CN201479460U - Radiating printed circuit board - Google Patents
Radiating printed circuit board Download PDFInfo
- Publication number
- CN201479460U CN201479460U CN2009201855957U CN200920185595U CN201479460U CN 201479460 U CN201479460 U CN 201479460U CN 2009201855957 U CN2009201855957 U CN 2009201855957U CN 200920185595 U CN200920185595 U CN 200920185595U CN 201479460 U CN201479460 U CN 201479460U
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- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- radiating
- layer
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Structure Of Printed Boards (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
The utility model discloses a radiating printed circuit board, which comprises a circuit board substrate and a circuit board structure layer arranged on the circuit board substrate. The surface of the side of the terminal of the circuit board substrate with the circuit board structure layer is coated with a radiating membrane layer. Compared with the direct use of the radiating metal substrate, the radiating membrane is thinner, thereby saving metal resources and reducing the production cost, and the radiating metal membrane on the surface has excellent radiating effect. Since the surfaces of the two sides of the printed circuit board are directly coated with a reflective ink layer, the reflective layer is not required to be arranged after the circuit board is processed and installed, thereby simplifying process steps, reducing the absorption of light energy, and also reducing the heat increase in the circuit board.
Description
Technical field
The utility model relates to a kind of heat radiating type printed circuit board.
Background technology
Heat radiating type printed circuit board of the prior art generally comprises a heat radiating material, the dielectric layer on heat radiating material surface, and the dielectric layer surface is used for the copper film of circuit framework, and the heat radiating material beyond the circuit framework exposes, to reach better heat radiating effect by heat radiating material.Wherein heat radiating material is generally heat radiation preferred metal base material, and therefore the cost of this heat radiating type printed circuit board is higher.
Summary of the invention
The utility model purpose provides a kind of heat radiating type printed circuit board, and it has under the prerequisite of heat dispersion preferably, and cost is lower, saves metals resources.
The technical solution of the utility model is: a kind of heat radiating type printed circuit board, comprise the circuit framework layer on board substrate and the board substrate, and the side surface plating that described board substrate is not provided with the circuit framework layer is provided with the heat radiation rete.
The further technical scheme of the utility model is: a kind of heat radiating type printed circuit board, comprise the circuit framework layer on board substrate and the board substrate, wherein the circuit framework layer is the copper film of forming circuit structure, this circuit skeleton layer can be the side surface that individual layer is located at base material, also multilayer, but the opposite side surface of base material is not provided with the circuit skeleton layer.The side surface plating that described board substrate is not provided with the circuit framework layer is provided with the heat radiation copper film.Described circuit board both side surface plating is provided with reflector layer.Described reflector layer is reflective ink lay.This reflective ink lay plates the circuit skeleton layer of being located at the base material both sides and the outer surface that dispels the heat copper film respectively.
The utility model advantage is:
1. the utility model is provided with the heat dissipation metal film in a surface plating of circuit common plate substrate, compare with direct use heat dissipation metal base material, it is many that the thickness of heat dissipation film will approach, and saves metals resources more, reduce production cost, the radiating effect of being located at the heat dissipation metal film on surface simultaneously also compares good.
2. the utility model directly plates in the printed circuit board both side surface and is provided with reflective ink lay, need not in the circuit board installation and processing reflector layer well to be set later again, simplifies processing step, reduces luminous energy simultaneously and absorbs, and has reduced the increase of circuit board heat.
Description of drawings
Fig. 1 is the structure cutaway view of the utility model specific embodiment.
Wherein: 1 board substrate; 2 circuit skeleton layers; 3 heat radiation retes; 4 reflector layers.
Embodiment
Below in conjunction with drawings and Examples the utility model is further described:
Embodiment: as shown in Figure 1, a kind of individual layer heat radiating type printed circuit board, comprise the board substrate 1 of phenolic resins and the circuit framework layer 2 of board substrate 1 one side surfaces, described circuit framework layer 2 is the conductive copper rete, and the opposite side surface plating that described board substrate 1 is not provided with circuit framework layer 2 is provided with heat radiation rete 3; Described heat radiation rete 3 is the heat radiation copper film.
Described circuit board both side surface plating is provided with reflector layer 4; Described reflector layer 4 is the reflective ink lay of white.
The utility model is compared with direct use heat dissipation metal base material, and what the thickness of heat dissipation film will be thin is many, more saves metals resources, Decrease production cost, and the radiating effect of being located at simultaneously surperficial heat dissipation metal film is also better; The utility model directly plates in the printed circuit board both side surface and establishes reflective ink lay, need not after circuit board processing installs reflector layer to be set again, simplifies processing step, reduces simultaneously luminous energy and absorbs, and has reduced the increase of circuit board heat.
Claims (4)
1. a heat radiating type printed circuit board comprises the circuit framework layer (2) on board substrate (1) and the board substrate (1), it is characterized in that: the side surface plating that described board substrate (1) is not provided with circuit framework layer (2) is provided with heat radiation rete (3).
2. heat radiating type printed circuit board according to claim 1 is characterized in that: described heat radiation rete (3) is the heat radiation copper film.
3. heat radiating type printed circuit board according to claim 1 and 2 is characterized in that: described circuit board both side surface plating is provided with reflector layer (4).
4. heat radiating type printed circuit board according to claim 3 is characterized in that: described reflector layer (4) is reflective ink lay.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201855957U CN201479460U (en) | 2009-06-23 | 2009-06-23 | Radiating printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201855957U CN201479460U (en) | 2009-06-23 | 2009-06-23 | Radiating printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201479460U true CN201479460U (en) | 2010-05-19 |
Family
ID=42415715
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009201855957U Expired - Fee Related CN201479460U (en) | 2009-06-23 | 2009-06-23 | Radiating printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201479460U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102564199A (en) * | 2010-12-28 | 2012-07-11 | 常州碳元科技发展有限公司 | Wing-shaped high-cooling-efficiency structure and manufacturing method thereof |
-
2009
- 2009-06-23 CN CN2009201855957U patent/CN201479460U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102564199A (en) * | 2010-12-28 | 2012-07-11 | 常州碳元科技发展有限公司 | Wing-shaped high-cooling-efficiency structure and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100519 Termination date: 20100623 |