US20130306277A1 - Thermal module structure - Google Patents

Thermal module structure Download PDF

Info

Publication number
US20130306277A1
US20130306277A1 US13/473,611 US201213473611A US2013306277A1 US 20130306277 A1 US20130306277 A1 US 20130306277A1 US 201213473611 A US201213473611 A US 201213473611A US 2013306277 A1 US2013306277 A1 US 2013306277A1
Authority
US
United States
Prior art keywords
thermal module
module structure
heat
main body
heat pipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/473,611
Inventor
Chih-peng Chen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asia Vital Components Co Ltd
Original Assignee
Asia Vital Components Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asia Vital Components Co Ltd filed Critical Asia Vital Components Co Ltd
Priority to US13/473,611 priority Critical patent/US20130306277A1/en
Assigned to ASIA VITAL COMPONENTS CO., LTD. reassignment ASIA VITAL COMPONENTS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHEN, CHIH-PENG
Publication of US20130306277A1 publication Critical patent/US20130306277A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates generally to an improved thermal module structure, and more particularly to a thermal module structure having lower thermal resistance and able to provide much better heat dissipation effect. Moreover, the manufacturing cost of the thermal module structure is lowered and the manufacturing time of the thermal module structure is shortened.
  • FIG. 1A is a perspective exploded view of a conventional thermal module 1 .
  • FIG. 1B is a perspective assembled view of the conventional thermal module 1 .
  • the conventional thermal module 1 includes a base seat 10 , a heat dissipation unit 11 and at least one heat pipe 12 .
  • the heat dissipation unit 11 is composed of multiple radiating fins 111 overlapping one another.
  • the heat pipe 12 passes through the heat dissipation unit 11 and is connected therewith to form the thermal module 1 .
  • the radiating fins 111 are connected to the base seat 10 and the heat pipe 12 with solder paste by means of soldering. Such soldering process takes much time and leads to increase of manufacturing cost.
  • the bottom face of the base seat 10 of the conventional thermal module 1 is directly attached to and in contact with a heat source 13 . Accordingly, the heat generated by the heat source must first go through the base seat 10 and then to the radiating fins 111 to dissipate. According to such arrangement, the heat cannot be quickly transferred to outer side of the thermal module in the first time. Moreover, the thermal resistance is increased. This will slow down the heat dissipation.
  • the conventional thermal module has the following shortcomings:
  • a primary object of the present invention is to provide an improved thermal module structure, which has lower thermal resistance and is able to provide much better heat dissipation effect.
  • a further object of the present invention is to provide the above thermal module structure.
  • the manufacturing cost of the thermal module structure is lowered and the manufacturing time of the thermal module structure is shortened.
  • the thermal module structure of the present invention includes a main body and at least one heat pipe.
  • the main body has a base section and an extension section extending from a middle portion of one side of the base section. Multiple radiating fins extend from a circumference of the extension section.
  • the heat pipe is assembled with the main body.
  • the heat pipe has a heat absorption end and a heat dissipation end. The heat absorption end is assembled with the other side of the base section opposite to the extension section. The heat dissipation end is attached to one side of the extension section.
  • the side of the base section with the heat absorption end of the heat pipe is attached to a heat source.
  • the heat absorption end of the heat pipe serves to directly absorb the heat generated by the heat source and transfer the heat to the heat dissipation end attached to the side of the extension section. Then the heat is dissipated from the radiating fins of the extension section. Accordingly, the heat can be quickly dissipated.
  • the main body is integrally formed so that the manufacturing cost of the thermal module structure is greatly lowered and the manufacturing process of the thermal module structure is simplified.
  • FIG. 1A is a perspective exploded view of a conventional thermal module
  • FIG. 1B is a perspective assembled view of the conventional thermal module
  • FIG. 2A is a perspective exploded view of a first embodiment of the thermal module structure of the present invention.
  • FIG. 2B is a perspective assembled view of the first embodiment of the thermal module structure of the present invention.
  • FIG. 3A is a perspective exploded view of a second embodiment of the thermal module structure of the present invention.
  • FIG. 3B is a perspective assembled view of the second embodiment of the thermal module structure of the present invention.
  • FIG. 4A is a perspective exploded view of a third embodiment of the thermal module structure of the present invention.
  • FIG. 4B is a perspective assembled view of the third embodiment of the thermal module structure of the present invention.
  • FIG. 2A is a perspective exploded view of a first embodiment of the thermal module structure of the present invention.
  • FIG. 2B is a perspective assembled view of the first embodiment of the thermal module structure of the present invention.
  • the thermal module structure 2 of the present invention includes a main body 20 and at least one heat pipe 21 .
  • the main body 20 has a base section 201 and an extension section 202 extending from a middle portion of one side of the base section 201 .
  • Multiple radiating fins 2023 extend from a circumference of the extension section 202 .
  • the base section 201 and the extension section 202 are integrally formed by means of mechanical processing. In this embodiment, the mechanical processing is aluminum extrusion.
  • the heat pipe 21 is assembled with the main body 20 .
  • the heat pipe 21 has a heat absorption end 211 and a heat dissipation end 212 .
  • the heat absorption end 211 is assembled with the other side of the base section 201 opposite to the extension section 202 .
  • the heat dissipation end 212 is attached to one side of the extension section 202 .
  • the other side of the base section 201 has at least one groove 2011 formed in a position where the heat pipe 21 is positioned.
  • the heat absorption end 211 of the heat pipe 21 is assembled in the groove 2011 .
  • the heat pipe 21 is assembled with the main body 20 , whereby the heat absorption end 211 can absorb the heat and transfer the heat to the heat dissipation end 212 . Then the heat is dissipated from the radiating fins 2023 of the extension section 202 . Accordingly, the heat can be quickly dissipated.
  • the base section 201 , the extension section 202 and the radiating fins 2023 are integrally formed so that the manufacturing process is simplified and the manufacturing cost is greatly lowered.
  • FIG. 3A is a perspective exploded view of a second embodiment of the thermal module structure of the present invention.
  • FIG. 3 B is a perspective assembled view of the second embodiment of the thermal module structure of the present invention.
  • the second embodiment is substantially identical to the first embodiment in component and connection relationship between the components and thus will not be repeatedly described hereinafter.
  • the second embodiment is mainly different from the first embodiment in that multiple extension limbs 2021 further outward extend from the circumference of the extension section 202 .
  • Each extension limb 2021 has a free end formed with at least one locating hole 2022 .
  • the main body 20 has a first side 22 .
  • a fan 24 is disposed on the first side 22 of the main body 20 .
  • the fan 24 is affixed to the thermal module structure 2 .
  • the side of the base section 201 with the heat pipe 21 is attached to the heat source 25 .
  • the heat absorption end 211 of the heat pipe 21 serves to absorb the heat generated by the heat source 25 and transfer the heat to the heat dissipation end 212 .
  • the heat is dissipated from the radiating fins 2023 of the extension section 202 and carried away by the airflow generated by the fan 24 . Accordingly, the heat can be quickly dissipated.
  • FIG. 4A is a perspective exploded view of a third embodiment of the thermal module structure of the present invention.
  • FIG. 4B is a perspective assembled view of the third embodiment of the thermal module structure of the present invention.
  • the third embodiment is substantially identical to the second embodiment in component and connection relationship between the components and thus will not be repeatedly described hereinafter.
  • the third embodiment is mainly different from the second embodiment in that the main body 20 has a second side 23 on which the heat dissipation end 212 of the heat pipe 21 is positioned.
  • a fan 24 is disposed on the second side 23 of the main body 20 .
  • the fan 24 is affixed to the thermal module structure 2 .
  • the side of the base section 201 with the heat pipe 21 is attached to the heat source 25 .
  • the heat absorption end 211 of the heat pipe 21 serves to absorb the heat generated by the heat source 25 and transfer the heat to the heat dissipation end 212 .
  • the heat is dissipated from the radiating fins 2023 of the extension section 202 and carried away by the airflow generated by the fan 24 . Accordingly, the heat can be quickly dissipated.
  • the present invention has the following advantages:

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Geometry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A thermal module structure includes a main body and at least one heat pipe. The main body has a base section and an extension section. Multiple radiating fins extend from a circumference of the extension section. The heat pipe is assembled with the main body. The heat pipe has a heat absorption end and a heat dissipation end. The thermal module structure has lower thermal resistance so that the heat dissipation effect of the thermal module structure is greatly enhanced. Moreover, the manufacturing cost of the thermal module structure is lowered and the manufacturing time of the thermal module structure is shortened.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The present invention relates generally to an improved thermal module structure, and more particularly to a thermal module structure having lower thermal resistance and able to provide much better heat dissipation effect. Moreover, the manufacturing cost of the thermal module structure is lowered and the manufacturing time of the thermal module structure is shortened.
  • 2. Description of the Related Art
  • Following the continuous advance of sciences and technologies, the sizes of electronic products have become smaller and smaller, while the power consumption and the heat generated by the electronic products have become greater and greater. In order to keep the electronic components stably operating, the heat must be dissipated at high efficiency.
  • Please refer to FIGS. 1A and 1B. FIG. 1A is a perspective exploded view of a conventional thermal module 1. FIG. 1B is a perspective assembled view of the conventional thermal module 1. The conventional thermal module 1 includes a base seat 10, a heat dissipation unit 11 and at least one heat pipe 12. The heat dissipation unit 11 is composed of multiple radiating fins 111 overlapping one another. The heat pipe 12 passes through the heat dissipation unit 11 and is connected therewith to form the thermal module 1. In general, the radiating fins 111 are connected to the base seat 10 and the heat pipe 12 with solder paste by means of soldering. Such soldering process takes much time and leads to increase of manufacturing cost.
  • Moreover, the bottom face of the base seat 10 of the conventional thermal module 1 is directly attached to and in contact with a heat source 13. Accordingly, the heat generated by the heat source must first go through the base seat 10 and then to the radiating fins 111 to dissipate. According to such arrangement, the heat cannot be quickly transferred to outer side of the thermal module in the first time. Moreover, the thermal resistance is increased. This will slow down the heat dissipation.
  • According to the above, the conventional thermal module has the following shortcomings:
  • 1. The manufacturing cost is increased.
    2. It takes much time to manufacture the thermal module.
    3. The heat dissipation is slowed down.
    • SUMMARY OF THE INVENTION
  • A primary object of the present invention is to provide an improved thermal module structure, which has lower thermal resistance and is able to provide much better heat dissipation effect.
  • A further object of the present invention is to provide the above thermal module structure. The manufacturing cost of the thermal module structure is lowered and the manufacturing time of the thermal module structure is shortened.
  • To achieve the above and other objects, the thermal module structure of the present invention includes a main body and at least one heat pipe. The main body has a base section and an extension section extending from a middle portion of one side of the base section. Multiple radiating fins extend from a circumference of the extension section. The heat pipe is assembled with the main body. The heat pipe has a heat absorption end and a heat dissipation end. The heat absorption end is assembled with the other side of the base section opposite to the extension section. The heat dissipation end is attached to one side of the extension section.
  • The side of the base section with the heat absorption end of the heat pipe is attached to a heat source. The heat absorption end of the heat pipe serves to directly absorb the heat generated by the heat source and transfer the heat to the heat dissipation end attached to the side of the extension section. Then the heat is dissipated from the radiating fins of the extension section. Accordingly, the heat can be quickly dissipated. The main body is integrally formed so that the manufacturing cost of the thermal module structure is greatly lowered and the manufacturing process of the thermal module structure is simplified.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • The structure and the technical means adopted by the present invention to achieve the above and other objects can be best understood by referring to the following detailed description of the preferred embodiments and the accompanying drawings, wherein:
  • FIG. 1A is a perspective exploded view of a conventional thermal module;
  • FIG. 1B is a perspective assembled view of the conventional thermal module;
  • FIG. 2A is a perspective exploded view of a first embodiment of the thermal module structure of the present invention;
  • FIG. 2B is a perspective assembled view of the first embodiment of the thermal module structure of the present invention;
  • FIG. 3A is a perspective exploded view of a second embodiment of the thermal module structure of the present invention;
  • FIG. 3B is a perspective assembled view of the second embodiment of the thermal module structure of the present invention;
  • FIG. 4A is a perspective exploded view of a third embodiment of the thermal module structure of the present invention; and
  • FIG. 4B is a perspective assembled view of the third embodiment of the thermal module structure of the present invention.
    •  DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • Please refer to FIGS. 2A and 2B. FIG. 2A is a perspective exploded view of a first embodiment of the thermal module structure of the present invention. FIG. 2B is a perspective assembled view of the first embodiment of the thermal module structure of the present invention. According to the first embodiment, the thermal module structure 2 of the present invention includes a main body 20 and at least one heat pipe 21. The main body 20 has a base section 201 and an extension section 202 extending from a middle portion of one side of the base section 201. Multiple radiating fins 2023 extend from a circumference of the extension section 202. The base section 201 and the extension section 202 are integrally formed by means of mechanical processing. In this embodiment, the mechanical processing is aluminum extrusion.
  • The heat pipe 21 is assembled with the main body 20. The heat pipe 21 has a heat absorption end 211 and a heat dissipation end 212. The heat absorption end 211 is assembled with the other side of the base section 201 opposite to the extension section 202. The heat dissipation end 212 is attached to one side of the extension section 202. The other side of the base section 201 has at least one groove 2011 formed in a position where the heat pipe 21 is positioned. The heat absorption end 211 of the heat pipe 21 is assembled in the groove 2011.
  • According to the above arrangement, the heat pipe 21 is assembled with the main body 20, whereby the heat absorption end 211 can absorb the heat and transfer the heat to the heat dissipation end 212. Then the heat is dissipated from the radiating fins 2023 of the extension section 202. Accordingly, the heat can be quickly dissipated. Moreover, the base section 201, the extension section 202 and the radiating fins 2023 are integrally formed so that the manufacturing process is simplified and the manufacturing cost is greatly lowered.
  • Please refer to FIGS. 3A and 3B. FIG. 3A is a perspective exploded view of a second embodiment of the thermal module structure of the present invention. FIG. 3B is a perspective assembled view of the second embodiment of the thermal module structure of the present invention. The second embodiment is substantially identical to the first embodiment in component and connection relationship between the components and thus will not be repeatedly described hereinafter. The second embodiment is mainly different from the first embodiment in that multiple extension limbs 2021 further outward extend from the circumference of the extension section 202. Each extension limb 2021 has a free end formed with at least one locating hole 2022. The main body 20 has a first side 22. A fan 24 is disposed on the first side 22 of the main body 20. By means of the locating holes 2022 of the free ends of the extension limbs 2021, the fan 24 is affixed to the thermal module structure 2. The side of the base section 201 with the heat pipe 21 is attached to the heat source 25. The heat absorption end 211 of the heat pipe 21 serves to absorb the heat generated by the heat source 25 and transfer the heat to the heat dissipation end 212. Then the heat is dissipated from the radiating fins 2023 of the extension section 202 and carried away by the airflow generated by the fan 24. Accordingly, the heat can be quickly dissipated.
  • Please refer to FIGS. 4A and 4B. FIG. 4A is a perspective exploded view of a third embodiment of the thermal module structure of the present invention. FIG. 4B is a perspective assembled view of the third embodiment of the thermal module structure of the present invention. The third embodiment is substantially identical to the second embodiment in component and connection relationship between the components and thus will not be repeatedly described hereinafter. The third embodiment is mainly different from the second embodiment in that the main body 20 has a second side 23 on which the heat dissipation end 212 of the heat pipe 21 is positioned. A fan 24 is disposed on the second side 23 of the main body 20. By means of the locating holes 2022 of the free ends of the extension limbs 2021, the fan 24 is affixed to the thermal module structure 2. The side of the base section 201 with the heat pipe 21 is attached to the heat source 25. The heat absorption end 211 of the heat pipe 21 serves to absorb the heat generated by the heat source 25 and transfer the heat to the heat dissipation end 212. Then the heat is dissipated from the radiating fins 2023 of the extension section 202 and carried away by the airflow generated by the fan 24. Accordingly, the heat can be quickly dissipated.
  • In conclusion, in comparison with the conventional thermal module, the present invention has the following advantages:
  • 1. The manufacturing cost is lowered.
    2. The manufacturing process is simplified.
    3. The heat dissipation is speeded.
  • The above embodiments are only used to illustrate the present invention, not intended to limit the scope thereof. It is understood that many changes and modifications of the above embodiments can be made without departing from the spirit of the present invention. The scope of the present invention is limited only by the appended claims.

Claims (7)

What is claimed is:
1. A thermal module structure comprising:
a main body having a base section and an extension section extending from a middle portion of one side of the base section, multiple radiating fins extending from a circumference of the extension section; and
at least one heat pipe assembled with the main body, the heat pipe having a heat absorption end and a heat dissipation end, the heat absorption end being assembled with the other side of the base section opposite to the extension section, the heat dissipation end being attached to one side of the extension section.
2. The thermal module structure as claimed in claim 1, wherein multiple extension limbs further outward extend from the circumference of the extension section, each extension limb having a free end formed with at least one locating hole.
3. The thermal module structure as claimed in claim 1, wherein the other side of the base section has at least one groove formed in a position where the heat pipe is positioned, the heat absorption end of the heat pipe being assembled in the groove.
4. The thermal module structure as claimed in claim 1, wherein the main body is integrally formed by means of mechanical processing.
5. The thermal module structure as claimed in claim 4, wherein the mechanical processing is aluminum extrusion.
6. The thermal module structure as claimed in claim 1, wherein the main body has a first side, a fan being disposed on the first side of the main body.
7. The thermal module structure as claimed in claim 1, wherein the main body has a second side on which the heat dissipation end of the heat pipe is positioned, a fan being disposed on the second side of the main body.
US13/473,611 2012-05-17 2012-05-17 Thermal module structure Abandoned US20130306277A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US13/473,611 US20130306277A1 (en) 2012-05-17 2012-05-17 Thermal module structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13/473,611 US20130306277A1 (en) 2012-05-17 2012-05-17 Thermal module structure

Publications (1)

Publication Number Publication Date
US20130306277A1 true US20130306277A1 (en) 2013-11-21

Family

ID=49580336

Family Applications (1)

Application Number Title Priority Date Filing Date
US13/473,611 Abandoned US20130306277A1 (en) 2012-05-17 2012-05-17 Thermal module structure

Country Status (1)

Country Link
US (1) US20130306277A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI567884B (en) * 2015-07-24 2017-01-21 奇鋐科技股份有限公司 Heat dissipation device

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6945319B1 (en) * 2004-09-10 2005-09-20 Datech Technology Co., Ltd. Symmetrical heat sink module with a heat pipe for spreading of heat
US7000687B2 (en) * 2004-04-22 2006-02-21 Hon Hai Precision Industry Co., Ltd. Heat dissipating device
US7382047B2 (en) * 2005-12-27 2008-06-03 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US7443677B1 (en) * 2007-07-12 2008-10-28 Fu Zhun Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US20100032144A1 (en) * 2008-08-08 2010-02-11 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US7690418B2 (en) * 2005-12-28 2010-04-06 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink
US20100206524A1 (en) * 2009-02-16 2010-08-19 Mei-Hua Yuan Thermal module with quick assembling structure

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7000687B2 (en) * 2004-04-22 2006-02-21 Hon Hai Precision Industry Co., Ltd. Heat dissipating device
US6945319B1 (en) * 2004-09-10 2005-09-20 Datech Technology Co., Ltd. Symmetrical heat sink module with a heat pipe for spreading of heat
US7382047B2 (en) * 2005-12-27 2008-06-03 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US7690418B2 (en) * 2005-12-28 2010-04-06 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink
US7443677B1 (en) * 2007-07-12 2008-10-28 Fu Zhun Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US20100032144A1 (en) * 2008-08-08 2010-02-11 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US20100206524A1 (en) * 2009-02-16 2010-08-19 Mei-Hua Yuan Thermal module with quick assembling structure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI567884B (en) * 2015-07-24 2017-01-21 奇鋐科技股份有限公司 Heat dissipation device

Similar Documents

Publication Publication Date Title
EP2444724B1 (en) LED bulb
US7852630B2 (en) Heat dissipating device
US20140202666A1 (en) Thermal module
EP2789908B1 (en) Led lamp heat radiator and led lamp
JP3178619U (en) LED resonator optical resonator structure
US20120268937A1 (en) Heat dissipation unit for led bulb
US20130306277A1 (en) Thermal module structure
US10132571B2 (en) Knockdown heat dissipation unit
JP3177425U (en) LED lamp light source module
US20110214842A1 (en) Heat sink
CN106705001A (en) LED lamp radiator and LED lamp
CN202151035U (en) Heat radiator
JP3177121U (en) Heat dissipation module
JP3153941U (en) Improved structure of radiator
JP3168201U (en) Heat dissipation module
US20100243204A1 (en) Heat radiating unit for adapter
TWI416310B (en) Thermal module and the thermal device had cooling effect
TW201410126A (en) Heat sink assembly
KR102404718B1 (en) Heat dissipation device
TWI567884B (en) Heat dissipation device
TWM511193U (en) Heat dissipation apparatus
TWI590749B (en) Thermal module
TW201343060A (en) Thermal module structure
JP3169419U (en) fan
TWI413752B (en) Waste heat power generation module

Legal Events

Date Code Title Description
AS Assignment

Owner name: ASIA VITAL COMPONENTS CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:CHEN, CHIH-PENG;REEL/FRAME:028222/0515

Effective date: 20120517

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION