CN209472833U - A kind of high shockproof aluminum-based copper-clad plate of heat dissipation - Google Patents
A kind of high shockproof aluminum-based copper-clad plate of heat dissipation Download PDFInfo
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- CN209472833U CN209472833U CN201822240469.9U CN201822240469U CN209472833U CN 209472833 U CN209472833 U CN 209472833U CN 201822240469 U CN201822240469 U CN 201822240469U CN 209472833 U CN209472833 U CN 209472833U
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Abstract
A kind of high shockproof aluminum-based copper-clad plate of heat dissipation provided by the utility model, including substrate and the laminating copper foil layer in substrate top surface, insulating layer is successively arranged below substrate, heat dissipating layer, aluminium sheet and shakeproof layer, insulating layer is made of heat conductive rubber, insulating layer is in grid plate, the top surface of insulating layer and the bottom surface of substrate are adhesively fixed, the bottom surface of insulating layer and the top surface of heat dissipating layer are adhesively fixed, the bottom surface of heat dissipating layer is fixed with a plurality of heat dissipation raised line, the raised line uniform intervals that radiate are arranged, heat dissipation raised line is structure as a whole with heat dissipating layer, the top surface of aluminium sheet and the bottom surface of heat dissipation raised line are adhesively fixed, the bottom surface of aluminium sheet and the top surface of shakeproof layer are adhesively fixed, shakeproof layer is silica gel foamed board；It has good heat dissipation performance, the degumming situation caused by the high temperature can be effectively prevent and can prevent electronic component due to temperature is excessively high caused by damage；And the problem of having buffering, shockproof properties, can effectively preventing copper-clad plate from fracture, damage occurring easily, extend the service life of copper-clad plate.
Description
Technical field
The utility model relates to copper-clad plate fields, more particularly to a kind of high shockproof aluminum-based copper-clad plate of heat dissipation.
Background technique
Currently, some highly exothermic electronic components are also increasingly widely used, example with the development of electronic component
Such as LED (semiconductor light-emitting-diode), these highly exothermic electronic components are because thermal discharge is big, to the heat-resisting of copper-clad plate
Property it is more demanding, that is, require copper-clad plate have good heat dissipation performance be just able to satisfy installing and using for such electronic component
Demand, and existing structure for covering copper plate is simple, heat dissipation performance is unable to reach demand, if installed and used reluctantly, be easy to cause electricity
The damage of sub- component, and existing copper-clad plate does not have buffering, shockproof effect, the problem of being easy to appear fracture, damage, makes
It is short with the service life.
Utility model content
In order to overcome the drawbacks of the prior art, the technical problem to be solved by the utility model is to propose a kind of high heat dissipation
Shockproof aluminum-based copper-clad plate, structure novel have good heat dissipation performance, degumming situation caused by can effectivelying prevent because of high temperature,
Extend copper-clad plate service life, and can prevent electronic component due to temperature is excessively high caused by damage；And has buffering, shockproof
Performance can effectively prevent copper-clad plate from the problem of being broken, damaging occurring easily, extend the service life of copper-clad plate.
For this purpose, the following technical solution is employed for the utility model:
A kind of shockproof aluminum-based copper-clad plate of high heat dissipation provided by the utility model, including substrate and laminating in the substrate top surface
Copper foil layer, be successively arranged insulating layer, heat dissipating layer, aluminium sheet and shakeproof layer below the substrate, the insulating layer is by thermally conductive rubber
Glue is made, and the insulating layer is in grid plate, and the top surface of the insulating layer and the bottom surface of the substrate are adhesively fixed, the insulation
The bottom surface of layer and the top surface of the heat dissipating layer are adhesively fixed, and the bottom surface of the heat dissipating layer is fixed with a plurality of heat dissipation raised line, described
Radiate the setting of raised line uniform intervals, the heat dissipation raised line is structure as a whole with the heat dissipating layer, the top surface of the aluminium sheet with it is described
The bottom surface of heat dissipation raised line is adhesively fixed, and the bottom surface of the aluminium sheet and the top surface of the shakeproof layer are adhesively fixed, and the shakeproof layer is
Silica gel foamed board.
In the preferable technical solution of the utility model, the top surface of the shakeproof layer is convexly equipped with the spherical crown shape being distributed in matrix
Protrusion, the protrusion is distributed in the top surface of the shakeproof layer.
In the preferable technical solution of the utility model, the aluminium sheet is equipped with the heat release hole in matrix distribution, described to dissipate
Hot hole is distributed in the top surface of the aluminium sheet.
In the preferable technical solution of the utility model, the heat dissipating layer and the heat dissipation raised line are made of graphene.
The utility model has the following beneficial effects:
A kind of high shockproof aluminum-based copper-clad plate of heat dissipation provided by the utility model, structure novel, heat dissipating layer, radiate raised line
Design can make whole aluminum-based copper-clad plate have good heat dissipation performance, degumming situation caused by can effectivelying prevent because of high temperature, extend
The service life of copper-clad plate, and can prevent electronic component due to temperature is excessively high caused by damage；And insulating layer is by heat conductive rubber
Manufactured fenestral fabric can provide certain heat dissipation effect while having buffering, shockproof properties, and be foamed by silica gel
The design of shakeproof layer made of plate can further improve shockproof properties, effectively can prevent copper-clad plate from sending out easily under overall co-ordination
The problem of raw fracture, damage, extend the service life of copper-clad plate.
Detailed description of the invention
Fig. 1 is a kind of structural representation of the high shockproof aluminum-based copper-clad plate of heat dissipation provided in specific embodiment of the utility model
Figure；
Fig. 2 is the top view of the insulating layer provided in specific embodiment of the utility model.
In figure:
100, substrate；200, copper foil layer；300, insulating layer；400, heat dissipating layer；410, radiate raised line；500, aluminium sheet；510,
Heat release hole；600, shockproof plate；610, raised.
Specific embodiment
Further illustrate the technical solution of the utility model below with reference to the accompanying drawings and specific embodiments.
It is described as shown in Figure 1, Figure 2, a kind of high shockproof aluminum-based copper-clad plate of heat dissipation is disclosed in specific embodiment of the utility model,
Including substrate 100 and the laminating copper foil layer 200 in 100 top surface of substrate, the lower section of the substrate 100 is successively arranged insulating layer
300, heat dissipating layer 400, aluminium sheet 500 and shakeproof layer 600, the insulating layer 300 are made of heat conductive rubber, and the insulating layer 300 is in
Grid plate, the top surface of the insulating layer 300 and the bottom surface of the substrate 100 are adhesively fixed, the bottom surface of the insulating layer 300 with
The top surface of the heat dissipating layer 400 is adhesively fixed, and the bottom surface of the heat dissipating layer 400 is fixed with a plurality of heat dissipation raised line 410, described to dissipate
Hot 410 uniform intervals of raised line setting, the heat dissipation raised line 410 are structure as a whole with the heat dissipating layer 400, the aluminium sheet 500
Top surface and the bottom surface of the heat dissipation raised line 410 are adhesively fixed, and the top surface of the bottom surface of the aluminium sheet 500 and the shakeproof layer 600 is viscous
Fixation is connect, the shakeproof layer 600 is silica gel foamed board.
A kind of above-mentioned high shockproof aluminum-based copper-clad plate of heat dissipation, structure novel, the heat dissipating layer 400, the heat dissipation raised line
410 design can make whole aluminum-based copper-clad plate have good heat dissipation performance, degumming situation caused by can effectivelying prevent because of high temperature,
Extend copper-clad plate service life, and can prevent electronic component due to temperature is excessively high caused by damage；And the insulating layer 300
The fenestral fabric made of heat conductive rubber can provide certain heat dissipation effect while having buffering, shockproof properties, and
The design of the shakeproof layer 600 made of silica gel foamed board can further improve shockproof properties, can be effective under overall co-ordination
Prevent copper-clad plate occur easily fracture, damage the problem of, extend the service life of copper-clad plate.
Further, the top surface of the shakeproof layer 600 is convexly equipped with the protrusion 610 of the spherical crown shape in matrix distribution, described convex
Play 610 top surfaces for being distributed in the shakeproof layer 600；Raised 610 design can increase the shakeproof layer 600 and the aluminium sheet
Bond area when 500 fitting, to further strengthen the connection between the shakeproof layer 600 and the aluminium sheet 500.
Further, the aluminium sheet 500 is equipped with the heat release hole 510 in matrix distribution, and the heat release hole 510 is distributed in institute
State the top surface of aluminium sheet 500；The design of the heat release hole 510 can further improve heat dissipation effect, accelerate radiating rate, to improve
Whole heat dissipation performance.
Further, the heat dissipating layer 400 and the heat dissipation raised line 410 are made of graphene；Graphene has fabulous
Heating conduction, graphene have extraordinary heat-conductive characteristic, and pure flawless single-layer graphene is thermally conductive system so far
The highest carbon material of number, therefore can provide efficiently using the heat dissipating layer 400 made of graphene and the heat dissipation raised line 410
Thermally conductive, heat dissipation effect guarantees whole heat dissipation performance.
The utility model is described with reference to the preferred embodiments, and those skilled in the art know, is not departing from this reality
In the case where with novel spirit and scope, various changes or equivalence replacement can be carried out to these features and embodiment.This reality
It is not limited to the particular embodiment disclosed with novel, other embodiments fallen into claims hereof all belong to
In the range of the utility model protection.
Claims (4)
1. a kind of high shockproof aluminum-based copper-clad plate of heat dissipation, including substrate (100) and the laminating copper foil layer in the substrate (100) top surface
(200), it is characterised in that:
Insulating layer (300), heat dissipating layer (400), aluminium sheet (500) and shakeproof layer are successively arranged below the substrate (100)
(600), the insulating layer (300) is made of heat conductive rubber, and the insulating layer (300) is in grid plate, the insulating layer (300)
Top surface and the bottom surface of the substrate (100) be adhesively fixed, the bottom surface of the insulating layer (300) and the heat dissipating layer (400)
Top surface is adhesively fixed, and the bottom surface of the heat dissipating layer (400) is fixed with a plurality of heat dissipation raised line (410), the heat dissipation raised line (410)
Uniform intervals setting, the heat dissipation raised line (410) are structure as a whole with the heat dissipating layer (400), the top surface of the aluminium sheet (500)
It is adhesively fixed with the bottom surface of heat dissipation raised line (410), the bottom surface of the aluminium sheet (500) and the top surface of the shakeproof layer (600)
It is adhesively fixed, the shakeproof layer (600) is silica gel foamed board.
2. a kind of high shockproof aluminum-based copper-clad plate of heat dissipation according to claim 1, it is characterised in that:
The top surface of the shakeproof layer (600) is convexly equipped with the protrusion (610) of the spherical crown shape in matrix distribution, and the protrusion (610) is equal
It is distributed in the top surface of the shakeproof layer (600).
3. a kind of high shockproof aluminum-based copper-clad plate of heat dissipation according to claim 1, it is characterised in that:
The aluminium sheet (500) is equipped with the heat release hole (510) in matrix distribution, and the heat release hole (510) is distributed in the aluminium sheet
(500) top surface.
4. a kind of high shockproof aluminum-based copper-clad plate of heat dissipation according to claim 1, it is characterised in that:
The heat dissipating layer (400) and the heat dissipation raised line (410) are made of graphene.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822240469.9U CN209472833U (en) | 2018-12-28 | 2018-12-28 | A kind of high shockproof aluminum-based copper-clad plate of heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822240469.9U CN209472833U (en) | 2018-12-28 | 2018-12-28 | A kind of high shockproof aluminum-based copper-clad plate of heat dissipation |
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| Publication Number | Publication Date |
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| CN209472833U true CN209472833U (en) | 2019-10-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201822240469.9U Active CN209472833U (en) | 2018-12-28 | 2018-12-28 | A kind of high shockproof aluminum-based copper-clad plate of heat dissipation |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110936677A (en) * | 2019-12-09 | 2020-03-31 | 苏州康丽达精密电子有限公司 | Preparation method and application of graphite and conductive layer composite film |
| CN113507780A (en) * | 2021-07-08 | 2021-10-15 | 江西柔顺科技有限公司 | Heat dissipation circuit board and preparation method thereof |
| CN114094001A (en) * | 2021-09-29 | 2022-02-25 | 华灿光电（浙江）有限公司 | Substrate, light emitting diode epitaxial wafer and manufacturing method thereof |
-
2018
- 2018-12-28 CN CN201822240469.9U patent/CN209472833U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110936677A (en) * | 2019-12-09 | 2020-03-31 | 苏州康丽达精密电子有限公司 | Preparation method and application of graphite and conductive layer composite film |
| CN113507780A (en) * | 2021-07-08 | 2021-10-15 | 江西柔顺科技有限公司 | Heat dissipation circuit board and preparation method thereof |
| CN114094001A (en) * | 2021-09-29 | 2022-02-25 | 华灿光电（浙江）有限公司 | Substrate, light emitting diode epitaxial wafer and manufacturing method thereof |
| CN114094001B (en) * | 2021-09-29 | 2023-12-01 | 华灿光电（浙江）有限公司 | Substrate, light-emitting diode epitaxial wafer and manufacturing method thereof |
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