JPH10117078A - Heat-dissipating structure for electronic device - Google Patents

Heat-dissipating structure for electronic device

Info

Publication number
JPH10117078A
JPH10117078A JP26812296A JP26812296A JPH10117078A JP H10117078 A JPH10117078 A JP H10117078A JP 26812296 A JP26812296 A JP 26812296A JP 26812296 A JP26812296 A JP 26812296A JP H10117078 A JPH10117078 A JP H10117078A
Authority
JP
Japan
Prior art keywords
heat
generating component
electronic device
plate
top plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP26812296A
Other languages
Japanese (ja)
Inventor
Tsutomu Toyoshima
勉 豊嶋
Original Assignee
Fujitsu General Ltd
株式会社富士通ゼネラル
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu General Ltd, 株式会社富士通ゼネラル filed Critical Fujitsu General Ltd
Priority to JP26812296A priority Critical patent/JPH10117078A/en
Publication of JPH10117078A publication Critical patent/JPH10117078A/en
Application status is Pending legal-status Critical

Links

Abstract

PROBLEM TO BE SOLVED: To provide a heat-dissipating structure, which does not give users an unpleasant feeling by uniformizing the temperature of the whole ceiling board.
SOLUTION: This construction is constituted by putting a board 4 on which heat-generating parts, etc., fixed to heat-dissipating boards 2 are mounted, a power unit 5 which supplies power, etc., on a bottom plate 1, and covering the bottom board 1 with a box 6 whose underside is opened, so that the heat of the heat-generating parts 3 is dissipated from the heat-dissipating boards 2 into the box, and the heat of the heated air in the box 6 is dissipating from the ceiling board 6a of the box 6 and so on. In this case, a heat-insulating material 7 is stuck to the internal surface of the ceiling board 6a above the heat-generating parts 3. Accordingly, a local temperature rise of the top board 6a is prevented by reflecting radiant heat from the heat-generating parts 3, etc., irregularly effectively, and uniformizing the temperature of the whole ceiling top 6a is enabled.
COPYRIGHT: (C)1998,JPO

Description

【発明の詳細な説明】 DETAILED DESCRIPTION OF THE INVENTION

【0001】 [0001]

【発明の属する技術分野】本発明は、電子機器の放熱構造に係わり、とくに、天板の温度を均一化するための構造に関する。 The present invention relates to relates to a heat dissipation structure of the electronic apparatus, in particular, it relates to a structure for equalizing the temperature of the top plate.

【0002】 [0002]

【従来の技術】従来、電子機器の放熱構造は図3に示すように、通気孔1aを有する底板1に、放熱板2に固定した発熱部品3等を搭載し、通気孔4aを形成してなる基板4、電源部5等を載置し、同底板1に、下方を開口し、天板6aに通気孔6bを設けた筐体6を被せるようにし、冷気を前記底板1の通気孔1aより流入し、基板4の通気孔4aを通して発熱部品3を冷却し、同冷却して温められた温風を天板6の通気孔6aより自然排気するようにしていた。 Conventionally, the heat radiation structure of an electronic device, as shown in FIG. 3, the bottom plate 1 having air holes 1a, equipped with a heat generating component 3 or the like fixed to the heat radiating plate 2, to form the vent holes 4a comprising substrate 4, placing the power unit 5 and the like, in the bottom plate 1, and opening downward, so as to put a housing 6 in which a vent hole 6b on the top plate 6a, the cold air of the bottom plate 1 vents 1a more flows, the heat generating component 3 is cooled through the vent holes 4a of the substrate 4, was warm air warmed by the cooled so naturally exhausted vent 6a of the top plate 6. しかし、この構造では、天板6aの発熱部品3の上方部分が、他の部分より局部的に熱くなり、使用者が触れると不快感を与えてしまうという問題があった。 However, in this structure, the upper portion of the heat generating component 3 of the top plate 6a is locally hotter than other portions, there is a problem that uncomfortable feeling when the user touches.

【0003】 [0003]

【発明が解決しようとする課題】本発明は以上述べた問題点を解決し、天板全体の温度を均一にして、使用者に不快感を与えることのない電子機器の放熱構造を提供することを目的としている。 SUMMARY OF THE INVENTION It is an object of the present invention is to solve the above mentioned problems, in the uniform temperature of the whole top plate, to provide a heat dissipation structure without electronic apparatus causing discomfort to the user It is an object.

【0004】 [0004]

【課題を解決するための手段】本発明は上述の課題を解決するため、底板に、放熱板を固定した発熱部品等を搭載した基板、電力を供給する電源部等を載置し、同底板に、下方を開口する筐体を被せてなり、発熱部品の熱を前記放熱板より前記筐体内に放熱し、同筐体内の温められた空気の熱を前記筐体の天板等より放熱するようにしてなる電子機器の放熱構造において、前記天板内面の発熱部品上方部に断熱材を貼付して、発熱部品よりの輻射熱等が直接天板の発熱部品上方部を熱しないようにしている。 Since the present invention SUMMARY OF THE INVENTION The to solve the problems described above, the bottom plate, the substrate mounted with heat generating component or the like to fix the heat dissipation plate, placed power unit or the like for supplying power, the bottom plate to become covered with a housing which opens downward, the heat of the heat generating component is dissipated to the housing from the heat radiating plate, for radiating from the top plate or the like of the housing of the heat of air warmed with the housing in the heat dissipation structure for electronic devices comprising as, by attaching insulation to the heat generating component upper portion of the top plate inner surface, radiation heat than the heat generating parts is not to heat the heat generating component upper portion of the direct ceiling plate . また、前記天板の前記発熱部品の上方の断熱材の貼付部以外の部分に、通気孔を形成するようにした。 Moreover, the portion other than the sticking portion of the upper insulation of the heat generating parts of the top plate, and so as to form a vent. また、前記断熱材に、発泡した断熱材料を使用するようにした。 Further, the heat insulating material, and to use a foamed insulation material. また、前記断熱材に、グラスウール材料を使用するようにした。 Further, the heat insulating material, and to use a glass wool material. また、前記断熱材に、白色の断熱材を使用するようにした。 Further, the heat insulating material, and to use a white insulation.

【0005】 [0005]

【発明の実施の形態】以上のように、本発明の電子機器の放熱構造においては、底板に、放熱板を固定した発熱部品等を搭載した基板、電力を供給する電源部等を載置し、同底板に、下方を開口する筐体を被せてなり、発熱部品の熱を前記放熱板より前記筐体内に放熱し、同筐体内の温められた空気の熱を前記筐体の天板等より放熱するようにしてなる電子機器の放熱構造において、前記天板内面の発熱部品上方部に断熱材を貼付したので、発熱部品よりの輻射熱等を効率良く乱反射することにより、 As described above PREFERRED EMBODIMENTS In the heat dissipation structure of the electronic apparatus of the present invention, the bottom plate, the substrate mounted with heat generating component or the like to fix the heat dissipation plate, placed power unit or the like for supplying power , in the bottom plate, it is covered with a casing that is open downward, the heat of the heat generating component is dissipated to the housing from the heat radiating plate, top plate, etc. of the housing heat air heated with the housing in the heat dissipation structure for electronic devices comprising so as to heat radiation, since the sticking insulation to the heat generating component upper portion of the top plate inner surface, by diffuse reflection efficiently radiation heat than the heat generating components,
天板の局部的な温度上昇を防止し、天板全体の温度を均一にするようにしている。 It prevents local temperature rise of the top plate, so that a uniform temperature across the top plate.

【0006】 [0006]

【実施例】以下、図面に基づいて本発明による電子機器の放熱構造を詳細に説明する。 EXAMPLES Hereinafter, the heat dissipation structure of the electronic device according to the present invention will be described in detail with reference to the accompanying drawings. 図1は本発明による電子機器の放熱構造の一実施例を示す側断面図、図2は同平面要部透視図である。 Figure 1 is a side sectional view showing an embodiment of a heat dissipation structure of the electronic device according to the present invention, and FIG. 2 is a plan main part perspective view. 図において、図3と同一部品は同一記号を使用しており、従来の技術の項で説明したので説明を省略する。 In the figure, FIG. 3 the same components are using the same symbols, and a description thereof will be omitted as described in the background section. 図に示すように、前記天板6aの前記発熱部品3の上方部分に、白色の発泡スチロール、またはグラスウール等の断熱材7を貼付するようにしている。 As shown, the upper portion of the heat generating component 3 of the top plate 6a, so that attaching a heat insulating material 7, such as a white foam or glass wool. そして、前記天板6aの通気孔6bは、前記断熱材7を貼付した部分以外の部分に形成するようにした。 The vent 6b of the top plate 6a was to form the portion other than the portion was attached to the heat insulating material 7.

【0007】以上の構成において、つぎにその動作を説明する。 [0007] In the above configuration, it will be described the operation. 発熱部品3より発生する熱は放熱板2に伝熱され、この熱せられた放熱板2は、前記底板1の通気孔1 Heat generated from the heat generating component 3 is transferred to the heat radiating plate 2, the heat radiating plate 2 which canceler This heat vent 1 of the bottom plate 1
aより吸い込み、基板4の通気孔4aを通した空気により冷却される。 Suction from a, is cooled by the air through the vent holes 4a of the substrate 4. そして、発熱部品3および放熱板2により温められた空気は天板6aの通気孔6bより自然排気される。 Then, air heated by the heat generating component 3 and the heat radiating plate 2 is naturally exhausted from the vent hole 6b of the top plate 6a. また、前記発熱部品3および放熱板2から発生する輻射熱は前記白色の断熱材7により効率良く乱反射され、この輻射熱により直接天板を加熱しないので、天板の局部的な温度上昇が防止され、天板全体の温度を均一にすることができる。 Also, radiation heat generated from the heat generating component 3 and the heat radiating plate 2 efficiently is irregularly reflected by the white heat insulating material 7, since not heated directly top plate by the radiant heat, local temperature rise of the top plate is prevented, it can be made uniform temperature across the top plate. 尚、本実施例では、底板1、基板4、天板6aにそれぞれ、通気孔1a、通気孔4a、 In this embodiment, the bottom plate 1, respectively the substrate 4, the top plate 6a, vents 1a, vents 4a,
通気孔6bが形成された場合を説明したが、発熱部品の発熱量の少ない場合は、特に、これらの通気孔を必要としないことは理解できよう。 Having described the case where the vent holes 6b are formed, if the small amount of heat generated by the heat generating components, in particular, it will be appreciated that does not require these vents.

【0008】 [0008]

【発明の効果】以上説明したように、本発明による電子機器の放熱構造によれば、底板に、放熱板を固定した発熱部品等を搭載した基板、電力を供給する電源部等を載置し、同底板に、下方を開口する筐体を被せてなり、発熱部品の熱を前記放熱板より前記筐体内に放熱し、同筐体内の温められた空気の熱を前記筐体の天板等より放熱するようにしてなる電子機器の放熱構造において、前記天板内面の発熱部品上方部に断熱材を貼付したので、発熱部品よりの輻射熱等を効率良く乱反射することにより、天板の局部的な温度上昇を防止し、天板全体の温度を均一にすることができ、使用者に不快感を与えることのない電子機器の放熱構造を提供することができる。 As described in the foregoing, according to the heat dissipation structure of the electronic device according to the present invention, the bottom plate, the substrate mounted with heat generating component or the like to fix the heat dissipation plate, placed power unit or the like for supplying power , in the bottom plate, it is covered with a casing that is open downward, the heat of the heat generating component is dissipated to the housing from the heat radiating plate, top plate, etc. of the housing heat air heated with the housing in the heat dissipation structure for electronic devices comprising so as to heat radiation, since the sticking insulation to the heat generating component upper portion of the top plate inner surface, by diffuse reflection efficiently radiation heat than the heat generating components, locally in the top plate a temperature rise is prevented, it is possible to make uniform the temperature of the entire top plate can provide a heat dissipation structure of the electronic device without discomfort to the user.

【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS

【図1】本発明による電子機器の放熱構造の一実施例を示す側断面図である。 It is a side sectional view showing an embodiment of a heat dissipation structure of the electronic device according to the invention; FIG.

【図2】本発明による電子機器の放熱構造の一実施例を示す平面要部透視図である。 Is a plan main part perspective view showing an embodiment of a heat dissipation structure of the electronic device according to the invention, FIG.

【図3】従来の電子機器の放熱構造を示す側断面図である。 3 is a side sectional view showing a heat dissipation structure of a conventional electronic apparatus.

【符号の説明】 DESCRIPTION OF SYMBOLS

1 底板 2 放熱板 3 発熱部品 4 基板 5 電源部 6 筐体 6a 天板 7 断熱材 1 the bottom plate 2 heat dissipating plate 3 heating component 4 substrate 5 Power unit 6 housing 6a top plate 7 heat insulating material

Claims (5)

    【特許請求の範囲】 [The claims]
  1. 【請求項1】 底板に、放熱板を固定した発熱部品等を搭載した基板、電力を供給する電源部等を載置し、同底板に、下方を開口する筐体を被せてなり、発熱部品の熱を前記放熱板より前記筐体内に放熱し、同筐体内の温められた空気の熱を前記筐体の天板等より放熱するようにしてなる電子機器の放熱構造において、前記天板内面の発熱部品上方部に断熱材を貼付して、発熱部品よりの輻射熱等が直接天板の発熱部品上方部を熱しないようにしてなることを特徴とする電子機器の放熱構造。 To 1. A bottom plate, a substrate equipped with a heat generating component or the like to fix the heat dissipation plate, placed power unit or the like for supplying power to the same base plate, it is covered with a housing which opens downward, heat generating component the heat radiated to the housing from the heat radiation plate, the radiation structure of an electronic device formed by the heat of the warmed air of the enclosure so that the heat radiation from the top plate or the like of the housing, the top plate inner surface heat generating component to the upper portion by attaching insulation, heat dissipation structure of the electronic apparatus radiation heat than the heat generating component is characterized by being not to heat the heat generating component upper portion of the direct ceiling plate.
  2. 【請求項2】 前記天板に、前記発熱部品の上方の断熱材の貼付部以外の部分に通気孔を形成してなることを特徴とする請求項1記載の電子機器の放熱構造。 2. A heat radiation structure of the the top plate, the electronic device according to claim 1, characterized in that by forming a vent hole in a portion other than the sticking portion of the upper insulation of the heat generating component.
  3. 【請求項3】 前記断熱材に、発泡した断熱材料を使用してなることを特徴とする請求項1記載の電子機器の放熱構造。 Wherein the heat-insulating material, heat dissipation structure of the electronic device according to claim 1, characterized in that using a foamed insulation material.
  4. 【請求項4】 前記断熱材に、グラスウール材料を使用してなることを特徴とする請求項1記載の電子機器の放熱構造。 4. A heat insulating material, heat dissipation structure of the electronic device according to claim 1, characterized in that using a glass wool material.
  5. 【請求項5】 前記断熱材を、白色の断熱材としたことを特徴とする請求項1または請求項3記載の電子機器の放熱構造。 Wherein said heat insulating material, heat dissipation structure of the electronic device according to claim 1 or claim 3, wherein it has a white insulation.
JP26812296A 1996-10-09 1996-10-09 Heat-dissipating structure for electronic device Pending JPH10117078A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26812296A JPH10117078A (en) 1996-10-09 1996-10-09 Heat-dissipating structure for electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26812296A JPH10117078A (en) 1996-10-09 1996-10-09 Heat-dissipating structure for electronic device

Publications (1)

Publication Number Publication Date
JPH10117078A true JPH10117078A (en) 1998-05-06

Family

ID=17454199

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26812296A Pending JPH10117078A (en) 1996-10-09 1996-10-09 Heat-dissipating structure for electronic device

Country Status (1)

Country Link
JP (1) JPH10117078A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002217578A (en) * 2001-01-23 2002-08-02 Ask Technica Corp Heat insulating and radiating structure of electronic equipment
US6621707B2 (en) 1998-08-11 2003-09-16 Fujitsu Limited Liquid-cooled electronic apparatus
JP2009164351A (en) * 2008-01-07 2009-07-23 Mitsubishi Electric Corp Power conditioner
JP2010104192A (en) * 2008-10-27 2010-05-06 Daihen Corp Ground-based transformer equipment
JP2012028575A (en) * 2010-07-23 2012-02-09 Mitsubishi Electric Corp Electronic apparatus
JP2013093487A (en) * 2011-10-27 2013-05-16 Buffalo Inc Electronic apparatus
JP2014512680A (en) * 2011-04-05 2014-05-22 シーメンス アクチエンゲゼルシヤフトSiemens Aktiengesellschaft Cooling device for electronic components and / or electronic assemblies
JP2015012250A (en) * 2013-07-02 2015-01-19 株式会社村田製作所 Module and portable device with the same

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6621707B2 (en) 1998-08-11 2003-09-16 Fujitsu Limited Liquid-cooled electronic apparatus
JP2002217578A (en) * 2001-01-23 2002-08-02 Ask Technica Corp Heat insulating and radiating structure of electronic equipment
JP2009164351A (en) * 2008-01-07 2009-07-23 Mitsubishi Electric Corp Power conditioner
JP2010104192A (en) * 2008-10-27 2010-05-06 Daihen Corp Ground-based transformer equipment
JP2012028575A (en) * 2010-07-23 2012-02-09 Mitsubishi Electric Corp Electronic apparatus
JP2014512680A (en) * 2011-04-05 2014-05-22 シーメンス アクチエンゲゼルシヤフトSiemens Aktiengesellschaft Cooling device for electronic components and / or electronic assemblies
US9516782B2 (en) 2011-04-05 2016-12-06 Siemens Aktiengesellschaft Arrangement for cooling electronic components and/or assemblies
JP2013093487A (en) * 2011-10-27 2013-05-16 Buffalo Inc Electronic apparatus
JP2015012250A (en) * 2013-07-02 2015-01-19 株式会社村田製作所 Module and portable device with the same

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