CN205883821U - Three -dimensional radiation radiator - Google Patents
Three -dimensional radiation radiator Download PDFInfo
- Publication number
- CN205883821U CN205883821U CN201620673166.4U CN201620673166U CN205883821U CN 205883821 U CN205883821 U CN 205883821U CN 201620673166 U CN201620673166 U CN 201620673166U CN 205883821 U CN205883821 U CN 205883821U
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- China
- Prior art keywords
- fin
- mentioned
- heat conduction
- flat board
- heat radiation
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Abstract
The utility model provides a three -dimensional radiation radiator which contains heat conduction flat board, a fin and a heat radiation layer. The fin extends from the dull and stereotyped edge of heat conduction, and the fin is for the configuration of bending of heat conduction flat board. The heat radiation layer covers wherein one side partly at least of fin. By the heat conduction flat board for the fin bend the configuration means and can overcome the problem in the dull and stereotyped no sufficient plane extend space of heat conduction.
Description
Technical field
This utility model relates to a kind of radiator, a kind of three-dimensional radiator.
Background technology
Being applied to the radiator of electronic installation heat radiation now, its structure is usually a substrate (mostly being metal to make)
Surface coating or paste heat radiation material；Substrate is contacted the thermal source in electronic installation by its working method system and self-heat power will
Heat absorption is to substrate, then is dissipated in environment by heat energy in the way of radiant heat biography by the radiation material on substrate.
Maximum pyrotoxin in electronic installation is generally processor chips, and processor chips are flat and are attached to circuit
On plate.Also having laid other a large amount of electronic building bricks on circuit board in addition to processor chips, these other electronic building brick exists
Protrusion height one on circuit board is above processor chips mostly, and therefore substrate can interfere other when attaching processor chips
Electronic building brick.
In view of this, the present inventor satisfies for above-mentioned prior art, and spy concentrates on studies and coordinates the utilization of scientific principle, solves as possible
The most above-mentioned problem points, becomes the target of the present inventor's improvement.
Summary of the invention
The purpose of this utility model is that providing a kind of can overcome heat conduction flat board asking without enough plane wider spaces
The three-dimensional radiator of topic.
This utility model provides a kind of three-dimensional radiator, and it comprises a heat conduction flat board, a fin and a hot spoke
Penetrate layer.Fin extends from the edge of heat conduction flat board, and fin configures relative to heat conduction flat board bending.Heat radiation layer covers fin
Wherein one side is at least some of.
It is preferred that fin is around heat conduction flat panel configurations.
It is preferred that fin is a plurality of, each fin and other any fin are non-parallel configuration.Fin is separated from each other joins
Put.Fin laterally can extend an extension.Fin arranges around heat conduction flat board.
It is preferred that each fin can press from both sides an obtuse angle respectively with heat conduction flat board, and above-mentioned heat radiation layer configures in opposite directions.Each fin
An acute angle, and the opposing configuration of above-mentioned heat radiation layer can also be pressed from both sides respectively with heat conduction flat board.
It is preferred that fin offers plural hole with the junction of heat conduction flat board.The lateral margin of fin is formed with plural number aperture.
It is preferred that heat radiation layer can be a pair, and this is covered each by two of fin to heat radiation layer.Heat radiation is permissible
Layer extends at least some of of heat conduction planar surface.Plural number heat radiation granule is included in heat radiation layer.Heat radiation granule
For one of them of Graphene granule, Graphene fragment, nm carbon ball or boron nitride.
Means that three-dimensional radiator of the present utility model configures relative to fin bending by heat conduction flat board and energy
Enough overcome heat conduction flat board without the problem of enough plane wider spaces.
Accompanying drawing explanation
Fig. 1 is the schematic perspective view of the three-dimensional radiator of this utility model first embodiment.
Fig. 2 is the first use state reference map of the three-dimensional radiator of this utility model first embodiment.
Fig. 3 is the second use state reference map of the three-dimensional radiator of this utility model first embodiment.
Fig. 4 is the 3rd use state reference map of the three-dimensional radiator of this utility model first embodiment.
Fig. 5 is the schematic perspective view of the three-dimensional radiator of this utility model the second embodiment.
Fig. 6 is the schematic perspective view of the three-dimensional radiator of this utility model the 3rd embodiment.
Fig. 7 is the schematic perspective view of the three-dimensional radiator of this utility model the 4th embodiment.
Fig. 8 is the schematic diagram of the three-dimensional radiator of this utility model the 5th embodiment.
Fig. 9 is one of the three-dimensional radiator of this utility model sixth embodiment schematic perspective view.
Figure 10 is another schematic perspective view of the three-dimensional radiator of this utility model sixth embodiment.
[critical piece symbol description]
10 circuit boards
11 heat generating components
12 electronic building bricks
100 thin-film sheets
101 holes
102 cutting lines
103 aperture
110 heat conduction flat boards
120 fins
121 extensions
200 heat radiation layers
Detailed description of the invention
Refering to Fig. 1, first embodiment of the present utility model provides a kind of three-dimensional radiator, and it includes a heat conduction
Flat board 110 and at least one fin 120.
In the present embodiment, heat conduction flat board 110 is a rectangular flat, and heat conduction flat board 110 can be that metal is made, such as aluminium sheet
Or copper coin；Heat conduction flat board 110 is the most nonmetal makes such as pottery, flake graphite alkene or glass plate.
In the present embodiment, three-dimensional radiator of the present utility model includes plural number fin 120, each fin 120
The edge of self-conductance flat plate heat 110 integrally extends respectively.Above-mentioned fin 120 is separately from each other and around heat conduction flat board
110 arrangements.Each fin 120 is respectively relative to heat conduction flat board 110 bending configuration and presss from both sides an obtuse angle with heat conduction flat board 110 respectively, and
And each fin 120 and other any fin 120 are non-parallel configuration.The wherein side of each fin 120 preferably laterally extends
One extension 121.
In the present embodiment, in heat radiation layer 200, include plural number heat radiation granule.Heat radiation granule is Graphene
Grain, Graphene fragment, C60Nm carbon ball or boron nitride etc. have one of them of good thermal radiation property material.Heat radiation
Layer 200 is preferably attached to the inner side of three-dimensional radiator and covers the medial surface of each fin 120, the most above-mentioned heat radiation
Layer 200 configures the most in opposite directions.And, heat radiation layer 200 preferably can extend at least the one of heat conduction flat board 110 end face
Part.
Refering to Fig. 2 to Fig. 4, three-dimensional radiator of the present utility model, is to be applied to a circuit board 10, circuit board 10
On be provided with a heat generating component 11, and the adjacent electronic building brick 12 that is provided around of heat generating component 11, at least a part of electronics
The height of assembly 12 protrusion on the circuit board 10 protrudes height on the circuit board 10 more than heat generating component 11.
The bottom surface of heat conduction flat board 110 attaches heat generating component 11, and when heat generating component 11 works, heat conduction flat board 110 can be inhaled
Receive heat energy that heat generating component 11 produces and conducting to each fin 120 to be sent out in the mode of radiant heat biography by heat radiation layer 200 again
It is dissipated in surrounding air.
Refering to Fig. 5, the second embodiment of the present utility model provides a kind of three-dimensional radiator, and it includes a heat conduction
Flat board 110 and at least one fin 120.Its structure is big to such as aforementioned first embodiment, the present embodiment and first embodiment phase
It is in this with it to repeat no more.The present embodiment is with first embodiment difference, and the lateral margin of each fin 120 is not configured with prolonging
The section of stretching 121, therefore, it is possible to retain bigger space for thermal convection current between adjacent fin 120
Refering to Fig. 6, the 3rd embodiment of the present utility model provides a kind of three-dimensional radiator, and it includes a heat conduction
Flat board 110 and at least one fin 120.
In the present embodiment, heat conduction flat board 110 is a circular flat board, and heat conduction flat board 110 can be that metal is made, such as aluminium sheet
Or copper coin；Heat conduction flat board 110 is the most nonmetal makes such as pottery, flake graphite alkene or glass.
In the present embodiment, three-dimensional radiator of the present utility model includes plural number fin 120, each fin 120
The edge of self-conductance flat plate heat 110 integrally extends respectively.Above-mentioned fin 120 is separately from each other and around heat conduction flat board
110 arrangements.Each fin 120 is respectively relative to heat conduction flat board 110 bending configuration and presss from both sides an obtuse angle with heat conduction flat board 110 respectively, and
And each fin 120 and other any fin 120 are non-parallel configuration.
In the present embodiment, in heat radiation layer 200, include plural number heat radiation granule.Heat radiation granule is Graphene
Grain, Graphene fragment, C60Nm carbon ball or boron nitride etc. have one of them of good thermal radiation property material.Heat radiation
Layer 200 is preferably attached to the inner side of three-dimensional radiator and covers the medial surface of each fin 120, the most above-mentioned heat radiation
Layer 200 configures the most in opposite directions.And, heat radiation layer 200 preferably can extend at least the one of heat conduction flat board 110 end face
Part.
Refering to Fig. 7, the 4th embodiment of the present utility model provides a kind of three-dimensional radiator, and it includes a heat conduction
Flat board 110 and single fin 120.
In the present embodiment, heat conduction flat board 110 is a circular flat board, and heat conduction flat board 110 can be that metal is made, such as aluminium sheet
Or copper coin；Heat conduction flat board 110 is the most nonmetal makes such as pottery, flake graphite alkene or glass.
In the present embodiment, the edge of fin 120 self-conductance flat plate heat 110 integrally extends.Fin 120 ring in the form of a ring
Configuring around heat conduction flat board 110, fin 120 presss from both sides one in conical ring shape with heat conduction flat board 110 relative to heat conduction flat board 110 bending configuration
Obtuse angle.
In the present embodiment, in heat radiation layer 200, include plural number heat radiation granule.Heat radiation granule is Graphene
Grain, Graphene fragment, C60Nm carbon ball or boron nitride etc. have one of them of good thermal radiation property material.Heat radiation
Layer 200 is preferably attached to the inner side of three-dimensional radiator and covers the medial surface of fin 120, therefore heat radiation layer 200
The forward of each several part preferably phase configuration.And, heat radiation layer 200 preferably can extend over heat conduction flat board 110 end face
At least partially.
Refering to Fig. 8, the 5th embodiment of the present utility model provides a kind of three-dimensional radiator, and it includes a heat conduction
Flat board 110 and a pair fin 120.
In the present embodiment, heat conduction flat board 110 is a circular flat board, and heat conduction flat board 110 can be that metal is made, such as aluminium sheet
Or copper coin；Heat conduction flat board 110 is the most nonmetal makes such as pottery, flake graphite alkene or glass.
In the present embodiment, the edge of each fin 120 self-conductance flat plate heat 110 respectively integrally extends.Above-mentioned fin 120
It is separately from each other and is arranged opposite at two sides of heat conduction flat board 110.Each fin 120 is respectively relative to heat conduction flat board 110 folding
Curved configuration and each fin 120 presss from both sides an acute angle with heat conduction flat board 110 respectively.
In the present embodiment, in heat radiation layer 200, include plural number heat radiation granule.Heat radiation granule is Graphene
Grain, Graphene fragment, C60Nm carbon ball or boron nitride etc. have one of them of good thermal radiation property material.Heat radiation
Layer 200 is preferably attached to the outside of three-dimensional radiator and covers the lateral surface of fin 120, and therefore this is to heat radiation layer
200 opposing configurations.
Refering to Fig. 9 and Figure 10, sixth embodiment of the present utility model provides a kind of three-dimensional radiator, and it includes
One heat conduction flat board 110 and at least one fin 120
In the present embodiment, heat conduction flat board 110 and fin 120 are preferably by made by same thin film sheet 100.Thin
Offer plural number hole 101 in film sheet 100 and be beneficial to tear or bending thin-film sheet 100.The hole 101 of a portion
On thin-film sheet 100, the edge being set as heat conduction flat board 110 is enclosed in arrangement, and remaining hole 101 is then arranged in self-conductance flat plate heat 110
Edge extend to the cutting line 102 of thin-film sheet frontside edge radially outward.
Cutting line 102 is available for Tear Film sheet material 100 and forms fin 120, after the hole 101 of cutting line 102 is torn
Then form the aperture 103 being positioned at fin 120 edge.The junction of fin 120 and heat conduction flat board 110 there is hole 101 and can
Fin 120 and heat conduction flat board 110 is made to configure in angle for bending thin-film sheet 100.
In the present embodiment, in heat radiation layer 200, include plural number heat radiation granule.Heat radiation granule is Graphene
Grain, Graphene fragment, C60Nm carbon ball or boron nitride etc. have one of them of good thermal radiation property material.Heat radiation
Layer 200 is preferably attached to two of thin-film sheet 100, and the inner side of the most three-dimensional radiator and outside are all coated with heat
Radiating layer 200.Heat radiation layer 200 is configured the most in opposite directions on fin 120 medial surface, on fin 120 lateral surface to heat radiation
Layer 200 opposing configuration.
The hands that three-dimensional radiator of the present utility model configures relative to fin 120 bending by heat conduction flat board 110
Section and heat conduction flat board 110 can be overcome without the problem of enough plane wider spaces.And, above-mentioned fin 120 is joined for non-parallel
Put, thereby it can be avoided that the heat radiation layer 200 being parallel to each other for a pair mutually absorbs the heat energy dissipated to radiation.
The foregoing is only the preferred embodiment of this utility model, be not used to limit the patent protection model of this utility model
Enclosing, other uses the equivalent of patent spirit of this utility model to change, and all should all belong to the scope of patent protection of this utility model.
Claims (14)
1. a three-dimensional radiator, it is characterised in that comprise:
One heat conduction flat board；
One fin, extends from the edge of this heat conduction flat board, and this fin configures relative to this heat conduction flat board bending；And
One heat radiation layer, cover this fin wherein one side at least some of.
Three-dimensional radiator the most according to claim 1, it is characterised in that above-mentioned fin is joined around this heat conduction flat board
Put.
Three-dimensional radiator the most according to claim 1, it is characterised in that above-mentioned fin is a plurality of, each fin with
Other any fin is non-parallel configuration.
Three-dimensional radiator the most according to claim 3, it is characterised in that above-mentioned each fin is separately from each other.
Three-dimensional radiator the most according to claim 3, it is characterised in that at least one fin in above-mentioned each fin
Laterally extend an extension.
Three-dimensional radiator the most according to claim 3, it is characterised in that above-mentioned each fin is around this heat conduction flat board
Arrangement.
Three-dimensional radiator the most according to claim 6, it is characterised in that above-mentioned each fin is put down with this heat conduction respectively
Plate holder one obtuse angle, and above-mentioned heat radiation layer configures in opposite directions.
Three-dimensional radiator the most according to claim 6, it is characterised in that above-mentioned each fin is put down with this heat conduction respectively
Plate holder one acute angle, and the opposing configuration of above-mentioned heat radiation layer.
Three-dimensional radiator the most according to claim 1, it is characterised in that above-mentioned fin and the company of this heat conduction flat board
The place of connecing offers plural number hole.
Three-dimensional radiator the most according to claim 1, it is characterised in that the lateral margin of above-mentioned fin is formed with plural number
Aperture.
11. three-dimensional radiators according to claim 1, it is characterised in that above-mentioned heat radiation layer is a pair, and should
Heat radiation layer is covered each by two of this fin.
12. three-dimensional radiators according to claim 1, it is characterised in that above-mentioned heat radiation layer extends over this and leads
Flat plate heat surface at least some of.
13. three-dimensional radiators according to claim 1, it is characterised in that include plural number in above-mentioned heat radiation layer
Heat radiation granule.
14. three-dimensional radiators according to claim 13, it is characterised in that above-mentioned heat radiation granule is Graphene
One of them of granule, Graphene fragment, nm carbon ball or boron nitride.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620673166.4U CN205883821U (en) | 2016-06-30 | 2016-06-30 | Three -dimensional radiation radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620673166.4U CN205883821U (en) | 2016-06-30 | 2016-06-30 | Three -dimensional radiation radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205883821U true CN205883821U (en) | 2017-01-11 |
Family
ID=57694348
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620673166.4U Expired - Fee Related CN205883821U (en) | 2016-06-30 | 2016-06-30 | Three -dimensional radiation radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205883821U (en) |
-
2016
- 2016-06-30 CN CN201620673166.4U patent/CN205883821U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170111 Termination date: 20210630 |