CN205830232U - Electronic installation and radiator thereof - Google Patents
Electronic installation and radiator thereof Download PDFInfo
- Publication number
- CN205830232U CN205830232U CN201620616148.2U CN201620616148U CN205830232U CN 205830232 U CN205830232 U CN 205830232U CN 201620616148 U CN201620616148 U CN 201620616148U CN 205830232 U CN205830232 U CN 205830232U
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- Prior art keywords
- flat board
- heat conduction
- conduction flat
- heat
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A kind of electronic installation, it comprises a circuit board, a heat conduction flat board and a heat radiation layer.A heat generating component and plural number electronic building brick it is provided with on circuit board.Heat conduction flat board stacks on circuit boards, and contact heating assembly.Heat radiation layer covers on a surface of heat conduction flat board.Being formed through at least one breach of heat conduction flat board on heat conduction flat board, breach extends through heat radiation layer, and at least one electronic building brick is contained in breach.
Description
Technical field
This utility model relates to radiator, a kind of flat radiator and comprise the electronics of this radiator
Device.
Background technology
Being applied to the radiator of electronic installation heat radiation now, its structure is usually a substrate (mostly being metal to make)
Surface coating or paste heat radiation material；Substrate is contacted the thermal source in electronic installation by its working method system and self-heat power will
Heat absorption is to substrate, then is dissipated in environment by heat energy in the way of radiant heat biography by the radiation material on substrate.
Maximum pyrotoxin in electronic installation is generally processor chips, and processor chips are flat and are attached to circuit
On plate.Also having laid other a large amount of electronic building bricks on circuit board in addition to processor chips, these other electronic building brick exists
Protrusion height one on circuit board is above processor chips mostly, and therefore substrate can be put down when attaching processor chips and be related to other
Electronic building brick.Existing solution system dodges electronic building brick with panel beating mode bending metal basal board, and its shortcoming is substrate
Structure complicated and be difficult to be suitable for the mode pasted in whole face and heat radiation material is laid in substrate, processing cost can only be selected higher
Spraying method.Panel beating must single-piece work therefore cost-effective rate low, substrate also can only with bent metal manufacture,
It is not suitable for the most bent material (such as pottery).
In view of this, the present inventor satisfies for above-mentioned prior art, and spy concentrates on studies and coordinates the utilization of scientific principle, solves as possible
The most above-mentioned problem points, becomes the target of the present inventor's improvement.
Summary of the invention
This utility model provides a kind of flat radiator.
This utility model provides a kind of radiator, and it comprises a heat conduction flat board and a heat radiation layer.Heat radiation layer covers
A surface at heat conduction flat board.At least one breach of heat conduction flat board it is formed through on heat conduction flat board.
It is preferred that breach can be through the perforation of heat conduction flat board.Breach can also be formed at the edge of heat conduction flat board.Heat
Radiating layer is attached to heat conduction flat board.Plural number heat radiation granule is included in heat radiation layer.Heat radiation granule is Graphene granule, stone
One of them of ink alkene fragment, nm carbon ball or boron nitride.Heat conduction flat board can be that metal is made.Heat conduction flat board can also
Make for pottery or flake graphite alkene.
This utility model separately provides a kind of electronic installation, and it comprises a circuit board, a heat conduction flat board and a heat radiation layer.
A heat generating component and plural number electronic building brick it is provided with on circuit board.Heat conduction flat board stacks on circuit boards, and contact heating
Assembly.Heat radiation layer covers on a surface of heat conduction flat board.At least one breach of heat conduction flat board it is formed through on heat conduction flat board,
Breach extends through heat radiation layer, and at least one electronic building brick is contained in breach.
It is preferred that breach can be through the perforation of heat conduction flat board.Breach can also be formed in heat conduction plate edge
Short slot.Heat radiation layer is attached to heat conduction flat board.Plural number heat radiation granule is included in heat radiation layer.Heat radiation granule is Graphene
One of them of granule, Graphene fragment, nm carbon ball or boron nitride.At least one electronic building brick protrudes it on circuit boards
Highly protrude height on circuit boards more than heat generating component.Heat conduction flat board can be that metal is made.Heat conduction flat board can also be
Pottery or flake graphite alkene are made.
Accompanying drawing explanation
Fig. 1 is the perspective exploded view of the electronic installation of this utility model preferred embodiment.
Fig. 2 is the schematic perspective view of the electronic installation of this utility model preferred embodiment.
Fig. 3 is the sectional view of the electronic installation of this utility model preferred embodiment.
Fig. 4 is the schematic diagram of another embodiment of the electronic installation of this utility model.
[critical piece symbol description]
10 circuit boards
11 heat generating components
12/13 electronic building brick
20 radiators
100 heat conduction flat boards
101/102 breach
200 heat radiation layers
300 thermal diffusion layers
301 openings
Detailed description of the invention
Refering to Fig. 1 to Fig. 3, the preferred embodiment of this utility model provides a kind of electronic installation, and it includes a circuit board
10 and a radiator 20.
Being provided with at least one heat generating component 11 and plural number electronic building brick 12/13 on circuit board 10, this utility model does not limits
Determining heat generating component 11 and the form of electronic building brick 12/13, the electronic building brick 12/13 that can generate heat in work can also be treated as heating
Assembly 11.And, the height of at least one electronic building brick 12/13 protrusion on the circuit board 10 is more than heat generating component 11 at circuit board 10
Protrude above height.In the present embodiment, heat generating component 11 preferably stacks thallus on the circuit board 10, and such as one
CPU (central processing unit；Central Processing Unit) or a GPU (graphic process unit；Graphics
Processing Unit).This utility model does not limit the form of electronic building brick 12/13, example as shown in the FIG., wherein an electricity
Sub-component 12 can be capacitance component (cylinder), and another electronic building brick 13 can also be transformation assembly (rectangular blocks).
Radiator 20 includes heat conduction flat board 100 and a heat radiation layer 200.In the present embodiment, heat conduction flat board 100
A preferably metal plate, there is not the structure of any bending or bending in the flat board at this indication, heat conduction flat board 100 also may be used
To be the flat board made by the material (such as pottery or flake graphite alkene) with other with good thermal conductivity characteristic, this practicality
Novel do not limit its material.Heat conduction flat board 100 stacks on the circuit board 10, and contact heating assembly 11, in the present embodiment,
Circuit board 10, heat generating component 11 and heat conduction flat board 100 sequentially storehouse, heat generating component 11 is clamped in circuit board 10 and heat conduction flat board
Between 100.Heat radiation layer 200 can be attached on one of them surface of heat conduction flat board 100 in the way of being coated with or pasting,
And the surface the most opposing with circuit board 10.The edge of heat radiation layer 200 extend to heat conduction flat board 100 edge, because of
This is completely covered the aforementioned surfaces on heat conduction flat board 100.Plural number heat radiation granule, heat radiation it is embedded with in heat radiation layer 200
Grain can be with Graphene granule, Graphene fragment, C60Nm carbon ball or boron nitride etc. have the material of good thermal radiation property.
At least one breach 101/102 being formed through heat conduction flat board 100 on heat conduction flat board 100 is preferable in the present embodiment
Set corresponding each electronic building brick 12/13 be provided with plural number breach 101/102, and each breach 101/102 each extend over penetration heat radiation
Layer 200.This utility model does not limit the form of breach 101/102, and as shown in the FIG., wherein a breach 101 can be through leading
The perforation of flat plate heat 100, and the circular hole that it is corresponding capacitance electronic assembly 12；Another breach 102 can also be formed in leads
The short slot of flat plate heat frontside edge, and the rectangle short slot that it is corresponding transformation electronic building brick 13.Each electronic building brick 12/13 is respectively
Within being contained in corresponding breach 101/102.
Heat energy produced by heat generating component 11 can be transferred to heat radiation layer by the mode of conduction of heat by heat conduction flat board 100
200, then be dissipated in environment from heat radiation layer 200 by thermal-radiating mode.
Refering to Fig. 4, in another embodiment of the present utility model, the heat conduction flat board 100 of radiator 20 is a metal
Flat board, heat radiation layer 200 can be attached on one of them surface of heat conduction flat board 100 in the way of being coated with or pasting, lead
A thermal diffusion layer 300, thermal diffusion layer 300 preferably flake graphite alkene then it is pasted with on another surface that flat plate heat 100 is relative
Made, flake graphite alkene has good plane-heat-transfer characteristic, hence helps to the heat energy absorbed by spontaneous heating assembly 11
Diffuse to whole heat conduction flat board 100.Owing to radiant heat transfer efficiency and swept area are positive correlation, diffusion heat energy can expand hot spoke
Penetrate the swept area of layer 200, and then enhancing radiating efficiency.Thermal diffusion layer 300 can directly attach heat generating component 11, it is also possible to choosing
Offer to selecting property port 301 for heat generating component 11 by attach heat conduction flat board 100.
Electronic installation of the present utility model, its radiator 20 is offered breach 101/102 at heat conduction flat board 100 and is protruded for accommodating
Electronic building brick 12/13 on circuit board 10, is thereby beneficial to configure radiator 20.Put down with bending heat conduction compared to prior art
Plate 100 is dodged the means of electronic building brick 12/13, flat board relatively easy processing perforate and also process velocity is fast, it is further
Can be applicable to cannot heat conduction flat board 100 made by the material of bending.
The foregoing is only the preferred embodiment of this utility model, be not used to limit the scope of the claims of this utility model, its
It uses the equivalence change of the patent spirit of this utility model, all should all belong to the scope of the claims of this utility model.
Claims (17)
1. a radiator, it is characterised in that comprise:
One heat conduction flat board；And
One heat radiation layer, covers on a surface of this heat conduction flat board；
Wherein, this heat conduction flat board is formed through at least one breach of this heat conduction flat board.
Radiator the most according to claim 1, it is characterised in that above-mentioned breach is the perforation running through this heat conduction flat board.
Radiator the most according to claim 1, it is characterised in that above-mentioned breach is formed at the edge of this heat conduction flat board.
Radiator the most according to claim 1, it is characterised in that above-mentioned heat radiation layer is attached to this heat conduction flat board.
Radiator the most according to claim 1, it is characterised in that include plural number heat radiation granule in above-mentioned heat radiation layer.
Radiator the most according to claim 5, it is characterised in that more above-mentioned heat radiation granule is Graphene granule, Graphene
One of them of fragment, nm carbon ball or boron nitride.
Radiator the most according to claim 1, it is characterised in that above-mentioned heat conduction flat board is that metal is made.
Radiator the most according to claim 1, it is characterised in that above-mentioned heat conduction flat board is made for pottery or flake graphite alkene.
9. an electronic installation, it is characterised in that comprise:
One circuit board, this circuit board is provided with a heat generating component and plural number electronic building brick；
One heat conduction flat board, stacks on the board, and contacts this heat generating component；And
One heat radiation layer, covers on a surface of this heat conduction flat board；
Wherein, this heat conduction flat board is formed through at least one breach of this heat conduction flat board, and at least one this electronic building brick houses
In this breach.
Electronic installation the most according to claim 9, it is characterised in that above-mentioned breach is the perforation running through this heat conduction flat board.
11. electronic installations according to claim 9, it is characterised in that above-mentioned breach is to be formed at this heat conduction plate edge
Short slot.
12. electronic installations according to claim 9, it is characterised in that above-mentioned heat radiation layer is attached to this heat conduction flat board.
13. electronic installations according to claim 9, it is characterised in that include plural number heat radiation in above-mentioned heat radiation layer
Grain.
14. electronic installations according to claim 13, it is characterised in that above-mentioned each heat radiation granule is Graphene granule, stone
One of them of ink alkene fragment, nm carbon ball or boron nitride.
15. electronic installations according to claim 9, this electronic building brick of at least a part of which one protrudes height on the board
Height is protruded on the board more than this heat generating component.
16. electronic installations according to claim 9, it is characterised in that above-mentioned heat conduction flat board is that metal is made.
17. electronic installations according to claim 9, it is characterised in that above-mentioned heat conduction flat board is pottery or flake graphite alkene system
Become.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620616148.2U CN205830232U (en) | 2016-06-22 | 2016-06-22 | Electronic installation and radiator thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620616148.2U CN205830232U (en) | 2016-06-22 | 2016-06-22 | Electronic installation and radiator thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205830232U true CN205830232U (en) | 2016-12-21 |
Family
ID=58146439
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620616148.2U Expired - Fee Related CN205830232U (en) | 2016-06-22 | 2016-06-22 | Electronic installation and radiator thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205830232U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108454185A (en) * | 2017-02-20 | 2018-08-28 | 慧隆科技股份有限公司 | Graphite material cooling fin |
-
2016
- 2016-06-22 CN CN201620616148.2U patent/CN205830232U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108454185A (en) * | 2017-02-20 | 2018-08-28 | 慧隆科技股份有限公司 | Graphite material cooling fin |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161221 Termination date: 20210622 |