CN104776338A

CN104776338A - Illuminating device

Info

Publication number: CN104776338A
Application number: CN201510203100.9A
Authority: CN
Inventors: 叶伟炳
Original assignee: Dongguan Wenyu Industrial Co Ltd
Current assignee: Dongguan Wenyu Industrial Co Ltd
Priority date: 2015-04-24
Filing date: 2015-04-24
Publication date: 2015-07-15
Anticipated expiration: 2035-04-24
Also published as: CN104776338B

Abstract

The invention discloses an illuminating device. The illuminating device comprises a heat radiator, an LED (Light-Emitting Diode) lamp which is arranged on the heat radiator, and a circuit board which is connected with the heat radiator, wherein the heat radiator comprises a body and radiating plates which are arranged on the body; the radiating plates are uniformly distributed along the circumferential edge of the body; the LED lamp comprises a PCB (Printed Circuit Board) and a plurality of LED chips which are arranged on the PCB; the circuit board comprises a fixing strip and a conductive wire which is arranged in a manner of being parallel to the fixing strip; the fixing strip is arranged on the body; the PCB is arranged on the fixing strip; the PCB is electrically connected with the conductive wire; the fixing strip is provided with a buckling position and a buckling part which is matched with the buckling position. According to the illuminating device, a ring-shaped groove is formed in the heat radiator body, a radiating body is filled into the ring-shaped groove, and the radiating plates are uniformly distributed at the outer circumferential edge of the body, so the radiation efficiency of the illuminating device is improved.

Description

Lighting device

Technical field

The present invention relates to light fixture, particularly relate to lighting device.

Background technology

LED is called as forth generation lighting source or green light source, have the features such as energy-saving and environmental protection, the life-span is long, volume is little, can be widely used in the fields such as various instruction, display, decoration, backlight, general lighting and urban landscape.

But whether LED work stablizes, quality quality, dispels the heat closely related with lamp body itself.At present, on market, the heat radiation of LED, usually adopts natural heat dissipation, and effect is unsatisfactory; Such as, the theoretical service life of LED is 100,000 hours, but due to radiating effect bad, often actual life was less than 20,000 hours, even lower than 10,000 hours.

Therefore, how heat radiation performance is the technical issues that need to address.

Summary of the invention

Based on this, be necessary the problem for how improving radiating efficiency, a kind of lighting device is provided.

A kind of lighting device, comprise radiator, be arranged on the LED on described radiator and connect the wiring board of described radiator, described radiator comprises body and is arranged at the fin on described body, described fin is uniformly distributed along the outer peripheral edge of described body, described LED comprises pcb board and is arranged on the some LED chip on described pcb board, the conductor wire that described wiring board comprises fixed band and be arranged in parallel with described fixed band, described fixed band is arranged on the body, described pcb board is arranged on described fixed band, described pcb board is electrically connected with described conductor wire, described fixed band is provided with the buckling parts fastening position and match with described fastening position.

Wherein in an embodiment, be connected with between described fastening position and described buckling parts and be linked with, for described lighting device button is hung over outside.

Wherein in an embodiment, described fin is bar-shaped.

Wherein in an embodiment, described fin is uniformly distributed along the outer peripheral edge of described body.

Wherein in an embodiment, described fin is provided with kink away from one end of described body.

Wherein in an embodiment, described kink is provided with some heat radiation thin slices.

Wherein in an embodiment, some described heat radiation thin slices are uniformly distributed along described kink.

Wherein in an embodiment, some described kinks offer intercommunicating pore.

Wherein in an embodiment, described intercommunicating pore is equipped with heat conducting bar.

Wherein in an embodiment, some described fin are connected by described heat conducting bar.

Wherein in an embodiment, described body is cylinder, and it offers ring groove away from axle center near the region of outer wall, described ring groove is filled with radiator, described fin is uniformly distributed along the outer wall of described body, and described fin is provided with thermal dispersant coatings.

Wherein in an embodiment, offer circular groove between described ring groove and described axle center, described circular groove is filled with coolant.

Above-mentioned lighting device, by radiator and the fin that is uniformly distributed on radiator, improve the radiating efficiency of lighting device, and, under the fastening position of fixed band and the effect of buckling parts, can facilitate user lighting device is arranged on user need throw light on region.

Above-mentioned lighting device, by being opened in ring groove on radiator body and filling radiator at this ring groove, and is evenly distributed with fin in the outer peripheral edge of body, thus improves the radiating efficiency of radiator.

Accompanying drawing explanation

Fig. 1 is the schematic diagram of lighting device one embodiment of the present invention;

Fig. 2 is for facing structural representation shown in Fig. 1;

Fig. 3 is the cross-sectional schematic of A-A shown in Fig. 2;

Fig. 4 is the schematic diagram of another embodiment of lighting device of the present invention;

Fig. 5 faces structural representation for shown in Fig. 4;

Fig. 6 is the cross-sectional schematic of B-B shown in Fig. 5;

Fig. 7 is the schematic diagram of another embodiment of lighting device of the present invention;

Fig. 8 is the schematic diagram of another embodiment of lighting device of the present invention;

Fig. 9 is the schematic diagram of another embodiment of lighting device of the present invention.

Detailed description of the invention

For enabling above-mentioned purpose of the present invention, feature and advantage become apparent more, are described in detail the specific embodiment of the present invention below in conjunction with accompanying drawing.Set forth a lot of detail in the following description so that fully understand the present invention.But the present invention can be much different from alternate manner described here to implement, those skilled in the art can when without prejudice to doing similar improvement when intension of the present invention, therefore the present invention is by the restriction of following public specific embodiment.

It should be noted that, when element is called as " being fixed on ", " being arranged at " another element, directly can there is element placed in the middle in it on another element or also.When an element is considered to " connection " another element, it can be directly connected to another element or may there is centering elements simultaneously.Term as used herein " vertical ", " level ", "left", "right" and similar statement just for illustrative purposes, do not represent it is unique embodiment.

See also Fig. 1 and Fig. 9, lighting device 50 comprises radiator 10, be arranged on the LED on radiator 10 and connect the wiring board 300 of radiator 10, radiator 10 comprises body 100 and is arranged at the fin 110 on body 100, body 100 is cylinder, fin 110 is uniformly distributed along the outer wall of body 100, as shown in Figure 6, LED comprises pcb board 210 and is arranged on the some LED chip 220 on pcb board 210, the conductor wire that wiring board 300 comprises fixed band and be arranged in parallel with fixed band, fixed band is arranged on body 100, pcb board 210 is arranged on fixed band, described pcb board 210 is electrically connected with conductor wire, fixed band is provided with and fastens position and the buckling parts mated with fastening position.Fasten position to mate with buckling parts, for lighting device 50 button is hung over outside.Such as, this lighting device 50 is any one in LED, light bar and greeting lamp.

In order to improve radiating efficiency, such as, radiator 10 comprises body 100 and is arranged at the fin 110 on body 100, body 100 is cylinder, fin 110 is uniformly distributed along the outer wall of body 100, and, described fin 110 is provided with thermal dispersant coatings, LED comprises pcb board 210 and is arranged on the some LED chip 220 on pcb board 210, the conductor wire that wiring board 300 comprises fixed band and be arranged in parallel with fixed band, fixed band is arranged on body 100, pcb board 210 is arranged on fixed band, described pcb board 210 is electrically connected with conductor wire, fixed band is provided with and fastens position and the buckling parts mated with fastening position.Fasten position to mate with buckling parts, for lighting device 50 button is hung over outside.Wherein in an embodiment, be connected with between described fastening position and described buckling parts and be linked with, for described lighting device 50 button is hung over outside.Such as, need the region of illumination to be provided with one and treat that button hangs thing, such as, it is an iron nail that this button hangs thing, utilizes to be linked with fixing bracelet to be hung over this button and hang on thing, then, fastens position and mate with buckling parts and fasten, detained by lighting device 50 and hang on this button extension thing.

In order to improve radiating efficiency, such as, LED comprises pcb board 210 and is arranged on the some LED chip 220 on pcb board 210, the conductor wire that wiring board 300 comprises fixed band and be arranged in parallel with fixed band, fixed band is arranged on body 100, and pcb board 210 is arranged on fixed band, and some described LED chip correspondences are arranged on the described pcb board 210 of described fixed band dorsad, described pcb board 210 is electrically connected with conductor wire, and fixed band is provided with and fastens position and the buckling parts mated with fastening position.Fasten position to mate with buckling parts, for lighting device 50 button is hung over outside.

In order to improve fastening intensity, such as, fastening position and buckling parts are respectively a wherein part for four-part button.Such as, this four-part button is snak link.By fastening position, this lighting device 50 button can be hung over outside.Such as, button is hung on arm.

Refer to Fig. 9, in order to improve the radiating efficiency of lighting device 50, such as, the region between two fin 110 of body 100 lateral wall is provided with some thrermostatic bimetal-plates 500.Thrermostatic bimetal-plate 500 is for having the bimetallic strip of active layers and passive layer, what thermal expansion coefficients was higher is called active layers, what the coefficient of expansion was lower is called passive layer, when thrermostatic bimetal-plate 500 is heated, the deformation of active layers is greater than the deformation of passive layer, thus the entirety of thrermostatic bimetal-plate 500 will to passive layer curving.Such as, the region between two fin 110 of body 100 lateral wall is fixed in one end of its active layers, and the other end is close to body 100.To make when thermo bimetal is by thermal deformation, active layers bends to the direction away from body 100 outer wall, thus increases area of dissipation.

In order to improve the radiating efficiency of lighting device 50 further, such as, thrermostatic bimetal-plate 500 is evenly distributed on the region between two fin 110 along the outer peripheral edge of body 100, that is, some thrermostatic bimetal-plate 500 stacked distribution.Such as, same straight line is provided with two thrermostatic bimetal-plates 500, the wherein one end being respectively the first thrermostatic bimetal-plate 500 and the second thrermostatic bimetal-plate 500, first thrermostatic bimetal-plate 500 is fixed on the side of body 100 near described pcb board 210, the other end is free end, and it is close to body 100.On body 100 below the free end that wherein one end of second thrermostatic bimetal-plate 500 is fixed on the first thrermostatic bimetal-plate 500, the other end is close to body 100.Preferably, also graphite linings is provided with between the first thrermostatic bimetal-plate and the second thrermostatic bimetal-plate.Such as, the thickness of described graphite linings is 5-25nm; And for example, described graphite linings comprises some graphite powders.

In order to reach better radiating effect, such as, active layers is manganin manganin alloy, and it comprises each component of following mass parts: Mn:22 ~ 43 part, Ni:38 ~ 65 part, Cu:12 ~ 23 part.And for example, Mn:12 ~ 33 part, Ni:58 ~ 75 part, Cu:12 ~ 33 part.And for example, Mn:23 ~ 35 part, Ni:58 ~ 85 part, Cu:8 ~ 13 part.In order to reach better radiating effect, such as, active layers is nichrome, and it comprises each component of following mass parts: Fe:32 ~ 43 part, Cr:18 ~ 35 part, Ni:52 ~ 73 part.Such as, Fe:42 ~ 53 part, Cr:9 ~ 15 part, Ni:62 ~ 75 part.And for example, Fe:22 ~ 35 part, Cr:18 ~ 25 part, Ni:52 ~ 85 part.In order to reach better radiating effect, such as, active layers is nicalloy, and it comprises each component of following mass parts: Fe:22 ~ 33 part, Mn:18 ~ 45 part, Ni:42 ~ 78 part.Such as, Fe:32 ~ 43 part, Mn:12 ~ 34 part, Ni:55 ~ 69 part.

In order to reach better radiating effect, such as, passive layer is dilval, and it comprises each component of following mass parts: Ni:38 ~ 55 part, Fe:45 ~ 62 part.And for example, Ni:45 ~ 61 part, Fe:39 ~ 55 part.

Like this, when thrermostatic bimetal-plate 500 is heated, two thrermostatic bimetal-plates 500 due to be heated uneven different time bending, but, when after the first thrermostatic bimetal-plate 500 heated bending, the free end of the first thrermostatic bimetal-plate 500 is unsettled, now, heat conduction to the second thrermostatic bimetal-plate 500, second thrermostatic bimetal-plate 500 heated bending, because the free end of the first thrermostatic bimetal-plate 500 is unsettled and reply to the topic on body 100 after cooling, now, heat on body 100 conducts to the free end of the first thrermostatic bimetal-plate 500 again, and reduce the heat conducting to the second thrermostatic bimetal-plate 500, the now free end cooling of the second thrermostatic bimetal-plate 500 is replied to the topic, the free end heated bending of the first thrermostatic bimetal-plate 500, thus reach continuous alternating bending and money order receipt to be signed and returned to the sender to body 100, and then improve the radiating efficiency of lighting device 50.

Refer to Fig. 1, radiator 10 comprises body 100 and is arranged at the fin 110 on body 100, and body 100 is cylinder, and fin 110 is uniformly distributed along the outer wall of body 100, and fin 110 is provided with thermal dispersant coatings.As shown in Figures 2 and 3, such as, body 100 is cylinder, and it offers ring groove 120 away from axle center near the region of outer wall, and ring groove 120 is filled with radiator.Such as, body 100 is cylinder, and it offers ring groove 120 away from axle center near the region of outer wall, and ring groove 120 fills heat radiation particle.Such as, body 100 is cylinder, and it offers ring groove 120 away from axle center near the region of outer wall, and ring groove 120 is filled with heat radiation particulate; And for example, described heat radiation particulate is heat radiation crystal grain.Such as, body 100 is cylinder, and it offers ring groove 120 away from axle center near the region of outer wall, and ring groove 120 is filled with heat radiation crystal grain.In other embodiments, body 100 can be any one in square, cuboid, cone or Rotary-table.Like this, radiator 10 realizes good radiating effect under the dual heat conduction and heat radiation of radiator and fin 110, is particularly suitable for the heat radiation of LED lamp.

In order to strengthen the radiating efficiency of radiator 10 further, region between ring groove 120 and axle center offers circular groove 130, and circular groove 130 is filled with coolant, such as, circular groove is filled with the first coolant, first coolant is water, and preferably, coolant is heavy water, the expense cost of heavy water is more expensive than light water, about 20 yuan/milliliter, have fluctuation according to purity, but its radiating effect approximately promotes 10% ~ 15% than light water.Such as, the region between ring groove 120 and axle center offers square groove, and square groove is filled with the second coolant, and such as, this second coolant is conduction oil.Such as, the region between ring groove 120 and axle center offers truncated cone-shaped groove, and round platform groove is filled with the 3rd coolant, and such as, the 3rd coolant is heat-conducting silicone grease.Like this, because each coolant is non-solid material, it can produce flowing after being heated, thus can take away the heat of thermal source, and then strengthens the radiating efficiency of radiator 10.

Such as, described pcb board 210 is arranged on described body 100, and some described LED chip 220 correspondences are arranged on the described pcb board of described ring groove dorsad, the heat that some described LED chip 220 are produced can be conducted to around by radiator in time, thus improves radiating efficiency.

Derived by the heat of thermal source to concentrate, such as, thermal source is LED chip, and body 100 is also provided with the lid 140 mated with circular groove 130, and lid 140 and circular groove 130 are tightly connected.Such as, lid 140 covers whole circular groove 130 opening, to make the coolant in circular groove 130 be sealed in circular groove 130, prevents coolant from spilling into external environment.Such as, lid 140 covers whole circular groove 130 opening and extends and is covered to body 100 place periphery, namely, lid 140 also cover the opening of ring groove 120 while covering circular groove 130 opening, ring groove 120 is also sealed, prevents the radiator be encapsulated in wherein to be spilled over to body 100 outside.Like this, by LED chip being arranged on the lid 140 of circular groove 130 dorsad, rapidly the heat that LED chip produces can being concentrated and conducting to outside.

In preferred embodiment, body 100 also comprises some heat pipes, and this heat pipe is arranged in circular groove 130, connects lid 140 and the hot inwall of circular groove 130.Such as, some LED chip are arranged on the lid 140 of circular groove 130 dorsad by pcb board, and position corresponding with each LED chip on lid 140 offers thermal hole, and heat pipe wears thermal hole, abut the pcb board in LED chip dorsad.That is, one end one_to_one corresponding of some heat pipes is located in the thermal hole on lid 140 and abuts the pcb board corresponding with thermal hole, and on this pcb board, correspondence is provided with LED chip, and the other end of some heat pipes abuts the inwall of circular groove 130.Like this, also LED chip is abutted correspondingly by the heat pipe be arranged on body 100, can immediately by the heat conduction that produced by LED chip to the inwall of circular groove 130, thus reach the most heat conduction that directly will LED chip produce rapidly to outside.

In order to increase the heat transfer efficiency of lid 140, lid 140 periphery is provided with heat-conducting silicone grease.Such as, when lid 140 and circular groove 130 are tightly connected, lid 140 periphery is provided with heat-conducting silicone grease with the place that the body 100 of circular groove 130 periphery contacts.Such as, lid 140 covers whole circular groove 130 opening and extends when being covered to body 100 outer peripheral edge, and lid 140 periphery and circular groove 130 periphery are provided with heat-conducting silicone grease with the place that the body 100 of ring groove 120 periphery contacts.Preferably, lid 140 is weldingly fixed on body 100.Lid 140 is also provided with solid adhesive with the place that the body 100 of circular groove 130 periphery contacts, for lid 140 is pasted onto body 100.Like this, the part that contacts with body 100 of lid 140 under the effect of heat-conducting silicone grease can rapidly by heat conduction on body 100.That is, heat conduction both also can be passed through heat-conducting silicone grease by radiator and coolant to during body 100 by lid 140, like this, also promoted the radiating efficiency of whole radiator 10 while promoting the heat transfer efficiency of lid 140.

In order to strengthen the service life of radiator 10, circular groove 130 and lid 140 are provided with waterproof coating, and such as, waterproof coating is provided with acrylic acid.Such as, water-proof acrylic acid paint be with pure acrylic acid polymer emulsion for base-material and add other additives obtain.The waterproofing membrane formed after solidification due to polyacrylic water-proof coating has crack resistance, impermeability and weatherability, can play waterproof, the anti-effect blending protection.Thus, the waterproof of circular groove 130 and lid 140 and the ability of antiseepage can be increased when circular groove 130 fills coolant, reacting with coolant contact portion generation chemical attack on the inwall of circular groove 130 and lid 140 can be prevented, and then improve the service life of radiator 10, improve the quality of products.

In order to improve the heat-sinking capability of radiator 10, such as, radiator is Graphene particle.Such as, ring groove 120 fills Graphene particle.Because the thermal conductivity factor of Graphene is high, when it is filled to ring groove 120, the heat of the part that lid 140 is in contact with it can directly conduct to rapidly in Graphene particle, Graphene particle again by heat conduction to fin 110, and then conduct to outside under the effect of fin 110.In other embodiments, radiator can be the graphite granule that heat radiation thermal conductivity factor is low compared with Graphene.Like this, because the heat affecting LED chip luminous efficiency is conducted to outside LED chip rapidly, therefore the heat-sinking capability of radiator 10 can be improved further, improve the luminous efficiency of LED chip.

In order to conduct to from the heat on body 100, lid 140 and radiator etc. rapidly in surrounding environment, fin 110 is graphite-aluminium alloy.Because the thermal conductivity factor of graphite is high, aluminium has the hardness of metal, both in conjunction with time there is the heat transfer efficiency more excellent relative to aluminium alloy.Above-mentioned graphite-aluminium alloy comprises each component of following mass parts: Si:15 ~ 18 part, Cu:9 ~ 13 part, Ti:10 ~ 15 part, Mg:5 ~ 8 part, Ai:45 ~ 65 part, C:25 ~ 35 part, Ni:25 ~ 35 part.

And for example, graphite-aluminium alloy comprises each component of following mass parts: Si:10 ~ 14 part, Cu:13 ~ 17 part, Ti:5 ~ 9 part, Mg:2 ~ 4 part, Ai:25 ~ 43 part, C:36 ~ 55 part, Ni:36 ~ 55 part.

And for example, graphite-aluminium alloy comprises each component of following mass parts: Si:8 ~ 12 part, Cu:5 ~ 8 part, Ti:2 ~ 4 part, Mg:2 ~ 6 part, Ai:65 ~ 75 part, C:55 ~ 75 part, Ni:55 ~ 75 part.

After above-mentioned each combination is grouped into graphite-aluminium alloy, there is excellent thermal conductivity factor, there is the plasticity of metal simultaneously, can effectively by the heat conduction that is set up from body 100, lid 140 and radiator equipotential in surrounding environment.

In order to improve radiating efficiency further, such as, fin 110 is aluminium alloy, and described aluminium alloy is uniformly distributed along the outer wall of body 100, and each fin 110 is laminated with a graphite heat radiation fin 110.And for example, described aluminium alloy wraps up described graphite heat radiation fin, like this, can obtain more firmly structure; Such as, fin 110 is tabular, and it is evenly distributed on the outer wall of body 100.Such as, fin 110 is reversed acanthoid, and it is evenly distributed on the outer wall of body 100.Such as, fin 110 is aerofoil profile, and it is evenly distributed on the outer wall of body 100.Preferably, graphite heat radiation fin 110 is provided with adhesive layer, for graphite heat radiation fin 110 is pasted onto fin 110.Like this, be distributed in the fin 110 of the outer wall of body 100 and the combination of graphite heat radiation fin 110, can accelerate by the heat conduction on body 100 to fin 110 on the one hand, add radiator 10 and the surface area of extraneous contact on the other hand, improve the radiating efficiency of radiator 10.

In order to improve the radiating efficiency of fin 110, such as, fin 110 is provided with some heat radiation projections.Such as, each heat radiation projection is prism structure.Such as, each heat radiation projection is sphere structure.For each heat radiation projection for prism structure, such as, each heat radiation projection is positive six prism structures, each sidewall of each positive six prism is provided with into the first heat radiation scale of matrix distribution, each incline of each positive six prism is provided with one and ranked second heat radiation scale, further, the second heat radiation scale between adjacent heat radiation projection mutually intersects and does not abut against each other.Such as, each heat radiation projection is regular triangular prism structure, each sidewall of each regular triangular prism is provided with into the 3rd heat radiation scale of matrix distribution, each incline of each regular triangular prism is provided with one and ranked fourth heat radiation scale, further, the 4th heat radiation scale between adjacent heat radiation projection mutually intersects and does not abut against each other.Like this, heat radiation projection that designed by more multiple-branching construction stacked in fin 110, that have multiple heat radiation scale, is made the heat on fin 110 conduct to outside from each heat radiation projection rapidly, improves the radiating efficiency of fin 110.

In order to improve the radiating efficiency of heat radiation projection, such as, heat radiation projection is hollow structure, and heat radiation projection also offers some thermal vias.That is, heat radiation projection is the prism structure of hollow, and, each sidewall also offers some thermal vias.Such as, heat radiation projection is positive six prism structures of hollow, each sidewall of each positive six prism is provided with into the 5th heat radiation scale of matrix distribution, and the sidewall between adjacent 5th heat radiation scale offers first thermal vias.Such as, heat radiation projection is the regular triangular prism structure of hollow, each sidewall of each regular triangular prism is provided with into the 6th heat radiation scale of matrix distribution, and the sidewall between adjacent 6th heat radiation scale offers second thermal vias.Like this, because the temperature of air is greater than the temperature of heat radiation projection outer air in heat radiation projection, make air heats uneven, the air that in heat radiation projection, temperature is higher expands and rises, the air that the outer temperature of heat radiation projection is lower is padded in heat radiation projection by thermal vias, thus forms local air convection current.And, the air that temperature is lower outside heat radiation projection is padded in the process in heat radiation projection by thermal vias, drive the flowing of each heat radiation scale surrounding air on sidewall, increase the radiating efficiency of each heat radiation scale, thus improve the radiating efficiency of heat radiation projection on the whole.

In order to improve the radiating efficiency of heat radiation projection, such as, heat radiation projection is provided with thermal dispersant coatings.Such as, heat radiation projection lateral wall is provided with thermal dispersant coatings.Such as, thermal dispersant coatings is arranged on other plane domain except described thermal vias and each heat radiation scale of lateral wall, to improve its radiating efficiency.Such as, thermal dispersant coatings is provided with heat radiation coating, and this heat radiation coating is special material, because it is present product and technology, so place repeats no more.By being provided with thermal dispersant coatings on heat radiation projection lateral wall, improving the radiating efficiency on this sidewall areas surface, thus improving the radiating efficiency of heat radiation projection.

Make it can close as a whole complementation in heat transfer heat conduction to integrate each fin 110, such as, fin 110 is uniformly distributed along the outer wall of body 100, fin 110 is bar-shaped, and fin 110 is provided with kink away from one end of body 100, and kink is provided with some heat radiation thin slices, some heat radiation thin slices are uniformly distributed along kink, some kinks offer intercommunicating pore, and intercommunicating pore is equipped with heat conducting bar, and some fin 110 are connected by heat conducting bar.Such as, fin 110 is bar-shaped.Such as, fin 110 is tabular, and fin 110 is uniformly distributed along the outer wall of body 100.Such as, fin 110 is prism-shaped, and fin 110 is uniformly distributed along the outer wall of body 100, and fin 110 is provided with kink away from one end of body 100.Such as, fin 110 is round table-like, and fin 110 is uniformly distributed along the outer wall of body 100, and fin 110 is provided with kink away from one end of body 100, and kink is provided with some heat radiation thin slices, and some heat radiation thin slices are uniformly distributed along kink.Such as, fin 110 is centrum shape, fin 110 is uniformly distributed along the outer wall of body 100, fin 110 is provided with kink away from one end of body 100, kink is provided with some heat radiation thin slices, and some heat radiation thin slices are uniformly distributed along kink, and some kinks offer intercommunicating pore, intercommunicating pore is equipped with heat conducting bar, and some fin 110 are connected by heat conducting bar.Such as, this heat conducting bar is that graphite-aluminium alloy is made.Like this, by heat conduction, each fin 110 is interconnected, make when each fin 110 is heated uneven, when particularly a certain fin 110 temperature is too high, this heat conducting bar can be passed through by the heat conduction fin 110 that extremely adjacent temperature is lower, and, while fin 110 heat conduction lower to temperature, heat itself also can be exported to outside by this heat conducting bar, thus improves thermal efficiency further.

In order to improve radiating effect, preferably, and for example, at least one described fin also extended some radiating fins.Such as, in this fin, the area of described radiating fin is the 0.2%-0.8% of the area of described fin; Such as, the area of described radiating fin is the 0.5%-0.6% of the area of described fin.And for example, the gross area of each described radiating fin is the 60%-95% of the area of described fin.

Such as, described radiating fin comprises: superpose the first rete of setting, the second rete, third membrane layer, the 4th rete and the 5th rete successively, namely the first rete, the second rete, third membrane layer, the 4th rete and the 5th rete superpose attaching successively, that is, second rete is attached on the first rete, third membrane layer is attached on the second rete, and the 4th rete is attached in third membrane layer, and the 5th rete is attached on the 4th rete.Such as, the first rete connects or fin described in close contact

Such as, the invention provides a kind of radiating fin, the first rete wherein, it is good that it has insulation effect, the advantage that thermal conductivity factor is large and thermal coefficient of expansion is low, so, when heat is directly delivered to described first rete, described first rete can lead away the heat that near zone is assembled fast and in time, to guarantee the normal work treating heat radiation product.Secondly, due to described first rete and waiting, to dispel the heat between product nearest, its heat conduction load born is maximum, when the thermal coefficient of expansion of described first rete is low, just can avoid producing gap between described first rete and described second rete, avoid producing gap with described first rete self, and then the problem that the thermal conductivity factor produced after can avoiding this gap and gap filling air reduces.Finally, due to described first rete and waiting, to dispel the heat between product nearest, the problem that easy generation electric elements directly contact with described first rete, when the insulation effect of described first rete is good, just can avoid the first rete energising, thus improve the security performance of described radiating fin, safety standard is higher.

Such as, first rete of an embodiment of the present invention, it comprises each component of following mass parts: 40 parts ~ 70 parts, carborundum, alundum (Al2O3) 13 parts ~ 55 parts, silica 2 parts ~ 15 parts, binding agent 3 parts ~ 25 parts, kaolin 2 parts ~ 20 parts, 0.5 part ~ 2 parts, magnesia, 0.5 part ~ 2 parts, Dongyang soil, light weight calcium 0.5 part ~ 2 parts and rare earth oxide 0.2 part ~ 0.5% part.Above-mentioned first rete utilizes carborundum as primary raw material, and mix the raw material that remaining may be used for preparing pottery, thus thermal conductivity factor is high, good insulation preformance, thermal coefficient of expansion are low and the good advantage of heat resistance to make above-mentioned first rete possess simultaneously, in addition, above-mentioned first rete also has the advantage being easy to the manufacturing and low cost of manufacture.

Preferably, first rete of an embodiment of the present invention comprises each component of following mass parts: 50 parts ~ 60 parts, carborundum, alundum (Al2O3) 30 parts ~ 50 parts, silica 10 part ~ 15 parts, binding agent 10 parts ~ 20 parts, kaolin 15 parts ~ 20 parts, 1 part ~ 1.5 parts, magnesia, 1 part ~ 1.5 parts, Dongyang soil, light weight calcium 1 part ~ 1.5 parts and rare earth oxide 0.3 part ~ 0.4% part.Preferably, first rete of an embodiment of the present invention comprises each component of following mass parts: 55 parts, carborundum, alundum (Al2O3) 40 parts, silica 13 parts, binding agent 15 parts, kaolin 18 parts, 1.5 parts, magnesia, 1.5 parts, Dongyang soil, light weight calcium 1.5 parts and rare earth oxide 0.3 part.

It should be noted that, because above-mentioned second rete is directly fitted with described first rete, so described first rete can be directly passed to described second rete by from the heat that absorbs of product of waiting to dispel the heat, this just requires that described second rete has high thermal conductivity factor, can the heat absorbed from described first rete be delivered to rapidly on described second rete, in addition, also require that described second rete has good heat dispersion simultaneously, and lower thermal coefficient of expansion.

Such as, the invention provides a kind of second rete, it is high that it has thermal conductivity factor, the advantage of perfect heat-dissipating and good mechanical property, so, when described first rete is directly passed to described second rete by from the heat that absorbs of product of waiting to dispel the heat, the heat that so described first rete absorbs just can be delivered to rapidly on described second rete, and in the process of heat conduction, based on the heat dispersion that described second rete is excellent, can also by the heat loss on described second rete in the air in the external world.Secondly, because described second rete is also in the distance relatively near with product of waiting to dispel the heat, the temperature of itself also can be higher, but, based on the thermal coefficient of expansion that described second rete is lower, just can avoid producing gap between described second rete and described third membrane layer, ensure that the compactness of both laminatings.

Such as, second rete of an embodiment of the present invention, it comprises each component of following mass parts: Graphene 80 parts ~ 95 parts, CNT 0.1 part ~ 20 parts and carbon nano-fiber 0.1 part ~ 20 parts.Above-mentioned second rete is by adopting Graphene to be primary raw material, and its thermal conductivity factor is greatly improved, and heat-conducting effect is better.In addition, then pass through to add CNT and carbon fiber, can form heat dissipation channel, heat dispersion is also better.

Preferably, the second rete comprises each component of following mass parts: Graphene 85 parts ~ 90 parts, CNT 5 parts ~ 15 parts and carbon nano-fiber 5 parts ~ 15 parts.Preferably, the second rete comprises Graphene 90 parts, CNT 10 parts and carbon nano-fiber 10 parts.

It should be noted that, because heat is through front two-layer, namely after described first rete and described second rete, understand the heat loss of some in the air in the external world.In addition, because the cost of described second rete is higher, its main cause is, the primary raw material of described second rete is the Graphene that preparation cost is higher, therefore, based on described third membrane layer heat transfer and heat radiation burden relatively little when, the heat dissipation metal material that described third membrane layer can use current market the most frequently used, to reach the effect reducing costs and obtain better heat transfer property.

Such as, the invention provides a kind of third membrane layer, it is high that it has thermal conductivity factor, perfect heat-dissipating, good mechanical property and lower-cost advantage, so, when the heat of described second rete passes to described third membrane layer, the heat that so described second rete absorbs just can more promptly be delivered in described third membrane layer, and in the process of heat transfer, the heat of part also can be directly delivered in extraneous air by described third membrane layer.

Such as, the third membrane layer of an embodiment of the present invention, it comprises each component of following mass parts: copper 93 parts ~ 97 parts, 2 parts ~ 4.5 parts, aluminium, 0.1 part ~ 0.3 part, nickel, 0.1 part ~ 0.4 part, manganese, titanium 0.1 part ~ 0.3 part, chromium 0.1 part ~ 0.3 part and vanadium 0.1 part ~ 0.3 part.

Above-mentioned third membrane layer contains copper (Cu) can make the heat conductivility of third membrane layer remain on a higher level.When the mass parts of copper is 93 parts ~ 97 parts, the coefficient of heat conduction of described third membrane layer can reach more than 380W/mK, the heat that can come described second rete transmits more quickly passes, and then be evenly dispersed in the structure of described third membrane layer entirety, to prevent from the contact position of heat between described second rete and described third membrane layer accumulates, cause the generation of hot-spot phenomenon.And the density of described third membrane layer but only has 8.0kg/m ³~ 8.1kg/m ³, be far smaller than the density of fine copper, effectively can alleviate the weight of described third membrane layer like this, be more conducive to manufacture is installed, also greatly reduce cost simultaneously.In addition, described third membrane layer contains the vanadium that mass parts is the aluminium of 2 parts ~ 4.5 parts, the nickel of 0.1 part ~ 0.3 part, the manganese of 0.1 part ~ 0.4 part, the titanium of 0.1 part ~ 0.3 part, the chromium of 0.1 part ~ 0.3 part and 0.1 part ~ 0.3 part.Relative to fine copper, the ductility of third membrane layer, toughness, intensity and resistance to elevated temperatures improve all greatly, and not easy-sintering.

In order to make described third membrane layer have performance better, such as, described third membrane layer contains the nickel (Ni) that mass parts is 0.1 part ~ 0.3 part, can improve the resistance to elevated temperatures of third membrane layer.And for example, it is that the vanadium (V) of 0.2 part ~ 1.2 parts can suppress third membrane layer grain growth that third membrane layer contains mass parts, obtains more tiny grain structure, to reduce the fragility of described third membrane layer, improve the mechanical property of described third membrane layer entirety, to improve toughness and intensity.And for example, described third membrane layer contains the titanium (Ti) that mass parts is 0.1 part ~ 0.3 part, can make the crystal grain miniaturization of described third membrane layer, to improve the ductility of described third membrane layer; And for example, described third membrane layer also comprises the silicon (Si) that mass parts is 1 part ~ 2.5 parts, when described third membrane layer contains appropriate silicon, under the prerequisite not affecting described third membrane layer heat conductivility, can effectively promote hardness and the abrasion resistance of described third membrane layer.

Preferably, described third membrane layer comprises each component of following mass parts: copper 94 parts ~ 96 parts, 3 parts ~ 4 parts, aluminium, 0.2 part ~ 0.3 part, nickel, 0.2 part ~ 0.3 part, manganese, titanium 0.2 part ~ 0.3 part, chromium 0.2 part ~ 0.3 part and vanadium 0.2 part ~ 0.3 part.Preferably, described third membrane layer comprises each component of following mass parts: copper 95 parts, 3.5 parts, aluminium, 0.3 part, nickel, 0.2 part ~ 0.3 part, manganese, titanium 0.2 part ~ 0.3 part, chromium 0.2 part ~ 0.3 part and vanadium 0.2 part ~ 0.3 part.

It should be noted that, when treating that the heat of heat radiation product generation is through three first layers, namely described first rete is respectively, after described second rete and described third membrane layer, have relatively large a part of heat to be dissipated in transmission in air dielectric, in addition, primary raw material due to described third membrane layer is copper, its heavier mass, therefore, when relatively little based on described 4th convection burden, described 4th rete can use radiating effect better, lighter in weight, lower-cost material, reduce costs and weight to reach, and obtain the effect of better heat dispersion.

Such as, the invention provides a kind of 4th rete, it is better that it has radiating effect, lighter in weight and lower-cost advantage, so, when the heat of described third membrane layer transmits described 4th rete, so described 4th rete can by the heat loss of the overwhelming majority in air dielectric, to coordinate described first rete, described second rete and described third membrane layer complete the effect of gradient heat transfer, like this, can for different heat regions, namely to measure with the distance of product distance of waiting to dispel the heat, realize the gradient transmission of heat and lost effect, solve traditional heat sinks insulated with material poor, cost is high, quality weight, the problem of heat conduction and radiating effect difference.

Such as, 4th rete of an embodiment of the present invention, it comprises each component of following mass parts: copper 47 parts ~ 50 parts, 49 parts ~ 52 parts, aluminium, 0.2 part ~ 0.7 part, magnesium, iron 0.2 part ~ 0.7 part, 0.2 part ~ 0.5 part, manganese, titanium 0.1 part ~ 0.3 part, chromium 0.05 part ~ 0.1 part and vanadium 0.1 part ~ 0.3 part.

It is the copper of 47 parts ~ 50 parts and the aluminium of 49 parts ~ 52 parts that above-mentioned 4th rete contains mass parts, the coefficient of heat conduction of described 4th rete can be made to remain on 300W/mK ~ 350W/mK, to ensure that the heat passed over by described third membrane layer can be dissipated in air dielectric by described 4th rete rapidly, and then prevent heat from piling up on described 4th rete, cause hot-spot phenomenon to produce.Relative to prior art, merely adopt price costly and the larger copper of quality, above-mentioned 4th rete both had good heat dissipation effect, can rapidly by heat loss in air, there is again lighter weight, be convenient to install casting, advantage that price is cheaper.Meanwhile, relative to prior art, merely adopt the aluminium alloy that radiating effect is poor, above-mentioned 4th rete has better heat transfer property.In addition, it is the magnesium of 0.2 part ~ 0.7 part, the iron of 0.2 part ~ 0.7 part, the manganese of 0.2 part ~ 0.5 part, the titanium of 0.1 part ~ 0.3 part, the chromium of 0.05 part ~ 0.1 part and the vanadium of 0.1 part ~ 0.3 that 4th rete contains mass parts, improves the yield strength of the 4th rete, tensile strength and resistance to elevated temperatures.Such as, find through many experiments evidence and theory analysis, the 4th rete contains the magnesium that mass parts is 0.2 part ~ 0.7 part, can give the 4th rete yield strength and tensile strength to a certain extent.

Preferably, described 4th rete comprises each component of following mass parts: copper 48 parts ~ 49 parts, 50 parts ~ 52 parts, aluminium, 0.2 part ~ 0.5 part, magnesium, iron 0.2 part ~ 0.5 part, 0.3 part ~ 0.5 part, manganese, titanium 0.2 part ~ 0.3 part, chromium 0.05 part ~ 0.08 part and vanadium 0.2 part ~ 0.3 part.Preferably, described 4th rete comprises each component of following mass parts: copper 48 parts, 51 parts, aluminium, 0.3 part, magnesium, iron 0.3 part, 0.4 part, manganese, titanium 0.4 part, chromium 0.08 part and vanadium 0.3 part.

It should be noted that, because treating that the heat of heat radiation product is through first four layers, namely after described first rete, described second rete, described third membrane layer and described 4th rete, greatly the heat of a part has been lost in extraneous air.Therefore; heat radiation burden based on described 5th rete is relatively little; and self-temperature lower when; when the impact of the larger generation of thermal coefficient of expansion is minimum; the plastic material that described third membrane layer can use current market the most frequently used; reduce costs and weight to reach, and obtain better surface protection performance.

Such as; the invention provides a kind of 5th rete; it is good that it has surface protection performance; the lower advantage of lighter in weight, cost; so, when described 5th rete is positioned at the outermost layer of described radiating fin, good heat dispersion can be had; good surface protection performance, lighter weight and lower cost.

Such as, 5th rete of an embodiment of the present invention, it comprises each component of following mass parts: described 5th rete comprises each component of following mass parts: 20 parts ~ 40 parts, graphite, 20 parts ~ 30 parts, carbon fiber, polyamide 40 parts ~ 60 parts, water-soluble silicate 10 parts ~ 20 parts, hexagonal boron nitride 1 part ~ 8 parts, BMI 2 parts ~ 5 parts, silane coupler 0.5 part ~ 2 parts, 0.25 part ~ 1 part, antioxidant.

When above-mentioned water-soluble silicate mixes with graphite and carbon fiber, under the high temperature conditions can with the generation copolyreaction of polyamide, form heat dissipation channel, thus improve heat dispersion, and the structure of more fluffy sky, quality is lighter.In addition, owing to the addition of carbon fiber, its surface protection performance and mechanical performance are better, such as, more anti-oxidant, and more acid and alkali-resistance is more corrosion-resistant.

Preferably, described 5th rete comprises each component of following mass parts: 30 parts ~ 35 parts, graphite, 25 parts ~ 30 parts, carbon fiber, polyamide 45 parts ~ 50 parts, water-soluble silicate 15 parts ~ 20 parts, hexagonal boron nitride 4 parts ~ 6 parts, BMI 3 parts ~ 4 parts, silane coupler 1 part ~ 1.5 parts, 0.5 part ~ 1 part, antioxidant.Preferably, described 5th rete comprises each component of following mass parts: 35 parts, graphite, 28 parts, carbon fiber, polyamide 45 parts, water-soluble silicate 18 parts, hexagonal boron nitride 5 parts, BMI 3.5 parts, silane coupler 1.8 parts, 0.7 part, antioxidant.

In order to make described first rete better, described second rete, described third membrane layer, heat conduction and the sinking path of described 4th rete and described 5th rete are optimized more, therefore, considering cost, weight, heat conduction and radiating effect, and when surface protection performance, described second rete of an embodiment of the present invention, described third membrane layer, described 4th rete and described 5th thicknesses of layers ratio are 1 ~ 1.5:8 ~ 12:5 ~ 7:6 ~ 10:2 ~ 2.5, so, described first rete can be made, described second rete, described third membrane layer, heat conduction and the sinking path of described 4th rete and described 5th rete are optimized more.

Be fixed together to make described first rete, described second rete, described third membrane layer, described 4th rete and described 5th rete further, to improve structural stability further, and the impact reduced described radiating fin heat conduction and heat transfer property, such as, filling adhesive layer is also set between each rete.

Such as, first filling adhesive layer is set between the first rete and the second rete, second filling adhesive layer is set between the second rete and third membrane layer, is provided with the 3rd between third membrane layer and the 4th rete and fills adhesive layer, arrange the 4th between the 4th rete and the 5th rete and fill adhesive layer.Be appreciated that, first rete, the second rete, the second rete, third membrane layer, the 4th rete and the 5th rete there is the small and a fairly large number of gap of structure between two between adjacent interfaces, its reason is mainly, due to the binding face defective tightness of above-mentioned layers of material, and the first filling adhesive layer, second fills adhesive layer by arranging, the 3rd filling adhesive layer and the 4th is filled adhesive layer and can be filled these gaps preferably, also play the effect of bonding simultaneously.

Such as, the invention provides an embodiment described first fills adhesive layer, it comprises each component of following mass parts: nano alumina particles 300 parts ~ 1000 parts, methyl vinyl silicone rubber 5 parts ~ 30 parts, vinyl silicone oil 10 parts ~ 50 parts, dimethicone 10 parts ~ 100 parts and MQ silicones 1 part ~ 20 parts.

Preferably, described first filling adhesive layer comprises each component of following mass parts: nano alumina particles 800 parts ~ 1000 parts, methyl vinyl silicone rubber 20 parts ~ 30 parts, vinyl silicone oil 40 parts ~ 50 parts, dimethicone 80 parts ~ 100 parts and MQ silicones 15 parts ~ 20 parts.

Preferably, described first filling adhesive layer comprises each component of following mass parts: nano alumina particles 900 parts, methyl vinyl silicone rubber 25 parts, vinyl silicone oil 45 parts, dimethicone 85 parts and MQ silicones 20 parts.

Such as, the invention provides an embodiment described second fills adhesive layer, it comprises each component of following mass parts: nano alumina particles 200 parts ~ 800 parts, methyl vinyl silicone rubber 10 parts ~ 40 parts, vinyl silicone oil 10 parts ~ 50 parts, dimethicone 10 parts ~ 100 parts and MQ silicones 1 part ~ 20 parts;

Preferably, described second filling adhesive layer comprises each component of following mass parts: nano alumina particles 500 parts ~ 700 parts, methyl vinyl silicone rubber 20 parts ~ 30 parts, vinyl silicone oil 30 parts ~ 40 parts, dimethicone 50 parts ~ 80 parts and MQ silicones 10 parts ~ 15 parts.

Preferably, described second filling adhesive layer comprises each component of following mass parts: nano alumina particles 600 parts, methyl vinyl silicone rubber 15 parts, vinyl silicone oil 35 parts, dimethicone 65 parts and MQ silicones 15 parts.

Such as, the invention provides an embodiment the described 3rd fills adhesive layer, it comprises each component of following mass parts: nano alumina particles 200 parts ~ 700 parts, methyl vinyl silicone rubber 10 parts ~ 40 parts, vinyl silicone oil 10 parts ~ 50 parts, dimethicone 10 parts ~ 100 parts and MQ silicones 1 part ~ 20 parts.

Preferably, described 3rd filling adhesive layer comprises each component of following mass parts: nano alumina particles 200 parts ~ 600 parts, methyl vinyl silicone rubber 20 parts ~ 40 parts, vinyl silicone oil 20 parts ~ 50 parts, dimethicone 30 parts ~ 100 parts and MQ silicones 5 parts ~ 10 parts.

Preferably, described 3rd filling adhesive layer comprises each component of following mass parts: nano alumina particles 500 parts, methyl vinyl silicone rubber 25 parts, vinyl silicone oil 25 parts, dimethicone 30 parts and MQ silicones 8 parts.

Such as, the invention provides an embodiment the described 4th fills adhesive layer, it comprises each component of following mass parts: nano alumina particles 150 parts ~ 700 parts, methyl vinyl silicone rubber 15 parts ~ 45 parts, vinyl silicone oil 10 parts ~ 50 parts, dimethicone 10 parts ~ 100 parts and MQ silicones 1 part ~ 20 parts.

Preferably, described 4th filling adhesive layer comprises each component of following mass parts: nano alumina particles 150 parts ~ 450 parts, methyl vinyl silicone rubber 15 parts ~ 25 parts, vinyl silicone oil 10 parts ~ 25 parts, dimethicone 80 parts ~ 100 parts and MQ silicones 1 part ~ 10 parts.

Preferably, described 4th filling adhesive layer comprises each component of following mass parts: nano alumina particles 250 parts, methyl vinyl silicone rubber 18 parts, vinyl silicone oil 20 parts, dimethicone 95 parts and MQ silicones 5 parts.

Above-mentioned first fills adhesive layer, the second filling adhesive layer, the 3rd fills adhesive layer and the 4th filling adhesive layer is all matrix material with organic siliconresin, and adds the nano alumina particles with better heat-conducting effect.By adding conduction powder nano aluminium oxide in organic siliconresin matrix, thus it is stronger to prepare bonding force, thermal conductivity factor height fills jointing material, and then described first rete, described second rete, described third membrane layer, described 4th rete and described 5th rete can be made better to be fixed together, to improve structural stability further.

It is emphasized that, first fills adhesive layer, the second filling adhesive layer, the 3rd fills adhesive layer and the 4th content of filling nano alumina particles in adhesive layer successively decreases successively, because heat load is also successively decrease successively from the first rete, the second rete, third membrane layer, the 4th rete to described 5th rete, like this, the effect of gradient heat conduction and heat radiation can be got better.

Described first rete, described second rete, described third membrane layer, described 4th rete and described 5th rete is held in order to sticky better, avoid increasing excessive thickness simultaneously, and the impact reduced heat conduction and heat dispersion, such as, described first fills adhesive layer, described second filling adhesive layer, the described 3rd fills adhesive layer and the 4th Thickness Ratio of filling adhesive layer is 1 ~ 1.5:2 ~ 2.5:3 ~ 3.5:4 ~ 4.5, and for example, the described first Thickness Ratio of filling adhesive layer and described first rete is 1:50 ~ 80.

Above-mentioned radiating fin arranges the first rete, the second rete, third membrane layer, the 4th rete and the 5th rete by superposition successively, can obtain good insulating, the coefficient of expansion is low, thermal conductivity factor is large, the advantage of good heat dissipation effect and light weight.

Refer to Fig. 4, LED 20 comprises radiator 10 and is arranged on the LED group 200 on radiator 10, radiator 10 comprises body 100 and is arranged at the fin 110 on body 100, body 100 is cylinder, it offers ring groove 120 away from axle center near the region of outer wall, and ring groove 120 is for filling radiator, and fin 110 is uniformly distributed along the outer wall of body 100, further, fin 110 is provided with thermal dispersant coatings; LED group 200 comprises pcb board 210 and is arranged on the some LED chip 220 on pcb board 210; Pcb board 210 is arranged on body 100, and some LED chip 220 correspondences are arranged on the pcb board 210 of ring groove 120 dorsad.

In order to improve the radiating efficiency of pcb board 210, such as, pcb board 210 is circular, and its radius size equals the radius size of described body 100.Because described body 100 is cylinder, circular pcb board 210 is coaxially arranged with described body 100, and is fixed on described lid 140.Such as, pcb board 210 is provided with some bolt apertures, corresponding, described lid 140 is provided with the some screwed holes mated with described bolt apertures, and pcb board 210 is spirally connected and is fixed on described lid 140.Such as, pcb board 210 is being symmetrically arranged with two bolt apertures along on the both sides of a wherein diameter, corresponding, described lid 140 offers along symmetrical on the both sides of a wherein diameter two screwed holes mated with described bolt apertures, and pcb board 210 is spirally connected and is fixed on described lid 140.Like this, by being fixed on by PCB lamp on described lid 140, it fully abuts with described lid 140 surface, and the heat on pcb board 210 is conducted to rapidly on described lid 140.

In order to prevent declining owing to contacting the uneven radiating efficiency that causes, such as, pcb board 210 is fixed on described body 100 by heat-conducting silicone grease.That is, pcb board 210 is provided with one deck heat-conducting silicone grease towards a side of described lid 140, and the heat that pcb board 210 is produced is conducted on described lid 140 by this heat-conducting silicone grease.Efficiently solve because the scolding tin pin on pcb board 210 causes pcb board 210 to contact the uneven problem causing radiating efficiency low with described lid 140, and, under the effect of this heat-conducting silicone grease, make pcb board 210 be fixed on described lid 140 more stably, increase the safety and stability of LED 20.

In order to improve the radiating efficiency of LED chip 220, such as, the circular array distribution of some LED chip 220 is on pcb board 210.Such as, pcb board 210 is toroidal, and the circular array of some LED chip 220 outwards distributes along described pcb board 210 center of circle.Such as, on the pcb board 210 of the circular array distribution of some LED chip 220 described circular groove 130 dorsad.Like this, the coolant by being filled in described circular groove 130 is conducted to outside by the heat produced when some LED chip 220 work, thus reaches the effect of quick heat radiating.

In order to improve the radiating efficiency of LED chip 220, such as, circular point of some LED chip 220 one-tenth are on pcb board 210.That is, some LED chip 220 are arranged on the pcb board 210 of described ring groove 120 dorsad, are namely distributed on pcb board 210 along described ring groove 120 one-tenth is circular.Like this, the radiator by being filled in described ring groove 120 is conducted to outside by the heat produced when some LED chip 220 work, thus reaches the effect of quick heat radiating.

Refer to Fig. 7, such as, light bar 30 comprises radiator 10, is arranged on the LED on radiator 10 and connects the wiring board 300 of radiator 10, and wherein, described radiator is radiator described in above-mentioned any embodiment; Such as, radiator 10 comprises body 100 and is arranged at the fin 110 on body 100, body 100 is cylinder, LED comprises pcb board 210 and is arranged on the some LED chip 220 on pcb board 210, the conductor wire that wiring board 300 comprises fixed band and be arranged in parallel with fixed band, fixed band is arranged on body 100, and pcb board 210 is arranged on fixed band, some LED chip 220 correspondences are arranged on the pcb board 210 of fixed band dorsad, and pcb board 210 is electrically connected with conductor wire.And for example, light bar 30 comprises radiator 10, be arranged on the LED on radiator 10 and connect the wiring board 300 of radiator 10, radiator 10 comprises body 100 and is arranged at the fin 110 on body 100, body 100 is cylinder, it offers ring groove 120 away from axle center near the region of outer wall, ring groove 120 is for filling heat radiation crystal grain, fin 110 is uniformly distributed along the outer wall of body 100, and, fin 110 is provided with thermal dispersant coatings, LED comprises pcb board 210 and is arranged on the some LED chip 220 on pcb board 210, the conductor wire that wiring board 300 comprises fixed band and be arranged in parallel with fixed band, fixed band is arranged on body 100, pcb board 210 is arranged on fixed band, some LED chip 220 correspondences are arranged on the pcb board 210 of fixed band dorsad, pcb board 210 is electrically connected with conductor wire.

In order to strengthen the practicality of light bar 30, wiring board 300 is FPC 300, and namely this FPC 300 is the printed circuit using flexible insulating substrate to make.Because it can free bend, winding and folding, be particularly suitable for the needs thrown light in daily life, such as, this light bar 30 can be made watchband, and use the power supply in wrist-watch, when user can open light bar 30 on arm with illuminating road when night walks.And for example, be arranged on the shoulder belt of student's school bag by this light bar 30, it be yellow for presetting this light bar 30 luminescence, and student just gives way the driver of steering vehicle to remind opening this light bar 30 upper class hour, thus effectively protects the safety of going to school of student.

In the present embodiment, this light bar 30 is used in the lamp lighting of family, such as, using this light bar 30 as the corner lamp on ceiling.Such as, using this light bar 30 as ground corner lamp.Such as, using this light bar 30 as other ornament lamp.

For the ease of by mounted externally for light bar 30, such as, body 100 is provided with installation position, and installation position offers installing hole, and installation position is used for mounted externally for radiator 10 by installing hole.Such as, by installation position, light bar 30 is arranged on wall, uses as ornament lamp.And for example, by installation position, light bar 30 is arranged on corridor, as the lamp body of sense light, relative conventional bulb burns out the situation of rear corridor without illumination, light bar 30 possesses numerous LED chip 220 due to it, to make when a certain LED chip 220 breaks down corridor still can bright light, improves Consumer's Experience.

In order to be installed on fixed band by LED, such as, fixed band offers mounting groove, and pcb board 210 is contained in mounting groove.Such as, this mounting groove is the circular mounting groove mated with pcb board 210.Such as, pcb board 210 is also provided with adhesive, by this adhesive, pcb board 210 is fixedly placed in this mounting groove.Such as, the height of mounting groove equals the thickness of pcb board 210, to make fixed band surface more smooth, is beneficial to the encapsulation operation in later stage.In other embodiments, conductor wire and fixed band one-body molded, that is, fixed band is integrated with LED drive circuit and the support plate of LED chip 220 is installed.

In order to make pcb board 210 be electrically connected with good with fixing, such as, mounting groove is provided with conductive bit, and described conductor wire is connected in conductive bit.Pcb board 210 be provided with mate with conductive bit connect current potential, conductive bit with connect current potential and be electrically connected.Such as, conductive bit is binding post.Such as, conductive bit is electrically connected with the plug-in that electrically connects as connecing current potential, so that assembling.Adopt due to binding post and be screwed, ensure reliable contacts and by enough electric currents with driving LED chip 220.

In order to avoid causing pcb board 210 and fixed band loose contact owing to loosening, such as, pcb board 210 and mounting groove are encapsulated by heat conductive silica gel.Such as, the fixed band away from mounting groove surrounding is also provided with holddown groove, this holddown groove is mounted with plastic lens, is filled with heat conductive silica gel between plastic lens and pcb board 210.Such as, the fixed band away from mounting groove surrounding is also provided with holddown groove, this holddown groove is mounted with plastic lens, is filled with heat conductive silica gel between plastic lens and pcb board 210, is also provided with phosphor powder layer between pcb board 210 and LED chip 220.Such as, the fixed band away from mounting groove surrounding is also provided with holddown groove, this holddown groove is mounted with plastic lens, is filled with heat conductive silica gel between plastic lens and pcb board 210, is also provided with phosphor powder layer between pcb board 210 and LED chip 220.Preferably, this heat conductive silica gel is phonon thermal conductance heat-conducting cream.Like this, by the effect of heat conductive silica gel and plastic lens, LED chip 220 can be fixed in light bar 30, avoid because the loosening of LED chip 220 causes bad electrical contact, reduce Consumer's Experience.

Refer to Fig. 8, such as, greeting lamp 40 comprises housing 400, radiator 10, be arranged on the LED on radiator 10 and connect the wiring board 300 of radiator 10, radiator 10 comprises body 100 and is arranged at the fin 110 on body 100, body 100 is cylinder, fin 110 is uniformly distributed along the outer wall of body 100, LED comprises pcb board 210 and is arranged on the some LED chip 220 on pcb board 210, the conductor wire that wiring board 300 comprises fixed band and be arranged in parallel with fixed band, fixed band is arranged on body 100, pcb board 210 is arranged on fixed band, some LED chip 220 correspondences are arranged on the pcb board 210 of fixed band dorsad, pcb board 210 is electrically connected with conductor wire, the cover plate that housing 400 is offered accepting groove and mated with accepting groove, radiator 10, LED and wiring board 300 are placed in accepting groove.Such as, greeting lamp 40 comprises housing 400, radiator 10, be arranged on the LED on radiator 10 and connect the wiring board 300 of radiator 10, radiator 10 comprises body 100 and is arranged at the fin 110 on body 100, body 100 is cylinder, it offers ring groove 120 away from axle center near the region of outer wall, ring groove 120 is for filling heat radiation crystal grain, fin 110 is uniformly distributed along the outer wall of body 100, LED comprises pcb board 210 and is arranged on the some LED chip 220 on pcb board 210, the conductor wire that wiring board 300 comprises fixed band and be arranged in parallel with fixed band, fixed band is arranged on body 100, pcb board 210 is arranged on fixed band, some LED chip 220 correspondences are arranged on the pcb board 210 of fixed band dorsad, pcb board 210 is electrically connected with conductor wire, the cover plate that housing 400 is offered accepting groove and mated with accepting groove, radiator 10, LED and wiring board 300 are placed in accepting groove.

Preferably, housing 400 is the cuboid of hollow, and it offers accepting groove, and radiator 10, the wiring board 300 etc. being arranged on LED on radiator 10 and connecting radiator 10 are contained in accepting groove.

For the ease of printing opacity and prevent light direct projection user, such as, cover plate is transparent plastic.This transparent plastic is provided with refractive power surface.Such as, this refractive power surface is adopted made of plastic, thus tank is reclaimed in straight line anaclasis, prevents light direct projection user.And for example, cover plate is provided with aobvious word bit, this character-display layer is for placing welcome's letter stencil, and this welcome's letter stencil covers described cover plate, demonstrates the word on welcome's letter stencil under the effect in LED lamplight.And for example, this aobvious word bit adopts two guide rail drawing and pulling type, and namely welcome's letter stencil is placed on this aobvious word bit along guide rail.Like this, by this cover plate, user can be facilitated to make personalized welcome's demand, simple and practical.

In order to make greeting lamp 40 have adjustable light angle, such as, the housing 400 of accepting groove both sides being provided with and rotating position, cover plate rotates to be installed on and rotates on position.Such as, rotate position and be provided with positioning part, positioning part is for adjusting the angle of cover plate and housing 400.Such as, this positioning part is hinge installation position, and a hinge part is arranged on cover plate, and another part is arranged on housing 400, makes cover plate rotatable relative to housing 400.Such as, hinge is spring hinge, and it is provided with adjustment screw, by this adjustment screw can up and down, the height of left and right adjusting cover plate and angle, such as, angle is 30 degree, and and for example, angle is 160 degree.

In order to prevent LED lamplight linear user, such as, radiator 10, the wiring board 300 etc. being arranged on LED on radiator 10 and connecting radiator 10 are arranged on towards on a side of the cover plate of described accepting groove opening, bottom the light directive accepting groove making LED.Such as, on the cover plate of described accepting groove opening, be provided with encapsulation groove, radiator 10, LED and wiring board 300 is arranged on encapsulation groove.Such as, LED and wiring board 300 are packaged on encapsulation groove.Be installed on housing 400 because cover plate rotates, rotating plate can drive the light angle of LED, is convenient to user and adjusts as required.

Dispel the heat for the ease of radiator 10, such as, housing 400 offers some air vents.Such as, some air vents are bending is arranged, to prevent light direct projection to outside housing 400.Such as, some air vents become two row's distributions.Such as, two row's air vents are distributed in accepting groove on the sidewall of bottom.Like this, due to air in accepting groove and accepting groove outer air negotiable, effectively can ensure the heat radiation of LED.

In other embodiments, accepting groove sidewall offers some perforation, and fin 110 wears this perforating exposed in housing 400, to ensure the radiating efficiency of radiator 10 further, ensures the normal work of LED.

In order to greeting lamp 40 is fixed on outside, such as, housing 400 is also provided with fixed bit, fixed bit is used for installing or mounting greeting lamp 40.Such as, this fixed bit is be extended on the installation screw on housing 400, for being fixed by screw when this greeting lamp 40 is fixed in installation.Such as, this fixed bit is welding position, for greeting lamp 40 is welded on welcome's platform.Like this, user can be facilitated to install according to demand.

Each technical characteristic of the above embodiment can combine arbitrarily, for making description succinct, the all possible combination of each technical characteristic in above-described embodiment is not all described, but, as long as the combination of these technical characteristics does not exist contradiction, be all considered to be the scope that this description is recorded.

The above embodiment only have expressed several embodiment of the present invention, and it describes comparatively concrete and detailed, but can not therefore be construed as limiting the scope of the patent.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.

Claims

1. a lighting device, is characterized in that, comprises radiator, is arranged on the LED on described radiator and connects the wiring board of described radiator,

Described radiator comprises body and is arranged at the fin on described body,

Described fin is uniformly distributed along the outer peripheral edge of described body,

Described LED comprises pcb board and is arranged on the some LED chip on described pcb board,

The conductor wire that described wiring board comprises fixed band and be arranged in parallel with described fixed band,

Described fixed band is arranged on the body, and described pcb board is arranged on described fixed band,

Described pcb board is electrically connected with described conductor wire,

Described fixed band is provided with the buckling parts fastening position and match with described fastening position.

2. lighting device according to claim 1, is characterized in that, is connected with and is linked with between described fastening position and described buckling parts, for described lighting device button is hung over outside.

3. lighting device according to claim 1, is characterized in that, described fin is bar-shaped.

4. lighting device according to claim 3, is characterized in that, described fin is uniformly distributed along the outer peripheral edge of described body.

5. lighting device according to claim 4, is characterized in that, described fin is provided with kink away from one end of described body.

6. lighting device according to claim 5, is characterized in that, described kink is provided with some heat radiation thin slices.

7. lighting device according to claim 6, is characterized in that, some described heat radiation thin slices are uniformly distributed along described kink.

8. lighting device according to claim 7, is characterized in that, some described kinks offer intercommunicating pore.

9. lighting device according to claim 8, is characterized in that, described intercommunicating pore is equipped with heat conducting bar.

10. lighting device according to claim 9, is characterized in that, some described fin are connected by described heat conducting bar.