CN105135233B - Led lamp - Google Patents

Led lamp Download PDF

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Publication number
CN105135233B
CN105135233B CN201510413507.4A CN201510413507A CN105135233B CN 105135233 B CN105135233 B CN 105135233B CN 201510413507 A CN201510413507 A CN 201510413507A CN 105135233 B CN105135233 B CN 105135233B
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China
Prior art keywords
substrate
pedestal
parts
led lamp
exhaust outlet
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CN201510413507.4A
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CN105135233A (en
Inventor
叶伟炳
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Dongguan Wenyu Industrial Co Ltd
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Dongguan Wenyu Industrial Co Ltd
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Priority to CN201510413507.4A priority Critical patent/CN105135233B/en
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs

Abstract

The present invention relates to technical field of heat dissipation, more particularly to LED lamp, including:Radiator, wiring board and baffle plate;Radiator includes:Pedestal, first substrate, second substrate and some thermal columns;Some thermal columns are respectively arranged on first substrate and second substrate;Pedestal is provided with some cradle portions, and baffle plate is connected with some cradle portions;First substrate and second substrate are provided with installing zone, and wiring board is fixedly installed in it.Above-mentioned LED lamp, first substrate and second substrate are provided with pedestal, pedestal can play a fixed restriction effect so that substrate is fixed on pedestal, heat caused by electronic component can be conducted by substrate to outside, also, is provided with thermal column on first substrate and second substrate, heat is conducted from substrate toward thermal column, and be dispersed to by thermal column in air, so as to be advantageous to the quick transmission of heat and disperse, it is effectively improved the heat dispersion of LED lamp.

Description

LED lamp
Technical field
The present invention relates to technical field of heat dissipation, more particularly to LED lamp.
Background technology
LED is the abbreviation of English light emitting diode (light emitting diode), and its basic structure is one block of electricity The chip of semiconductor material of photoluminescence, with elargol or latex solidified to support, then connect chip and electricity with silver wire or gold thread Road plate, then surrounding sealed with epoxy resin, play a part of protecting internal core, shell be finally installed, so LED is anti- Shock stability is good, is referred to as forth generation green light source.
LED illumination lamp is exactly a kind of illuminator made using forth generation green light source LED, i.e. LED is referred to as the 4th For lighting source or green light source, there is energy-saving and environmental protection, long lifespan, small volume, can be widely applied to various fingers Show, show, decorating, the field such as backlight, general lighting and urban landscape.
However, whether LED work stablizes, quality quality, radiated in itself with lamp body most important, the high brightness of in the market The radiating of LED, it is usually unsatisfactory using natural heat dissipation, effect.The LED lamp that LED light source is made, tied by LED, radiating Structure, driver, lens composition, therefore it is also a part and parcel to radiate, if LED can not radiate very well, its life-span Can be impacted.
For example, a kind of LED power type street lamp segmentation luminescence unit is disclosed in Chinese patent CN201410741409.9 Radiator structure, by for LED secondary light-distribution lens modules (1), the LED lamp bead (2) being welded in aluminum-based circuit board (3), aluminium Matter radiator (5) and solid-state silicon heat conducting film (4) are formed;Solid-state silicon heat conducting film (4) substitutes the liquid heat conductive silicon that tradition is continued to use Fat, the pattern contacted with face, aluminum-based circuit board (3) is connected with aluminium radiator (5), is worked in LED street lamp and is produced high temperature Under conditions of, the conductive structure of its mutual face contact will not be changed, the LED operation electric heating of Cheng Load in aluminum-based circuit board can be made smooth Conduction, be diffused on aluminium radiator;Radiating fin (6) on radiator is coated with heat loss through radiation coating, and this radiation dissipates Hot coating is that the solution that cohesion forms occurs for the modified colloidal particulate (being less than 100 nanometers) crossed through high-temperature process, and solution is solidifying In the presence of agent after film-forming, in fish scale-shaped structure, be advantageous to radiation of heat, its filler is CNT, spinelle metal The material of the high thermal conductances such as oxide and infrared emission, this construction can greatly increase radiating specific surface area and conduction Rate, the radiation coefficient of luminescence unit infra-red radiation is improved, lift the effect of heat exchange, reduce the light decay probability of luminescence unit.
And for example, a kind of high-heat-dispersion LED wiring board is disclosed in Chinese patent CN201410734343.0, it include by it is lower extremely On be sequentially provided with radiating base layer, thermal insulation layer and line layer, the radiating base layer is metallic plate, and its upper surface is provided with multiple cones Shape projection;The top of the taper projection is provided with the heat transfer bar of two intersections.The taper projection stretched into thermal insulation layer, increase The contact area of radiating base layer and thermal insulation layer, and then improve radiating base layer and the heat transfer efficiency of insulating heat-conductive interlayer.And The topside area of taper projection is smaller, thermal insulation layer can be avoided to be punctured by high-tension electricity.
But dissipation from electronic devices of the prior art substantially or by the heat between heat carrier and fin passes Lead to complete, radiating effect is not highly desirable, so it is required to provide a kind of new light fixture.
The content of the invention
Based on this, it is necessary in view of the above-mentioned problems, providing a kind of good heat dispersion performance, radiating efficiency higher LED lamp.
A kind of LED lamp, including:Radiator, wiring board and baffle plate;The radiator includes:Pedestal, first substrate, Two substrates and some thermal columns;The first substrate connects with the second substrate, also, the first substrate and described second Substrate is arranged at the same side of the pedestal;Some thermal columns are respectively arranged at the first substrate and second base On plate;The pedestal is provided with some cradle portions, and the baffle plate is connected with some cradle portions;The first substrate and described Second substrate is provided with installing zone, and the wiring board is fixedly installed in it.
In one of the embodiments, described cradle portion one end is arranged at the pedestal, and the other end is along perpendicular to the base The direction of seat is extended.
In one of the embodiments, the pedestal is provided with four cradle portions.
In one of the embodiments, the cradle portion is cylinder.
In one of the embodiments, the baffle plate is correspondingly arranged on several support positions.
In one of the embodiments, the baffle plate is correspondingly arranged on four support positions.
In one of the embodiments, the support position is connected with the cradle portion.
In one of the embodiments, one cradle portion of the corresponding connection in the support position.
In one of the embodiments, the support position and the cradle portion are spirally connected fixation.
In one of the embodiments, the support position is welded and fixed with the cradle portion.
Above-mentioned LED lamp, first substrate and second substrate is provided with pedestal, pedestal can play a fixed restriction effect So that substrate is fixed on pedestal, the electronic components such as LED chip are arranged on substrate, heat caused by electronic component can pass through Substrate is conducted to outside, also, thermal column is provided with first substrate and second substrate, and heat is conducted from substrate toward thermal column, And be dispersed to by thermal column in air, so as to be advantageous to the quick transmission of heat and disperse, improve first substrate and the second base The contact area of plate and air, it is effectively improved the heat dispersion of LED lamp.
Brief description of the drawings
Fig. 1 is the structural representation of one embodiment of the invention LED lamp;
Fig. 2 is the structural representation at another visual angles of Fig. 1;
Fig. 3 is the structural representation of further embodiment of this invention LED lamp;
Fig. 4 is the structural representation of further embodiment of this invention LED lamp;
Fig. 5 is the mounting structure schematic diagram of controller;
Fig. 6 is the structural representation of cradle portion;
Fig. 7 is the structural representation at Fig. 6 another visual angle;
Fig. 8 is the structural representation of further embodiment of this invention LED lamp;
Fig. 9 is Fig. 8 dimensional structure diagram.
Embodiment
In order to facilitate the understanding of the purposes, features and advantages of the present invention, below in conjunction with the accompanying drawings to the present invention Embodiment be described in detail.Many details are elaborated in the following description in order to fully understand this hair It is bright.But the invention can be embodied in many other ways as described herein, those skilled in the art can be not Similar improvement is done in the case of running counter to intension of the present invention, therefore the present invention is not limited by following public specific embodiment.
In the description of the invention, it is to be understood that term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width ", " thickness ", " on ", " under ", "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom ", " interior ", " outer ", " up time The orientation or position relationship of the instruction such as pin ", " counterclockwise ", " axial direction ", " radial direction ", " circumference " be based on orientation shown in the drawings or Position relationship, it is for only for ease of and describes the present invention and simplify description, rather than indicates or imply that signified device or element must There must be specific orientation, with specific azimuth configuration and operation, therefore be not considered as limiting the invention.
In addition, term " first ", " second " are only used for describing purpose, and it is not intended that instruction or hint relative importance Or the implicit quantity for indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can be expressed or Implicitly include at least one this feature.In the description of the invention, " multiple " are meant that at least two, such as two, three It is individual etc., unless otherwise specifically defined.
In the present invention, unless otherwise clearly defined and limited, term " installation ", " connected ", " connection ", " fixation " etc. Term should be interpreted broadly, for example, it may be fixedly connected or be detachably connected, or integrally;Can be that machinery connects Connect or electrically connect;Can be joined directly together, can also be indirectly connected by intermediary, can be in two elements The connection in portion or the interaction relationship of two elements, limited unless otherwise clear and definite.For one of ordinary skill in the art For, the concrete meaning of above-mentioned term in the present invention can be understood as the case may be.
In the present invention, unless otherwise clearly defined and limited, fisrt feature can be with "above" or "below" second feature It is that the first and second features directly contact, or the first and second features pass through intermediary mediate contact.Moreover, fisrt feature exists Second feature " on ", " top " and " above " but fisrt feature are directly over second feature or oblique upper, or be merely representative of Fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " lower section " and " below " can be One feature is immediately below second feature or obliquely downward, or is merely representative of fisrt feature level height and is less than second feature.
It should be noted that when element is referred to as " being fixed on ", " being arranged at " another element, it can be directly another On individual element or there may also be element placed in the middle.When an element is considered as " connection " another element, it can be It is directly connected to another element or may be simultaneously present centering elements.Term as used herein " vertically ", " level ", "left", "right" and similar statement for illustrative purposes only, it is unique embodiment to be not offered as.
For example, LED lamp includes:Radiator, wiring board and baffle plate;The radiator includes:Pedestal, first substrate, Two substrates and some thermal columns;The first substrate connects with the second substrate, also, the first substrate and described second Substrate is arranged at the same side of the pedestal;Some thermal columns are respectively arranged at the first substrate and second base On plate;The pedestal is provided with some cradle portions, and the baffle plate is connected with some cradle portions;The first substrate and described Second substrate is provided with installing zone, and the wiring board is fixedly installed in it.Wherein, some LED chips are provided with the wiring board.
Referring to Fig. 1, radiator includes pedestal 100, first substrate 110, second substrate 120 and some thermal columns 130, the One substrate connects with second substrate, also, first substrate and second substrate are arranged at the same side of pedestal, first substrate and Two substrates set some thermal columns respectively, that is to say, that some thermal columns are respectively arranged on first substrate and second substrate.Example Such as, pedestal squarely body.For example, pedestal has mounting surface.For example, the section of first substrate and second substrate, into V-type, it has Kink, long heat sink and short heat sink, long heat sink and short heat sink are connected with kink respectively.For example, the length of substrate dissipates The width of hot plate is more than the width of short heat sink, and both equal lengths, i.e., the length of long heat sink and the length of short heat sink Spend equal, also just says, the area of the area of long heat sink more than short heat sink.For example, mounting surface offer the first mounting groove and Second mounting groove.The section of first mounting groove and the second mounting groove is into V-type.For example, first substrate is arranged at the first mounting groove, the Two substrates are arranged at the second mounting groove so that first substrate and second substrate are arranged on pedestal into X-type.So, heat via First substrate and second substrate conduct to thermal column, and distributed heat to by thermal column in air, to realize the mesh of radiating 's.
In order to increase the contact area of thermal column and air, Fig. 1 and Fig. 2 are referred to, for example, radiator also includes heating column 140, heating column is arranged on pedestal, and kink is connected with heating column, the bearing of trend of heating column and the bearing of trend phase of substrate Together.For example, first substrate 110 includes the first kink 111, the first long 112 and first short heat sink 113 of heat sink.For example, the Two substrates 120 include the second kink 121, the second long 122 and second short heat sink 123 of heat sink.For example, the first kink and Second kink is connected with heating column respectively.For example, the first long heat sink is located at the extending direction of the second short heat sink, i.e., first Long heat sink is located along the same line with the second short heat sink.Likewise, the second long heat sink is located at prolonging for the first short heat sink Length direction, i.e., the second long heat sink are located along the same line with the first short heat sink.Also, the first long heat sink and first it is short dissipate Angle between hot plate is acute angle, and it is also acute angle that the angle between the second long heat sink and the second short radiating, which is,.In this way, the first length The angle between angle and the first short heat sink and the second short heat sink between heat sink and the second long heat sink is obtuse angle, Some thermal columns are arranged in the heat sink on two obtuse angles, to cause thermal column as much as possible and air contact, increase The contact area of thermal column and air, improves radiating efficiency.
For the ease of thermal column is arranged on the first short heat sink and the second short heat sink, for example, it is short to be arranged on first Thermal column on heat sink is staggered with the thermal column being arranged on the second short heat sink, i.e. the remote heat sink of thermal column One end is staggered.For example, some thermal columns are divided into two groups, including first group of thermal column and second group of thermal column.For example, first Group thermal column and second group of thermal column are respectively into matrix distribution on the first short heat sink and the second short heat sink.In this way, radiating The length of post not between by the first short heat sink and the second short heat sink angle size, that is to say, that no matter the first short radiating Between plate and the second short heat sink angle why the number of degrees, thermal column may be provided at the first short heat sink and the second short heat sink On, also, due to being staggered between each thermal column of the first short heat sink and the second short heat sink, do not hinder each other, So that when design radiates column length regardless of its length, so as to easily by thermal column be arranged on the first short heat sink and On second short heat sink.
In order to improve radiating efficiency, for example, thermal column includes heat conduction core and external diffusion layer.For example, heat conduction core and external diffusion Layer extends from substrate to the direction of vertical substrate.For example, external diffusion layer wraps up heat conduction core.Preferably, heat conduction core is made up of graphite, External diffusion layer is aluminium alloy.For example, each component that the aluminium alloy includes following mass parts forms:Aluminium:81.2 parts~89.5 parts; Magnesium:11.3 parts~15.1 parts;Silicon:0.5 part~1.5 parts;Copper:2.2 parts~3.5 parts;Manganese:0.3 part~1.0 parts;Nickel:2.3 parts~ 4.6 part;Molybdenum:0.1 part~0.5 part;Zirconium:0.2 part~0.5 part;Above-mentioned aluminium alloy is mainly made up of aluminium, magnesium, can not only make system The lighter weight of standby base material, thermal conductivity is preferable, and the addition of silicon, copper, manganese, nickel, molybdenum can have the outer wall of external diffusion layer There is larger intensity, in addition, the addition of zirconium can improve the fatigue-resistance characteristics and decay resistance of the outer wall of external diffusion layer, but zirconium Content when being more than 0.5 part, its decay resistance improves smaller, and can influence the surrender degree and other mechanical mechanics of material Can, therefore control the content of zirconium to be less than 0.5 part, to ensure the fatigue-resistance characteristics of external diffusion layer and decay resistance.
In addition, for the ease of promptly the heat on substrate is conducted into surrounding environment, it is preferred that external diffusion layer For graphite-aluminium alloy.In this way, because the thermal conductivity factor of graphite is high, aluminium has the hardness of metal, have when both combine relative to The more excellent heat transfer efficiency of aluminium alloy.Preferably, above-mentioned graphite-aluminium alloy includes each component of following mass parts:Si:8~18 Part, Cu:5~17 parts, Pt:3~23 parts, V:2~12 parts, Ti:2~15 parts, Mg:2~8 parts, Ai:23~75 parts, C:20~75 Part, Ni:19~75 parts.
And for example, graphite-aluminium alloy includes each component of following mass parts:Si:10~14 parts, Cu:13~17 parts, Pt:6~ 20 parts, V:4~10 parts, Ti:5~9 parts, Mg:2~4 parts, Ai:25~43 parts, C:36~55 parts, Ni:36~55 parts.
And for example, graphite-aluminium alloy includes each component of following mass parts:Si:15~16 parts, Cu:9~13 parts, Pt:12~ 18 parts, V:6~8 parts, Ti:10~15 parts, Mg:5~8 parts, Ai:45~65 parts, C:25~35 parts, Ni:25~35 parts.
Preferably, graphite-aluminium alloy includes each component of following mass parts:Si:10 parts, Cu:6 parts, Pt:13 parts, V:7 parts, Ti:3 parts, Mg:5 parts, Ai:74 parts, C:74 parts, Ni:70 parts.
Above-mentioned each combination has excellent thermal conductivity factor after being grouped into graphite-aluminium alloy, while has the plasticity of metal, Effectively the heat on substrate can be conducted into surrounding environment.
In order to further improve radiating efficiency, for example, offering heat conduction annular groove between heat conduction core and external diffusion layer.For example, Heat conduction core and external diffusion layer are made up of aluminium alloy.For example, heat conduction annular groove is filled with graphene particles.And for example, heat conduction annular groove is filled There is the graphite particle that thermal conductivity factor is low compared with graphene particles.Preferably, heat conduction core and external diffusion layer and it is filled in heat conduction annular groove Graphene particles be integrally formed, each contact surface is provided with heat conductive silica gel, to improve derivative coefficient.It is appreciated that it is filled with After graphene particles, the thermal conductivity factor between heat conduction core, heat conduction annular groove and external diffusion layer is unbalanced, also, in heat conduction annular groove Graphene particles thermal conductivity factor be higher than heat conduction core and external diffusion layer, in this way, causing the heat of the graphene particles in heat conduction annular groove Amount is assembled and carries out horizontal proliferation, i.e., is diffused between the graphene particles in heat conduction annular groove, and due to remote substrate The temperature of the graphene particles of one end is relatively low, therefore, the temperature of the graphene particles in heat conduction annular groove from close to substrate to remote Successively decrease in the direction of substrate.And then heat conduction annular groove and external diffusion layer can be radiated, and further increase radiating efficiency.
For example, the outside of external diffusion layer, which is extended, some fin.For example, some fin are uniformly distributed in and extended out Dissipate the outside of layer.For example, fin is tabular, it is evenly distributed on the outer wall of body.For example, fin is reversed acanthoid, its is equal The even outer wall for being distributed in body.For example, fin is aerofoil profile, it is evenly distributed on the outside of external diffusion layer.So, by numerous Respectively in the fin in the outside of outer diffusion layer so that heat is more easily dissipated at the outside of outer diffusion layer by fin Send out in air, so as to be effectively improved radiating efficiency.
Preferably, some radiating projections are provided with substrate.For example, the extension of the bearing of trend and thermal column of radiating projection Direction is identical.For example, each radiating projection is prism structure.For example, each radiating projection is sphere structure.With each Exemplified by the projection that radiates is prism structure, for example, each radiating projection is positive six prismsby structure, each positive six prismsby it is each The first heat dissipation scales are evenly arranged with side wall, being provided with one on each incline of each positive six prismsby ranked second radiating squama Piece, also, the second heat dissipation scales between adjacent heat radiation projection intersect and not abutted against each other.For example, each radiating is convex Block is regular triangular prism structure, the 3rd heat dissipation scales of matrix distribution is provided with into each side wall of each regular triangular prism, often One is provided with each incline of one regular triangular prism and ranked fourth heat dissipation scales, also, the 4th between adjacent heat radiation projection dissipates Hot scale intersects and not abutted against each other.So, by be laminated in a substrate more embranchment Designs, have it is multiple The radiating projection of heat dissipation scales so that the heat on substrate is conducted to outside rapidly from each radiating projection, improves the radiating of substrate Efficiency.
In order to improve the radiating efficiency of radiating projection, for example, radiating projection is hollow structure, also, the projection that radiates also is opened Provided with some thermal vias.That is, radiating projection is hollow prism structure, if also, being further opened with each side wall Dry thermal vias.For example, radiating projection is hollow positive six prismsby structure, it is provided with each side wall of each positive six prismsby Into the 5th heat dissipation scales of matrix distribution, first thermal vias is offered in the side wall between adjacent 5th heat dissipation scales. For example, radiating projection is hollow regular triangular prism structure, matrix distribution is provided with into each side wall of each regular triangular prism The 6th heat dissipation scales, offer second thermal vias in the side wall between adjacent 6th heat dissipation scales.So, due to dissipating The temperature of air is more than the temperature of the outer air of radiating projection in hot projection so that air heats are uneven, in the projection that radiates temperature compared with High air expansion rises, and the relatively low air of the outer temperature of radiating projection is padded in radiating projection by thermal vias, so as to shape Into local air convection current.Also, the relatively low air of temperature is padded to by thermal vias in radiating projection outside radiating projection During, the flowing of each heat dissipation scales surrounding air in side wall is driven, increases the radiating efficiency of each heat dissipation scales, so as to whole The radiating efficiency of radiating projection is improved on body.
In order to improve the radiating efficiency of radiating projection, for example, radiating projection is provided with thermal dispersant coatings.For example, radiating projection Thermal dispersant coatings are provided with lateral wall.For example, thermal dispersant coatings be arranged on lateral wall remove the thermal vias and each heat dissipation scales Outside other plane domains, that is to say, that thermal dispersant coatings cover lateral wall plane domain, to improve its radiating efficiency. For example, thermal dispersant coatings are provided with heat radiation coating, the heat radiation coating is special material, because it is present product and technology, so Place repeats no more.By being provided with thermal dispersant coatings on radiating projection lateral wall, the radiating efficiency on the sidewall areas surface is improved, So as to improve the radiating efficiency of radiating projection.
In order to improve radiating effect, for example, setting radiating area on the long heat sink, it, which is sequentially overlapped, sets the first film Layer, the second film layer, third membrane layer, the 4th film layer, the 5th film layer, i.e. the first film layer, the second film layer, third membrane layer, the 4th film layer, 5th film layer, which is sequentially overlapped to be attached on the long heat sink, is used as radiating area, that is to say, that the first film layer is attached at the length On heat sink, the second film layer is attached in the first film layer, and third membrane layer is attached in the second film layer, and the 4th film layer is attached at the 3rd In film layer, the 5th film layer is attached in the 4th film layer, and the 6th film layer is attached in the 5th film layer.And for example, the radiating area is set One side or two sides in the long heat sink;And for example, the radiating area is arranged at all surfaces of the long heat sink On.
For example, the first film layer includes each component of following mass parts:40 parts~70 parts of carborundum, 13 parts of alundum (Al2O3)~ 55 parts, 2 parts~15 parts of silica, 4 parts~13 parts of pyrite, 2 parts~28 parts of spinelle, 3 parts~25 parts of binding agent, kaolin 2 parts~20 parts, 0.5 part~2 parts of magnesia, Dongyang is native 0.5 part~2 parts, 0.2 part of 0.5 part~2 parts of light weight calcium and rare earth oxide ~0.5% part.
Above-mentioned first film layer mixes remaining original that can be used for preparing ceramics by the use of carborundum as primary raw material Material, so that above-mentioned first film layer has been provided simultaneously with, thermal conductivity factor height, good insulation preformance, thermal coefficient of expansion be low and heat resistance The advantages of preferable, in addition, above-mentioned first film layer, which also has, is readily produced the advantages of manufacture is low with manufacturing cost.
Preferably, the first film layer includes each component of following mass parts:50 parts~60 parts of carborundum, 30 parts of alundum (Al2O3) ~50 parts, 0 part~15 parts of silica 1,7 parts~11 parts of pyrite, 4 parts~18 parts of spinelle, 10 parts~20 parts of binding agent, height 15 parts~20 parts of ridge soil, 1 part~1.5 parts of magnesia, 1 part~1.5 parts of Dongyang soil, 1 part~1.5 parts of light weight calcium and rare earth oxide 0.3 part~0.4% part.Preferably, the first film layer includes each component of following mass parts:55 parts of carborundum, alundum (Al2O3) 40 Part, 3 parts of silica 1,11 parts of pyrite, 15 parts of spinelle, 15 parts of binding agent, 18 parts of kaolin, 1.5 parts of magnesia, Dongyang 0.3 part of 1.5 parts of soil, 1.5 parts of light weight calcium and rare earth oxide.
Preferably, the second film layer includes each component of following mass parts:85 parts~90 parts of graphene, 5 parts of CNT~ 15 parts and 5 parts~15 parts of carbon nano-fiber.Preferably, 10 parts of 90 parts of graphene, 10 parts of CNT and carbon nano-fiber.
It should be noted that two layers before passing through because of the heat of long heat sink, i.e., described first film layer and second film layer Afterwards, understand the heat of some to be lost in the air in the external world.Further, since the cost of second film layer is higher, its is main Reason is that the primary raw material of second film layer is prepares the higher graphene of cost, therefore, based on the third membrane layer In the case that heat transfer and radiating burden are relatively small, the third membrane layer can use the most frequently used heat dissipation metal material in current market Material, to reach the effect for reducing cost and obtaining preferable heat transfer property.
Preferably, the third membrane layer includes each component of following mass parts:94 parts~96 parts of copper, 3 parts~4 parts of aluminium, nickel 0.2 part~0.3 part, 0.5 part~1 part of vanadium, 0.1 part~0.5 part of platinum, silver 0.2 part~0.3,0.2 part~0.3 part of tungsten, 0.2 part of manganese 0.2 part~0.3 part of~0.3 part, 0.2 part~0.3 part of titanium and chromium.Preferably, the third membrane layer includes following mass parts Each component:95 parts of copper, 3.5 parts of aluminium, 0.3 part of nickel, 0.8 part of vanadium, 0.1 part~0.5 part of platinum, 0.2 part~0.3 part of silver, 0.2 part of tungsten~ 0.2 part~0.3 part of 0.3 part, 0.2 part~0.3 part of manganese, 0.2 part~0.3 part of titanium and chromium.
For example, the 4th film layer includes each component of following mass parts:47 parts~50 parts of copper, 49 parts~52 parts of aluminium, 0.2 part of magnesium ~0.7 part, 0.2 part~0.7 part of iron, 0.1 part~0.5 part of platinum, silver 0.2 part~0.3, tungsten 0.2 part~0.3, manganese 0.2 part~0.5 Part, 0.1 part~0.3 part of titanium, 0.05 part~0.1 part of chromium and 0.1 part~0.3 part of vanadium.
Preferably, the 4th film layer includes each component of following mass parts:48 parts~49 parts of copper, 50 parts~52 parts of aluminium, 0.2 part~0.5 part of magnesium, 0.2 part~0.5 part of iron, 0.1 part~0.5 part of platinum, 0.2 part~0.3 part of silver, 0.2 part~0.3 part of tungsten, manganese 0.2 part~0.3 part of 0.3 part~0.5 part, 0.2 part~0.3 part of titanium, 0.05 part~0.08 part of chromium and vanadium.Preferably, the described 4th Film layer includes each component of following mass parts:48 parts of copper, 51 parts of aluminium, 0.3 part of magnesium, 0.3 part of iron, 0.5 part of platinum, silver-colored 0.3 part, tungsten 0.3 part of 0.3 part, 0.4 part of manganese, 0.4 part of titanium, 0.08 part of chromium and vanadium.
In order to further mitigate the weight of the 4th film layer, and preferable radiating effect is obtained, for example, the present invention also carries For the 4th film layer of auxiliary, the 4th film layer of the auxiliary is arranged at the 4th film layer away from the third membrane layer one side.
For example, the 4th film layer of auxiliary includes each component of following mass parts:88 parts~93 parts of aluminium, 5.5 parts~10.5 parts of silicon, 0.3 part~0.7 part of magnesium, 0.05 part~0.3 part of copper, 0.2 part~0.8 part of iron, 0.1 part~0.5 part of platinum, silver 0.2 part~0.3 part, 0.05 part~0.3 part of 0.2 part~0.5 part of manganese, 0.05 part~0.3 part of titanium, 0.05 part~0.1 part of chromium and vanadium.Need what is illustrated It is, four layers before passing through because of the heat of long heat sink, i.e., described first film layer, second film layer, the third membrane layer and described After 4th film layer, the heat of a greatly part has been lost in the air in the external world.Therefore, the radiating based on the 5th film layer is born Carry on a shoulder pole it is relatively small, influenceed and in the case that self-temperature is relatively low, caused by thermal coefficient of expansion is larger it is minimum in the case of, described the Three film layers can use the most frequently used plastic material in current market, and cost and weight are reduced to reach, and obtain preferable surface Protective value.
Preferably, the 5th film layer includes each component of following mass parts:30 parts~35 parts of graphite, 25 parts of carbon fiber~ 30 parts, 45 parts~50 parts of polyamide, 15 parts~20 parts of water-soluble silicate, 4 parts~6 parts of hexagonal boron nitride, BMI 3 Part~4 parts, 1 part~1.5 parts of silane coupler, 0.5 part~1 part of antioxidant.Preferably, the 5th film layer includes following quality The each component of part:35 parts of graphite, 28 parts of carbon fiber, 45 parts of polyamide, 18 parts of water-soluble silicate, 5 parts of hexagonal boron nitride, span Come 3.5 parts of acid imide, 1.8 parts of silane coupler, 0.7 part of antioxidant.
In order to preferably cause first film layer, second film layer, the third membrane layer, the 4th film layer and institute The heat conduction and sinking path for stating the 5th film layer more optimize, therefore, considering cost, weight, heat conduction and radiating effect, and In the case of surface protection performance, second film layer, the third membrane layer, the 4th film layer of an embodiment of the present invention And the 5th thicknesses of layers ratio is 1~1.5:8~12:5~7:6~10:2~2.5, in this way, first film can be caused Layer, second film layer, the third membrane layer, the 4th film layer and the heat conduction of the 5th film layer and sinking path are more excellent Change.
In order that obtain each Rotating fields, i.e., described first film layer, second film layer, the third membrane layer, the 4th film Layer and the 5th film layer are preferably fixed together, to improve structural stability can, for example, first film layer, described the Inserted tooth is provided between two film layers, the third membrane layer, the adjacent interfaces two-by-two of the 4th film layer and the 5th film layer And caulking groove, when adjacent two layers structure is bonded, inserted tooth can so cause each layer knot of the long heat sink in caulking groove Structure, i.e., described first film layer, second film layer, the third membrane layer, the 4th film layer and the 5th film layer are preferably It is fixed together, to improve structural stability can.And for example, first film layer, second film layer, the third membrane layer, institute State and be provided with buckle and neck between the adjacent interfaces two-by-two of the 4th film layer and the 5th film layer, when adjacent two layers structure is pasted During conjunction, buckle can so cause each Rotating fields of the long heat sink in the neck, i.e., described first film layer, described Second film layer, the third membrane layer, the 4th film layer and the 5th film layer are preferably fixed together, further to improve Structural stability can.
So, the first film layer, the second film layer, third membrane layer, the 4th film layer, the 5th film layer are set by being sequentially overlapped, can With obtain good insulating, the coefficient of expansion are low, thermal conductivity factor is big, good heat dissipation effect and it is light the advantages of.
Referring to Fig. 2, pedestal has host cavity, the first blower fan is provided with host cavity.For example, pedestal offers two rows Air port, including the first exhaust outlet 151 and the second exhaust outlet 152.For example, the air draft direction of the first exhaust outlet and the second exhaust outlet point Not towards first substrate and second substrate.For example, first exhaust outlet is towards the first substrate, and/or, the second row Air port is towards the second substrate.For example, be provided with negative temperature coefficient thermistor on first substrate and second substrate, its with First fans in series is in the same circuit.When the temperature on first substrate and second substrate is increased to preset value, negative temperature system The resistance decrease of number thermal resistor, the first blower fan work after the conducting of loop, the first exhaust outlet and the second exhaust outlet direction first Substrate and second substrate air-supply, so as to increase the air flow rate on first substrate and second substrate, improve first substrate and The radiating efficiency of second substrate.When the temperature on first substrate and second substrate is reduced to preset value, negative temperature coefficient thermistor power The resistance for hindering device rises, and loop shut-off, the first blower fan is stopped.In this way, in the first blower fan and negative tempperature coefficient thermistor In the presence of device, it can avoid because of first substrate and the aggregation of second substrate heat, temperature is too high to cause to be arranged on first substrate and the The component damage of two substrates, i.e., when temperature is too high, first substrate and second substrate can be improved by way of manual intervention On air flow rate so that first substrate and second substrate temperature quickly reduce.
As shown in figure 4, for example, pedestal offers power interface 101, power interface is connected with the first blower fan, for for One blower fan is powered.For example, pedestal is provided with rechargeable lithium ion batteries, the output end of rechargeable lithium ion batteries and the first blower fan Connection, the input and power interface of rechargeable lithium ion batteries, it is to fill for external power supply for being powered for the first blower fan Electric lithium ion battery charging.For example, rechargeable lithium ion batteries are additionally provided with control chip, when power interface and external power source connect When logical, control chip cut-out and the connection of the first blower fan, to cause the first blower fan to be individually connected with power interface.So, first Blower fan can both work after external power source is connected, and can also be worked under the power supply of rechargeable lithium ion batteries.
Referring to Fig. 3, in order to expand the usable floor area of radiator, for example, first substrate and the second substrate backwards of pedestal Side be provided with the 3rd substrate 160 and tetrabasal 170, i.e., the 3rd substrate and tetrabasal be arranged at pedestal backwards to first The side of substrate and second substrate, some thermal columns is provided with the 3rd substrate and tetrabasal, it is understood that into pedestal two Side is symmetrically arranged with two first substrates, two second substrates, if being provided with two first substrates and two second substrates Dry thermal column, the i.e. first substrate of pedestal both sides, second substrate and some thermal columns set connection in the same way.From And the usable floor area of radiator is expanded, when radiator is provided with LED, illumination zone also expands therewith.
For example, likewise, pedestal offers the 3rd exhaust outlet and the 4th exhaust outlet, for example, the 3rd exhaust outlet and the 4th row The air draft direction in air port is respectively facing the 3rd substrate and tetrabasal.For example, it is provided with subzero temperature on the 3rd substrate and tetrabasal Coefficient thermal resistor is spent, it is with fans in series in the same circuit.In order to avoid wasting power supply, pedestal sets up the second wind in addition The negative temperature coefficient thermistor set on machine, the second blower fan and the 3rd substrate and tetrabasal is connected in the same circuit, Also, the second blower fan and the first blower fan are individually arranged in two loops, air outlet the 3rd air draft of direction of the second blower fan Mouth and the 4th exhaust outlet.When the temperature on the 3rd substrate and tetrabasal is increased to preset value, negative tempperature coefficient thermistor The resistance decrease of device, the second blower fan work after the conducting of loop, the 3rd exhaust outlet and the 4th exhaust outlet direction the 3rd substrate and the 4th Substrate is blown, and so as to increase the air flow rate on the 3rd substrate and tetrabasal, improves the 3rd substrate and tetrabasal Radiating efficiency.When the temperature on the 3rd substrate and tetrabasal is reduced to preset value, the resistance of negative temperature coefficient thermistor Rise, loop shut-off, the second blower fan is stopped.In this way, in the presence of the second blower fan and negative temperature coefficient thermistor, It can avoid because of the 3rd substrate and the aggregation of tetrabasal heat, the too high first device for causing to be arranged on the 3rd substrate and tetrabasal of temperature Part is damaged, i.e., when temperature is too high, the air circulation on the 3rd substrate and tetrabasal can be improved by way of manual intervention Speed so that the 3rd substrate and tetrabasal temperature quickly reduce, simultaneously as the second blower fan is individually set with the first blower fan Put in two loops, when the substrate temperature rise of pedestal both sides is unequal, the asynchronous working of the second blower fan and the first blower fan, i.e., only Have when the temperature of the substrate of certain side reaches preset value, its corresponding blower fan just works and blown to the substrate, so as to reach section Save the purpose of electric energy.
So, in the presence of the first exhaust outlet to the 4th exhaust outlet, when the substrate temperature where thermal column reaches default During value, corresponding to the first exhaust outlet to the 4th exhaust outlet to thermal column region blow so that heat conduction core, external diffusion layer, with And the air velocity around fin is strengthened, to have the function that heat conduction core and external diffusion layer synchronously cool, so as to internally originally By changing the constituent of heat conduction core and external diffusion layer in matter, by improving heat conduction core and external diffusion layer in external structure Air velocity, so as to be effectively improved radiating efficiency in a manner of the combination of inner and outside, enhance radiating effect.
Referring to Fig. 4, for the ease of by pedestal equipment mounted externally or on wall, for example, pedestal is set There is external connection portion 102.For example, external connection portion is integrally formed with pedestal.For example, external connection portion is provided with the position that is spirally connected, by the position that is spirally connected by base Seat is spirally connected fixation with external equipment.For example, external connection portion is provided with welding position, pedestal is welded on by welding position and set in outside It is standby.For example, external connection portion is provided with grafting position, pedestal is plugged on external equipment by grafting position.For example, external connection portion includes the One external connection portion and the second external connection portion.For example, for example, the first external connection portion and the second external connection portion are symmetricly set on the two of power interface Side, damaged with protection power source interface from exterior object.
Referring to Fig. 5, base interior is provided with controller 180, controller is used to be connected with external power source.It is for example, described Pedestal is provided with rechargeable lithium ion batteries, and the controller is connected with the rechargeable lithium ion batteries.For example, first substrate Second substrate is provided with installing zone, wiring board 190 is fixedly installed in it, that is to say, that installing zone is used to set wiring board.Control Device is connected with wiring board, for controlling the wiring board.For example, controller is connected with the switch of outside, for according to switch State turns on or the connection of line disconnection plate and external power source.For example, some LED chips are provided with wiring board.If for example, Dry LED chip into matrix distribution in the circuit board.For example, wiring board includes first line plate and the second wiring board.For example, first Substrate 110 is provided with the first installing zone 114.For example, first line plate is arranged on the first installing zone.For example, second substrate is set There is the second installing zone.For example, the second wiring board is arranged on the second installing zone.For example, the first installing zone is arranged on the first short radiating On plate.For example, the second installing zone is arranged on the second short heat sink.For example, the first installing zone the first long heat sink of direction.Example Such as, the second long heat sink of the second installing zone direction.
Preferably, first line plate and the second wiring board are separately positioned on described the close to first substrate and second substrate One film layer position, in order on first line plate and the second wiring board heat rapidly conduction to first film layer and and then Conduct heat to outside.
In order to realize the state of intelligent control LED chip or parameter, for example, the controller also includes induction installation. For example, the base interior is provided with fixed bit, the induction installation is installed on the fixed bit.For example, the sensing dress Put and be also connected by wire with each wiring board.That is, induction installation is integrated with the power line of each wiring board, each circuit It is connected in parallel between plate.The induction installation includes what is be sequentially connected:Power module, receiving module, time delay module, processing unit And scheduling module.For example, power module is directly connected to external power source, for by the 220V voltage conversions of outside into LED chip Required driving voltage.For example, receiving module is connected by the output end with power module, the receiving module is used to receive The break-make frequency of power module and external power source simultaneously generates frequency signal.For example, frequency signal is (secondary per second) as single using p/s Position.For example, the time delay module is used to receive the frequency signal generation frequency signal value and contrasted.For example, described prolong When module preset some frequency contrast values, the frequency signal value that some frequency contrast values contrasts judge actually to receive simultaneously generates Relative process signal.For example, frequency contrast value is used as unit using p/s (secondary per second).For example, some frequency contrast value bags Include:1p/s, 2p/s, 3p/s and 4p/s.For example, when the frequency signal value that time delay module receives is 1p/s, the frequency signal Value matches with the frequency contrast value that value is 1p/s and generates normally-open process signal.For example, received when time delay module When frequency signal value is 2p/s, the frequency signal value, which is matched and generated with the frequency contrast value that value is 2p/s, closes all LED cores The process signal of piece.For example, when the frequency signal value that time delay module 413 receives is 3p/s, the frequency signal value is with value 3p/s frequency contrast value matches and generated the process signal for opening LED chip.For example, when the frequency that time delay module receives is believed When be 4p/s, the frequency signal value matches for 4p/s frequency contrast value with value and generates the place of change LED chip parameter for number value Manage signal.For example, the processing unit is used to receive the process signal, and each process signal is distributed to scheduling module.Example Such as, the scheduling module is used to receive the process signal from processing unit, and changes the shape of LED chip according to the process signal State or the parameter for adjusting LED chip.For example, when the processing unit receives normally-open process signal, the place Reason unit distributes the normally-open process signal to scheduling module, and the scheduling module receives the normally-open processing Normally-open each LED chip after signal.For example, when the processing unit receives the process signal for changing LED chip parameter, The processing unit distributes the process signal of the change LED chip parameter to scheduling module, and the scheduling module receives this Change the parameter of each LED chip after the process signal of change LED chip parameter.It should be noted that power module, reception mould It is prior art that block, time delay module, the operation principle and hardware of processing unit and scheduling module, which are formed, those skilled in the art Member can write out the control program of each unit module according to present disclosure, and the control program can be according to reality Border production needs flexibly to be changed, and therefore, the present invention repeats no more the operation principle of each unit module, hardware is formed and control Program.In this way, it is the beneficial effect of state or parameter that intelligent control LED chip can be achieved by above-mentioned induction installation.
In order to improve illumination range, for example, the first long heat sink and the second long heat sink are respectively arranged with the 3rd installing zone With the 4th installing zone, also, the 3rd installing zone and the 4th installing zone are respectively facing the first short heat sink and the second short heat sink.Example Such as, the 3rd installing zone and the 4th installing zone are respectively arranged with LED lamp panel.For example, LED lamp panel is provided with arc diffusion shell, arc Diffusion shell is stretched out bending by the kink, also, arcwall face is respectively facing the first short heat sink and the second short heat sink. In this way, in the presence of LED lamp panel, illumination range can be effectively improved.
Also referring to Fig. 6 to Fig. 9, for example, pedestal is provided with several cradle portions 104.For example, pedestal be provided with it is some Cradle portion, baffle plate 200 are connected with some cradle portions.For example, pedestal is provided with four cradle portions.For example, cradle portion one end is set In pedestal, other end edge is extended perpendicular to the direction of pedestal.For example, cradle portion is cylinder.For example, support position is used to pacify Fill baffle plate.For example, baffle plate is correspondingly arranged on several support positions.For example, baffle plate is correspondingly arranged on four support positions.For example, branch Frame position is connected with cradle portion.For example, one cradle portion of a corresponding connection in support position.For example, baffle plate setting after cradle portion, is led to The cooperation of support position and cradle portion is crossed, baffle plate is fixed on cradle portion.The fixation for example, support position and cradle portion are spirally connected.For example, institute Support position is stated to be welded and fixed with the cradle portion.
In order to avoid the object in the external world is fallen on substrate, for example, the area covering pedestal and each substrate of baffle plate.For example, gear Plate has certain radian, to fall the object on plate washer can skid off plate washer.For example, baffle plate is made of metal material. In this way, when pedestal is installed outdoors, baffle plate, which can be played effectively, prevents foreign objects substrate and thermal column, meanwhile, Contacting rain water pedestal can be prevented to a certain extent.
In order to make full use of solar cell as rechargeable lithium ion batteries, controller and wiring board power supply, for example, baffle plate It is provided with solar panel.For example, solar panel is arranged on baffle plate backwards to the side of pedestal.Pedestal is set in this way, working as Put at outdoor, can sufficiently utilize solar energy, be rechargeable lithium ion batteries charge and be controller and wiring board power supply, Realize the normal work illumination of LED chip.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality Apply all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited In contradiction, the scope that this specification is recorded all is considered to be.
Embodiment described above only expresses the several embodiments of the present invention, and its description is more specific and detailed, but simultaneously Can not therefore it be construed as limiting the scope of the patent.It should be pointed out that come for one of ordinary skill in the art Say, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention Scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.

Claims (10)

  1. A kind of 1. LED lamp, it is characterised in that including:Radiator, wiring board and baffle plate;
    The radiator includes:Pedestal, first substrate, second substrate and some thermal columns;
    The first substrate connects with the second substrate, also, the first substrate and the second substrate be arranged at it is described The same side of pedestal;
    Some thermal columns are respectively arranged on the first substrate and the second substrate;
    The pedestal is provided with some cradle portions, and the baffle plate is connected with some cradle portions;
    The first substrate and the second substrate are provided with installing zone, and the wiring board is fixedly installed in it;
    Some LED chips are provided with the wiring board;
    The wiring board includes first line plate and the second wiring board, and first substrate is provided with the first installing zone, first line plate It is arranged on the first installing zone;Second substrate is provided with the second installing zone, and the second wiring board is arranged on the second installing zone;
    Pedestal has host cavity, and the first blower fan is provided with host cavity, and pedestal offers two exhaust outlets, including the first exhaust outlet With the second exhaust outlet, first exhaust outlet towards the first substrate, and/or, second exhaust outlet is towards described second The air draft direction of substrate, the first exhaust outlet and the second exhaust outlet is respectively facing first substrate and second substrate, first substrate and Negative temperature coefficient thermistor is provided with two substrates, it is with the first fans in series in the same circuit;
    Pedestal is provided with the 3rd substrate and tetrabasal, the 3rd substrate and the 4th backwards to the side of first substrate and second substrate Some thermal columns are provided with substrate;Pedestal offers the 3rd exhaust outlet and the 4th exhaust outlet, the 3rd exhaust outlet and the 4th air draft The air draft direction of mouth is respectively facing the 3rd substrate and tetrabasal, and negative temperature coefficient heat is provided with the 3rd substrate and tetrabasal Sensitive resistor, it is with fans in series in the same circuit;Pedestal sets up the second blower fan, the second blower fan and the 3rd substrate and the 4th base The negative temperature coefficient thermistor set on plate is connected in the same circuit, also, the second blower fan and the first blower fan are single respectively Solely it is arranged in two loops, air outlet direction the 3rd exhaust outlet and the 4th exhaust outlet of the second blower fan.
  2. 2. LED lamp according to claim 1, it is characterised in that described cradle portion one end is arranged at the pedestal, another End edge is extended perpendicular to the direction of the pedestal.
  3. 3. LED lamp according to claim 2, it is characterised in that the pedestal is provided with four cradle portions.
  4. 4. LED lamp according to claim 3, it is characterised in that the cradle portion is cylinder.
  5. 5. LED lamp according to claim 4, it is characterised in that the baffle plate is correspondingly arranged on several support positions.
  6. 6. LED lamp according to claim 5, it is characterised in that the baffle plate is correspondingly arranged on four support positions.
  7. 7. LED lamp according to claim 6, it is characterised in that the support position is connected with the cradle portion.
  8. 8. LED lamp according to claim 7, it is characterised in that one cradle portion of the corresponding connection in the support position.
  9. 9. LED lamp according to claim 8, it is characterised in that the support position and the cradle portion are spirally connected fixation.
  10. 10. LED lamp according to claim 8, it is characterised in that the support position is welded and fixed with the cradle portion.
CN201510413507.4A 2015-07-14 2015-07-14 Led lamp Active CN105135233B (en)

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CN102278612A (en) * 2010-06-11 2011-12-14 液光固态照明股份有限公司 Light emitting diode (LED) illumination lamp
CN202118623U (en) * 2011-06-21 2012-01-18 深圳市卓明光电有限公司 Outdoor LED lamp
CN203797604U (en) * 2014-04-11 2014-08-27 王向东 Radiator for LED lamp

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CN201475902U (en) * 2009-09-04 2010-05-19 郑州光华灯具有限公司 LED street lamp housing and LED street lamp structure including same
CN102278612A (en) * 2010-06-11 2011-12-14 液光固态照明股份有限公司 Light emitting diode (LED) illumination lamp
CN202118623U (en) * 2011-06-21 2012-01-18 深圳市卓明光电有限公司 Outdoor LED lamp
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