CN109565930B - Circuit board and super computing device - Google Patents
Circuit board and super computing device Download PDFInfo
- Publication number
- CN109565930B CN109565930B CN201880002442.6A CN201880002442A CN109565930B CN 109565930 B CN109565930 B CN 109565930B CN 201880002442 A CN201880002442 A CN 201880002442A CN 109565930 B CN109565930 B CN 109565930B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- heat
- groove
- card
- board body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The application provides a circuit board and an ultra-computation device, wherein the circuit board comprises a circuit board body, and at least one groove is arranged on the surface of the circuit board body; at least one heat conducting member is arranged in at least one groove; the lower surface of each heat conducting piece is attached to the bottom surface of the groove corresponding to the heat conducting piece. The surface of the circuit board body is provided with the groove, and one or more heat-conducting pieces are arranged in the groove, so that heat in the circuit board body can be dissipated through the heat-conducting pieces, and the heat dissipation effect of the circuit board is enhanced; the bottom surface of the heat conducting piece is attached to the bottom surface of the groove, so that the contact area between the heat conducting piece and the circuit board body is further increased, heat generated by the circuit board in the working process is transferred to the outside, and the heat dissipation capacity of the circuit board is improved; furthermore, the circuit board and the components on the circuit board are prevented from being damaged by high temperature, and normal work of the circuit board and the components on the circuit board is guaranteed.
Description
Technical Field
The application relates to the technical field of circuit boards, in particular to a circuit board and an ultra-computation device.
Background
Printed Circuit boards (PCBs for short) are used in various electronic devices, and are important electronic components on which various components can be mounted. Among them, the printed circuit board may be simply referred to as a circuit board. The circuit board can produce the heat at the in-process of work, and the temperature that can make the circuit board is higher, and higher temperature can destroy the structure of circuit board and the components and parts on the circuit board, leads to the components and parts on circuit board and the circuit board can not normally work to need carry out the heat dissipation to the circuit board and handle. A plurality of heat sinks may be provided on the circuit board, and the circuit board is heat-dissipated through the heat sinks.
In the prior art, when a heat sink is disposed on a circuit board, solder paste may be coated on the circuit board, and solder paste may be coated on the bottom of the heat sink, so that the heat sink is fixedly disposed on the circuit board through the solder paste; alternatively, the heat sink is screwed to the circuit board by screws.
However, the inventors of the present application have found that the contact area between the heat sink and the circuit board is still not large enough, resulting in poor heat dissipation effect of the circuit board.
Disclosure of Invention
The application provides a circuit board and super computing equipment to solve the problems that the existing circuit board heat dissipation mode can only take away a small part of heat in the circuit board generally, and the overall heat dissipation effect is not ideal.
In a first aspect, the present application provides a circuit board comprising:
the circuit board comprises a circuit board body, wherein at least one groove is formed in the surface of the circuit board body;
at least one heat conducting member is arranged in the at least one groove;
the lower surface of each heat conducting piece in the at least one heat conducting piece is attached to the bottom surface of the groove corresponding to the heat conducting piece.
Further, the heat conducting member is a heat conducting metal.
Further, the heat conductive metal includes one or more of copper, aluminum, silver, tin, gold, iron, and aluminum alloy.
Further, the heat conducting member is a heat conducting nonmetal.
Further, the heat-conducting nonmetal is graphene.
Further, one or more of the at least one thermal conduction member is disposed in each of the at least one groove.
Further, each of the at least one groove is in one-to-one correspondence with each of the at least one heat-conducting member.
Further, each groove is in threaded connection with the heat-conducting piece corresponding to each groove;
or, each groove is bonded with the heat conducting piece corresponding to each groove.
Furthermore, each groove is clamped with the heat-conducting piece corresponding to each groove.
Further, be provided with first joint portion on each recess, be provided with second joint portion on each heat-conducting member that each recess corresponds, first joint portion with second joint portion joint.
Furthermore, the number of the first clamping portions on each groove is one, at least one first clamping portion is arranged on each first clamping portion, and at least one second clamping portion matched with the first clamping portion is arranged on each heat conducting piece corresponding to each groove.
Further, the first card and the part are concave, and the second card and the part are convex;
or the first card and the part are convex, and the second card and the part are concave.
Further, the at least one first clamping portion on each first clamping portion is arranged at the edge of the top of the groove;
the at least one second engagement portion is provided at an edge of a top surface of the heat conductive member.
Further, the at least one first clamping portion on each first clamping portion and the top of the groove are located on the same horizontal plane, and the at least one second clamping portion and the top surface of the heat conducting piece are located on the same horizontal plane.
Further, the first card and the second card correspond to each other one to one.
Furthermore, at least one radiating fin is arranged on the circuit board body;
each of the at least one heat radiating fin comprises a bottom plate and at least one heat radiating fin, each of the at least one heat radiating fin is connected with the bottom plate, and the bottom plate is connected with the surface of the circuit board body.
Furthermore, each heat dissipation sheet is provided with a connecting part, each connecting part comprises a first plate and a second plate, and a preset angle is formed between the first plate and the second plate;
the at least one radiating fin is fixedly arranged on the upper surface of the connecting part, and the bottom plate is fixedly arranged on the lower surface of the connecting part.
Further, adjacent ones of the at least one heat dissipating fin have the same or different heights.
In a second aspect, the present application provides a supercomputing apparatus comprising at least one circuit board as claimed in any of claims 1 to 18.
Further, the circuit boards in the supercomputing device are connected in parallel with each other.
Furthermore, a sliding groove is arranged on the case of the supercomputing device, and the sliding groove is used for being in sliding connection with each circuit board in the supercomputing device.
In the above aspects, by providing at least one groove on a surface of the circuit board body; at least one heat conducting member is arranged in at least one groove; the lower surface of each heat conducting piece is attached to the bottom surface of the groove corresponding to the heat conducting piece. The surface of the circuit board body is provided with the groove, and one or more heat-conducting pieces are arranged in the groove, so that heat in the circuit board body can be dissipated through the heat-conducting pieces, and the heat dissipation effect of the circuit board is enhanced; the bottom surface of the heat conducting piece is attached to the bottom surface of the groove, so that the contact area between the heat conducting piece and the circuit board body is further increased, heat generated by the circuit board in the working process is transferred to the outside, and the heat dissipation capacity of the circuit board is improved; furthermore, the circuit board and the components on the circuit board are prevented from being damaged by high temperature, and normal work of the circuit board and the components on the circuit board is guaranteed.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without inventive exercise.
Fig. 1 is a first schematic structural diagram of a circuit board according to an embodiment of the present disclosure;
FIG. 2 is a first schematic structural diagram of a heat conducting member according to an embodiment of the present disclosure;
fig. 3 is a schematic structural diagram of a circuit board according to an embodiment of the present disclosure;
fig. 4 is a schematic structural diagram of a circuit board according to an embodiment of the present disclosure;
fig. 5 is a first schematic structural diagram of another circuit board according to an embodiment of the present disclosure;
fig. 6 is a second schematic structural diagram of another circuit board according to an embodiment of the present disclosure;
fig. 7 is a first schematic structural diagram of a heat sink according to an embodiment of the present disclosure;
fig. 8 is a second schematic structural diagram of a heat sink provided in the embodiment of the present application;
fig. 9 is a schematic structural diagram of a heat sink provided in the embodiment of the present application;
fig. 10 is a schematic structural diagram of a heat sink according to an embodiment of the present application;
fig. 11 is a first schematic structural diagram of another circuit board according to an embodiment of the present disclosure;
fig. 12 is a second schematic structural diagram of another circuit board according to an embodiment of the present disclosure;
fig. 13 is a schematic structural diagram of another circuit board according to the embodiment of the present application;
fig. 14 is a second structural view of a heat-conducting member according to an embodiment of the present application;
fig. 15 is a schematic structural diagram of a heat-conducting member according to an embodiment of the present application;
fig. 16 is a schematic structural diagram of a supercomputing apparatus provided in an embodiment of the present application.
Reference numerals:
| 1-Circuit Board body | 2-groove | 3-Heat conducting Member |
| 4-Heat sink | 5-negative film | 6-radiating fin |
| 7-connecting part | 8-first card and portion | 9-second card and part |
| 161-Circuit Board |
Detailed Description
The embodiment of the application is applied to the circuit board. It should be noted that, when the scheme of the embodiment of the present application is applied to a circuit board which may appear now or in the future, names of the respective structures may change, but this does not affect the implementation of the scheme of the embodiment of the present application.
It should be noted that the terms or terms referred to in the embodiments of the present application may be mutually referred and are not described in detail.
In the prior art, when a heat sink is disposed on a circuit board, solder paste may be coated on the circuit board, and solder paste may be coated on the bottom of the heat sink, so that the heat sink is fixedly disposed on the circuit board through the solder paste; alternatively, the heat sink is screwed to the circuit board by screws or bolts or the like. However, the above method of installing the heat sink makes the contact area between the heat sink and the circuit board smaller, and the heat sink cannot take away the heat of the circuit board well, resulting in poor heat dissipation effect of the circuit board.
The application provides a circuit board and super calculation equipment, aims at solving the above technical problems of the prior art.
The following describes the technical solutions of the present application and how to solve the above technical problems with specific embodiments. The following several specific embodiments may be combined with each other, and details of the same or similar concepts or processes may not be repeated in some embodiments. Embodiments of the present application will be described below with reference to the accompanying drawings.
Fig. 1 is a first structural schematic diagram of a circuit board according to an embodiment of the present application, and fig. 2 is a first structural schematic diagram of a heat conducting element according to an embodiment of the present application, as shown in fig. 1 and fig. 2, the circuit board includes: the circuit board comprises a circuit board body 1, wherein at least one groove 2 is formed in the surface of the circuit board body 1; at least one heat conducting member 3 is arranged in at least one groove 2; the lower surface of each heat conduction member 3 of the at least one heat conduction member 3 is attached to the bottom surface of the groove 2 corresponding to the heat conduction member 3.
Optionally, the heat conducting member 3 is a heat conducting metal. Preferably, the thermally conductive metal comprises one or more of copper, aluminum, silver, tin, gold, iron, and aluminum alloys.
Alternatively, the heat-conducting member 3 is optionally a heat-conducting non-metal. Preferably, the thermally conductive non-metal is graphene.
Optionally, one or more heat-conducting members 3 of the at least one heat-conducting member 3 are disposed in each of the at least one grooves 2; alternatively, each of the at least one grooves 2 is in one-to-one correspondence with each of the at least one heat-conducting members 3.
Optionally, each groove 2 is in threaded connection with the heat-conducting member 3 corresponding to each groove 2; or, each groove 2 is bonded with the heat-conducting member 3 corresponding to each groove 2; alternatively, each groove 2 is engaged with the heat-conducting member 3 corresponding to each groove 2.
The circuit board is illustratively composed of one circuit board body 1.
The shape of the circuit board body 1 can be rectangular, square, trapezoid, other regular shapes or other irregular shapes; the shape of the circuit board body 1 is not limited in this application.
The material of the circuit board body 1 is not limited in this application.
The circuit board body 1 may be a single-sided board, a double-sided board, or a multi-layered board, and the application is not limited thereto.
The surface of the circuit board body 1 is provided with N grooves 2, wherein N is a positive integer greater than or equal to 1. For example, one or more grooves 2 are formed on the upper surface of the circuit board body 1; or, one or more grooves 2 are formed on the lower surface of the circuit board body 1; alternatively, one or more grooves 2 are formed in the upper surface of the circuit board body 1, and one or more grooves 2 are formed in the lower surface of the circuit board body 1.
The recess 2 needs not to affect the work of the circuit board body 1 itself, and the recess 2 needs not to affect the work of each component on the circuit board body 1.
The application is not limited as to the position of each recess 2 on the surface of the circuit board body 1. The size, shape and area of each groove 2 are not limited in this application. The depth of each groove 2 is not limited in this application. The size, area and material of the heat-conducting members 3 in the same groove 2 can be the same or different.
M heat-conducting pieces 3 are arranged in the N grooves 2, wherein M is a positive integer greater than or equal to 1; the heat conducting piece 3 can take away heat generated by the circuit board; in order to further improve the heat conduction of the heat-conducting members 3, the lower surface of each heat-conducting member 3 is bonded to the bottom surface of the corresponding groove 2 of the heat-conducting member 3. Exemplarily, one or more heat-conducting members 3 are provided in each of the N grooves 2; alternatively, one or more heat-conducting members 3 may be provided in R recesses 2 out of the N recesses 2, R being an integer of 1 or more and less than N, and the heat-conducting members 3 may not be provided in the remaining N-R recesses 2 out of the N recesses 2.
The heat conducting members 3 in each groove 2 can be filled in the corresponding groove 2; alternatively, the respective heat-conducting members 3 in each of the grooves 2 may not be filled with the corresponding groove 2.
For example, fig. 3 is a schematic structural diagram of a circuit board according to an embodiment of the present disclosure, as shown in fig. 3, N grooves 2 are formed on a surface of a circuit board body 1, and one or more heat conductive members 3 are disposed in each groove 2, where the number of the heat conductive members 3 in different grooves 2 may be the same or different. For example, as shown in fig. 3, the N grooves 2 include a first groove 2, a second groove 2, and a third groove 2, one heat-conducting member 3 is provided in the first groove 2, two heat-conducting members 3 are provided in the second groove 2, and one heat-conducting member 3 is provided in the third groove 2.
For another example, fig. 4 is a schematic structural diagram three of a circuit board according to an embodiment of the present disclosure, as shown in fig. 4, N grooves 2 are formed on a surface of a circuit board body 1, a heat conducting member 3 is disposed in each groove 2, and the grooves 2 and the heat conducting members 3 are in one-to-one correspondence.
In this embodiment, the heat-conducting member 3 may be a heat-conducting metal; preferably, the material of the thermally conductive metal may include one or more of the following: copper, aluminum, silver, tin, gold, iron, aluminum alloy, but not limited thereto. Alternatively, the thermally conductive member 3 is a thermally conductive non-metal, for example, the thermally conductive non-metal may include one or more of the following: the thermally conductive non-metallic material includes, but is not limited to, resin, ceramic, graphite, graphene, water, and the like. In this embodiment, the materials of the different heat-conducting members 3 are the same or different. For example, M heat-conducting members 3 are disposed in N grooves 2 of the circuit board body 1, and the M heat-conducting members 3 may be all heat-conducting metals; alternatively, the M heat-conducting members 3 may all be a heat-conducting nonmetal; or S of the M heat-conducting members 3 are heat-conducting metals, where S is a positive integer greater than or equal to 1 and less than M, and the remaining N-S heat-conducting members 3 are heat-conducting non-metals.
Further, in order to allow the heat-conducting member 3 to be stably disposed in the groove 2, the groove 2 and the heat-conducting member 3 in the groove 2 may be fixedly coupled. Wherein, the fixed connection mode can adopt at least one of the following: screwing, cementing, bonding and clamping.
In this embodiment, the fixing connection modes adopted by the different heat-conducting members 3 may be the same or different. For example, M heat-conducting members 3 are disposed in N grooves 2 of the circuit board body 1, and each heat-conducting member 3 of the M heat-conducting members 3 is screwed with the groove 2 corresponding to the heat-conducting member 3; or, each heat conduction member 3 of the M heat conduction members 3 is engaged with the corresponding groove 2 of the heat conduction member 3; or S heat conducting members 3 in the M heat conducting members 3 are in threaded connection with the grooves 2 corresponding to the heat conducting members 3, wherein S is a positive integer which is more than or equal to 1 and less than M, and the rest N-S heat conducting members 3 are clamped with the grooves 2 corresponding to the heat conducting members 3; s heat conduction members 3 in the M heat conduction members 3 are in threaded connection with the grooves 2 corresponding to the heat conduction members 3, wherein S is a positive integer which is more than or equal to 1 and less than M, and the rest N-S heat conduction members 3 are cemented with the grooves 2 corresponding to the heat conduction members 3.
In the embodiment, at least one groove 2 is arranged on the surface of the circuit board body 1; at least one heat conducting member 3 is arranged in at least one groove 2; the lower surface of each heat-conducting member 3 is attached to the bottom surface of the corresponding groove 2 of the heat-conducting member 3. The surface of the circuit board body 1 is provided with the groove 2, and one or more heat-conducting pieces 3 are arranged in the groove 2, so that heat in the circuit board body 1 can be dissipated through the heat-conducting pieces 3, and the heat dissipation effect of the circuit board is enhanced; the bottom surface of the heat conducting piece 3 is attached to the bottom surface of the groove 2, so that the contact area between the heat conducting piece 3 and the circuit board body 1 is further increased, heat generated in the working process of the circuit board is transferred to the outside, and the heat dissipation capacity of the circuit board is improved; furthermore, the circuit board and the components on the circuit board are prevented from being damaged by high temperature, and normal work of the circuit board and the components on the circuit board is guaranteed.
Fig. 5 is a first schematic structural diagram of another circuit board provided in the embodiment of the present application, and fig. 6 is a second schematic structural diagram of another circuit board provided in the embodiment of the present application, and as shown in fig. 5 and fig. 6, on the basis of the embodiment shown in fig. 1, at least one heat sink 4 is disposed on a circuit board body 1.
Each of the at least one heat sink 4 includes a base plate 5 and at least one heat dissipating fin 6, each of the at least one heat dissipating fins 6 is connected to the base plate 5, and the base plate 5 is connected to the surface of the circuit board body 1.
Optionally, each heat sink 4 is provided with a connecting portion 7, each connecting portion 7 includes a first plate and a second plate, and a preset angle is formed between the first plate and the second plate; at least one heat radiation fin 6 is fixedly arranged on the upper surface of the connecting part 7, and the bottom sheet 5 is fixedly arranged on the lower surface of the connecting part 7.
Optionally, the heights of adjacent heat dissipation fins 6 in at least one heat dissipation fin 6 are the same or different.
Exemplarily, on the basis of the above-described embodiments, one or more heat sinks 4 may also be provided on the surface of the circuit board body 1.
For example, one or more heat sinks 4 are fixedly provided on the upper surface of the circuit board body 1; or, one or more radiating fins 4 are fixedly arranged on the lower surface of the circuit board body 1; or, one or more heat sinks 4 are fixedly arranged on the upper surface of the circuit board body 1, and one or more heat sinks 4 are fixedly arranged on the lower surface of the circuit board body 1; alternatively, one or more heat sinks 4 are provided on the surface of one or more heat conductive members 3 on the circuit board body 1.
The present application is not limited as to the position of the heat sink 4 on the circuit board body 1. The arrangement of the heat sink 4 on the circuit board body 1 is not limited in this application. The number of the heat dissipation fins 4 is not limited in the present application. The shape and size of the heat sink 4 are not limited in this application.
Furthermore, one or more chips are arranged on the lower surface of the circuit board body 1, and each chip is fixedly connected with the circuit board body 1; to facilitate heat dissipation from the chips, a heat sink 4 may be provided on each chip.
The connection mode of the heat sink 4 and the chip is not limited in this application. The present application is not limited with respect to the position of the chip on the lower surface of the circuit board body 1. The arrangement of the chips on the circuit board body 1 is not limited in this application. The number of chips is not limited in this application. The shape and size of the chip are not limited in this application.
Further, fig. 7 is a schematic structural diagram of the heat sink provided in the embodiment of the present application, as shown in fig. 7, each heat sink 4 is composed of a bottom plate 5 and at least one heat sink fin 6, and each heat sink fin 6 is fixedly connected to the bottom plate 5; the base sheet 5 is fixedly connected to the circuit board body 1, and the heat sink 4 is fixedly attached to the circuit board body 1.
The heights of adjacent ones of the heat dissipating fins 6 in each of the heat dissipating fins 6 in the same heat dissipating sheet 4 are the same or different. For example, the heights of the respective heat dissipating fins 6 in the same heat dissipating fin 4 are all the same; alternatively, the heights of the radiating fins 6 in the same radiating fin 4 are different; or, the heights of part of the radiating fins 6 in the same radiating fin 4 are the same, and the heights of the rest of the radiating fins 6 are different; alternatively, for the same heat sink 4, the heights of the heat dissipating fins 6 are sequentially increased or decreased from the heat dissipating fin 6 in the middle of the heat sink 4 toward the heat dissipating fins 6 on both sides. For example, as shown in fig. 7, the heights of the respective heat radiation fins 6 in the heat radiation fin 4 are all the same; for example, fig. 8 is a schematic structural diagram of a second heat sink provided in the embodiment of the present application, and as shown in fig. 8, the heights of the heat sink fins 6 are sequentially increased from the heat sink fins 6 in the middle of the heat sink 4 to the heat sink fins 6 on both sides.
Furthermore, a handle may be disposed on the top of the heat sink 4, and the handle is fixedly connected to one heat sink fin 6 of the heat sink 4, so that the heat sink 4 can be clamped to the circuit board body 1 by the handle, and the heat sink 4 can be removed from the circuit board body 1 by the handle.
In this embodiment, a connecting portion 7 may be disposed on the heat sink 4, the connecting portion 7 includes a first plate and a second plate, and a preset angle is formed between the first plate and the second plate, and the preset angle may be in a range of 180 degrees to 90 degrees; the heat-radiating fins 6 are fixedly provided on the upper surface of the connecting portion 7, and the base sheet 5 is fixedly provided on the lower surface of the connecting portion 7.
For example, fig. 9 is a schematic structural diagram of a heat sink provided in an embodiment of the present application, and as shown in fig. 9, the heat sink 4 is provided with a connecting portion 7, and heights of the heat sink fins 6 in the heat sink 4 are all the same; fig. 10 is a schematic structural diagram of a heat sink according to an embodiment of the present invention, and as shown in fig. 10, a connecting portion 7 is provided on the heat sink 4, and the heights of the heat sink fins 6 are sequentially increased from the heat sink fins 6 in the middle of the heat sink 4 toward the heat sink fins 6 on both sides.
In the embodiment, one or more radiating fins 4 are arranged on the circuit board body 1; the heat sink 4 may be provided on the heat conductive member 3 of the circuit board body 1, or the heat sink 4 may be provided at other positions on the surface of the circuit board body 1. Further, the heat generated by the circuit board in the working process is further transferred to the outside through the radiating fins 4; further improving the heat dissipation capability of the circuit board.
Fig. 11 is a first schematic structural diagram of another circuit board according to an embodiment of the present disclosure, and as shown in fig. 11, on the basis of the embodiments shown in fig. 1 and fig. 5, when the groove 2 is engaged with the heat conducting member 3 corresponding to the groove 2, the following scheme of the present disclosure is implemented.
Each recess 2 is provided with first joint portion, and each heat-conducting member 3 that each recess 2 corresponds is provided with second joint portion, first joint portion and second joint portion joint.
Optionally, the number of the first clamping portions on each groove 2 is one, at least one first clamping portion 8 is arranged on each first clamping portion, and at least one second clamping portion 9 matched with the first clamping portion 8 is arranged on each heat conducting member 3 corresponding to each groove 2.
Optionally, the first engaging portion 8 is concave, and the second engaging portion 9 is convex; alternatively, the first engaging portion 8 is convex and the second engaging portion 9 is concave.
Optionally, at least one first clamping portion 8 on each first clamping portion is arranged at the edge of the top of the groove 2; at least one second click portion 9 is provided at the edge of the top surface of the heat-conductive member 3.
Optionally, at least one first engaging portion 8 of each first engaging portion is located at the same level as the top of the groove 2, and at least one second engaging portion 9 is located at the same level as the top of the heat-conducting member 3.
Alternatively, the first card and portion 8 and the second card and portion 9 correspond one to one.
For example, in order to make the grooves 2 and the heat-conducting members 3 perform good clamping, a first clamping portion is arranged on each groove 2, and a second clamping portion is arranged on each heat-conducting member 3; first joint portion and second joint portion match each other to first joint portion can carry out the joint with second joint portion, and then with 3 blocks of heat-conducting piece to recess 2.
Further, a first engaging portion is provided on each of the grooves 2, one or more first engaging portions 8 are provided on the first engaging portion, and one or more second engaging portions 9 that match the first engaging portions 8 are provided on the heat conductive member 3.
For example, as shown in fig. 11, a first card and portion 8 is provided in each recess 2; one recess 2 corresponds to one heat-conducting member 3, and one or more second engaging portions 9 that match the first engaging portions 8 are provided on the heat-conducting member 3 corresponding to the recess 2. Preferably, the first card and portion 8 is in one-to-one correspondence with the second card and portion 9. As shown in fig. 11, the first card and portion 8 may be located on the bottom surface of the recess 2. Wherein, the first card and part 8 can be concave, and the second card and part 9 is convex, and the second card and part 9 can be inserted into the first card and part 8; in order to make the connection of the first card and portion 8 and the second card and portion 9 more secure, the first card and portion 8 may be provided to be elastic, and the diameter of the first card and portion 8 may be larger than the diameter of the second card and portion 9. Alternatively, the first card and portion 8 may be convex, the second card and portion 9 may be concave, the first card and portion 8 may be inserted into the second card and portion 9, in order to make the connection of the first card and portion 8 and the second card and portion 9 more secure, the first card and portion 8 may be provided to be elastic, and the diameter of the first card and portion 8 may be smaller than that of the second card and portion 9. If the first card and portion 8 can be convex and the second card and portion 9 concave, the plurality of second card and portions 9 can communicate with each other when one first card and portion 8 is inserted into the plurality of second card and portions 9.
As another example, as shown in fig. 11, a first card and portion 8 is provided in each recess 2; one recess 2 corresponds to a plurality of heat conductive members 3, and one or more second engaging portions 9 that match the first engaging portions 8 are provided on each heat conductive member 3 corresponding to the recess 2. The first card and portion 8 may be concave and the second card and portion 9 convex; alternatively, the first card and portion 8 may be convex and the second card and portion 9 may be concave. The first card and portion 8 may be arranged to be resilient.
For another example, fig. 12 is a schematic structural diagram of another circuit board provided in the embodiment of the present application, and as shown in fig. 12, a plurality of first card engaging portions 8 are disposed in each of the grooves 2; one groove 2 corresponds to one or more heat-conducting members 3; one or more second catches 9 matching the first catches 8 are provided on the heat-conducting member 3 corresponding to the recess 2. Wherein a first card and portion 8 corresponds to a heat-conducting member 3; alternatively, the plurality of first engaging portions 8 correspond to one heat-conducting member 3; alternatively, the first card and portion 8 and the second card and portion 9 are in one-to-one correspondence. As shown in fig. 12, the first card and portion 8 may be located on the bottom surface of the recess 2. Likewise, the first card and portion 8 may be concave, while the second card and portion 9 is convex; alternatively, the first card and portion 8 may be convex and the second card and portion 9 concave. The first card and portion 8 may be arranged to be resilient.
Further, fig. 13 is a schematic structural diagram of a third circuit board according to an embodiment of the present application, and as shown in fig. 13, the first card and portion 8 may be disposed at an edge of the top of the groove 2 corresponding to the first card and portion 8, and the second card and portion 9 may be disposed at an edge of the top surface of the heat conducting member 3. The first card and portion 8 and the second card and portion structure provide the following several embodiments.
The first embodiment: first card and portion 8 can be sunken form, and second card and portion 9 is protruding form, and then first card and portion 8 is sunken on the edge at the top of recess 2, extends second card and portion 9 on the edge of the top surface of heat-conducting member 3, and then second card and portion 9 card with in first card and portion 8. At this time, the top of the first engaging portion 8 is located at the same level as the top of the corresponding recess 2. At this time, fig. 14 is a schematic structural view of the heat conducting member according to the embodiment of the present application, and as shown in fig. 14, the top surface of the second card and portion 9 and the top surface of the corresponding heat conducting member 3 are located at the same horizontal plane; alternatively, fig. 15 is a schematic structural diagram of a heat conducting member provided in an embodiment of the present application, and as shown in fig. 15, the bottom surface of the second card and portion 9 and the top surface of the corresponding heat conducting member 3 are located at the same horizontal plane.
The first embodiment: first card and portion 8 can be protruding form, and second card and portion 9 is sunken form, and then first card and portion 8 carries out the arch on the edge at the top of recess 2, extends second card and portion 9 on the edge of the top surface of heat-conducting member 3, and then first card and portion 8 card with in second card and portion 9. At this time, the bottom of the first engaging portion 8 is located at the same level as the top of the corresponding recess 2. At this time, a concave portion may be dug in the second engaging portion 9 of the heat conducting member 3 shown in fig. 14, and the top surface of the second engaging portion 9 and the top surface of the corresponding heat conducting member 3 are located on the same horizontal plane; alternatively, a concave portion is formed in the second engaging portion 9 of the heat conducting member 3 shown in fig. 15, and the bottom surface of the second engaging portion 9 and the top surface of the corresponding heat conducting member 3 are located on the same horizontal plane.
This embodiment is provided with first joint portion through being provided with on each recess 2, is provided with second joint portion on each heat-conducting member 3 that each recess 2 corresponds, first joint portion and second joint portion joint, and then make heat-conducting member 3 and recess 2 carry out good block for heat-conducting member 3 is difficult for droing from circuit board body 1, is of value to dispel the heat to the circuit board.
An embodiment of the present application further provides a supercomputing apparatus, as shown in fig. 16, which is a schematic structural diagram of the supercomputing apparatus provided in the embodiment of the present application. Specifically, as can be seen from fig. 16, the super computing apparatus includes therein at least one circuit board 161 provided in the above-described embodiment.
Optionally, the circuit boards 161 in the super computing device are connected in parallel with each other.
Optionally, a sliding groove is provided on the chassis of the supercomputing apparatus, and the sliding groove is used for being slidably connected with each circuit board 161 in the supercomputing apparatus.
Optionally, fans may be further disposed on two sides of the chassis of the supercomputing apparatus, and a heat dissipation air duct of the fan may be consistent with a heat dissipation cavity of a heat sink on the circuit board 161, so as to quickly dissipate heat generated by the circuit board 161 in the chassis to the outside of the chassis, thereby providing performance of the supercomputing apparatus.
Illustratively, one or more circuit boards 161 are provided in the supercomputing apparatus, and the circuit boards 161 employ the circuit boards provided in the above-described embodiments. The structure and function of the circuit board 161 can be referred to the description of the above embodiments, and are not described again.
In this embodiment, a plurality of circuit boards 161 may be connected in parallel, and then the circuit boards 161 connected in parallel may be set in the super computing apparatus. In one embodiment, the supercomputing device may be a supercomputing server.
The connection mode of the circuit board 161 and the super computing equipment can be selected from a fixed connection mode or a sliding connection mode. For example, one or more sliding grooves may be provided on the chassis of the supercomputing apparatus, and then the circuit board 161 is disposed in the sliding groove so that the circuit board 161 can slide on the sliding groove.
Here, when the plurality of circuit boards 161 are provided in the super computing apparatus, the structure of each circuit board 161 of the plurality of circuit boards 161 may be the same or different. For example, S circuit boards 161 are provided in the super computing apparatus, S is a positive integer greater than or equal to 2, one groove is provided on a part of the circuit boards 161 among the S circuit boards 161, and a plurality of grooves are provided on the remaining circuit boards 161.
In the embodiment, at least one groove is arranged on the surface of the circuit board body; at least one heat conducting member is arranged in at least one groove; the lower surface of each heat conducting piece is attached to the bottom surface of the groove corresponding to the heat conducting piece. The surface of the circuit board body is provided with the groove, and one or more heat-conducting pieces are arranged in the groove, so that heat in the circuit board body can be dissipated through the heat-conducting pieces, and the heat dissipation effect of the circuit board 161 is enhanced; the bottom surface of the heat conducting piece is attached to the bottom surface of the groove, so that the contact area between the heat conducting piece and the circuit board body is further increased, heat generated in the working process of the circuit board 161 is transferred to the outside, and the heat dissipation capacity of the circuit board 161 is improved; furthermore, the circuit board 161 and the components on the circuit board 161 are not damaged by high temperature, and normal operation of the circuit board 161 and the components on the circuit board 161 is guaranteed.
As used in this application, although the terms "first," "second," etc. may be used in this application to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, unless the meaning of the description changes, so long as all occurrences of the "first element" are renamed consistently and all occurrences of the "second element" are renamed consistently. The first and second elements are both elements, but may not be the same element.
The words used in this application are words of description only and not of limitation of the claims. As used in the description of the embodiments and the claims, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. Similarly, the term "and/or" as used in this application is meant to encompass any and all possible combinations of one or more of the associated listed. Furthermore, the terms "comprises" and/or "comprising," when used in this application, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
The above description of the technology may refer to the accompanying drawings, which form a part hereof, and in which is shown by way of illustration embodiments in which the described embodiments may be practiced. These embodiments, while described in sufficient detail to enable those skilled in the art to practice them, are non-limiting; other embodiments may be utilized and changes may be made without departing from the scope of the described embodiments. For example, the order of operations described in a flowchart is non-limiting, and thus the order of two or more operations illustrated in and described in accordance with the flowchart may be altered in accordance with several embodiments. As another example, in several embodiments, one or more operations illustrated in and described with respect to the flowcharts are optional or may be eliminated. Additionally, certain steps or functions may be added to the disclosed embodiments, or two or more steps may be permuted in order. All such variations are considered to be encompassed by the disclosed embodiments and the claims.
Additionally, terminology is used in the foregoing description of the technology to provide a thorough understanding of the described embodiments. However, no unnecessary detail is required to implement the described embodiments. Accordingly, the foregoing description of the embodiments has been presented for purposes of illustration and description. The embodiments presented in the foregoing description and the examples disclosed in accordance with these embodiments are provided solely to add context and aid in the understanding of the described embodiments. The above description is not intended to be exhaustive or to limit the described embodiments to the precise form disclosed. Many modifications, alternative uses, and variations are possible in light of the above teaching. In some instances, well known process steps have not been described in detail in order to avoid unnecessarily obscuring the described embodiments.
The principle and the implementation mode of the present application are explained by applying specific embodiments in the present application, and the description of the above embodiments is only used to help understanding the method and the core idea of the present application; meanwhile, for a person skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (16)
1. A circuit board, comprising:
the circuit board comprises a circuit board body, wherein at least one groove is formed in the surface of the circuit board body;
at least one heat conducting member is arranged in the at least one groove;
the lower surface of each heat conducting piece in the at least one heat conducting piece is attached to the bottom surface of the groove corresponding to the heat conducting piece;
each groove is clamped with the heat-conducting piece corresponding to each groove;
each groove is provided with a first clamping portion, each heat conducting piece corresponding to each groove is provided with a second clamping portion, and the first clamping portions are clamped with the second clamping portions;
the number of the first clamping parts on each groove is one, at least one first clamping part is arranged on each first clamping part, and at least one second clamping part matched with the first clamping part is arranged on each heat conducting piece corresponding to each groove; the first card and the second card are concave, and the second card are convex; or the first card and the part are convex, and the second card and the part are concave.
2. The circuit board of claim 1, wherein the thermal conductive member is a thermally conductive metal.
3. The circuit board of claim 2, wherein the thermally conductive metal comprises one or more of copper, aluminum, silver, tin, gold, iron, and aluminum alloys.
4. The circuit board of claim 1, wherein the thermally conductive member is a thermally conductive non-metal.
5. The circuit board of claim 4, wherein the thermally conductive non-metal is graphene.
6. The circuit board of claim 1, wherein one or more of the at least one thermal-conductive member is disposed in each of the at least one recess.
7. The circuit board of claim 1, wherein each of the at least one recess is in one-to-one correspondence with each of the at least one thermal conductive member.
8. The circuit board of claim 1, wherein the at least one first card-engaging portion on each of the first card-engaging portions is disposed at an edge of a top of the recess;
the at least one second engagement portion is provided at an edge of a top surface of the heat conductive member.
9. The circuit board of claim 8, wherein the at least one first engaging portion of each first engaging portion is located at the same level as the top of the recess, and the at least one second engaging portion is located at the same level as the top surface of the heat-conducting member.
10. The circuit board of claim 8 or 9, wherein the first card and portion and the second card and portion correspond one-to-one.
11. The circuit board according to any one of claims 1 to 9, wherein the circuit board body is provided with at least one heat sink;
each of the at least one heat radiating fin comprises a bottom plate and at least one heat radiating fin, each of the at least one heat radiating fin is connected with the bottom plate, and the bottom plate is connected with the surface of the circuit board body.
12. The circuit board of claim 11, wherein each heat sink has a connecting portion thereon, the connecting portion includes a first plate and a second plate, and the first plate and the second plate form a predetermined angle therebetween;
the at least one radiating fin is fixedly arranged on the upper surface of the connecting part, and the bottom plate is fixedly arranged on the lower surface of the connecting part.
13. The circuit board of claim 12, wherein adjacent ones of the at least one heat sink fins have the same or different heights.
14. A supercomputing apparatus, characterized in that it comprises at least one circuit board according to any of claims 1 to 13.
15. The super computing apparatus of claim 14, wherein each of said circuit boards in said super computing apparatus are connected in parallel with each other.
16. The supercomputing apparatus of claim 14 or 15, wherein a sliding groove is provided on the chassis of the supercomputing apparatus, and the sliding groove is used for sliding connection with each circuit board in the supercomputing apparatus.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2018/113201 WO2020087411A1 (en) | 2018-10-31 | 2018-10-31 | Circuit board and supercomputing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109565930A CN109565930A (en) | 2019-04-02 |
| CN109565930B true CN109565930B (en) | 2022-03-08 |
Family
ID=65872570
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201880002442.6A Active CN109565930B (en) | 2018-10-31 | 2018-10-31 | Circuit board and super computing device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN109565930B (en) |
| WO (1) | WO2020087411A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116136618A (en) * | 2021-11-16 | 2023-05-19 | 中兴智能科技南京有限公司 | Optical module heat abstractor and communication equipment |
| CN117395865B (en) * | 2023-12-12 | 2024-02-27 | 深圳市凌航达电子有限公司 | Stackable circuit board for sensor |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101291571A (en) * | 2007-04-20 | 2008-10-22 | 富准精密工业(深圳)有限公司 | Heat radiating device |
| CN104776338A (en) * | 2015-04-24 | 2015-07-15 | 东莞市闻誉实业有限公司 | Illuminating device |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100819887B1 (en) * | 2005-11-25 | 2008-04-07 | 윤동구 | IC holder, system board and IC package for this. |
| CN204217201U (en) * | 2014-10-13 | 2015-03-18 | 东莞森玛仕格里菲电路有限公司 | Bury copper billet heat radiation PCB structure |
| CN105472869A (en) * | 2015-12-14 | 2016-04-06 | 深圳崇达多层线路板有限公司 | Printed circuit board with semi-embedded type embedded heat conductive block |
| CN205693973U (en) * | 2016-06-28 | 2016-11-16 | 广州市博声电子科技开发有限公司 | A kind of pcb board assembly |
| CN205864859U (en) * | 2016-07-11 | 2017-01-04 | 江门市奔力达电路有限公司 | A kind of PCB with radiator structure |
| CN207573703U (en) * | 2017-12-08 | 2018-07-03 | 东莞市德胜电路板有限公司 | A kind of single-sided circuit board |
-
2018
- 2018-10-31 WO PCT/CN2018/113201 patent/WO2020087411A1/en active Application Filing
- 2018-10-31 CN CN201880002442.6A patent/CN109565930B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101291571A (en) * | 2007-04-20 | 2008-10-22 | 富准精密工业(深圳)有限公司 | Heat radiating device |
| CN104776338A (en) * | 2015-04-24 | 2015-07-15 | 东莞市闻誉实业有限公司 | Illuminating device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109565930A (en) | 2019-04-02 |
| WO2020087411A1 (en) | 2020-05-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP2902872B1 (en) | Handheld device with heat pipe | |
| US20120085520A1 (en) | Heat spreader with flexibly supported heat pipe | |
| US20070146990A1 (en) | Heat dissipating assembly | |
| US9429370B1 (en) | Heat sink with flat heat pipe | |
| JP2009117612A (en) | Circuit module and method of manufacturing the same | |
| CN109565930B (en) | Circuit board and super computing device | |
| TW201204227A (en) | Heat dissipation apparatus | |
| JP2020533796A (en) | Printed circuit board with heat sink | |
| CN109644553B (en) | Circuit board and super computing device | |
| US7800904B2 (en) | Electronic assembly and heat sink | |
| US9870973B2 (en) | Cooling device and device | |
| CN205071462U (en) | Multilayer circuit board heat conduction radiation structure | |
| US11985759B2 (en) | Electronic assemblies having embedded passive heat pipes and associated method | |
| TWI522032B (en) | Heat dissipating module | |
| CN107454805B (en) | VR product heat radiation structure | |
| JP2006245025A (en) | Heat dissipation structure of electronic apparatus | |
| US20080057279A1 (en) | Laminated heat-transfer interface for cooler module | |
| US20090151908A1 (en) | Cooling Module | |
| CN210042352U (en) | Circuit board and super computing device | |
| CN209643064U (en) | Circuit board and supercomputer equipment | |
| US20100181051A1 (en) | Heat-Dissipating Fin, Heat-Dissipating Device, And Method For Enhancing Heat Dissipation Effect Of A Heat-Dissipating Fin | |
| TWI828976B (en) | Heat dissipation element for semiconductor power devices and circuit board having the same | |
| TW201410127A (en) | Electronic device | |
| US20050063160A1 (en) | Heat-dissipating plate module | |
| CN207460698U (en) | A kind of radiator |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |