CN113507780A - Heat dissipation circuit board and preparation method thereof - Google Patents
Heat dissipation circuit board and preparation method thereof Download PDFInfo
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- CN113507780A CN113507780A CN202110781727.8A CN202110781727A CN113507780A CN 113507780 A CN113507780 A CN 113507780A CN 202110781727 A CN202110781727 A CN 202110781727A CN 113507780 A CN113507780 A CN 113507780A
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 71
- 238000002360 preparation method Methods 0.000 title claims abstract description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 107
- 239000010949 copper Substances 0.000 claims abstract description 89
- 229910052802 copper Inorganic materials 0.000 claims abstract description 82
- 239000000463 material Substances 0.000 claims abstract description 36
- 238000004804 winding Methods 0.000 claims abstract description 36
- 238000007731 hot pressing Methods 0.000 claims abstract description 30
- 238000000034 method Methods 0.000 claims abstract description 19
- 239000000853 adhesive Substances 0.000 claims abstract description 18
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 30
- 230000007246 mechanism Effects 0.000 claims description 29
- 229910052751 metal Inorganic materials 0.000 claims description 29
- 239000002184 metal Substances 0.000 claims description 29
- 239000011889 copper foil Substances 0.000 claims description 25
- 239000000758 substrate Substances 0.000 claims description 24
- 229910002804 graphite Inorganic materials 0.000 claims description 18
- 239000010439 graphite Substances 0.000 claims description 18
- 229910052782 aluminium Inorganic materials 0.000 claims description 16
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 16
- 238000010438 heat treatment Methods 0.000 claims description 14
- 239000011888 foil Substances 0.000 claims description 11
- 230000032258 transport Effects 0.000 claims description 8
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- 229910052755 nonmetal Inorganic materials 0.000 claims description 3
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- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
Abstract
The invention discloses a preparation method of a heat dissipation circuit board, which comprises the following steps: (1) preparing a conductive copper layer on the surface of a carrier layer, wherein the carrier layer comprises a base material layer and a stripping layer, and etching the conductive copper layer to form a circuit layer; (2) the carrier layer and the circuit layer form a material supply roll; (3) the method comprises the following steps of feeding heat-conducting adhesive to the surface of a material supply roll, bonding the heat-conducting adhesive with a first heat dissipation layer and a second heat dissipation layer after drying of a drying device, and jointly feeding the heat-conducting adhesive and the first heat dissipation layer and the second heat dissipation layer into two hot pressing devices for hot pressing, wherein a heat-conducting insulation layer is formed between the first heat dissipation layer and a conductive copper layer after the heat-conducting adhesive is subjected to hot pressing, the first winding device is used for winding a carrier layer, and the second winding device is used for winding a product; and (4) after stripping the carrier layer, preparing a thickened copper layer on the surface of the circuit layer. The process can be used for preparing the circuit board with the copper layer and the heat-conducting insulating layer having good bonding force, and has the advantages of good heat dissipation effect, simple process, low cost and capability of improving the production efficiency and yield.
Description
Technical Field
The invention relates to the technical field of circuit board preparation, in particular to a heat dissipation circuit board and a preparation method thereof.
Background
Pcb (printed circuit board), i.e. printed wiring board, printed circuit board for short, is one of the important parts in the electronics industry. Almost every kind of electronic equipment, as small as electronic watches, calculators, as large as computers, communication electronics, military weaponry systems, has electronic components such as integrated circuits, and printed boards are used to electrically interconnect the various components. The printed circuit board consists of an insulating bottom plate, a connecting lead and a welding disc for assembling and welding electronic elements, and has double functions of a conductive circuit and the insulating bottom plate. The circuit can replace complex wiring to realize electrical connection among elements in the circuit, thereby simplifying the assembly and welding work of electronic products, reducing the wiring workload in the traditional mode and greatly lightening the labor intensity of workers; and the volume of the whole machine is reduced, the product cost is reduced, and the quality and the reliability of the electronic equipment are improved. The printed circuit board has good product consistency, can adopt standardized design, and is beneficial to realizing mechanization and automation in the production process. Meanwhile, the whole printed circuit board subjected to assembly and debugging can be used as an independent spare part, so that the exchange and maintenance of the whole product are facilitated. At present, printed wiring boards have been used very widely in the manufacture of electronic products.
Electronic products can generate heat in a large amount under long-term work, and if heat is not dissipated in time, functions of the electronic products are at risk of failure. The LED is called as a fourth generation lighting source or a green light source, has the characteristics of energy conservation, environmental protection, long service life, small volume and the like, is widely applied to the fields of various indications, display, decoration, backlight sources, common lighting, urban night scenes and the like, can be divided into information display, signal lamps, vehicle lamps and general lighting according to different use functions, has the problem of circuit board heat dissipation in the prior art, is low in heat dissipation speed and cannot play a good protection role on the circuit board. In traditional heat dissipation circuit board, generally adopt copper foil layer, heat conduction insulating layer and aluminum plate to constitute, but heat conduction insulating layer and copper foil layer when the pressfitting, layering and fracture appear easily, and simultaneously, the cohesion of obtained heat conduction insulating layer and copper foil layer is not enough, leads to the copper layer to break away from easily to the quality of product has been influenced.
Therefore, it is necessary to provide a heat dissipation circuit board and a method for manufacturing the same to solve the above drawbacks.
Disclosure of Invention
One of the objectives of the present invention is to provide a method for manufacturing a heat dissipation circuit board, which can manufacture a circuit board having a copper layer and a heat conductive insulating layer with good bonding force, and has the advantages of good heat dissipation effect, simple process, low cost, and improved production efficiency and yield.
The second objective of the present invention is to provide a heat dissipation circuit board, which has a copper layer and a heat conductive insulating layer with good bonding force and good heat dissipation effect.
In order to achieve the purpose, the invention discloses a preparation method of a heat dissipation circuit board, which comprises the following steps:
(1) providing a carrier layer, preparing a conductive copper layer on the surface of the carrier layer, wherein the carrier layer comprises a base material layer and a stripping layer prepared on the surface of the base material layer, preparing the conductive copper layer on the surface of the stripping layer, and etching the conductive copper layer to form a circuit layer;
(2) the carrier layer and the circuit layer form a material supply roll;
(3) providing an unreeling device, a first transport mechanism, a second transport mechanism, a drying device, a hot-pressing device, a heating device, a first reeling device and a second reeling device,
the unreeling device conveys the feeding roll to the hot-pressing device,
the first transportation mechanism transports the first heat dissipation layer to the hot pressing device and attaches to the surface of the conductive copper layer,
the second transportation mechanism transports the second heat dissipation layer to the hot pressing device and is attached to the surface of the first heat dissipation layer,
sending a heat-conducting adhesive material to the surface of the material supply roll conveyed by the unwinding device, bonding the heat-conducting adhesive material with a first heat dissipation layer conveyed by a first conveying mechanism and a second heat dissipation layer conveyed by a second conveying mechanism after drying by the drying device, jointly entering the two hot-pressing devices for hot pressing, and then carrying out heating treatment by the heating device, wherein the heat-conducting adhesive material forms a heat-conducting insulation layer between the first heat dissipation layer and the conductive copper layer after hot pressing, the first winding device is used for winding the carrier layer, and the second winding device is used for winding a product;
and after the carrier layer is stripped, preparing a thickened copper layer on the surface of the circuit layer exposed out of the heat-conducting insulating layer.
Compared with the prior art, the preparation method of the radiating circuit board adopts the carrier layer as the bearing to prepare the conductive copper layer, can prepare the thin conductive copper layer, is convenient to etch and low in cost, is accurate to etch, and can improve the utilization rate of the radiating circuit board and increase the data transmission effect. The base material layer is peeled by the aid of the peeling layer, the heat conduction adhesive is hot-pressed to form a heat conduction insulating layer between the first heat dissipation layer and the conductive copper layer, the heat conduction insulating layer and the circuit layer are mutually embedded, the first winding device is used for winding the carrier layer to peel the carrier layer, and the second winding device is used for winding a product. On one hand, the bonding force between the heat conduction insulating layer and the circuit layer is improved, and on the other hand, the heat conduction insulating layer, the first heat dissipation layer and the second heat dissipation layer endow the circuit board with a good heat dissipation effect. The process avoids the situation that the thin copper is easy to break due to tension, and realizes high yield and high yield of the circuit board.
Preferably, the substrate layer is selected from a metal substrate or a non-metal substrate.
Preferably, the metal substrate is selected from copper, aluminum or stainless steel.
Preferably, the thickness of the conductive copper layer is 0.5 μm to 18 μm.
Preferably, the heat-conducting glue material comprises silica gel, heat-conducting powder and a solvent.
Preferably, the first heat dissipation layer is selected from an aluminum foil or a copper foil, and preferably, the surface of the aluminum foil or the copper foil is coated with at least one of graphene, carbon nanotubes and graphite.
Preferably, the second heat dissipation layer is selected from a graphite film, and the graphite film comprises a graphite layer and a protective film positioned on the surface of the graphite layer; or
And at least one of graphene, carbon nanotubes and graphite is coated on the surface of the aluminum foil or the copper foil to form the second heat dissipation layer.
Preferably, a metal layer is prepared on the surface of the carrier layer through vacuum magnetron sputtering, a copper foil layer is prepared on the surface of the metal layer through electroplating or chemical copper deposition, and the conductive copper layer is formed on the metal layer and the copper foil layer.
Preferably, the metal layer is a Cu layer, a Ni layer, a Cu/Ni layer or an Ag layer.
On the other hand, the invention also provides a radiating circuit board which is prepared by the preparation method, has good bonding force between the copper layer and the heat conducting insulating layer and has good radiating effect.
Drawings
FIG. 1: FIG. 1(a) shows a schematic structural view of a carrier layer for the present application for the preparation of a conductive copper layer; FIG. 1(b) is a schematic diagram showing the structure of the conductive copper layer etched into the wiring layer shown in FIG. 1(a), which is also a cross-sectional view of the supply roll.
FIG. 2: fig. 2(a) shows a schematic structural diagram of a carrier layer of the present application for preparing a metal layer and a copper foil layer; fig. 2(b) is a schematic structural view of the metal layer and the copper foil layer etched to form the circuit layer shown in fig. 2(a), and is a cross-sectional view of another embodiment of the supply roll.
Fig. 3 shows a schematic flow chart of the processing device of the heat dissipation circuit board of the present application.
Fig. 4 shows an enlarged view at a in fig. 3.
FIG. 5: FIG. 5(a) is a schematic structural view of the product of FIG. 1, wherein the supply roll is processed by the processing apparatus of FIG. 3, showing the circuit layer embedded in the heat-conducting and insulating layer; FIG. 5(b) shows a schematic diagram of a thickened copper layer formed on the wiring layer shown in FIG. 5 (a).
FIG. 6: FIG. 6(a) is a schematic structural view of the product of FIG. 2, wherein the supply roll is processed by the processing apparatus of FIG. 3, showing the circuit layer embedded in the heat-conducting and insulating layer; FIG. 6(b) shows a schematic diagram of a thickened copper layer formed on the wiring layer shown in FIG. 6 (a).
Description of the symbols:
the device comprises a carrier layer 10, a substrate layer 11, a stripping layer 13, a conductive copper layer 20, a metal layer 21, a copper foil layer 23, a circuit layer 30, a feeding roll 40, a thickened copper layer 50, an unreeling device 61, a first conveying mechanism 62, a second conveying mechanism 63, a drying device 64, a hot-pressing device 65, a heating device 66, a first reeling device 67, a second reeling device 68, a coating mechanism 69, an auxiliary roller 70, a heat-conducting insulating layer 73, a cutting device 74, a first heat dissipation layer 81 and a second heat dissipation layer 83.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 to 6, the present invention provides a method for manufacturing a heat dissipation circuit board, including the steps of:
(1) providing a carrier layer 10, preparing a conductive copper layer 20 on the surface of the carrier layer 10, wherein the carrier layer 10 comprises a substrate layer 11 and a stripping layer 13 prepared on the surface of the substrate layer 11, preparing the conductive copper layer 20 on the surface of the stripping layer 13, and etching the conductive copper layer 20 to form a circuit layer 30;
(2) the carrier layer 10 and the wiring layer 30 form a supply roll 40;
(3) providing an unreeling device 61, a first transport mechanism 62, a second transport mechanism 63, a drying device 64, a hot-pressing device 65, a heating device 66, a first reeling device 67 and a second reeling device 68,
the unwinding device 61 delivers the supply roll 40 to the hot press device 65,
the first transportation mechanism 62 transports the first heat dissipation layer 81 to the hot press device 65, and adheres to the surface of the conductive copper layer 20,
the second transportation mechanism 63 transports the second heat dissipation layer 83 to the hot press device 65, and attaches to the surface of the first heat dissipation layer 81,
sending the heat-conducting adhesive material to the surface of the feeding roll 40 conveyed by the unreeling device 61, drying the heat-conducting adhesive material by the drying device 64, then matching with the first heat dissipation layer 81 conveyed by the first conveying mechanism 62 and the second heat dissipation layer 83 conveyed by the second conveying mechanism 63, jointly entering the two hot pressing devices 65 for hot pressing, and then carrying out heating treatment by the heating device 66, wherein the heat-conducting adhesive material is subjected to hot pressing to form a heat-conducting insulation layer 73 between the first heat dissipation layer 81 and the conductive copper layer 20, the first reeling device 67 is used for reeling the carrier layer 10, and the second reeling device 68 is used for reeling the product;
after peeling off the carrier layer 10, a thickened copper layer 50 is prepared on the surface of the wiring layer 30 where the heat conductive insulating layer 73 is exposed.
The concrete description is as follows:
in the technical solution of the present invention, referring to fig. 1(a), the carrier layer 10 includes a substrate layer 11 and a peeling layer 13 prepared on a surface of the substrate layer 11, a conductive copper layer 20 is prepared on a surface of the peeling layer 13, and the peeling layer 13 is used for removing the carrier layer 10. The substrate layer 11 is selected from a metal substrate or a non-metal substrate, and the provision of the substrate layer 11 can provide support guarantee for the subsequent preparation of the conductive copper layer 20. The metal substrate may be, but is not limited to, copper, aluminum, or stainless steel; the non-metallic substrate may be, but is not limited to, a PET film, a PEN film, a PP film, a PI film, a PC film. Preferably, a non-metallic substrate is provided. In actual preparation, the surface of the substrate layer 11 is pretreated to obtain a suitable surface tension. Preferably, the method of pretreatment may be, but is not limited to, corona or chemical treatment, or the like. Wherein, in order to ensure a certain supporting force, the thickness of the substrate layer 11 is 25 μm-100 μm. For example, the thickness of the substrate layer 11 may be, but is not limited to, 25 μm, 35 μm, 45 μm, 55 μm, 65 μm, 75 μm, 85 μm, 95 μm, 100 μm.
In the technical solution of the present invention, please refer to fig. 1(a) continuously, the peeling layer 13 is prepared on the surface of the substrate layer 11, and the forming manner of the peeling layer 13 is not limited to bonding, printing, injection molding, pressing, etc. In this embodiment, a release layer 13 is bonded to the surface of the base layer 11. The peel ply 13 can peel off so that get rid of the substrate layer 11 with the electrically conductive copper layer 20 (be circuit layer 30 after the etching), and operation peel ply 13 is released type so that get rid of the substrate layer 11, makes substrate layer 11 and circuit layer 30 separation with the help of peel ply 13, and consequently, circuit layer 30 and heat conduction glue solution imbed each other under the hot pressing, and circuit layer 30 imbeds in heat conduction insulating layer 73 after the shaping, improves the cohesion of circuit layer 30 and heat conduction insulating layer 73 greatly. Further, the peeling layer 13 may be made of silicon, fluorine, non-silicon, or the like, or may be made of a release material.
In the technical solution of the present invention, please refer to fig. 1(a) continuously, after the peeling layer 13 is prepared, the conductive copper layer 20 is prepared on the surface of the peeling layer 13, and the conductive copper layer 20 may be formed by, but not limited to, vacuum magnetron sputtering, chemical plating, water electroplating, chemical copper deposition, and other technical means. By the above-described means, an extremely thin conductive copper layer 20 can be obtained on the surface of the peeling layer 13, facilitating etching. The thickness of the conductive copper layer 20 is 0.5 μm to 18 μm, for example, the thickness of the conductive copper layer 20 may be, but is not limited to, 0.5 μm, 1 μm, 3 μm, 5 μm, 7 μm, 9 μm, 11 μm, 13 μm, 15 μm, 17 μm, 18 μm. Preferably, the thickness of the conductive copper layer 20 is 2 μm to 9 μm.
In a preferred embodiment of the above technical solution, referring to fig. 2(a), the conductive copper layer 20 includes a metal layer 21 and a copper foil layer 23 located on a surface of the metal layer 21. Preparing a metal layer 21 on the surface of the stripping layer 13 by vacuum magnetron sputtering, preparing a copper foil layer 23 on the surface of the metal layer 21 by electroplating or chemical copper deposition, and forming a conductive copper layer 20 on the metal layer 21 and the copper foil layer 23. Firstly, a thin metal layer 21 is formed on the surface of the stripping layer 13 through vacuum magnetron sputtering, and then a copper foil layer 23 is formed on the surface of the metal layer 21 through electroplating or chemical copper deposition, so that the cost is reduced, and the yield and the productivity are improved. Further, the metal layer 21 is a Cu layer, a Ni layer, a Cu/Ni layer, or an Ag layer. Preferably, the metal layer 21 is a Cu/Ni layer, which is beneficial to improve the corrosion resistance of the circuit board.
In the technical solution of the present invention, referring to fig. 1(b), after the conductive copper layer 20 is prepared, the conductive copper layer 20 is etched to form the circuit layer 30. Since the conductive copper layer 20 has a small thickness, the etching process is easy, a small line width can be obtained, for example, the line width is 2 μm, the line distance is 3 μm, the transmission speed is increased, the amount of the etching solution is small, and the method is environment-friendly and low in cost. Further, referring to fig. 2(b), the conductive copper layer 20 includes a metal layer 21 and a copper foil layer 23, and both the metal layer 21 and the copper foil layer 23 are etched to form a circuit layer 30. Among them, the etching process is a common manner in the art and will not be described herein.
In the technical scheme of the invention, after the conductive copper layer 20 is etched into the circuit layer 30, the carrier layer 10 and the circuit layer 30 form a rolled supply roll 40, and the supply roll 40 is obtained by rolling the carrier layer 10 and the circuit layer 30 for subsequent processes. Because the peeling layer 13 in the carrier layer 10 has a certain adhesion with the conductive copper layer 20, after the conductive copper layer 20 is etched into the circuit layer 30, the circuit layer 30 is not separated from the carrier layer 10 under the condition of no external force, and the circuit layer 30 and the carrier layer 10 are made into a supply roll 40 for standby.
In the technical solution of the present invention, please refer to fig. 3, an unwinding device 61, a first transporting mechanism 62, a second transporting mechanism 63, a drying device 64, a hot-pressing device 65, a heating device 66, a first winding device 67, and a second winding device 68 are provided. The unwinding device 61 unwinds the material supply roll 40, the first winding device 67 is used for winding the carrier layer 10 of the material supply roll 40, that is, peeling off the carrier layer 10, and the second winding device 68 is used for winding a product, or winding the product without using a winding method, which is not limited herein. The first transporting mechanism 62 transports the first heat dissipation layer 81 to the thermocompression device 65, and the first transporting mechanism 62 can be, but not limited to, a belt or a conveyer belt, and transports the first heat dissipation layer 81 to the surface of the conductive copper layer 20 through the first transporting mechanism 62. The second transportation mechanism 63 transports the second heat dissipation layer 83 to the hot press device 65, and the second transportation mechanism 63 may adopt an unwinding method or other methods. The hot-pressing device 65 is provided with at least 2 and is symmetrically arranged. The thermally conductive adhesive is fed to the surface of the supply roll 40 unwound by the unwinding device 61, such as by coating, spreading, printing, etc. In the present embodiment, a coating mechanism 69 is provided and located between the unwinding device 61 and the drying device 64, and the coating mechanism 69 is used for coating the heat-conducting glue on the surface of the material supply roll 40. And 2 first winding devices 67 are provided for winding the carrier layer 10 removed from the corresponding supply roll 40, and a second winding device 68 is provided for winding the product. Along the conveying direction K, a heating device 66 is arranged behind the hot-pressing device 65, first hot-pressing forming is carried out through the hot-pressing device 65, and then the heating device 66 is hot-pressed again, so that the curing and adhesion performance is improved. It should be noted that, a plurality of auxiliary rollers 70 are further provided in the technical solution to ensure smooth operation of the unwinding device 61, the first transporting mechanism 62, the second transporting mechanism 63, the drying device 64, the first winding device 67, and the second winding device 68, and the positions of the auxiliary rollers 70 can be set according to actual operation requirements. In order to adapt to different needs, a cutting device 74 is arranged before the product is rolled. In this embodiment, the unwinding device 61 unwinds the material supply roll 40, the coating mechanism 69 sends the heat-conducting adhesive to the surface of the material supply roll 40 conveyed by the unwinding device 61, and the heat-conducting adhesive is dried by the drying device 64 and then matched with the first heat dissipation layer 81 conveyed by the first conveying mechanism 62 and the second heat dissipation layer 83 conveyed by the second conveying mechanism 63, so that the heat-conducting glue is located between the conductive copper layer 20 of the material supply roll 40 and the first heat dissipation layer 81, the superposed material supply roll 40, the first heat dissipation layer 81 and the second heat dissipation layer 83 are hot-pressed and formed by two hot-pressing devices 65, the heat-conducting glue is hot-pressed to form a heat-conducting insulation layer 73, the circuit layer 30 is embedded into the heat-conducting insulation layer 73, then, the second hot pressing treatment is carried out through the heating device 66, the carrier layer 10 of the material supply roll 40 is wound by the first winding device 67, so as to drive the peeling layer 13 to be separated from the conductive copper layer 20, and the product is wound by the second winding device 68.
In the technical scheme of the invention, the heat-conducting glue comprises silica gel, heat-conducting powder and a solvent, and the solvent can be properly added according to the requirement. The first heat dissipation layer 81 is selected from an aluminum foil or a copper foil, and in this embodiment, a metal aluminum foil is compounded on the surface of the heat conduction insulation layer 73, so as to further improve the heat dissipation effect. Preferably, the nanocarbon copper sheet or nanocarbon aluminum sheet, and more preferably, the first heat dissipation layer 81 is selected from a graphene-coated aluminum foil or copper foil. Further, the second heat dissipation layer 83 is selected from a graphite film, and the graphite film includes a graphite layer and a protective film on the surface of the graphite layer. In the embodiment, the graphite film is continuously compounded on the surface of the aluminum foil, so that the heat dissipation effect is effectively improved. Of course, the second heat dissipation layer may also be formed by coating the surface of the aluminum foil or the copper foil with at least one of graphene, carbon nanotubes and graphite. Wherein the thermally conductive powder is selected from Al2O3At least one of AlN, SiC, BN and graphene. The solvent may be acetone, ethylene glycol, etc., but is not limited thereto.
In the technical solution of the present invention, referring to fig. 5(a), fig. 5(b), fig. 6(a) and fig. 6(b), after obtaining a product in which the circuit layer 30 is embedded in the heat conductive insulating layer 73, a thickened copper layer 50 is prepared on the surface of the circuit layer 30 where the heat conductive insulating layer 73 is exposed. Namely, a thicker thickened copper layer 50 is obtained on the surface of the circuit layer 30 to improve the conveying capacity of the circuit board. In particular, the thickened copper layer 50 can be formed by electrolytic copper plating, electroless copper plating or electroless copper plating. In this embodiment, a layer of copper is plated on the surface of the circuit layer 30 by electroplating to increase the thickness of the circuit layer 30 in the heat conducting insulating layer 73, and the specific thickness is obtained as required. Because the circuit layer 30 is embedded in the heat-conducting insulating layer 73, the adhesion force, the stability and the service life between the circuit layer 30 and the heat-conducting insulating layer 73 are effectively guaranteed.
Compared with the prior art, the preparation method of the radiating circuit board adopts the carrier layer 10 as the carrier to prepare the conductive copper layer 20, can prepare the thin conductive copper layer 20, is convenient to etch and low in cost, is accurate in etching, and can improve the utilization rate of the radiating circuit board and increase the data transmission effect. The base material layer 11 is peeled by the peeling layer 13, the heat conducting adhesive is hot pressed to form the heat conducting insulating layer 73 between the first heat dissipation layer 81 and the conductive copper layer 20, the heat conducting insulating layer 73 and the circuit layer 30 are embedded into each other, the first winding device 67 is used for winding the carrier layer 10, and the second winding device 68 is used for winding the product. On one hand, the bonding force between the heat-conducting insulating layer 73 and the circuit layer 30 is improved, and on the other hand, the heat-conducting insulating layer 73, the first heat dissipation layer 81 and the second heat dissipation layer 83 endow the circuit board with a good heat dissipation effect. The process avoids the situation that the thin copper is easy to break due to tension, and realizes high yield and high yield of the circuit board.
The above disclosure is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the scope of the present invention, therefore, the present invention is not limited by the appended claims.
Claims (10)
1. A preparation method of a heat dissipation circuit board is characterized by comprising the following steps:
(1) providing a carrier layer, preparing a conductive copper layer on the surface of the carrier layer, wherein the carrier layer comprises a base material layer and a stripping layer prepared on the surface of the base material layer, preparing the conductive copper layer on the surface of the stripping layer, and etching the conductive copper layer to form a circuit layer;
(2) the carrier layer and the circuit layer form a material supply roll;
(3) providing an unreeling device, a first transport mechanism, a second transport mechanism, a drying device, a hot-pressing device, a heating device, a first reeling device and a second reeling device,
the unwinding device conveys the material supply roll to the hot pressing device,
the first transportation mechanism transports the first heat dissipation layer to the hot pressing device and is attached to the surface of the conductive copper layer,
the second transportation mechanism conveys the second heat dissipation layer to the hot pressing device and is attached to the surface of the first heat dissipation layer,
sending a heat-conducting adhesive material to the surface of the material supply roll conveyed by the unwinding device, bonding the heat-conducting adhesive material with the first heat dissipation layer conveyed by the first conveying mechanism and the second heat dissipation layer conveyed by the second conveying mechanism after drying by the drying device, jointly entering the two hot pressing devices for hot pressing, and then carrying out heating treatment by the heating device, wherein the heat-conducting adhesive material forms a heat-conducting insulation layer between the first heat dissipation layer and the conductive copper layer after hot pressing, the first winding device is used for winding the carrier layer, and the second winding device is used for winding a product;
and after the carrier layer is stripped, preparing a thickened copper layer on the surface of the circuit layer exposed out of the heat-conducting insulating layer.
2. The method of manufacturing a heat-dissipating wiring board according to claim 1, wherein the base material layer is selected from a metal base material and a non-metal base material.
3. The method of manufacturing a heat dissipating wiring board according to claim 2, wherein the metal substrate is selected from copper, aluminum, and stainless steel.
4. The method of manufacturing a heat dissipating wiring board of claim 1, wherein the thickness of the conductive copper layer is 0.5 μm to 18 μm.
5. The method of manufacturing a heat dissipating circuit board according to claim 1, wherein the heat conductive paste comprises silica gel, heat conductive powder, and a solvent.
6. The method for manufacturing a heat dissipation circuit board according to claim 1, wherein the first heat dissipation layer is selected from an aluminum foil or a copper foil, and preferably, the surface of the aluminum foil or the copper foil is coated with at least one of graphene, carbon nanotubes and graphite.
7. The method of manufacturing a heat dissipating wiring board according to claim 1, wherein the second heat dissipating layer is selected from a graphite film, the graphite film including a graphite layer and a protective film on a surface of the graphite layer; or
And at least one of graphene, carbon nanotubes and graphite is coated on the surface of the aluminum foil or the copper foil to form the second heat dissipation layer.
8. The method for manufacturing a heat dissipation circuit board according to claim 1, wherein a metal layer is manufactured on the surface of the carrier layer by vacuum magnetron sputtering and a copper foil layer is manufactured on the surface of the metal layer by electroplating or electroless copper plating, and the metal layer and the copper foil layer form the conductive copper layer.
9. The method of manufacturing a heat dissipating wiring board according to claim 8, wherein the metal layer is a Cu layer, a Ni layer, a Cu/Ni layer, or an Ag layer.
10. A heat dissipating wiring board produced by the production method according to any one of claims 1 to 9.
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| CN202110781727.8A CN113507780A (en) | 2021-07-08 | 2021-07-08 | Heat dissipation circuit board and preparation method thereof |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0930811A1 (en) * | 1998-01-19 | 1999-07-21 | MITSUI MINING & SMELTING CO., LTD. | Composite copper foil, process for preparing the same, and copper-clad laminate and printed wiring board using the same |
| JP2004319781A (en) * | 2003-04-16 | 2004-11-11 | Shin Etsu Polymer Co Ltd | Flexible printed circuit board and its manufacturing method |
| WO2011129232A1 (en) * | 2010-04-13 | 2011-10-20 | 宇部興産株式会社 | Heat dissipation substrate for led |
| CN102709439A (en) * | 2012-05-08 | 2012-10-03 | 东莞市凯昶德电子科技股份有限公司 | LED (Light emitting diode) ceramic support and manufacturing method thereof |
| US20180035546A1 (en) * | 2016-07-26 | 2018-02-01 | Jx Nippon Mining & Metals Corporation | Printed wiring board, electronic device, catheter, and metallic material |
| CN109479371A (en) * | 2016-09-06 | 2019-03-15 | 日本梅克特隆株式会社 | The manufacturing method of flexible printed circuit board and flexible printed circuit board |
| CN209472833U (en) * | 2018-12-28 | 2019-10-08 | 江西倍韬新材料科技有限公司 | A kind of high shockproof aluminum-based copper-clad plate of heat dissipation |
-
2021
- 2021-07-08 CN CN202110781727.8A patent/CN113507780A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0930811A1 (en) * | 1998-01-19 | 1999-07-21 | MITSUI MINING & SMELTING CO., LTD. | Composite copper foil, process for preparing the same, and copper-clad laminate and printed wiring board using the same |
| JP2004319781A (en) * | 2003-04-16 | 2004-11-11 | Shin Etsu Polymer Co Ltd | Flexible printed circuit board and its manufacturing method |
| WO2011129232A1 (en) * | 2010-04-13 | 2011-10-20 | 宇部興産株式会社 | Heat dissipation substrate for led |
| CN102709439A (en) * | 2012-05-08 | 2012-10-03 | 东莞市凯昶德电子科技股份有限公司 | LED (Light emitting diode) ceramic support and manufacturing method thereof |
| US20180035546A1 (en) * | 2016-07-26 | 2018-02-01 | Jx Nippon Mining & Metals Corporation | Printed wiring board, electronic device, catheter, and metallic material |
| CN109479371A (en) * | 2016-09-06 | 2019-03-15 | 日本梅克特隆株式会社 | The manufacturing method of flexible printed circuit board and flexible printed circuit board |
| CN209472833U (en) * | 2018-12-28 | 2019-10-08 | 江西倍韬新材料科技有限公司 | A kind of high shockproof aluminum-based copper-clad plate of heat dissipation |
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