TW201933974A - Heat dissipation structure for electronic device - Google Patents

Abstract

A heat dissipation structure for an electronic device including a metal case, a circuit board, a heat radiation emitting layer and a heat radiation receiving layer is provided in the present disclosure. The circuit board is accommodated in the metal case, and a heat source is arranged on one surface of the circuit board. The heat radiation emitting layer covers on the heat source. The heat radiation receiving layer is arranged on an internal surface of the metal case and face to the heat radiation emitting layer. The radiation heat emitted by the heat radiation emitting layer could be effectively transferred to the metal shell by the heat radiation receiving layer.

Description

Electronic device heat dissipation structure

The invention relates to a heat dissipating device, in particular to a heat radiating electronic device heat dissipating structure, which is suitable for an electronic device having a metal casing.

The conventional heat conduction or heat convection heat dissipation structure needs to disperse the heat energy generated by the heat source to the external environment by arranging the medium between the heat source and the external environment, so that the application is limited by the space of the device.

The heat radiation transmission mode has penetrability, so the heat radiation type heat dissipation structure can overcome the limitation of the device space and dissipate the heat energy transmission device structure generated by the heat source to the external environment. However, the metal surface can reflect the heat radiation. Therefore, when the heat radiating heat dissipating structure is used for a device having a metal outer casing, the diverging heat energy is mostly reflected by the inner wall of the metal casing and accumulated in the metal casing, so the heat dissipation effect is not good.

In view of the above, the inventors of the present invention have made great efforts to solve the above problems in view of the above-mentioned prior art, and have made great efforts to solve the above problems, which has become the object of improvement of the present inventors.

The invention provides a heat radiation type electronic device heat dissipation structure which is suitable for an electronic device having a metal casing.

The invention provides a heat dissipation structure for an electronic device, comprising a metal casing, a circuit board, a heat radiation emitting layer and a heat radiation absorbing layer. The circuit board is housed in the metal casing, and a heat source is disposed on one side of the circuit board. The heat radiation emitting layer covers the heat source. The heat radiation absorbing layer is attached to the inner wall of the metal casing and disposed to face the heat radiation emitting layer.

In the heat dissipation structure of the electronic device of the present invention, the other surface of the circuit board may be spaced apart from the inner wall of the metal casing. The other side of the circuit board is covered with another heat radiation emitting layer, and another heat radiation absorbing layer provided with a corresponding opposing arrangement is attached to the inner wall of the metal case. The other side of the board can also be attached to the inner wall of the metal case.

In the heat dissipation structure of the electronic device of the present invention, the area of the heat radiation absorbing layer is larger than the area of the corresponding heat radiation emitting layer. The thermal radiation emissive layer extends over at least a portion of the circuit board. The heat radiation emitting layer may be a graphene sheet. The thermal radiation emitting layer may comprise graphene fragments or nano carbon spheres. The heat radiation absorbing layer may be a graphene sheet. The heat radiation absorbing layer may comprise graphene fragments or nano carbon spheres.

The invention can prevent the radiant heat energy emitted by the heat radiation emitting layer from being reflected by the metal shell by disposing the heat radiation absorbing layer on the inner wall of the metal shell, and the graphite material itself has good heat conduction characteristics and can emit heat radiation. The layer radiates radiant heat energy and is effectively transferred to the metal casing.

Referring to FIG. 1, a first embodiment of the present invention provides an electronic device heat dissipation structure including a metal casing 100, a circuit board 200, a heat radiation emitting layer 410, and a heat radiation absorbing layer 420.

In the present embodiment, the metal casing 100 is preferably a closed metal casing. The circuit board 200 is housed in the metal casing 100, and a heat source 300 is disposed on one side of the circuit board 200. The heat source 300 may be an electronic component or a partial printed circuit conductor. In the present embodiment, the other side of the circuit board 200 is preferably attached to one side of the inner wall of the outer casing.

The heat radiation emissive layer 410 covers the heat source 300, and the outer edge of the heat radiation emissive layer 410 may further extend to cover at least a portion of the circuit board 200. The heat radiation emitting layer 410 may be formed of a graphene sheet and disposed on the heat source 300 by means of adhesion. The heat radiation emitting layer 410 may also be composed of a mixture of graphene fragments or nanocarbon spheres, and is disposed on the heat source 300 by means of pasting, spraying or printing.

The heat radiation absorbing layer 420 is attached to the inner wall of the metal casing 100. In the present embodiment, the heat radiation absorbing layer 420 is attached to the opposite side of the inner wall of the metal casing 100, thereby causing the heat radiation absorbing layer 420 and the heat radiation. The emissive layers 410 are arranged opposite each other. Preferably, the area of the heat radiation absorbing layer 420 is larger than the area of the corresponding heat radiation emitting layer 410. The heat radiation absorbing layer 420 may be composed of a graphene sheet and disposed on the inner wall of the metal shell 100 by adhesive bonding. The heat radiation absorbing layer 420 may also be formed by curing a mixture containing graphene chips or nano carbon balls, and is disposed on the inner wall of the metal casing 100 by adhesion, spraying or printing.

Graphene or a graphite material such as nano carbon spheres has good heat conduction and heat radiation characteristics, and thus the heat radiation emitting layer 410 can quickly absorb heat energy generated by the heat source 300 by heat conduction. Also, the heat radiation emitting layer 410 can rapidly dissipate the heat energy absorbed by it by means of heat radiation. The heat radiation absorbing layer 420 absorbs heat by absorbing the heat energy radiated from the heat radiation emitting layer 410 by means of heat radiation. Since the heat radiation transmission direction is divergent, the area of the heat radiation absorption layer 420 disposed in this embodiment is larger than the area of the corresponding heat radiation emission layer 410, thereby ensuring that the heat radiation absorption layer 420 can completely absorb the heat radiation emission layer. 410 diverging thermal energy, otherwise, radiant heat that does not reach the thermal radiation absorbing layer 420 will be reflected by the inner wall of the metal casing 100 toward the heat source 300. The heat radiation absorbing layer 420 is transferred to the metal casing 100 by heat conduction, and is further radiated to the environment by heat convection through the outer surface of the metal casing 100. In addition, the metal case 100 is attached to the other surface of the circuit board 200, and the thermal energy of the circuit board 200 can be transferred to the metal case 100 by heat conduction.

Referring to FIG. 2, a second embodiment of the present invention provides an electronic device heat dissipation structure including a metal case 100, a circuit board 200, a heat radiation emitting layer 410, and a heat radiation absorbing layer 420. The configuration of this embodiment is substantially the same as the foregoing first embodiment, and the same points are not described herein again. The differences of the first embodiment of the present embodiment are described in detail below.

In this embodiment, the other side of the circuit board 200 is disposed apart from the inner wall of the metal casing 100 by at least one bracket 210 being elevated. The other side of the circuit board 200 opposite to the heat generating source 300 is covered with another heat radiation emitting layer 410a, and the inner wall of the metal shell 100 is attached with another heat radiation absorbing layer 420a provided with a corresponding opposing arrangement, thus the circuit The board 200 can also transfer thermal energy of the circuit board 200 to the metal casing 100 by means of thermal radiation emission/absorption as described in the first embodiment.

The present invention can prevent the radiant heat energy radiated by the heat radiation emitting layer 410/410a from being reflected by the metal casing 100 by arranging the heat radiation absorbing layer 420/420a on the inner wall of the metal casing 100, and the graphite material itself has good also. The heat conduction property can efficiently transfer the radiant heat energy radiated from the heat radiation emitting layer 410/410a to the metal casing 100.

The above is only the preferred embodiment of the present invention, and is not intended to limit the scope of the invention, and other equivalent variations of the patent spirit of the present invention are all within the scope of the invention.

100‧‧‧Metal casing

200‧‧‧ boards

210‧‧‧ bracket

300‧‧‧heat source

410/410a‧‧‧thermal radiation emitting layer

420/420a‧‧‧thermal radiation absorption layer

1 is a schematic view showing a heat dissipation structure of an electronic device according to a first embodiment of the present invention.

2 is a schematic view showing a heat dissipation structure of an electronic device according to a second embodiment of the present invention.

Claims (10)

An electronic device heat dissipation structure comprising: a metal casing; a circuit board housed in the metal casing, wherein a heat source is disposed on one side of the circuit board; a heat radiation emitting layer covering the heat source; The heat radiation absorbing layer is attached to the inner wall of the metal casing and disposed opposite to the heat radiation emitting layer. The electronic device heat dissipation structure according to claim 1, wherein the other side of the circuit board is spaced apart from the inner wall of the metal casing. The electronic device heat dissipation structure according to claim 2, wherein the other surface of the circuit board is covered with another heat radiation emitting layer, and another heat radiation absorbing layer provided with a corresponding opposing arrangement is attached to the inner wall of the metal case. . The electronic device heat dissipation structure according to claim 1, wherein the other side of the circuit board is attached to an inner wall of the metal casing. The electronic device heat dissipation structure according to claim 1, wherein an area of the heat radiation absorbing layer is larger than a corresponding area of the heat radiation emitting layer. The electronic device heat dissipation structure of claim 1, wherein the thermal radiation emitting layer extends over at least a portion of the circuit board. The heat dissipation structure of an electronic device according to claim 1, wherein the heat radiation emitting layer is a graphene sheet. The electronic device heat dissipation structure of claim 1, wherein the thermal radiation emitting layer comprises graphene fragments or nano carbon spheres. The heat dissipation structure of an electronic device according to claim 1, wherein the heat radiation absorbing layer is a graphene sheet. The electronic device heat dissipation structure according to claim 1, wherein the heat radiation absorbing layer comprises graphene fragments or nano carbon spheres.