CN207573703U - A kind of single-sided circuit board - Google Patents
A kind of single-sided circuit board Download PDFInfo
- Publication number
- CN207573703U CN207573703U CN201721716293.9U CN201721716293U CN207573703U CN 207573703 U CN207573703 U CN 207573703U CN 201721716293 U CN201721716293 U CN 201721716293U CN 207573703 U CN207573703 U CN 207573703U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- heat dissipation
- heat
- dissipation cavity
- bayonet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a kind of single-sided circuit boards, certain damage can be generated in the heat that the course of work generates to circuit board and its component by solving the component mounted on circuit board, the problem of so as to influence the service life of component or even monoblock circuit board, its key points of the technical solution are that：Including circuit board body, multiple heat dissipation cavities arranged in parallel are equipped in circuit board body, electric-insulation heat-conduction body is filled in heat dissipation cavity；The circuit board body back side is equipped with the bayonet that setting is connected with heat dissipation cavity, and bayonet is laid with direction along heat dissipation cavity and is extended；Bayonet is connected with cooling fin, has the heat-sinking capability of enhancing circuit board, improves the effect of circuit board service life.
Description
Technical field
The utility model is related to a kind of circuit board, more specifically, it relates to a kind of single-sided circuit board.
Background technology
At present, with the rapid development of electronic technology, circuit board also develops into surface patch by the via assembly ware at initial stage
Fill device (SMD, Surface Mounted Devices).With the development of SMD technologies, circuit board realize packing density it is high,
The advantages that electronic product is small, light-weight.
However, the component mounted on circuit board can generate circuit board and its component in the heat that the course of work generates
How certain damage so as to influence the service life of component or even monoblock circuit board, therefore, enhances the heat radiation energy of circuit board
Power is that we need urgently to solve the problems, such as at present.
Utility model content
The purpose of this utility model is to provide a kind of single-sided circuit board, has the heat-sinking capability of enhancing circuit board, improves electricity
The effect of road plate service life.
The above-mentioned technical purpose of the utility model technical scheme is that：A kind of single-sided circuit board,
Including circuit board body, multiple heat dissipation cavities arranged in parallel are equipped in circuit board body, electric-insulation heat-conduction is filled in heat dissipation cavity
Body；The circuit board body back side is equipped with the bayonet that setting is connected with heat dissipation cavity, and bayonet is laid with direction along heat dissipation cavity and is extended；Bayonet card
It is connected to cooling fin.
By using above-mentioned technical proposal, using electric-insulation heat-conduction body, convenient for the positive electric appliance member of circuit board body will be located at
In the heat transfer to cooling fin that part generates during the work time；Using cooling fin, convenient for by the heat in electric-insulation heat-conduction body
It distributes, enhances the heat-sinking capability of circuit board body, improve the service life of single-sided circuit board；Utilize cooling fin and bayonet
Clamping convenient for the filling of electric-insulation heat-conduction body, during single-sided circuit board use, reduces electric-insulation heat-conduction body drain and goes out heat dissipation
Chamber happens.
The utility model is further arranged to：The heat dissipation cavity is the rectangular cavities of bar shaped.
By using above-mentioned technical proposal, the positive heat transfer of circuit board body is arrived into cooling fin in electric-insulation heat-conduction body
In the process, the heat transfer rate inside electric-insulation heat-conduction body is made more to be uniformly distributed, improves the practicability of electric-insulation heat-conduction body.
The utility model is further arranged to：The symmetrical inner wall of the bayonet is equipped with arc-shaped concave, arc-shaped concave edge card
Mouth is laid with direction and is extended；Cooling fin side is equipped with the arc convex of fitting corresponding with arc-shaped concave.
By using above-mentioned technical proposal, be bonded using arc convex with arc-shaped concave, convenient for cooling fin installation with tearing open
It unloads.
The utility model is further arranged to：The arc convex is equipped with insulation glue-line.
By using above-mentioned technical proposal so that cooling fin is clamped with bayonet more to be stablized.
The utility model is further arranged to：The cooling fin is copper sheet or aluminium flake.
By using above-mentioned technical proposal, using copper sheet or aluminium flake, feelings of the cooling fin with enough heat dissipation performances are being ensured
Under condition, the input cost of single-sided circuit board is reduced.
The utility model is further arranged to：The electric-insulation heat-conduction body is thermal conductive silicon colloid.
By using above-mentioned technical proposal, using scleroid performance after thermal conductive silicon colloid solidification, circuit board body is reduced
What is be broken off in use happens.
The utility model is further arranged to：The electric-insulation heat-conduction body is heat-conducting silicone grease body.
By using above-mentioned technical proposal, using heat-conducting silicone grease body, during heat-conducting silicone grease body carries out hot transmission, subtract
Few electric-insulation heat-conduction body weakens happening for heat conductivility when by oxidation.
The utility model is further arranged to：The distance between adjacent described heat dissipation cavity is thick not less than two doubling circuit plate bodys
Degree.
By using above-mentioned technical proposal, in the case where enhancing circuit board body heat-sinking capability, circuit board body is avoided because strong
It spends relatively low and what is be broken off happens, improves the stability that single-sided circuit board uses.
The utility model is further arranged to：The thickness of the thickness of the cooling fin, the height of heat dissipation cavity and circuit board body
Ratio be：1：1：4.
By using above-mentioned technical proposal, during electric elements, reduce that circuit board body is breakdown to be happened, carry
The reliability that high single-sided circuit board uses.
In conclusion the utility model has the advantages that：Using electric-insulation heat-conduction body, convenient for circuit board will be located at
In the heat transfer to cooling fin that the positive electric elements of body generate during the work time；Using cooling fin, convenient for that will be electrically insulated
Heat in heat carrier distributes；It is clamped using cooling fin and bayonet, convenient for the filling of electric-insulation heat-conduction body, reduces electrical isolation
Heat carrier leaks out happening for heat dissipation cavity；Using copper sheet or aluminium flake, the input cost of single-sided circuit board is reduced.
Description of the drawings
Fig. 1 is the overall structure diagram in embodiment.
In figure：1st, circuit board body；2nd, heat dissipation cavity；3rd, electric-insulation heat-conduction body；4th, bayonet；5th, cooling fin；6th, arc convex；7、
Arc-shaped concave；8th, insulate glue-line.
Specific embodiment
The utility model is described in further detail below in conjunction with attached drawing.
Embodiment：A kind of single-sided circuit board, as shown in Figure 1, being equipped with including circuit board body 1, in circuit board body 1 multiple mutual
The heat dissipation cavity 2 being arranged in parallel, can increase or decrease the quantity of heat dissipation cavity 2 according to the size of circuit board body 1, in the present embodiment
Using three along the equally distributed heat dissipation cavity 2 of 1 long side direction of circuit board body, heat dissipation cavity 2 is interior to be filled with electric-insulation heat-conduction body 3.Electricity
Plate body 1 back side in road is equipped with the bayonet 4 that setting is connected with heat dissipation cavity 2, each heat dissipation cavity 2 is correspondingly provided with a bayonet 4, bayonet 4
Direction is laid with along heat dissipation cavity 2 to be extended；Bayonet 4 is connected with cooling fin 5.Using electric-insulation heat-conduction body 3, convenient for circuit will be located at
In the heat transfer to cooling fin 5 that 1 positive electric elements of plate body generate during the work time；Using cooling fin 5, convenient for will be electric
Heat in insulating thermal conductor 3 distributes, and enhances the heat-sinking capability of circuit board body 1, improves the use of single-sided circuit board
Service life；It is clamped using cooling fin 5 and bayonet 4, convenient for the filling of electric-insulation heat-conduction body 3, during single-sided circuit board use,
It reduces electric-insulation heat-conduction body 3 and leaks out happening for heat dissipation cavity 2.
Heat dissipation cavity 2 is the rectangular cavities of bar shaped, in electric-insulation heat-conduction body 3 by 1 positive heat transfer of circuit board body to scattered
During backing 5, the heat transfer rate inside electric-insulation heat-conduction body 3 is made more to be uniformly distributed, improve electric-insulation heat-conduction body 3
Practicability.
The symmetrical inner wall of bayonet 4 is equipped with arc-shaped concave 7, and arc-shaped concave 7 is laid with direction along bayonet 4 and is extended；Heat dissipation
5 side of piece is equipped with the arc convex 6 with 7 corresponding fitting of arc-shaped concave.It is bonded using arc convex 6 with arc-shaped concave 7, convenient for dissipating
The installation and dismounting of backing 5.
Arc convex 6 is pasted with insulation glue-line 8 so that cooling fin 5 is clamped with bayonet 4 more to be stablized.
Cooling fin 5 is copper sheet or aluminium flake, and copper sheet is used in the present embodiment；Using copper sheet or aluminium flake, ensuring that cooling fin 5 has
In the case of there are enough heat dissipation performances, the input cost of single-sided circuit board is reduced.
Electric-insulation heat-conduction body 3 is thermal conductive silicon colloid or heat-conducting silicone grease body, and thermal conductive silicon colloid is used in the present embodiment.Using leading
Scleroid performance after hot colloidal silica solidification, what reduction circuit board body 1 was broken off in use happens.Using leading
Hot silicone grease body during heat-conducting silicone grease body carries out hot transmission, reduces electric-insulation heat-conduction body 3 and weakens thermal conductivity when by oxidation
Energy happens.
The distance between adjacent heat radiation chamber 2 is not less than two doubling circuit plate bodys, 1 thickness, in the present embodiment adjacent heat radiation chamber 2 it
Between distance use two doubling circuit plate bodys, 1 thickness.In the case where enhancing 1 heat-sinking capability of circuit board body, avoid circuit board body 1 because
Intensity is relatively low and what is be broken off happens, and improves the stability that single-sided circuit board uses.
The ratio of the thickness of the thickness of cooling fin 5, the height of heat dissipation cavity 2 and circuit board body 1 is：1：1：4, in electric elements
In the process, it reduces that circuit board body 1 is breakdown happens, improves the reliability that single-sided circuit board uses.
The course of work：When electric elements generate heat during the work time, transferred heat to by electric-insulation heat-conduction body 3
On cooling fin 5；Then it is distributed by 5 heat of cooling fin；It is clamped using cooling fin 5 and bayonet 4, convenient for electric-insulation heat-conduction body
3 filling reduces electric-insulation heat-conduction body 3 and leaks out happening for heat dissipation cavity 2；Using copper sheet or aluminium flake, single-sided circuit board is reduced
Input cost.
This specific embodiment is only explanation to the utility model, is not the limitation to the utility model, ability
Field technique personnel can as needed make the present embodiment the modification of no creative contribution after this specification is read, but
As long as it is all protected in the right of the utility model by Patent Law.
Claims (9)
1. a kind of single-sided circuit board, it is characterized in that：Including circuit board body (1), set in circuit board body (1) equipped with multiple be mutually parallel
The heat dissipation cavity (2) put, heat dissipation cavity (2) is interior to be filled with electric-insulation heat-conduction body (3)；Circuit board body (1) back side is equipped with and heat dissipation cavity (2)
The bayonet (4) of setting is connected, bayonet (4) is laid with direction along heat dissipation cavity (2) and is extended；Bayonet (4) is connected with cooling fin (5).
2. a kind of single-sided circuit board according to claim 1, it is characterized in that：The heat dissipation cavity (2) is the rectangular cavity of bar shaped
Body.
3. a kind of single-sided circuit board according to claim 1, it is characterized in that：The symmetrical inner wall of the bayonet (4) is equipped with
Arc-shaped concave (7), arc-shaped concave (7) are laid with direction along bayonet (4) and are extended；Cooling fin (5) side is equipped with and arc-shaped concave
(7) arc convex (6) of corresponding fitting.
4. a kind of single-sided circuit board according to claim 3, it is characterized in that：The arc convex (6) is equipped with insulation glue-line
(8)。
5. a kind of single-sided circuit board according to claim 1, it is characterized in that：The cooling fin (5) is copper sheet or aluminium flake.
6. a kind of single-sided circuit board according to claim 1, it is characterized in that：The electric-insulation heat-conduction body (3) is thermal conductive silicon
Colloid.
7. a kind of single-sided circuit board according to claim 1, it is characterized in that：The electric-insulation heat-conduction body (3) is thermal conductive silicon
Fat body.
8. a kind of single-sided circuit board according to claim 1, it is characterized in that：The distance between adjacent described heat dissipation cavity (2)
Not less than two doubling circuit plate body (1) thickness.
9. a kind of single-sided circuit board according to claim 1, it is characterized in that：The thickness of the cooling fin (5), heat dissipation cavity
(2) height and the ratio of the thickness of circuit board body (1) be：1：1：4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721716293.9U CN207573703U (en) | 2017-12-08 | 2017-12-08 | A kind of single-sided circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721716293.9U CN207573703U (en) | 2017-12-08 | 2017-12-08 | A kind of single-sided circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207573703U true CN207573703U (en) | 2018-07-03 |
Family
ID=62686758
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721716293.9U Expired - Fee Related CN207573703U (en) | 2017-12-08 | 2017-12-08 | A kind of single-sided circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207573703U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109565930A (en) * | 2018-10-31 | 2019-04-02 | 北京比特大陆科技有限公司 | Circuit board and supercomputer equipment |
-
2017
- 2017-12-08 CN CN201721716293.9U patent/CN207573703U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109565930A (en) * | 2018-10-31 | 2019-04-02 | 北京比特大陆科技有限公司 | Circuit board and supercomputer equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180703 Termination date: 20181208 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |