M426063 101年.02月10日梭正替¥頁 五、新型說明： 【新型所屬之技術領域】 [0001] 本創作係有關於一種散熱或導熱裝置，尤指一種散熱結 構。 【先前技術】 [0002] 一般電子設備均具有許多電子元件，而當電子設備在運 作時，電子元件就會產生熱量，使溫度升高影響其效能 ，進而讓電子設備產生當機之情形發生，因此，電子元 件所產生的熱能必須有效的散熱才不致於影響其工作效 能。就習知電子元件之散熱方式，其大抵使用一散熱鰭 片組和一風扇裝設在電子元件上，使電子元件所產生之 熱量被傳導至散熱鰭片組，再利用風扇所產生之風對流 而將鰭片組上所聚積的熱量帶走。 [0003] 另外，熱量的傳導可以分為三種方式，分別為對流、傳 導及輻射，其中對流是指熱能透過一液體或氣體的傳遞 介質進行循環流動，使得熱能由高溫的地方往低溫的地 方移動，最終達到溫度趨於均勻的過程；熱傳導是發生 於固體傳遞介質之間的熱流動，是由組成固體的一個分 子將熱能向另一個分子傳遞震動能的結果；而熱輻射則 是將能量以波或是次原子粒子移動的型態傳送。 [0004] 然而，上述散熱鰭片組，大多以對流和傳導為主，而這 兩種熱導方式的傳導效率十分容易受到傳遞介質（即液 體、氣體或固體）材料及特性所影響。但是，散熱效率 對許多電子設備或產品的壽命及使用效率來說都是十分 重要的影響因子。同時，隨科技發達下，電子設備或產 1013048651-0 100220251^^^^ A0101 第 3 頁 / 共 15 頁 M426063 [0005] [0006] 101年02月10日梭正替换頁 品幾乎都處於高功率運作過程，因此，上述散熱鰭片組 以對流和傳導的熱導方式，已不敷電子元件之散熱使用 〇 有鑑於此，本創作人遂針對上述現有技術，特潛心研究 並配合學理的運用，盡力解決上述之問題點，即成為本 創作人改良之目標。 【新型内容】 本創作之一目的，在於提供一種散熱結構，其係利用提 高散熱、熱量傳導能力，以達到本創作具有良好的散熱 · 效率。 [0007] [0008] [0009] 為了達成上述之目的，本創作係提供一種散熱結構，包 括：一主體，具有一基板及分別自該基板一側延伸有複 數散熱鰭片；以及一陶瓷層，彼覆在該基板及該等散熱 鰭片表面。 為了達成上述之目的，本創作係提供一種散熱結構，包 括：一主體，具有一基柱及分別自該基柱一側延伸有複 數散熱鰭片；以及一陶瓷層，彼覆在該基柱及該等散熱 鰭片表面。 本創作還具有以下功效，陶瓷層可將熱量轉換成不被金 屬材料吸收的電磁輻射以光量子的形式散發至空氣中， 使本創作散熱結構提高散熱、熱量傳導能力，進而具有 良好的散熱效率。另外，陶瓷層又可將電子元件產生的 電磁輻射轉成對人體無害的紅外線電磁輻射，以增加整 體的使用安全性。 100220251^^^^ A〇101 第4頁/共15頁 1013048651-0 M.426063 101年.02月10日梭正替換頁 【實施方式】 [0010] 有關本創作之詳細說明及技術内容，將配合圖式說明如 下，然而所附圖式僅作為說明用途，並非用於侷限本創 作。 [0011] 請參考第一至三圖所示，本創作係提供一種散熱結構， 此散熱結構主要包括主體1及一陶瓷層2。 [0012] 主體1具有一基板11a及分別自基板11 a—側延伸的複數散 熱鰭片12，又基板11a設成有遠離該等散熱鰭片12的一相 對面13 _，其中，基板11a為玻璃材料、金屬材料或導熱材 料的元件。 [0013] 陶瓷層2坡覆在基板11 a及該等散熱鰭片12表面，此陶瓷 層2為氮化矽、碳化矽、氧化鋁、氧化锆或前述之組合。 另外，陶瓷層2可以連續或不連續的方式排列於基板11a [0014] 本創作散熱結構之組合，係利用陶瓷層2披覆在基板11a 及該等散熱鰭片12表面，但此掏瓷層2不彼覆在相對面13 上，以使相對面13為一潔淨表面，讓相對面13貼附電子 元件，以將電子元件所產生之熱量傳導至該等散熱鰭片 12。藉此，因陶瓷層2可將熱量轉換成不被金屬材料吸收 的電磁輻射以光量子的形式散發至空氣中，達到很快速 的散熱作用，使本創作散熱結構提高散熱、熱量傳導能 力，進而具有良好的散熱效率。 [0015] 另外，目前國際癌症研究機構已證實極低頻電磁幅射為 「可能致癌物」，因此大量的電磁幅射可能危害人體。 100220251^^^^ A〇101 第5頁/共15頁 1013048651-0 M426063 101年02月10日孩正替換頁 本創作陶瓷層2為一種能量轉換的載體，電磁輻射通過陶 瓷層2所形成的過渡金屬的晶體結構而形成的電子躍遷， 從而轉換為一種新的能量形式外線電磁輻射。其發 射波長為8 A m，其發射率達93%，同時2〜18〆id的電 磁辕射可被含錢_雙好和多原子好吸收，按照 能量守怪定律，含有氫鍵的雙原子和多原子分子吸收其 ^後，减·高速叫使其具備能量’使 遂紅外電磁輻射對人體無害反而 ^ ? 为益。故，本創作可將 電子元件產生的電磁輻射轉成對 ^ 八體無害的紅外線電磁 轄射’以增加整體的使用安全性。 [0016] =參考第_騎，料創作散-構另—實施例，其 中基板11 a —側延伸的各散熱鰭片 μ_ . 1 ^可如第一圖或第四圖 所不，各散熱鰭片12的外型不以此* * . ^ G马限，但陶瓷層2皆披 覆在基板11 a及該等散熱鰭片12表 , 农面，同時陶瓷層2不披 覆在相對面13上，以使相對面13 而μβι· ^ 馬一潔淨表面’讓相對 面13貼附電子元件，以將電子元 . ^ u 件所產生之熱量傳導至 ^等散熱鰭片12 ^再藉由陶瓷層2 麗好μ « & 了將熱量轉換成不被金 屬材枓吸收的電彻以光量子的形式散發至空氣中， 使本創作散熱結構提高散熱、熱=發至4中 良好的散熱效率。另外，陶曼層2^導能力，進而具有 雷磁耘从絲丄 又可將電子元件產生的 ㈣射轉成對人體無害的紅外線 體的使用安全性。 €邮射，以增加整 [0017] 請參考第五至六圖所示，係本創 ，其巾^ π政熱結構又一實施例 兵中主體1具有一基柱llb及分 葙鲂埤舳絲u j目基桂lib—側延伸的 複數放熱鰭片12,如第五圖或第 、圖所示，該等散熱鰭 100220251^^^^ A0101 第6頁/共15頁 1013048651-0 M426063 ιοί年〇2月ίο日梭正替 片12自基柱lib的外周緣延伸成型，各散熱鰭片12的外型 及其共同圍設形成的造型，不以此為限；但陶瓷層2皆披 覆在基柱lib及該等散熱鰭片12表面，同時陶瓷層2不披 覆在相對面13上，以使相對面13為一潔淨表面，讓相對 面13貼附電子元件，以將電子元件所產生之熱量傳導至 該等散熱鰭片12。再藉由陶瓷層2可將熱量轉換成不被金 屬材料吸收的電磁輻射以光量子的形式散發至空氣中，M426063 101 years. On February 10th, the shuttle is replacing ¥. V. New description: [New technical field] [0001] This creation is about a heat dissipation or heat conduction device, especially a heat dissipation structure. [Prior Art] [0002] Generally, electronic devices have many electronic components, and when the electronic device is in operation, the electronic components generate heat, so that the temperature rise affects the performance, and the electronic device is caused to crash. Therefore, the heat generated by the electronic components must be effectively dissipated so as not to affect its performance. As for the heat dissipation method of the conventional electronic component, the heat dissipation fin group and a fan are mounted on the electronic component, so that the heat generated by the electronic component is transmitted to the heat dissipation fin group, and the wind convection generated by the fan is utilized. The heat accumulated on the fin group is taken away. [0003] In addition, heat conduction can be divided into three ways, namely convection, conduction and radiation, wherein convection refers to the circulation of heat energy through a liquid or gas transfer medium, so that the heat energy moves from a high temperature place to a low temperature place. , eventually reaching a process in which the temperature tends to be uniform; heat conduction is the heat flow that occurs between the solid transfer media, and is the result of the transfer of the thermal energy to the other molecule by one molecule that makes up the solid; Wave or type transfer of subatomic particle movement. [0004] However, most of the above-mentioned heat sink fin groups are mainly convection and conduction, and the conduction efficiencies of the two heat conduction modes are highly susceptible to the material and characteristics of the transfer medium (ie, liquid, gas or solid). However, heat dissipation efficiency is an important factor in the life and efficiency of many electronic devices or products. At the same time, with the development of technology, electronic equipment or production 1013048651-0 100220251^^^^ A0101 Page 3 of 15 M426063 [0005] [0006] On February 10, 101, the shuttle is replacing the page products almost at high power. The operation process, therefore, the above-mentioned heat-dissipating fin group has a heat conduction method of convection and conduction, which is insufficient for the heat dissipation of the electronic component. In view of this, the present author has devoted himself to the above-mentioned prior art to study and cooperate with the use of the theory. Trying to solve the above problems is the goal of the creator's improvement. [New Content] One of the purposes of this creation is to provide a heat dissipation structure that utilizes improved heat dissipation and heat transfer capability to achieve good heat dissipation and efficiency. [0009] In order to achieve the above object, the present invention provides a heat dissipation structure, comprising: a main body having a substrate and a plurality of heat dissipation fins extending from a side of the substrate; and a ceramic layer. It covers the substrate and the surface of the heat sink fins. In order to achieve the above object, the present invention provides a heat dissipation structure comprising: a body having a base column and a plurality of heat dissipation fins extending from one side of the base column; and a ceramic layer overlying the base column and These heat sink fin surfaces. The creation also has the following effects: the ceramic layer can convert heat into electromagnetic radiation that is not absorbed by the metal material and is emitted into the air in the form of light quantum, so that the heat dissipation structure of the present invention can improve the heat dissipation and heat conduction capability, and thus has good heat dissipation efficiency. In addition, the ceramic layer converts the electromagnetic radiation generated by the electronic components into infrared electromagnetic radiation that is harmless to the human body to increase the overall safety of use. 100220251^^^^ A〇101 Page 4 / Total 15 pages 1013048651-0 M.426063 101 years. February 10th Shuttle replacement page [Embodiment] [0010] The detailed description and technical content of this creation will be The drawings are described below, but the drawings are for illustrative purposes only and are not intended to limit the present invention. [0011] Please refer to the first to third figures. The present invention provides a heat dissipation structure mainly comprising a main body 1 and a ceramic layer 2. The main body 1 has a substrate 11a and a plurality of heat dissipation fins 12 extending from the substrate 11 a side, and the substrate 11 a is disposed away from an opposite surface 13 _ of the heat dissipation fins 12 , wherein the substrate 11 a is A component of a glass material, a metal material or a thermally conductive material. [0013] The ceramic layer 2 is coated on the surface of the substrate 11a and the heat dissipation fins 12. The ceramic layer 2 is tantalum nitride, tantalum carbide, aluminum oxide, zirconium oxide or a combination thereof. In addition, the ceramic layer 2 may be arranged on the substrate 11a in a continuous or discontinuous manner. [0014] The combination of the heat dissipation structure of the present invention is coated on the substrate 11a and the surface of the heat dissipation fins 12 by using the ceramic layer 2, but the enamel layer 2 does not cover the opposite surface 13 such that the opposite surface 13 is a clean surface, and the opposite surface 13 is attached with electronic components to conduct heat generated by the electronic components to the heat dissipation fins 12. Thereby, the ceramic layer 2 can convert the heat into electromagnetic radiation which is not absorbed by the metal material and is radiated into the air in the form of light quantum, thereby achieving a very fast heat dissipation effect, so that the heat dissipation structure of the present invention can improve heat dissipation and heat conduction capability, thereby having Good heat dissipation efficiency. [0015] In addition, the International Agency for Research on Cancer has confirmed that extremely low frequency electromagnetic radiation is a "possible carcinogen", so a large amount of electromagnetic radiation may harm the human body. 100220251^^^^ A〇101 Page 5 of 15 1013048651-0 M426063 On February 10, 101, the child replaces the page. The ceramic layer 2 is an energy conversion carrier. The electromagnetic radiation is formed by the ceramic layer 2. The electronic transition formed by the crystal structure of the transition metal is converted into a new form of external electromagnetic radiation. Its emission wavelength is 8 A m, its emissivity is 93%, and the electromagnetic radiation of 2~18〆id can be absorbed by the money_double good and polyatoms. According to the law of energy, the diatomic containing hydrogen bonds After the polyatomic molecule absorbs it, the reduction and high speed are called to make it energetic, so that the infrared electromagnetic radiation is harmless to the human body. Therefore, this creation can convert the electromagnetic radiation generated by electronic components into an infrared electromagnetic ray that is harmless to the eight bodies to increase the overall safety of use. [0016] = reference to the first riding, the material creation of the other embodiment, wherein the substrate 11 a - side extending fins μ _ 1 ^ can be as shown in the first or fourth figure, each heat sink fin The shape of the sheet 12 is not limited to this * * . ^ G horse limit, but the ceramic layer 2 is covered on the substrate 11 a and the heat sink fins 12, the agricultural surface, while the ceramic layer 2 does not cover the opposite surface 13 Upper, so that the opposite surface 13 and μβι·^ horse a clean surface 'allows the opposite surface 13 to attach the electronic component to conduct the heat generated by the electron element to the heat sink fin 12 ^ and then by ceramic Layer 2 Lihao μ « & The heat that is converted into heat that is not absorbed by the metal material is emitted into the air in the form of light quanta, so that the heat dissipation structure of the present invention can improve heat dissipation and heat=4 to achieve good heat dissipation efficiency. In addition, the Tauman layer 2 is capable of guiding, and further has the safety of using a magnetic field from a wire to convert an electronic component (four) into an infrared body that is harmless to the human body. €邮射, to increase the whole [0017] Please refer to the fifth to sixth figure, the original, the towel ^ π political thermal structure, another embodiment of the main body 1 has a base column llb and bifurcation The plurality of heat-dissipating fins 12 extending from the side of the wire, as shown in the fifth figure or the first figure, the heat-dissipating fins 100220251^^^^ A0101 page 6/15 pages 1013048651-0 M426063 ιοί year 〇February ίο 日索正片12 is extended from the outer periphery of the base column lib, and the shape of each fin 14 and the shape formed by the common fins are not limited thereto; however, the ceramic layer 2 is covered. On the surface of the base column lib and the heat dissipation fins 12, while the ceramic layer 2 is not coated on the opposite surface 13, so that the opposite surface 13 is a clean surface, and the opposite surface 13 is attached with electronic components to place the electronic components. The generated heat is conducted to the heat dissipation fins 12. The ceramic layer 2 converts heat into electromagnetic radiation that is not absorbed by the metal material and is emitted into the air in the form of photons.
使本創作散熱結構提高散熱、熱量傳導能力，進而具有 良好的散熱效率。另外，陶瓷層2又可將電子元件產生的 電磁輻射轉成對人體無害的紅外線電磁輻射，以增加整 體的使用安全性。 [0018] 综上所述，本創作之散熱結構，確可達到預期之使用目 的，而解決習知之缺失，並具有產業利用性、新穎性與 進步性，完全符合新型專利申請要件，爰依專利法提出 申請，敬請詳查並賜准本案專利，以保障創作人之權利 【圖式簡單說明】 [0019] 第一圖係本創作散熱結構之立體示意圖。 [0020] 第二圖係本創作散熱結構之剖面示意圖。 [0021] 第三圖係本創作散熱結構之另一立體示意圖。 [0022] 第四圖係本創作散熱結構另一實施例之立體示意圖。 [0023] 第五圖係本創作散熱結構又一實施例之立體示意圖。 [0024] 第六圖係本創作散熱結構再一實施例之立體示意圖。 100220251^單編號 A〇101 第7頁/共15頁 1013048651-0 101年02月10日修正替换頁 M426063 【主要元件符號說明】 [0025] 1…主體 [0026] 11 a…基板 [0027] lib…基柱 [0028] 12…散熱鰭片 [0029] 1 3…相對面 [0030] 2…陶瓷層The heat dissipation structure of the present invention is improved in heat dissipation and heat conduction capability, and thus has good heat dissipation efficiency. In addition, the ceramic layer 2 converts the electromagnetic radiation generated by the electronic components into infrared electromagnetic radiation which is harmless to the human body to increase the overall safety of use. [0018] In summary, the heat dissipation structure of the creation can achieve the intended use purpose, and solve the lack of conventional knowledge, and has industrial utilization, novelty and progress, fully conforms to the requirements of the new patent application, and converts the patent. If you apply for the law, please check and grant the patent in this case to protect the rights of the creator [Simplified illustration] [0019] The first picture is a three-dimensional diagram of the heat dissipation structure of the creation. [0020] The second figure is a schematic cross-sectional view of the heat dissipation structure of the present invention. [0021] The third figure is another perspective view of the heat dissipation structure of the present invention. [0022] The fourth figure is a perspective view of another embodiment of the heat dissipation structure of the present invention. [0023] The fifth figure is a perspective view of still another embodiment of the heat dissipation structure of the present invention. [0024] The sixth figure is a perspective view of still another embodiment of the heat dissipation structure of the present invention. 100220251^单编号A〇101 Page 7/15 pages 1013048651-0 101 February 2011 Revision replacement page M426063 [Main component symbol description] [0025] 1... Body [0026] 11 a...Substrate [0027] lib ...base column [0028] 12... heat sink fin [0029] 1 3... opposite surface [0030] 2...ceramic layer
麗2025产單编號A〇101 第8頁/共15頁 1013048651-0Li 2025 Production Order No. A〇101 Page 8 of 15 1013048651-0