CN103096616A - Heat conduction structure of patch power component on circuit board - Google Patents
Heat conduction structure of patch power component on circuit board Download PDFInfo
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- CN103096616A CN103096616A CN2013100035222A CN201310003522A CN103096616A CN 103096616 A CN103096616 A CN 103096616A CN 2013100035222 A CN2013100035222 A CN 2013100035222A CN 201310003522 A CN201310003522 A CN 201310003522A CN 103096616 A CN103096616 A CN 103096616A
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- circuit board
- power component
- paster power
- patch power
- hole
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Abstract
The invention belongs to the technical field of patch power components and relates to a heat conduction structure of the patch power components on a circuit board. A plurality of installation positions for installing the patch power components are arranged on the circuit board, a through hole which penetrates the circuit board is formed in each installation position for installing each patch power component on the circuit board, a patch power component is installed on each installation position on the circuit board, and each electrode slice of each patch power component is electrically connected with a corresponding circuit on the circuit board. The heat conduction structure of the patch power components on the circuit board has the advantages that heat generated by the patch power components in the process of working is transmitted to the wall of a shell instantly by means of insulation heat conduction liquid and then dissipated into the air by means of heat dissipation slices on the wall of the shell. The heat conduction structure of the patch power components on the circuit board is rapid in heat dissipation, small in size, little in used raw material, low in cost, low in failure rate, and long in service life.
Description
Technical field
The invention belongs to paster power component technical field, refer in particular to the conductive structure of the paster power component on a kind of circuit board.
Background technology
At present, the syndeton of general paster power component and circuit board has following several structure
A kind ofly more commonly the bottom heat radiation face of paster power component is close on the aluminium base or copper base of metal base.It is expensive that its weak point is that the aluminium base of metal base or copper base are compared the general circuit plate, and the aluminium base of metal base or copper base can only wherein simultaneously be placed surface mount elements.
Another kind is that the paster power component is directly welded with the front that is embedded in the heat conduction copper billet in circuit board, again the heat conduction copper billet is connected with heating panel, with convenient heat radiation (referring to Chinese patent CN101556941B disclosed " radiator structure of surface mounting high-power element " document), its weak point: the one, because the power of some paster power component is large, must use larger heat conduction copper billet and the heating panel of volume, cause the volume of circuit board larger, affect the integral layout of electrical appliance; The 2nd, because the power of some paster power component is large, the welding that makes the metal shell of paster power component and heat-dissipating aluminium plate or copper coin is easy local overheating and cause sealing-off afterwards, very easily causes fault.
Summary of the invention
The purpose of this invention is to provide that a kind of volume is little, the conductive structure of the paster power component on circuit board very easily heat conduction and heat radiation.
The object of the present invention is achieved like this:
The conductive structure of the paster power component on circuit board, be provided with the installation position of some installation paster power components on circuit board, the corresponding through hole that penetrates circuit board that is provided with on the installation position of each the installation paster power component on circuit board, a paster power component is installed on each installation position of circuit board, and each electrode slice of paster power component is electrically connected to the corresponding circuits on circuit board.
Above-mentioned circuit board is the circuit board of insulating substrate.
Above-mentioned through hole is circular hole or polygonal hole, the surface area that the area of described through hole is close to less than corresponding paster power component bottom and circuit board.
The above-mentioned circuit board that the paster power component is installed is immersed in lumen loading to be had in insulating heat-conductive liquid in the seal box of insulating heat-conductive liquid, and described seal box has at least a face or wall to make with metal material.
Circuit lead-out wire sealing on the foregoing circuit plate is drawn outside seal box.
The present invention's outstanding and useful technique effect compared to existing technology is:
The through hole of offering on circuit board of the present invention, and instantaneous being delivered on housing wall of heat that produces when utilizing insulating heat-conductive liquid that the paster power component is worked, and then be dispersed in atmosphere by the fin on housing wall, because housing wall adopts metal structure, volume is large, area of dissipation is large, rapid heat dissipation, and don't take the volume of circuit board, thereby make the volume of product little, the raw material that use are few, production cost is low, failure rate is low, long service life.
Description of drawings
Fig. 1 is one of mechanism of the present invention cutaway view.
Fig. 2 is two of mechanism of the present invention cutaway view.
Embodiment
The invention will be further described with specific embodiment below in conjunction with accompanying drawing, referring to Fig. 1-2:
The conductive structure of the paster power component on circuit board, be provided with the installation position 12 of some installation paster power components 20 on circuit board 10, the corresponding through hole 11 that penetrates circuit board 10 that is provided with on the installation position 12 of each installation paster power component of circuit board 10, on each installation position 12 of circuit board 11, a paster power component 20 is installed, each electrode slice 21 of paster power component 20 is electrically connected to the corresponding circuits on circuit board 10.
Above-mentioned circuit board 10 is the circuit board of insulating substrate.
Above-mentioned through hole 11 is circular hole or polygonal hole, the surface area that the area of described through hole 11 is close to less than corresponding paster power component 20 bottoms and circuit board, be that described through hole 11 should be covered by the metal shell 22 of paster power component 20, guaranteeing by being electrically connected to of interlock circuit on the metal shell 22 of paster power component 20 and circuit board, described polygonal hole is such as square hole or slot or pentagon hole etc.
The maximum outside diameter of above-mentioned through hole 11 is 1-20mm, with the demand of convenient different big or small paster power components 20.
the above-mentioned circuit board 10 that paster power component 20 is installed is immersed in lumen loading and has in insulating heat-conductive liquid 50 in the seal box 30 of insulating heat-conductive liquid 50, described seal box 30 has at least a face or wall to make with metal material, the heat that produces when being convenient to 20 work of paster power component in time is delivered on the metal sidewall 32 or diapire 31 of seal box 30 by through hole 11 and insulating heat-conductive liquid 50, during fin on the metal sidewall 32 of utilizing seal box 30 or diapire 31 outer surfaces is dispersed into ambient atmosphere, because the volume of the metal sidewall 32 of seal box 30 or diapire 31 is large, area of dissipation is large, so its rapid heat dissipation, and don't occupy volume and the space of circuit board, make less that the volume of electric equipment products such as controller etc. can do, the raw material that use are few, production cost is low, failure rate is low, long service life, described insulating heat-conductive liquid 50 is transformer oil, electrical apparatus insulation heat conduction wet goods.
It is outer or be electrically connected to the corresponding contact of electrical socket 60 on seal box 30 that seal box 30 is drawn in circuit lead-out wire 13 sealing on foregoing circuit plate 10, with convenient external use.
Above-described embodiment is only preferred embodiment of the present invention, is not to limit according to this protection scope of the present invention, therefore: all equivalences of doing according to structure of the present invention, shape, principle change, within all should being covered by protection scope of the present invention.
Claims (5)
1. the conductive structure of the paster power component on circuit board, it is characterized in that: the installation position that is provided with some installation paster power components on circuit board, the corresponding through hole that penetrates circuit board that is provided with on the installation position of each the installation paster power component on circuit board, a paster power component is installed on each installation position of circuit board, and each electrode slice of paster power component is electrically connected to the corresponding circuits on circuit board.
2. the conductive structure of the paster power component on circuit board according to claim 1, it is characterized in that: described circuit board is the circuit board of insulating substrate.
3. the conductive structure of the paster power component on circuit board according to claim 1, it is characterized in that: described through hole is circular hole or polygonal hole, the surface area that the area of described through hole is close to less than corresponding paster power component bottom and circuit board.
4. the conductive structure of the paster power component on according to claim 1-3 described circuit boards of any one, it is characterized in that: the described circuit board that the paster power component is installed is immersed in lumen loading to be had in insulating heat-conductive liquid in the seal box of insulating heat-conductive liquid, and described seal box has at least a face or wall to make with metal material.
5. the conductive structure of the paster power component on circuit board according to claim 4 is characterized in that: the circuit lead-out wire sealing on described circuit board is drawn outside seal box.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013100035222A CN103096616A (en) | 2013-01-05 | 2013-01-05 | Heat conduction structure of patch power component on circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013100035222A CN103096616A (en) | 2013-01-05 | 2013-01-05 | Heat conduction structure of patch power component on circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103096616A true CN103096616A (en) | 2013-05-08 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013100035222A Pending CN103096616A (en) | 2013-01-05 | 2013-01-05 | Heat conduction structure of patch power component on circuit board |
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| CN (1) | CN103096616A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109588021A (en) * | 2018-12-29 | 2019-04-05 | 出门问问信息科技有限公司 | Electronic equipment |
| CN110996606A (en) * | 2020-01-06 | 2020-04-10 | 西安电掣风云智能科技有限公司 | Anti-interference integrated heat dissipation capacitor module and preparation method thereof |
| CN111326071A (en) * | 2018-12-13 | 2020-06-23 | 乐金显示有限公司 | Flexible display module and electronic device including the same |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5305184A (en) * | 1992-12-16 | 1994-04-19 | Ibm Corporation | Method and apparatus for immersion cooling or an electronic board |
| US20040246683A1 (en) * | 2001-09-27 | 2004-12-09 | Martin Honsberg-Riedl | Electrical circuit arrangement comprised of a number of electrically interconnected circuit components |
| WO2005093551A2 (en) * | 2004-03-09 | 2005-10-06 | Georg Kinder | Cooling system for electronic devices, in particular for computer |
| CN1913763A (en) * | 2006-08-04 | 2007-02-14 | 华为技术有限公司 | Thermal rubber heat sink and its manufacturing method and circuit board and its manufacturing method |
| CN203086840U (en) * | 2013-01-05 | 2013-07-24 | 陈夏新 | Heat conduction structure of surface-mount power components on circuit board |
-
2013
- 2013-01-05 CN CN2013100035222A patent/CN103096616A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5305184A (en) * | 1992-12-16 | 1994-04-19 | Ibm Corporation | Method and apparatus for immersion cooling or an electronic board |
| US20040246683A1 (en) * | 2001-09-27 | 2004-12-09 | Martin Honsberg-Riedl | Electrical circuit arrangement comprised of a number of electrically interconnected circuit components |
| WO2005093551A2 (en) * | 2004-03-09 | 2005-10-06 | Georg Kinder | Cooling system for electronic devices, in particular for computer |
| CN1913763A (en) * | 2006-08-04 | 2007-02-14 | 华为技术有限公司 | Thermal rubber heat sink and its manufacturing method and circuit board and its manufacturing method |
| CN203086840U (en) * | 2013-01-05 | 2013-07-24 | 陈夏新 | Heat conduction structure of surface-mount power components on circuit board |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111326071A (en) * | 2018-12-13 | 2020-06-23 | 乐金显示有限公司 | Flexible display module and electronic device including the same |
| CN111326071B (en) * | 2018-12-13 | 2022-06-17 | 乐金显示有限公司 | Flexible display module and electronic device including the same |
| CN109588021A (en) * | 2018-12-29 | 2019-04-05 | 出门问问信息科技有限公司 | Electronic equipment |
| CN110996606A (en) * | 2020-01-06 | 2020-04-10 | 西安电掣风云智能科技有限公司 | Anti-interference integrated heat dissipation capacitor module and preparation method thereof |
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| ASS | Succession or assignment of patent right |
Owner name: WENZHOU SANLI ELECTRONIC TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: CHEN XIAXIN Effective date: 20140822 |
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Free format text: CORRECT: ADDRESS; FROM: 317500 TAIZHOU, ZHEJIANG PROVINCE TO: 325025 WENZHOU, ZHEJIANG PROVINCE |
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| TA01 | Transfer of patent application right |
Effective date of registration: 20140822 Address after: 325025, D3 building, No. three, No. 311, Jinhai Road, Wenzhou economic and Technological Development Zone, Zhejiang, five Applicant after: Wenzhou Sanli Electronic Technology Co., Ltd. Address before: 317500, Zhejiang Province, Taizhou city Wenling city pine door town No. 499 cross door Applicant before: Chen Xiaxin |
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130508 |