TW201410126A - Heat sink assembly - Google Patents

Heat sink assembly Download PDF

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Publication number
TW201410126A
TW201410126A TW101130092A TW101130092A TW201410126A TW 201410126 A TW201410126 A TW 201410126A TW 101130092 A TW101130092 A TW 101130092A TW 101130092 A TW101130092 A TW 101130092A TW 201410126 A TW201410126 A TW 201410126A
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TW
Taiwan
Prior art keywords
heat sink
heat
sink assembly
film
assembly
Prior art date
Application number
TW101130092A
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Chinese (zh)
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TWI566673B (en
Inventor
Shih-Yao Li
Jui-Wen Hung
Ming-Hsiu Chung
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Foxconn Tech Co Ltd
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Application filed by Foxconn Tech Co Ltd filed Critical Foxconn Tech Co Ltd
Priority to TW101130092A priority Critical patent/TWI566673B/en
Priority to US13/660,017 priority patent/US20140048241A1/en
Publication of TW201410126A publication Critical patent/TW201410126A/en
Application granted granted Critical
Publication of TWI566673B publication Critical patent/TWI566673B/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3731—Ceramic materials or glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A heat sink assembly is adapted for dissipating heat generated from a heat-generating component. The heat sink assembly includes a heat sink for thermally connecting the heat-generating component and a thermal radiation film coated on an outer surface of the heat sink. A thermal radiation wavelength of the thermal radiation film is in a wavelength region of a far and middle infrared ray.

Description

散熱器組合Radiator combination

本發明涉及一種散熱器組合，特別涉及對發熱電子元件散熱的散熱器組合。The present invention relates to a heat sink assembly, and more particularly to a heat sink assembly that dissipates heat from a heat-generating electronic component.

隨著各種消費型電子產品朝向可攜式發展的趨勢，電子產品有著重量更輕、體積更小、功能更多樣等諸多挑戰。同一款電子產品，如平板電腦，在採用相同電路設計的前提下，功能性越強，其內發熱量越高，給人的溫度感受則越差。為此，降低電子產品的熱量，業界通常使用石墨片、金屬片(銅/鋁箔)等習知的導熱元件與電子產品內的發熱電子元件貼設，將發熱電子元件所產生的熱量分散於系統內進而傳遞至其外殼以降低發熱電子元件的溫度。為此，如何在有限空間內提高散熱效率就顯得尤為重要。With the trend toward portable development of various consumer electronic products, electronic products have many challenges such as lighter weight, smaller size, and more functions. The same electronic product, such as a tablet computer, with the same circuit design, the more functional, the higher the heat inside, the worse the temperature perception. Therefore, in order to reduce the heat of electronic products, conventional heat conduction components such as graphite sheets and metal sheets (copper/aluminum foil) are attached to heat-generating electronic components in electronic products, and heat generated by the heat-generating electronic components is dispersed in the system. The interior is in turn transferred to its outer casing to reduce the temperature of the heat-generating electronic components. For this reason, how to improve the heat dissipation efficiency in a limited space is particularly important.

有鑒於此，有必要提供一種散熱效率高的散熱器組合用於對電子元件散熱。In view of this, it is necessary to provide a heat sink combination with high heat dissipation efficiency for dissipating heat from electronic components.

一種散熱器組合，用於對電子元件散熱，包括與電子元件貼設的散熱器及設於散熱器外表面的散熱膜，所述散熱膜的熱輻射波長在中遠紅外線波長區域內。A heat sink assembly for dissipating heat from an electronic component, comprising a heat sink attached to the electronic component and a heat dissipating film disposed on an outer surface of the heat sink, wherein the heat radiation wavelength of the heat dissipating film is in a mid-infrared wavelength region.

本發明中，因散熱膜的熱輻射波長落入中遠紅外線波長區域，因此，散熱膜對中遠紅外線的熱輻射率較佳，能快速的將散熱器的熱量向外輻射，從而使散熱器組合的散熱效率得以提高。In the present invention, since the heat radiation wavelength of the heat dissipation film falls into the wavelength region of the far-infrared rays, the heat radiation film has a better heat radiation rate to the far-infrared rays, and can quickly radiate heat of the heat sink, thereby making the heat sink combination. The heat dissipation efficiency is improved.

請參閱圖1及圖2，本發明的散熱器組合1包括一散熱器10及設置於散熱器10外表面的一散熱膜30。Referring to FIG. 1 and FIG. 2 , the heat sink assembly 1 of the present invention includes a heat sink 10 and a heat dissipation film 30 disposed on the outer surface of the heat sink 10 .

所述散熱器10由導熱性能良好的材料如鋁等擠型或壓鑄成型，其包括一底座11、設置於底座11上的若干散熱片13。所述底座11為一方形板體，用於與電子元件20直接貼設從而吸收電子元件20散發的熱量。所述散熱片13自所述底座11的一側表面向上突伸形成。每一散熱片13為一縱長的片體。這些散熱片13等距離平行間隔設置且垂直於所述底座11。這些散熱片13用於將底座11吸收的熱量快速向外散發。The heat sink 10 is extruded or die-cast from a material having good thermal conductivity, such as aluminum, and includes a base 11 and a plurality of fins 13 disposed on the base 11. The base 11 is a square plate for directly attaching to the electronic component 20 to absorb heat emitted by the electronic component 20. The heat sink 13 is formed to protrude upward from a side surface of the base 11. Each fin 13 is an elongated sheet. These fins 13 are equidistantly spaced apart from each other and perpendicular to the base 11. These fins 13 serve to quickly dissipate the heat absorbed by the base 11.

所述散熱膜30通過對散熱器10的外表面進行微弧氧化的方式均勻設於散熱器10的外表面，其由金屬氧化物如氧化鋁、氧化鎂、氧化鈦等的一種或多種混合物組成。所述散熱膜30的導熱性能良好。The heat dissipating film 30 is uniformly disposed on the outer surface of the heat sink 10 by micro-arc oxidation of the outer surface of the heat sink 10, which is composed of one or more kinds of metal oxides such as alumina, magnesia, titanium oxide, and the like. . The heat dissipation film 30 has good thermal conductivity.

以下表格表示本發明中一長、寬、高分別為42毫米、42毫米、32毫米的散熱器10的熱輻射率(Thermal Emissivity)與電子元件20溫度之間的關係：The following table shows the relationship between the thermal emissivity of the heat sink 10 having a length, width, and height of 42 mm, 42 mm, and 32 mm, respectively, and the temperature of the electronic component 20 in the present invention:

散熱器10的熱輻射率與電子元件溫度關係示意圖Schematic diagram of the relationship between the heat emissivity of the heat sink 10 and the temperature of the electronic component

由上表中可知，散熱器10的熱輻射率越高，其向外輻射的熱量越多，因此導致電子元件20的溫度越低。As can be seen from the above table, the higher the heat emissivity of the heat sink 10, the more heat it radiates outward, thus causing the temperature of the electronic component 20 to be lower.

而由測試可知，當相同尺寸的散熱器10表面形成有散熱膜30後，電子元件20的溫度為79.7℃。由此推斷本發明的散熱膜30的熱輻射率介於0.8至1.0之間，其波長範圍介於2.5微米至1000微米之間，而中遠紅外線的波長範圍介於2.5微米至1000微米之間，而散熱膜30的熱輻射率區間對應的熱輻射波長正好落入中遠紅外線波長區域，因此，散熱膜30對中遠紅外線的熱輻射率較佳，可以快速的散發散熱器10的熱量。As can be seen from the test, when the heat dissipation film 30 is formed on the surface of the heat sink 10 of the same size, the temperature of the electronic component 20 is 79.7 °C. It is inferred that the heat radiation film 30 of the present invention has a heat emissivity of between 0.8 and 1.0, a wavelength range of between 2.5 micrometers and 1000 micrometers, and a mid-range infrared light having a wavelength range of between 2.5 micrometers and 1000 micrometers. On the other hand, the heat radiation wavelength corresponding to the heat radiation rate interval of the heat dissipation film 30 falls in the wavelength range of the middle and far infrared rays. Therefore, the heat radiation film 30 has a better heat radiation rate to the far infrared rays, and can quickly dissipate the heat of the heat sink 10.

本發明中，因散熱膜30的熱輻射波長落入中遠紅外線波長區域，因此，散熱膜30對中遠紅外線的熱輻射率較佳，能快速的將散熱器10的熱量向外輻射，從而使散熱器組合1的散熱效率得以提高，特別在無風扇存在的情況下，散熱器組合1自身能通過散熱膜30將熱量向外輻射，而不是被動散熱。另外，在散熱器10表面微弧氧化形成散熱膜30之前，散熱器10可不做表面處理，可減少工序，有利於節約成本。In the present invention, since the heat radiation wavelength of the heat dissipation film 30 falls into the wavelength region of the far-infrared rays, the heat radiation film 30 has a better heat radiation rate to the far-infrared rays, and can quickly radiate heat of the heat sink 10 to thereby dissipate heat. The heat dissipation efficiency of the combination 1 is improved, and in particular, in the absence of a fan, the heat sink assembly 1 itself can radiate heat outward through the heat dissipation film 30 instead of passive heat dissipation. In addition, before the surface of the heat sink 10 is micro-arc oxidized to form the heat-dissipating film 30, the heat sink 10 can be surface-treated, which can reduce the number of processes and is advantageous in cost saving.

另外，本領域技術人員還可在本發明精神內做其他變化，當然，這些依據本發明精神所做之變化，都應包含在本發明所要求保護之範圍之內。In addition, those skilled in the art can make other changes in the spirit of the present invention. Of course, the changes made in accordance with the spirit of the present invention should be included in the scope of the present invention.

1．．．散熱器組合1. . . Radiator combination

10．．．散熱器10. . . heat sink

11．．．底座11. . . Base

13．．．散熱片13. . . heat sink

20．．．電子元件20. . . Electronic component

30．．．散熱膜30. . . Heat sink

圖1為本發明的散熱器組合的立體圖。Figure 1 is a perspective view of a heat sink assembly of the present invention.

圖2為圖1所示散熱器組合貼設於發熱電子元件後的剖視圖。2 is a cross-sectional view of the heat sink assembly of FIG. 1 attached to a heat-generating electronic component.

1．．．散熱器組合1. . . Radiator combination

10．．．散熱器10. . . heat sink

11．．．底座11. . . Base

13．．．散熱片13. . . heat sink

20．．．電子元件20. . . Electronic component

30．．．散熱膜30. . . Heat sink

Claims (9)

一種散熱器組合，用於對電子元件散熱，包括與電子元件貼設的散熱器及設於散熱器外表面的散熱膜，其改良在於：所述散熱膜的熱輻射波長在中遠紅外線波長區域內。A heat sink assembly for dissipating heat to an electronic component, comprising a heat sink attached to the electronic component and a heat dissipation film disposed on an outer surface of the heat sink, wherein the heat radiation wavelength of the heat dissipation film is in a wavelength range of the far infrared ray . 如申請專利範圍第1項所述的散熱器組合，其中，所述散熱膜為導熱導熱性能良好的金屬氧化膜。The heat sink assembly of claim 1, wherein the heat dissipation film is a metal oxide film having good thermal conductivity. 如申請專利範圍第2項所述的散熱器組合，其中，所述散熱膜由氧化鋁、氧化鎂、氧化鈦的一種或多種混合物組成。The heat sink assembly of claim 2, wherein the heat dissipation film is composed of one or more mixtures of aluminum oxide, magnesium oxide, and titanium oxide. 如申請專利範圍第1項所述的散熱器組合，其中，所述散熱膜的熱輻射率介於0.8至1.0之間。The heat sink assembly of claim 1, wherein the heat radiation film has a heat emissivity of between 0.8 and 1.0. 如申請專利範圍第1項所述的散熱器組合，其中，所述散熱膜設於所述散熱器的整個外表面。The heat sink assembly of claim 1, wherein the heat dissipation film is disposed on an entire outer surface of the heat sink. 如申請專利範圍第5項所述的散熱器組合，其中，所述散熱器包括一與電子元件貼設的基板及自所述基板一側表面突伸的若干間隔的散熱片。The heat sink assembly of claim 5, wherein the heat sink comprises a substrate attached to the electronic component and a plurality of spaced fins protruding from a side surface of the substrate. 如申請專利範圍第1項所述的散熱器組合，其中，所述散熱膜由微弧氧化的方式形成於散熱器的外表面。The heat sink assembly of claim 1, wherein the heat dissipation film is formed on the outer surface of the heat sink by micro-arc oxidation. 如申請專利範圍第7項所述的散熱器組合，其中，在散熱器表面微弧氧化形成散熱膜之前，散熱器並未做表面處理。The heat sink assembly of claim 7, wherein the heat sink is not surface treated before the surface of the heat sink is micro-arc oxidized to form a heat sink film. 如申請專利範圍第1項所述的散熱器組合，其中，用於對無風扇的電子產品內部的電子元件散熱。The heat sink assembly of claim 1, wherein the heat sink for dissipating heat inside the fanless electronic product.
TW101130092A 2012-08-20 2012-08-20 Heat sink assembly TWI566673B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW101130092A TWI566673B (en) 2012-08-20 2012-08-20 Heat sink assembly
US13/660,017 US20140048241A1 (en) 2012-08-20 2012-10-25 Heat sink assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW101130092A TWI566673B (en) 2012-08-20 2012-08-20 Heat sink assembly

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TW201410126A true TW201410126A (en) 2014-03-01
TWI566673B TWI566673B (en) 2017-01-11

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US20180040532A1 (en) * 2015-04-30 2018-02-08 Hewlett-Packard Development Company, L.P. Heat sink

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US20140048241A1 (en) 2014-02-20

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