JP3220705U - Radiation heat dissipation structure of wireless charging device - Google Patents
Radiation heat dissipation structure of wireless charging device Download PDFInfo
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- JP3220705U JP3220705U JP2019000108U JP2019000108U JP3220705U JP 3220705 U JP3220705 U JP 3220705U JP 2019000108 U JP2019000108 U JP 2019000108U JP 2019000108 U JP2019000108 U JP 2019000108U JP 3220705 U JP3220705 U JP 3220705U
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- 230000005855 radiation Effects 0.000 title claims abstract description 107
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 49
- 239000000758 substrate Substances 0.000 claims abstract description 39
- 230000006698 induction Effects 0.000 claims abstract description 30
- 239000011248 coating agent Substances 0.000 claims abstract description 18
- 238000000576 coating method Methods 0.000 claims abstract description 18
- 230000005540 biological transmission Effects 0.000 claims abstract description 13
- 229910052755 nonmetal Inorganic materials 0.000 claims abstract description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 17
- 239000008187 granular material Substances 0.000 claims description 15
- 229910052799 carbon Inorganic materials 0.000 claims description 7
- 229910021389 graphene Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 239000011807 nanoball Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 6
- 239000004033 plastic Substances 0.000 claims description 5
- 229910000859 α-Fe Inorganic materials 0.000 claims description 4
- 239000004677 Nylon Substances 0.000 claims description 3
- 229910002804 graphite Inorganic materials 0.000 claims description 3
- 239000010439 graphite Substances 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 229920001778 nylon Polymers 0.000 claims description 3
- 229920001470 polyketone Polymers 0.000 claims description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims 1
- 238000009434 installation Methods 0.000 abstract description 3
- 230000001939 inductive effect Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 239000003973 paint Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/08—Cooling; Ventilating
- H01F27/22—Cooling by heat conduction through solid or powdered fillings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/02—Casings
- H01F27/025—Constructional details relating to cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F38/00—Adaptations of transformers or inductances for specific applications or functions
- H01F38/14—Inductive couplings
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
- H02J50/10—Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Networks & Wireless Communication (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Charge And Discharge Circuits For Batteries Or The Like (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
【課題】無線充電装置の放射放熱構造を提供する。
【解決手段】無線充電装置の放射放熱構造は、筐体１００、基板２００、誘導コイル３００、および熱放射コーティング４００を含む。筐体１００は熱放射透過領域１０１を有し、筐体１００の熱放射透過領域１０１が形成される部分は非金属製である。基板２００は筐体１００内に収容され、基板２００の１つの面に放熱面２０１が形成され、放熱面２０１は熱放射透過領域１０１に向かって配置される。誘導コイル３００は、基板２００の放熱面２０１に設置される。熱放射コーティング４００は基板２００の放熱面２０１を覆い、誘導コイル３００を覆う。誘導コイル３００に塗布された熱放射コーティング４００により、熱放射の方式で、誘導コイル３００の動作時に生成される熱エネルギーを取り除く。したがって、放熱手段の設置により、無線充電装置の体積が増加することはない。
【選択図】図２A radiation heat dissipation structure of a wireless charging device is provided.
A radiation heat dissipation structure of a wireless charging device includes a housing (100), a substrate (200), an induction coil (300), and a heat radiation coating (400). The housing 100 has a heat radiation transmission area 101, and the part of the housing 100 where the heat radiation transmission area 101 is formed is made of nonmetal. The substrate 200 is accommodated in the housing 100, the heat dissipation surface 201 is formed on one surface of the substrate 200, and the heat dissipation surface 201 is disposed toward the heat radiation transmission area 101. The induction coil 300 is installed on the heat dissipation surface 201 of the substrate 200. The thermal radiation coating 400 covers the heat dissipation surface 201 of the substrate 200 and covers the induction coil 300. The thermal radiation coating 400 applied to the induction coil 300 removes the thermal energy generated during operation of the induction coil 300 in a manner of thermal radiation. Therefore, the installation of the heat dissipating means does not increase the volume of the wireless charging device.
[Selected figure] Figure 2
Description
本考案は無線充電装置の放熱構造に関し、特に無線充電装置の放射放熱構造である。 The present invention relates to a heat dissipation structure of a wireless charging device, and more particularly to a radiation heat dissipation structure of a wireless charging device.
現代人の生活は各種携帯電子機器であふれており、ケーブルの使用を減少させるため、無線化は必然的な傾向である。既存の携帯電子機器のほとんどはデータを無線通信する機能がすでに配備されており、さらにデータの通信速度も日増しに高くなっている。現在、携帯電子機器の無線充電技術は普及の最中であり、従来の無線充電装置の出力電力は高くないが、無線充電技術が次第に発展、成熟するのに伴って、無線充電装置が出力することができる電力も日増しに増加している。従来の無線充電装置の出力電力は低いため、充電中の発熱量は高くなく、多くが自然対流による放熱で充分であったが、無線充電装置が出力することができる電力が日増しに増加するのに伴い、充電中の発熱量も増加し、追加の放熱手段も必要な配備となっている。しかし、無線充電装置は携帯する需要を有するため、現在の無線充電装置のほとんどは体積が大きくない。既存の強制対流放熱部材の体積は、無線充電装置自体の体積よりはるかに大きいため、無線充電装置の放熱手段として適さない。さらに、強制対流放熱部材は、一般的に制御装置を使用し、ファンまたはポンプおよび水冷ヘッドを組み合わせて実現する必要があり、したがってそのコストも比較的高い。 Modern people's lives are full of various portable electronic devices, and wireless use is an inevitable trend to reduce the use of cables. Most of the existing portable electronic devices are already equipped with a function to wirelessly communicate data, and further, the data communication speed is getting higher day by day. At present, the wireless charging technology for portable electronic devices is in the process of spreading, and the output power of the conventional wireless charging device is not high, but the wireless charging device outputs as the wireless charging technology is gradually developed and matured. The power that can be done is also increasing day by day. Since the output power of the conventional wireless charging device is low, the calorific value during charging is not high, and most of the heat dissipation by natural convection was sufficient, but the power that the wireless charging device can output increases day by day As a result, the amount of heat generated during charging also increases, and additional heat dissipation measures are also required. However, since wireless charging devices have a demand to carry, most of the current wireless charging devices are not bulky. Since the volume of the existing forced convection heat dissipating member is much larger than the volume of the wireless charging device itself, it is not suitable as a heat dissipating means of the wireless charging device. Furthermore, the forced convection heat dissipating member generally needs to be realized by using a control device and combining a fan or a pump and a water cooling head, and therefore its cost is relatively high.
このことを考慮して、本考案者は上記既存技術に対して鋭意研究を重ね、さらに学理的な利用を組み合わせ、上記の問題点の解決に尽力することは、本考案者の改良の目標となっている。 Taking this into consideration, the present inventor has conducted intensive studies on the above-mentioned existing technology, and further combined the use of academics to make an effort to solve the above-mentioned problems with the aim of the present inventor's improvement. It has become.
本考案は、無線充電装置の放射放熱構造を提供する。 The present invention provides a radiation heat dissipation structure of a wireless charging device.
本考案は無線充電装置の放射放熱構造を提供し、これは筐体、基板、誘導コイル、および熱放射コーティングを含む。筐体は熱放射透過領域を有し、筐体の熱放射透過領域が形成される部分は非金属製である。基板は筐体内に収容され、基板の１つの面に放熱面が形成され、放熱面は熱放射透過領域に向かって配置される。誘導コイルは、基板の放熱面に設置される。熱放射コーティングは基板の放熱面を覆い、誘導コイルを覆う。 The present invention provides a radiating structure for a wireless charging device, which includes a housing, a substrate, an inductive coil, and a thermal radiation coating. The housing has a heat radiation transmission area, and the part of the housing where the heat radiation transmission area is formed is nonmetallic. The substrate is accommodated in the housing, a heat dissipation surface is formed on one surface of the substrate, and the heat dissipation surface is disposed toward the heat radiation transmission area. The induction coil is placed on the heat dissipation surface of the substrate. The thermal radiation coating covers the heat dissipation surface of the substrate and covers the induction coil.
本考案の無線充電装置の放射放熱構造において、基板はフェライト板である。誘導コイルは、該基板上プリントされたプリント回路でよい。誘導コイルは、巻き付けて配置される金属リード線を含むこともできる。筐体は、非金属製である。筐体の内側面における該熱放射透過領域に対応する位置に、熱放射層が設置される。熱放射層は、該筐体に塗布される媒体と、該媒体内に分散する複数の熱放射顆粒とを含むことができる。熱放射層の媒体はパッドでもよく、媒体に複数の熱放射顆粒が分布する。熱放射コーティングは該基板に塗布される媒体と、該媒体内に分散する複数の熱放射顆粒とを含む。熱放射顆粒はグラフェン片またはカーボンナノボールである。 In the radiation heat dissipation structure of the wireless charging device of the present invention, the substrate is a ferrite plate. The induction coil may be a printed circuit printed on the substrate. The induction coil can also include a metal lead that is wound around. The housing is made of nonmetal. A heat emitting layer is disposed at a position corresponding to the heat radiation transmitting area on the inner surface of the housing. The heat emitting layer can include a medium applied to the housing and a plurality of heat emitting granules dispersed in the medium. The medium of the thermally emissive layer may be a pad, and a plurality of thermally emissive granules distributed in the medium. The thermal radiation coating comprises a medium to be applied to the substrate and a plurality of thermal radiation granules dispersed in the medium. The heat emitting granules are pieces of graphene or carbon nanoballs.
本考案の無線充電装置の放射放熱構造において、筐体は熱放射材料で製造することができる。熱放射材料はポリケトン、ナイロンおよびグラファイトの混合物、または熱放射成分を含有するプラスチックでよい。熱放射成分は、グラフェンまたはカーボンナノボールでよい。 In the radiation heat dissipation structure of the wireless charging device of the present invention, the housing can be made of a heat radiation material. The heat emitting material may be a polyketone, a mixture of nylon and graphite, or a plastic containing a heat emitting component. The heat emitting component may be graphene or carbon nanoballs.
本考案の無線充電装置の放射放熱構造において、基板における放熱面と相対するもう１つの面に、熱放射層が設置される。基板における放熱面と相対するもう１つの面に対応する筐体の部分に、もう１つの熱放射層が設置される。 In the radiation heat dissipation structure of the wireless charging device of the present invention, a heat radiation layer is disposed on another surface of the substrate opposite to the heat dissipation surface. Another heat emitting layer is disposed on the portion of the housing corresponding to the other surface opposite to the heat releasing surface of the substrate.
本考案の無線充電装置の放射放熱構造は、誘導コイルに塗布された熱放射コーティングにより、熱放射の方式で、誘導コイルの動作時に生成される熱エネルギーを取り除く。したがって、放熱手段の設置により、無線充電装置の体積が増加することはなく、コストは低い。 The radiation heat dissipation structure of the wireless charging device of the present invention removes the thermal energy generated during operation of the induction coil in the manner of heat radiation by the heat radiation coating applied to the induction coil. Therefore, the installation of the heat dissipation means does not increase the volume of the wireless charging device, and the cost is low.
図１から図４を参照されたい。本考案の好ましい実施例は、無線充電装置の放射放熱構造を提供し、筐体１００、基板２００、誘導コイル３００、および熱放射コーティング４００を含む。 See Figures 1-4. The preferred embodiment of the present invention provides a radiant heat dissipating structure for a wireless charging device, including a housing 100, a substrate 200, an inductive coil 300, and a thermal radiative coating 400.
筐体１００は熱放射透過領域１０１を有し、金属は熱エネルギーの放射を反射させる特性を有するため、筐体１００の熱放射透過領域１０１が形成される部分は非金属製である。本実施例において、好ましくは、筐体１００全体はいずれも非金属（例えばプラスチック）で製造されるため、熱エネルギーを放射の方式で透過させることができる。 Since the housing 100 has a heat radiation transmitting area 101, and the metal has the property of reflecting the radiation of thermal energy, the portion of the housing 100 where the heat radiation transmitting area 101 is formed is made of nonmetal. In the present embodiment, preferably, the entire casing 100 is made of nonmetal (for example, plastic), so that thermal energy can be transmitted in a radiation manner.
基板２００は該筐体１００内に収容され、本実施例において、基板２００は、好ましくはフェライト板（Ｆｅｒｒｉｔｅ）である。基板２００の１つの面に放熱面２０１が形成され、放熱面２０１は熱放射透過領域１０１に向かって配置される。 The substrate 200 is housed in the housing 100, and in the present embodiment, the substrate 200 is preferably a ferrite plate (Ferrite). The heat dissipation surface 201 is formed on one surface of the substrate 200, and the heat dissipation surface 201 is disposed toward the heat radiation transmission area 101.
図３から図６を参照されたい。誘導コイル３００は基板２００の放熱面２０１に貼り付けて設置され、誘導コイル３００は該基板２００にプリントされたプリント回路でよい。誘導コイル３００は、巻き付けて配置され、基板２００の放熱面２０１に貼り付けられる金属リード線も含み、金属リード線は好ましくは螺旋状に巻き付けられ、平面に配置されるが、本考案は金属リード線を巻き付ける形式を限定しない。 See Figures 3 to 6. The induction coil 300 may be attached to the heat dissipation surface 201 of the substrate 200, and the induction coil 300 may be a printed circuit printed on the substrate 200. The induction coil 300 also includes a metal lead that is wound and disposed and attached to the heat dissipation surface 201 of the substrate 200, and the metal lead is preferably helically wound and disposed in a plane, although the present invention is a metal lead It does not limit the form of winding the wire.
熱放射コーティング４００は基板２００の放熱面２０１を覆い、誘導コイル３００を覆う。熱放射コーティング４００は、基板２００に塗布される媒体４１０（例えばケイ素、ゴム、樹脂または塗料）と、媒体４１０内に分散する複数の熱放射顆粒４２０とを含むことができ、その熱放射顆粒４２０はグラフェン片またはカーボンナノボールである。 The thermal radiation coating 400 covers the heat dissipation surface 201 of the substrate 200 and covers the induction coil 300. The thermal emissive coating 400 may include a medium 410 (eg, silicon, rubber, resin or paint) applied to the substrate 200 and a plurality of thermal emissive granules 420 dispersed within the medium 410, the thermal emissive granules 420. Are graphene pieces or carbon nanoballs.
誘導コイル３００は、他に電源または負荷（例えば電池または電子機器内の各機能モジュール）に電気的に接続することができ、誘導コイル３００が電源に電気的に接続するとき、通電した誘導コイル３００は磁場を生成することができる。誘導コイル３００が負荷に電気的に接続するとき、通電していない誘導コイル３００を場に装着すると、磁場を誘導して、内部に電流を生成し、負荷に電力供給することができる。したがって、電源および負荷の間に１対の誘導コイル３００を配置することにより、電源を無線方式で負荷に供給することができる。 The induction coil 300 can be electrically connected to another power source or load (for example, a battery or each functional module in an electronic device), and the induction coil 300 is energized when the induction coil 300 is electrically connected to the power source. Can generate a magnetic field. When the induction coil 300 is electrically connected to the load, when the non-energized induction coil 300 is attached to the field, a magnetic field can be induced to generate a current inside and supply power to the load. Therefore, by arranging the pair of induction coils 300 between the power supply and the load, the power can be supplied to the load wirelessly.
電力供給時、電流が誘導コイル３００を通過して生成される熱エネルギーは、熱放射コーティング４００に吸収されて放射、発散することができ、放射、発散された熱エネルギーは筐体１００の熱放射透過領域１０１を通過して筐体１００から排出させることができる。 At the time of power supply, the thermal energy generated by the current passing through the induction coil 300 can be absorbed and radiated by the thermal radiation coating 400, and the radiated and radiated thermal energy is the thermal radiation of the housing 100. It can be discharged from the housing 100 through the transmission region 101.
図２、図５および図６を参照されたい。筐体１００の内側面における熱放射透過領域１０１に対応する位置に、選択可能に熱放射層５００を追加設置することを選択することができる。特に筐体１００の一部分のみが非金属で製造され、熱放射透過領域１０１を構成するとき、熱放射は金属製の部分を透過することができないため、熱放射層５００を追加設置して、熱放射、伝達を補助する。熱放射層５００は、筐体１００に塗布する媒体５１０（例えばケイ素、ゴム、樹脂または塗料）と、媒体５１０内に分散する複数の熱放射顆粒５２０とを含むが、本考案はこれに限定されない。例えば熱放射層５００の媒体５１０は、筐体１００の内側面に貼り付けるパッドでもよく、媒体５１０内部または媒体５１０の表面に複数の熱放射顆粒５２０が分布し、その熱放射顆粒５２０はグラフェン片またはカーボンナノボールである。熱放射層５００は熱放射コーティング４００が放射、発散した熱エネルギーを吸収し、さらに外側に放射して筐体１００から排出させる。 See FIG. 2, FIG. 5 and FIG. It is possible to select to additionally install the heat emitting layer 500 at a position corresponding to the heat radiation transmitting area 101 on the inner surface of the housing 100. In particular, when only a part of the housing 100 is made of nonmetal and the heat radiation transmitting region 101 is configured, the heat radiation can not be transmitted through the metal part, so that the heat radiation layer 500 is additionally provided to Assist in radiation and transmission. The heat emitting layer 500 includes a medium 510 (eg, silicon, rubber, resin or paint) to be applied to the housing 100, and a plurality of heat emitting granules 520 dispersed in the medium 510, but the invention is not limited thereto . For example, the medium 510 of the heat radiation layer 500 may be a pad attached to the inner surface of the housing 100, and a plurality of heat radiation granules 520 are distributed in the medium 510 or on the surface of the medium 510, and the heat radiation granules 520 are graphene pieces Or carbon nanoballs. The thermal radiation layer 500 absorbs the thermal energy radiated and dissipated by the thermal radiation coating 400, and radiates it further to discharge it from the housing 100.
図７を参照されたい。全体が非金属製の筐体１００で、熱放射層５００を配置する場合、筐体１００全体が非金属で製造されるため、いずれも熱放射透過領域１０１とすることができ、したがって熱放射層５００は、好ましくは筐体１００の内側面に一面に配置することもできる。 See FIG. When the heat radiation layer 500 is disposed in the whole nonmetallic casing 100, since the whole casing 100 is manufactured with nonmetal, any of them can be a heat radiation transmission region 101, and thus the heat radiation layer 500 may also be preferably disposed on the inside surface of the housing 100.
図８を参照されたい。筐体１００全体が非金属で製造されるとき、熱放射層５００を設置しないことを選択することができる。非金属製の筐体１００は熱放射材料、例えば、改質したポリケトン（Ｐｏｌｙｋｅｔｏｎｅ）；ナイロンおよびグラファイトの混合物；または熱放射成分（グラフェン、カーボンナノボール）を有するプラスチックを選択して製造することができる。したがって筐体１００自体が熱放射することにより、誘導コイルが放出する熱放射を吸収することができ、さらに筐体から外側に熱放射し、発散させる。一般的なプラスチックが熱放射、透過することしかできないことと比較して、前記熱放射材料製の筐体１００は、さらに熱放射を吸収して、放熱効率を高めることができる。 See FIG. If the entire enclosure 100 is manufactured non-metallic, it may be chosen not to install the heat emitting layer 500. The non-metallic housing 100 can be manufactured by selecting a plastic having a thermally emitting material, for example, a modified polyketone; a mixture of nylon and graphite; or a thermally emitting component (graphene, carbon nanoballs) . Therefore, when the housing 100 itself radiates heat, it can absorb the thermal radiation emitted by the induction coil, and further radiate heat from the housing to the outside and radiate it. The housing 100 made of the heat radiation material can further absorb the heat radiation to enhance the heat radiation efficiency, as compared with the fact that a general plastic can only radiate and transmit heat.
図９を参照されたい。基板２００における放熱面２０１と相対するもう１つの面に、選択的に熱放射層６００を追加設置することもでき、この放射層６００は誘導コイル３００の動作時に生成される熱エネルギーの発散を補助するのに用いることができる。さらに、前記基板２００におけるもう１つの面に対応する筐体１００の部分にも、選択的に熱放射層５００を設置して、前記基板の熱放射層６００が発散する熱エネルギーを吸収し、さらに筐体１００の外側に発散させることができる。ここで、熱放射層５００／６００は筐体１００または基板２００に塗布して設置することができる。熱放射層５００／６００はパッドの形式でもよく、筐体１００または基板２００に貼り付けて固定される。 See FIG. A thermal radiation layer 600 can be selectively provided additionally on another surface of the substrate 200 opposite to the thermal radiation surface 201, and this radiation layer 600 helps to dissipate the thermal energy generated when the induction coil 300 operates. Can be used to Furthermore, the heat radiation layer 500 is selectively provided also on the portion of the housing 100 corresponding to the other surface of the substrate 200 so that the heat radiation layer 600 of the substrate absorbs the diverging heat energy, It can diverge outside the housing 100. Here, the heat radiation layer 500/600 can be applied and installed on the housing 100 or the substrate 200. The thermal radiation layer 500/600 may be in the form of a pad and is affixed to the housing 100 or the substrate 200 and fixed.
本考案の無線充電装置の放射放熱構造は、誘導コイル３００に塗布した熱放射コーティング４００により、熱放射の方式で、誘導コイル３００の動作時に生成される熱エネルギーを取り除く。したがって放熱手段の設置により、無線充電装置の体積が増加することはなく、さらに熱放射コーティング４００の配置コストも相当低い。 The radiant heat dissipating structure of the wireless charging device of the present invention removes thermal energy generated during operation of the inductive coil 300 by means of the thermal radiation coating 400 applied to the inductive coil 300 in the manner of thermal radiation. Therefore, the installation of the heat radiation means does not increase the volume of the wireless charging device, and the cost of arranging the heat radiation coating 400 is also considerably low.
以上の記載は本考案の好ましい実施例に過ぎず、本考案の実用新案登録請求の範囲を限定しない。その他の本考案の趣旨を利用して同等に変化させたものは、いずれも本考案の実用新案登録請求の範囲に属するべきである。 The above description is only a preferred embodiment of the present invention, and does not limit the scope of the utility model registration request of the present invention. Anything that is equally changed using the purpose of the present invention should belong to the scope of the utility model registration request of the present invention.
１００ 筐体
１０１ 熱放射透過領域
２００ 基板
２１０ 放熱面
３００ 誘導コイル
４００ 熱放射コーティング
４１０ 媒体
４２０ 熱放射顆粒
５００／６００ 熱放射層
５１０ 媒体
５２０ 熱放射顆粒
Reference Signs List 100 housing 101 heat radiation transmission area 200 substrate 210 heat radiation surface 300 induction coil 400 heat radiation coating 410 medium 420 heat radiation granule 500/600 heat radiation layer 510 medium 520 heat radiation granule
Claims (15)
熱放射透過領域を有し、該熱放射透過領域を形成する部分は非金属製である筐体と；
該筐体内に収容され、１つの面に放熱面が形成され、該放熱面が該熱放射透過領域に向かって配置される基板と；
該基板の該放熱面に設置される誘導コイルと；
基板の該放熱面を覆い、該誘導コイルを覆う熱放射コーティングと；を含む構造。 The radiation heat dissipation structure of the wireless charging device,
A housing having a heat radiation transmissive area, the portion forming the heat radiation transmissive area being made of non-metal;
A substrate housed in the housing, the heat dissipation surface being formed on one surface, the heat dissipation surface being disposed toward the heat radiation transmission area;
An induction coil mounted on the heat dissipation surface of the substrate;
A thermal radiation coating covering the heat dissipation surface of the substrate and covering the induction coil.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW107212088 | 2018-09-04 | ||
| TW107212088 | 2018-09-04 | ||
| TW107213605 | 2018-10-08 | ||
| TW107213605 | 2018-10-08 |
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| Publication Number | Publication Date |
|---|---|
| JP3220705U true JP3220705U (en) | 2019-03-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019000108U Active JP3220705U (en) | 2018-09-04 | 2019-01-16 | Radiation heat dissipation structure of wireless charging device |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP3220705U (en) |
| KR (1) | KR20200000579U (en) |
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2018
- 2018-12-03 KR KR2020180005567U patent/KR20200000579U/en not_active Application Discontinuation
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