CN209472832U - A kind of good CEM-3 copper-clad plate of thermal diffusivity - Google Patents
A kind of good CEM-3 copper-clad plate of thermal diffusivity Download PDFInfo
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- CN209472832U CN209472832U CN201822240345.0U CN201822240345U CN209472832U CN 209472832 U CN209472832 U CN 209472832U CN 201822240345 U CN201822240345 U CN 201822240345U CN 209472832 U CN209472832 U CN 209472832U
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- heat dissipating
- dissipating layer
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- copper
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Abstract
The utility model provides a kind of good CEM-3 copper-clad plate of thermal diffusivity, including substrate and the laminating copper foil layer in substrate top surface, insulating layer, the first heat dissipating layer and the second heat dissipating layer are successively arranged below substrate, the fitting Nian Jie with substrate top surface of insulating layer top surface, the top surface of first heat dissipating layer and the bottom surface of insulating layer it is Nian Jie fitting, first heat dissipating layer bottom surface is fixed with the thermal column being distributed in matrix, thermal column is distributed in the bottom surface of the first heat dissipating layer, and thermal column is structure as a whole with the first heat dissipating layer and the first heat dissipating layer and thermal column are made of graphene；Second heat dissipating layer top surface is adhesively fixed with thermal column bottom surface, and the second heat dissipating layer is equipped with the heat release hole in matrix distribution, and heat release hole is distributed in the second heat dissipating layer top surface；Its structure novel has good heat dissipation performance, and degumming situation caused by can effectivelying prevent because of high temperature extends the service life of copper-clad plate, and can prevent electronic component due to temperature is excessively high caused by damage, extend the service life of electronic component.
Description
Technical field
The utility model relates to copper-clad plate fields, more particularly to a kind of good CEM-3 copper-clad plate of thermal diffusivity.
Background technique
Currently, some highly exothermic electronic components are also increasingly widely used, example with the development of electronic component
Such as LED (semiconductor light-emitting-diode), these highly exothermic electronic components are because thermal discharge is big, to the heat-resisting of copper-clad plate
Property it is more demanding, that is, require copper-clad plate have good heat dissipation performance be just able to satisfy installing and using for such electronic component
Demand, and existing structure for covering copper plate is simple, heat dissipation performance is unable to reach demand, if installed and used reluctantly, be easy to cause electricity
The damage of sub- component, service life are short.
Utility model content
In order to overcome the drawbacks of the prior art, the technical problem to be solved by the utility model is to propose a kind of thermal diffusivity
Good CEM-3 copper-clad plate, structure novel have good heat dissipation performance, degumming feelings caused by can effectivelying prevent because of high temperature
Condition extends the service life of copper-clad plate, and can prevent electronic component due to temperature is excessively high caused by damage, extend electronics member device
The service life of part.
For this purpose, the following technical solution is employed for the utility model:
The utility model provides a kind of good CEM-3 copper-clad plate of thermal diffusivity, including substrate and laminating in the substrate
The copper foil layer of top surface is successively arranged insulating layer, the first heat dissipating layer and the second heat dissipating layer, the insulating layer top below the substrate
Face fitting Nian Jie with the substrate top surface, the fitting Nian Jie with the bottom surface of the insulating layer of the top surface of first heat dissipating layer are described
First heat dissipating layer bottom surface is fixed with the thermal column being distributed in matrix, and the thermal column is distributed in the bottom of first heat dissipating layer
Face, the thermal column and first heat dissipating layer are structure as a whole and first heat dissipating layer and the thermal column are by graphite
Alkene is made；Second heat dissipating layer top surface is adhesively fixed with the thermal column bottom surface, and it is in matrix that second heat dissipating layer, which is equipped with,
The heat release hole of distribution, the heat release hole are distributed in second heat dissipating layer top surface.
In the preferable technical solution of the utility model, the substrate bottom surface is equipped with a plurality of radiating groove, and the radiating groove is equal
Even interval setting.
In the preferable technical solution of the utility model, the diameter of the heat release hole is less than the diameter of the thermal column.
In the preferable technical solution of the utility model, second heat dissipating layer is made of aluminium alloy.
In the preferable technical solution of the utility model, the insulating layer is made of thermosetting phenolic resin.
The utility model has the following beneficial effects:
The good CEM-3 copper-clad plate of a kind of thermal diffusivity provided by the utility model, structure novel, the first heat dissipating layer and
The design of two heat dissipating layers can make entire CEM-3 copper-clad plate have good heat dissipation performance, wherein the first heat dissipating layer is equipped with heat dissipation
Column, the second heat dissipating layer is equipped with heat release hole, and the first heat dissipating layer and thermal column are made of the good graphene of thermal conductivity, can be into one
Step improves heat dissipation performance, and degumming situation caused by can effectivelying prevent because of high temperature under overall co-ordination extends the service life of copper-clad plate,
And can prevent electronic component due to temperature is excessively high caused by damage, extend the service life of electronic component；And insulating layer
Design can prevent from electrically conducting between the first heat dissipating layer and copper foil layer, prevent electrical leakage problems, reduce security risk.
Detailed description of the invention
Fig. 1 is a kind of structure of the good CEM-3 copper-clad plate of thermal diffusivity disclosed in specific embodiment of the utility model
Schematic diagram.
In figure:
100, substrate；110, radiating groove；200, copper foil layer；300, insulating layer；400, the first heat dissipating layer；410, thermal column；
500, the second heat dissipating layer；510, heat release hole.
Specific embodiment
Further illustrate the technical solution of the utility model below with reference to the accompanying drawings and specific embodiments.
As shown in Figure 1, a kind of good CEM-3 copper-clad plate of thermal diffusivity is disclosed in specific embodiment of the utility model,
Including substrate 100 and the laminating copper foil layer 200 in 100 top surface of substrate, the lower section of the substrate 100 is successively arranged insulating layer
300, the first heat dissipating layer 400 and the second heat dissipating layer 500,300 top surface of the insulating layer fitting Nian Jie with 100 top surface of substrate,
The fitting Nian Jie with the bottom surface of the insulating layer 300 of the top surface of first heat dissipating layer 400,400 bottom surface of the first heat dissipating layer are solid
The fixed thermal column 410 being equipped in matrix distribution, the thermal column 410 is distributed in the bottom surface of first heat dissipating layer 400, described to dissipate
Plume 410 and first heat dissipating layer 400 are structure as a whole and first heat dissipating layer 400 and the thermal column 410 are by stone
Black alkene is made；Second heat dissipating layer, 500 top surface is adhesively fixed with 410 bottom surface of thermal column, on second heat dissipating layer 500
Equipped with the heat release hole 510 in matrix distribution, the heat release hole 510 is distributed in 500 top surface of the second heat dissipating layer.
A kind of good CEM-3 copper-clad plate of above-mentioned thermal diffusivity, structure novel, first heat dissipating layer 400 and described
The design of second heat dissipating layer 500 can make entire CEM-3 copper-clad plate have good heat dissipation performance, wherein first heat dissipating layer
400 are equipped with the thermal column 410, and second heat dissipating layer 500 is equipped with the heat release hole 510, and first heat dissipating layer
400 and the thermal column 510 be made of the good graphene of thermal conductivity, can further improve heat dissipation performance, can under overall co-ordination
Degumming situation caused by effectivelying prevent because of high temperature extends the service life of copper-clad plate, and electronic component can be prevented because of temperature mistake
It is high and caused by damage, extend the service life of electronic component；And the design of the insulating layer 300 can prevent described first to dissipate
It electrically conducts between thermosphere 400 and the copper foil layer 200, prevents electrical leakage problems, reduce security risk.
Further, 100 bottom surface of substrate is equipped with a plurality of radiating groove 110,110 uniform intervals of the radiating groove setting；
Closer to electronic component, heat is transferred on the substrate 100 substrate 100 first heat dissipating layer 400 first, because
The design of this radiating groove 110 can carry out certain diffusion to heat, further increase whole heat dissipation performance.
Further, the diameter of the heat release hole 510 is less than the diameter of the thermal column 410；The structure setting can prevent
The heat release hole 510, just at coaxial line state, avoids the thermal column 410 from filling in the heat dissipation with the thermal column 410
In hole 510, therefore the thermal column 410 and 500 top surface of the second heat dissipating layer can be increased and be directly adhesively fixed area, enhancing
Connective stability between first heat dissipating layer 400 and second heat dissipating layer 500.
Further, second heat dissipating layer 500 is made of aluminium alloy；Second heat dissipating layer 500 is made of aluminium alloy
On the one hand the good heating conduction of aluminium alloy can be utilized, guarantees that second heat dissipating layer 500 can provide preferable heat dissipation effect, separately
On the one hand the overall structural strength that CEM-3 copper-clad plate then can be improved prevents CEM-3 copper-clad plate to be broken or damage easily.
Further, the insulating layer 300 is made of thermosetting phenolic resin；It is that size is steady that Bakeland, which has,
Fixed, heat-resisting, fire-retardant, the advantages that electrical insulation capability is good etc., the insulating layer 300 is made of the material can guarantee excellent insulation
Performance, and and certain heat-resisting, flame retardant effect are provided outside.
The utility model is described with reference to the preferred embodiments, and those skilled in the art know, is not departing from this reality
In the case where with novel spirit and scope, various changes or equivalence replacement can be carried out to these features and embodiment.This reality
It is not limited to the particular embodiment disclosed with novel, other embodiments fallen into claims hereof all belong to
In the range of the utility model protection.
Claims (5)
1. a kind of good CEM-3 copper-clad plate of thermal diffusivity, including substrate (100) and the laminating copper in the substrate (100) top surface
Layers of foil (200), it is characterised in that:
Insulating layer (300), the first heat dissipating layer (400) and the second heat dissipating layer (500) are successively arranged below the substrate (100),
Insulating layer (300) the top surface fitting Nian Jie with the substrate (100) top surface, the top surface of first heat dissipating layer (400) and institute
The bottom surface bonding fitting of insulating layer (300) is stated, the first heat dissipating layer (400) bottom surface is fixed with the thermal column being distributed in matrix
(410), the thermal column (410) is distributed in the bottom surface of first heat dissipating layer (400), the thermal column (410) and described the
One heat dissipating layer (400) is structure as a whole and first heat dissipating layer (400) and the thermal column (410) are made of graphene；
Second heat dissipating layer (500) top surface is adhesively fixed with the thermal column (410) bottom surface, sets on second heat dissipating layer (500)
There is the heat release hole (510) in matrix distribution, the heat release hole (510) is distributed in the second heat dissipating layer (500) top surface.
2. the good CEM-3 copper-clad plate of a kind of thermal diffusivity according to claim 1, it is characterised in that:
Substrate (100) bottom surface is equipped with a plurality of radiating groove (110), radiating groove (110) the uniform intervals setting.
3. the good CEM-3 copper-clad plate of a kind of thermal diffusivity according to claim 1, it is characterised in that:
The diameter of the heat release hole (510) is less than the diameter of the thermal column (410).
4. the good CEM-3 copper-clad plate of a kind of thermal diffusivity according to claim 1, it is characterised in that:
Second heat dissipating layer (500) is made of aluminium alloy.
5. the good CEM-3 copper-clad plate of a kind of thermal diffusivity according to claim 1, it is characterised in that:
The insulating layer (300) is made of thermosetting phenolic resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822240345.0U CN209472832U (en) | 2018-12-28 | 2018-12-28 | A kind of good CEM-3 copper-clad plate of thermal diffusivity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822240345.0U CN209472832U (en) | 2018-12-28 | 2018-12-28 | A kind of good CEM-3 copper-clad plate of thermal diffusivity |
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| CN209472832U true CN209472832U (en) | 2019-10-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201822240345.0U Active CN209472832U (en) | 2018-12-28 | 2018-12-28 | A kind of good CEM-3 copper-clad plate of thermal diffusivity |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112248579A (en) * | 2020-10-20 | 2021-01-22 | 赣州烨森电子科技有限公司 | Corrosion-resistant copper-clad plate |
-
2018
- 2018-12-28 CN CN201822240345.0U patent/CN209472832U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112248579A (en) * | 2020-10-20 | 2021-01-22 | 赣州烨森电子科技有限公司 | Corrosion-resistant copper-clad plate |
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