the heat source and the external environment to dissipate the thermal energy generated by the heat source to the external environment, so its application is the space of the device Limited to
熱放射伝達方式は透過性を有するため、熱放射式放熱構造は装置の空間による制限を克服することができ、発熱源が生成する熱エネルギーは装置の構造体を透過して外部環境に発散される。しかし、金属表面は熱放射を反射することができるため、熱放射式放熱構造が金属筐体を有する装置に用いられるとき、発散された熱エネルギーの大部分は金属筐体の内壁に反射され、金属筐体中に蓄えられるため、放熱効果は好ましくない。 Since the heat radiation transfer system is transparent, the heat radiation heat dissipation structure can overcome the space limitation of the device, and the heat energy generated by the heat source is transmitted through the device structure and dissipated to the external environment. Ru. However, since metal surfaces can reflect heat radiation, when a heat-radiating heat dissipating structure is used in a device having a metal housing, most of the emitted thermal energy is reflected to the inner wall of the metal housing, Since it is stored in a metal case, the heat radiation effect is not preferable.
このことを考慮して、本考案者は上記既存技術に対して鋭意研究を行い、さらに学理的な利用を組み合わせ、上記問題点の解決に尽力することは、本考案者の改良の目標となっている。 Taking this into consideration, it is the goal of the present inventor's improvement that the present inventor carries out earnest research on the above-mentioned existing technology, and further combines scientific use and makes an effort to solve the above-mentioned problems. ing.
本考案は熱放射式の電子機器放熱構造を提供し、これは金属筐体を有する電子機器に適用される。 The present invention provides a heat radiation electronic device heat dissipation structure, which is applied to an electronic device having a metal housing.
本考案は電子機器放熱構造を提供し、金属筐体、回路基板、熱放射放出層および熱放射吸収層を含む。回路基板は金属筐体内に収容され、回路基板の１つの面に発熱源が設置される。熱放射放出層は、発熱源を覆う。熱放射吸収層は金属筐体の内壁に貼り付けられ、熱放射放出層と向かい合って配置される。 The present invention provides an electronic device heat dissipation structure, which includes a metal housing, a circuit board, a heat radiation emission layer, and a heat radiation absorption layer. The circuit board is housed in a metal casing, and a heat source is installed on one side of the circuit board. The thermal radiation emitting layer covers the heat source. The thermal radiation absorbing layer is affixed to the inner wall of the metal housing and is disposed opposite the thermal radiation emitting layer.
本考案の電子機器放熱構造において、回路基板のもう１つの面は金属筐体の内壁と相互に間隔を開けて配置することができる。回路基板のもう１つの面はもう１つの熱放射放出層を覆い、金属筐体の内壁に、対応し、向かい合って配置されるもう１つの熱放射吸収層が貼り付けて設置される。回路基板のもう１つの面は、金属筐体の内壁に貼り付けることもできる。 In the electronic device heat dissipation structure of the present invention, the other side of the circuit board can be spaced apart from the inner wall of the metal housing. The other side of the circuit board covers another heat radiation emitting layer, and another heat radiation absorbing layer disposed corresponding to and disposed opposite to the inner wall of the metal housing is attached. The other side of the circuit board can also be attached to the inner wall of the metal housing.
本考案の電子機器放熱構造において、熱放射吸収層の面積は対応する熱放射放出層の面積より大きい。熱放射放出層は延伸して、回路基板の少なくとも一部分を覆う。熱放射放出層は、グラフェン片でよい。熱放射放出層は、グラフェン片またはカーボンナノボールを含むことができる。熱放射吸収層は、グラフェン片でよい。熱放射吸収層は、グラフェン片またはカーボンナノボールを含むことができる。 In the electronic device heat dissipation structure of the present invention, the area of the heat radiation absorption layer is larger than the area of the corresponding heat radiation emission layer. The thermal radiation emitting layer is stretched to cover at least a portion of the circuit board. The thermal emission layer may be a piece of graphene. The thermal emission layer may comprise graphene strips or carbon nanoballs. The thermal radiation absorbing layer may be graphene pieces. The thermal radiation absorbing layer can include graphene pieces or carbon nanoballs.
本考案は、金属筐体の内壁に熱放射吸収層を配置することにより、熱放射放出層から発散される放射熱エネルギーが金属筐体に反射されるのを防止することができる。さらにグラファイト材料自体も良好な熱伝導特性を有し、熱放射放出層から発散される放射熱エネルギーを吸収後、効果的に金属筐体に伝達することができる。 The present invention can prevent the radiation thermal energy emitted from the thermal radiation emitting layer from being reflected to the metal casing by arranging the thermal radiation absorbing layer on the inner wall of the metal casing. Furthermore, the graphite material itself also has good heat transfer properties, and after absorbing the radiant heat energy emitted from the thermal radiation emitting layer, it can be effectively transferred to the metal casing.
図１を参照されたい。本考案の第１実施例は電子機器放熱構造を提供し、これは金属筐体１００、回路基板２００、熱放射放出層４１０および熱放射吸収層４２０を含む。 See FIG. The first embodiment of the present invention provides an electronic device heat dissipation structure, which includes a metal housing 100, a circuit board 200, a thermal radiation emitting layer 410 and a thermal radiation absorbing layer 420.
本実施例において、金属筐体１００は、好ましくは閉鎖された金属筐体である。回路基板２００は金属筐体１００内に収容され、回路基板２００の１つの面に発熱源３００が設置され、発熱源３００は電子部品または部分的なプリント回路のリード線でよい。本実施例において、回路基板２００のもう１つの面は、好ましくは金属筐体内壁の１つの面に貼り付けられる。 In the present example, the metal housing 100 is preferably a closed metal housing. The circuit board 200 is housed in the metal housing 100, and the heat source 300 is installed on one surface of the circuit board 200, and the heat source 300 may be an electronic component or a lead wire of a partial printed circuit. In this embodiment, the other side of the circuit board 200 is preferably affixed to one side of the inner wall of the metal housing.
熱放射放出層４１０は発熱源３００を覆い、熱放射放出層４１０の外縁がさらに延伸して、回路基板２００の少なくとも一部分も覆うことができる。熱放射放出層４１０はグラフェン片で構成することができ、貼り付ける方式により発熱源３００に設置される。熱放射放出層４１０はグラフェン片またはカーボンナノボールを含む混合物で構成することもでき、貼り付け、吹き付けまたはプリントの方式により発熱源３００に設置される。 The thermal radiation emitting layer 410 covers the heat source 300, and the outer edge of the thermal radiation emitting layer 410 can be further extended to cover at least a portion of the circuit board 200. The thermal radiation emission layer 410 can be composed of graphene pieces, and is installed on the heat source 300 by a pasting method. The thermal radiation emitting layer 410 can also be composed of a mixture containing graphene pieces or carbon nanoballs, and is attached to the heat source 300 by a method of pasting, spraying or printing.
熱放射吸収層４２０は、金属筐体１００の内壁に貼り付けられる。本実施例において、熱放射吸収層４２０は金属筐体１００内壁の相対する面に貼り付けられるため、熱放射吸収層４２０および熱放射放出層４１０は向かい合って配置される。好ましくは、熱放射吸収層４２０の面積は、対応する熱放射放出層４１０の面積より大きい。熱放射吸収層４２０はグラフェン片（Ｇｒａｐｈｅｎｅ）で構成することができ、貼り付ける方式により金属筐体１００の内壁に設置される。熱放射吸収層４２０はグラフェン片またはカーボンナノボール（Ｎａｎｏｃａｒｂｏｎ ｂａｌｌ）を含む混合物を固化させて構成することもでき、貼り付け、吹き付けまたはプリントの方式により、金属筐体１００の内壁に設置される。 The heat radiation absorption layer 420 is attached to the inner wall of the metal housing 100. In the present embodiment, the heat radiation absorption layer 420 and the heat radiation emission layer 410 are disposed to face each other because the heat radiation absorption layer 420 is attached to the opposite surface of the inner wall of the metal housing 100. Preferably, the area of the thermal radiation absorbing layer 420 is larger than the area of the corresponding thermal radiation emitting layer 410. The heat radiation absorption layer 420 may be formed of graphene pieces, and is installed on the inner wall of the metal casing 100 by a bonding method. The heat radiation absorption layer 420 may be formed by solidifying a mixture containing graphene pieces or carbon nanoballs (Nanocarbon balls), and is installed on the inner wall of the metal housing 100 by a method of pasting, spraying or printing.
グラフェンまたはカーボンナノボールなどのグラファイト材料は、良好な熱伝導および熱放射特性を有するため、熱放射放出層４１０は、熱伝導の方式により、発熱源３００が生成する熱エネルギーを急速に吸収することができる。さらに、熱放射放出層４１０は、熱放射の方式により、吸入した熱エネルギーを急速に発散させることができる。熱放射吸収層４２０は、熱放射の方式により、熱放射放出層４１０から発散される熱エネルギーを吸収して発熱する。熱放射の伝達方向は発散式であるため、本実施例で配置される熱放射吸収層４２０の面積は、対応する熱放射放出層４１０の面積より大きい。これにより、熱放射吸収層４２０が熱放射放出層４１０から発散される熱エネルギーを完全に吸収することができることを確実に保証し、そうでなければ、熱放射吸収層４２０に達しない放射熱は、金属筐体１００の内壁により発熱源３００に向かって反射する。熱放射吸収層４２０は、熱伝導の方式により、吸収した熱エネルギーを急速に金属筐体１００に伝達し、さらに金属筐体１００の外表面を通過して、熱対流の方式で環境中に発散させる。他に、回路基板２００のもう１つの面を金属筐体１００に貼り付け、熱伝導の方式で、回路基板２００の熱エネルギーを金属筐体１００に伝達することができる。 Because graphite materials such as graphene or carbon nanoballs have good thermal conductivity and thermal emission characteristics, the thermal radiation emitting layer 410 can rapidly absorb the thermal energy generated by the heat source 300 by means of thermal conductivity. it can. Furthermore, the thermal radiation emitting layer 410 can rapidly dissipate the inhaled thermal energy by means of thermal radiation. The heat radiation absorption layer 420 absorbs heat energy emitted from the heat radiation emission layer 410 to generate heat in a manner of heat radiation. Since the heat radiation transfer direction is divergent, the area of the heat radiation absorption layer 420 disposed in the present embodiment is larger than the area of the corresponding heat radiation emission layer 410. This ensures that the thermal radiation absorbing layer 420 can completely absorb the thermal energy emitted from the thermal radiation emitting layer 410, otherwise radiation heat that does not reach the thermal radiation absorbing layer 420 is The light is reflected toward the heat source 300 by the inner wall of the metal casing 100. The heat radiation absorption layer 420 rapidly transmits the absorbed heat energy to the metal casing 100 by the heat conduction method, and further passes through the outer surface of the metal casing 100 and is dissipated into the environment by the heat convection method. Let In addition, the other surface of the circuit board 200 can be attached to the metal housing 100, and the thermal energy of the circuit board 200 can be transmitted to the metal housing 100 by a heat conduction method.
図２を参照されたい。本考案の第２実施例は電子機器放熱構造を提供し、これは金属筐体１００、回路基板２００、熱放射放出層４１０および熱放射吸収層４２０を含む。本実施例の構造は、前記第１実施例とおおよそ同じであり、同じ部分はここでは省略し、本実施例における第１実施例と異なる部分を以下に詳述する。 See FIG. A second embodiment of the present invention provides an electronic device heat dissipation structure, which includes a metal housing 100, a circuit board 200, a thermal radiation emitting layer 410 and a thermal radiation absorbing layer 420. The structure of this embodiment is approximately the same as that of the first embodiment, and the same parts are omitted here, and parts different from the first embodiment in the present embodiment will be described in detail below.
本実施例において、回路基板２００のもう１つの面は、少なくとも１つの支持具２１０でかさ上げすることにより、金属筐体１００の内壁と相互に間隔を開けて配置される。回路基板２００における発熱源３００と反対の面は、もう１つの熱放射放出層４１０ａを覆い、金属筐体１００の内壁に、対応し、向かい合って配置されるもう１つの熱放射吸収層４２０ａが貼り付けて設置される。したがって回路基板２００も、第１実施例の記載と同じ熱放射放出／吸収の方式により、回路基板２００の熱エネルギーを金属筐体１００に伝達することができる。 In this embodiment, the other side of the circuit board 200 is spaced apart from the inner wall of the metal housing 100 by being raised by at least one support 210. The surface of the circuit board 200 opposite to the heat source 300 covers another heat radiation emission layer 410a, and another heat radiation absorption layer 420a disposed opposite to the corresponding heat radiation absorption layer is attached to the inner wall of the metal housing 100. Will be installed. Therefore, the circuit board 200 can also transfer the thermal energy of the circuit board 200 to the metal casing 100 by the same method of thermal radiation emission / absorption as described in the first embodiment.
本考案は、金属筐体１００の内壁に、熱放射吸収層４２０／４２０ａを配置することにより、熱放射放出層４１０／４１０ａから発散される放射熱エネルギーが金属筐体１００により反射されるのを防止することができる。さらにグラファイト材料自体も良好な熱伝導特性を有し、熱放射放出層４１０／４１０ａから発散される放射熱エネルギーを吸収後、効果的に金属筐体１００に伝達することができる。 According to the present invention, by disposing the heat radiation absorbing layer 420 / 420a on the inner wall of the metal case 100, the radiation heat energy emitted from the heat radiation emitting layer 410 / 410a is reflected by the metal case 100. It can be prevented. Furthermore, the graphite material itself also has good heat transfer characteristics, and can effectively transmit the heat energy radiated from the heat radiation emitting layer 410 / 410a to the metal housing 100 after being absorbed.
以上の記載は本考案の好ましい実施例に過ぎず、本考案の実用新案登録請求の範囲を限定しない。その他の本考案の趣旨を利用して同等に変化させたものは、いずれも本考案の実用新案登録請求の範囲に属するべきである。 The above description is only a preferred embodiment of the present invention, and does not limit the scope of the utility model registration request of the present invention. Anything that is equally changed using the purpose of the present invention should belong to the scope of the utility model registration request of the present invention.
１００ 金属筐体
２００ 回路基板
２１０ 支持具
３００ 発熱源
４１０／４１０ａ 熱放射放出層
４２０／４２０ａ 熱放射吸収層
DESCRIPTION OF SYMBOLS 100 metal housing 200 circuit board 210 support 300 heat source 410 / 410a thermal radiation emission layer 420 / 420a thermal radiation absorption layer
Claims (10)
金属筐体と；
該金属筐体内に収容され、１つの面に発熱源が設置される回路基板と；
該発熱源を覆う熱放射放出層と；
該金属筐体の内壁に貼り付けられ、該熱放射放出層と向かい合って配置される熱放射吸収層と；を含む構造。 Electronic device heat dissipation structure,
With metal casings;
A circuit board housed in the metal casing and having a heat source installed on one side thereof;
A thermal radiation emitting layer covering the heat source;
A thermal radiation absorbing layer affixed to the inner wall of the metal housing and disposed facing the thermal radiation emitting layer.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW107101696A TWI697271B (en) | 2018-01-17 | 2018-01-17 | Heat dissipation structure for electronic device |
| TW107101696 | 2018-01-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP3220706U true JP3220706U (en) | 2019-03-28 |
Family
ID=65895155
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019000109U Active JP3220706U (en) | 2018-01-17 | 2019-01-16 | Electronic device heat dissipation structure |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP3220706U (en) |
| TW (1) | TWI697271B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021017676A1 (en) * | 2019-07-27 | 2021-02-04 | 深圳市麟富科技有限公司 | Radiation-resistant protection cover, and processing process for same |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205883820U (en) * | 2016-06-30 | 2017-01-11 | 慧隆科技股份有限公司 | Radiation heat dissipation formula electron device |
| CN206614861U (en) * | 2017-02-20 | 2017-11-07 | 慧隆科技股份有限公司 | Graphite material fin |
| TWM541701U (en) * | 2017-02-24 | 2017-05-11 | Amazing Cool Tech Corp | Directional heat dissipation structure of electronic device |
| CN206506817U (en) * | 2017-02-27 | 2017-09-19 | 慧隆科技股份有限公司 | The oriented heat dissipating structure of electronic installation |
| TWM560761U (en) * | 2018-01-17 | 2018-05-21 | 慧隆科技股份有限公司 | Heat dissipation structure for electronic device |
-
2018
- 2018-01-17 TW TW107101696A patent/TWI697271B/en active
-
2019
- 2019-01-16 JP JP2019000109U patent/JP3220706U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021017676A1 (en) * | 2019-07-27 | 2021-02-04 | 深圳市麟富科技有限公司 | Radiation-resistant protection cover, and processing process for same |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201933974A (en) | 2019-08-16 |
| TWI697271B (en) | 2020-06-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5794225B2 (en) | Light-emitting device cooling system and light-emitting device using the same | |
| TW201528927A (en) | New heat spreading packaging design | |
| JP4006795B2 (en) | Information processing apparatus having heat dissipation structure | |
| WO2021083142A1 (en) | Electronic device | |
| JP2000106495A (en) | Inner structure of electric/electronic apparatus | |
| US20090073654A1 (en) | Compact surface-mount heat exchanger | |
| JP3220706U (en) | Electronic device heat dissipation structure | |
| CN207948002U (en) | Electronic apparatus heat radiation construction | |
| JP2006339223A (en) | Heat dissipation structure of cpu | |
| JP2005150429A (en) | Radiation cabinet structure and display unit employing it | |
| TWM560761U (en) | Heat dissipation structure for electronic device | |
| TWM511068U (en) | Heat spreading device | |
| JP2011171237A (en) | Luminaire | |
| JPH10117078A (en) | Heat-dissipating structure for electronic device | |
| TWM547096U (en) | Graphite heat dissipation piece | |
| JP2004200533A (en) | Heat radiation structure of device | |
| JP4309189B2 (en) | Portable electronic equipment | |
| US7816629B2 (en) | Vacuum heating device | |
| JP3699869B2 (en) | Flat light emitting display | |
| TWM532141U (en) | Radiative heat-dissipation type electronic device | |
| CN209821767U (en) | Novel heat dissipation server | |
| JP5408528B2 (en) | Electronics | |
| JP3220705U (en) | Radiation heat dissipation structure of wireless charging device | |
| JP4194180B2 (en) | Outdoor electronics housing | |
| CN209525618U (en) | Heat-dissipation type chassis |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 3220706 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |