CN203775519U - Heat dissipation circuit board - Google Patents
Heat dissipation circuit board Download PDFInfo
- Publication number
- CN203775519U CN203775519U CN201420039265.8U CN201420039265U CN203775519U CN 203775519 U CN203775519 U CN 203775519U CN 201420039265 U CN201420039265 U CN 201420039265U CN 203775519 U CN203775519 U CN 203775519U
- Authority
- CN
- China
- Prior art keywords
- substrate
- heat dissipation
- circuit board
- layer
- porous ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A heat dissipation circuit board comprises a substrate and a lead plate covering the substrate. A weld-aid layer and an insulating layer are arranged on the lead plate. The weld-aid layer is located below the insulating layer. The circuit board is characterized in that a ventilation air hole is arranged in the substrate; a porosity of the substrate is 30-80%; a bottom of the substrate is provided with a heat dissipation film. A porous ceramic plate is used and served as the substrate. And a heat dissipation copper film is additionally arranged on a bottom plate of the porous ceramic plate. Characteristics of the porous ceramic plate, which are a large heat dissipation area and fast heat transfer of the copper film, are used so that heat of an electronic component, the lead plate and the substrate can be rapidly eliminated and stability of the electronic component is further guaranteed.
Description
Technical field
The utility model relates to electrical field, is specifically related to a kind of cooling circuit board.
Background technology
In recent years, electronics technology is advanced by leaps and bounds, electronic installation is healed and is become accurate, therefore, for in order to connecting electronic component with the quality requirements of circuit board that forms a useful electronic installation also with higher, especially the in the situation that of electronic component microminiaturization densification, the heat that electronic component work done produces is relatively more, and the radiating efficiency of circuit board will directly affect the action stability of whole Electronic Components And Devices.General circuit plate is because material is limit, radiating effect is poor, cannot be immediately and rapidly electronic component is conducted to loose the removing of heat of circuit board itself, especially very easily produce the electronic component of high temperature for some, the light-emittingdiode of such as high luminous power etc., therefore, the circuit board of development high cooling efficiency becomes the problem that industry is more and more paid close attention to.
Summary of the invention
The purpose of this utility model is defect and the deficiency that overcomes existing technology, provides that a kind of radiating efficiency is high, the cooling circuit board of working stability.
For realizing above object, technical solution of the present utility model is: a kind of cooling circuit board, comprise substrate and cover the wire guide plate on substrate, on described wire guide plate, arrange and help layer and insulating barrier, and help layer to be positioned at the below of insulating barrier, it is characterized in that: the inside of described substrate is provided with ventilation holes, the porosity of substrate is 30～80%, and the bottom of described substrate is provided with heat dissipation film.
Described substrate is porous ceramic plate, and described heat dissipation film is copper film.
Described helping is provided with protective layer and conductive layer between layer and substrate.
The utility model uses porous ceramic plate as substrate, the large characteristic of area of dissipation that can utilize porous ceramic plate itself to have, the heat of electronic component and wire guide plate and even substrate is eliminated fast, the heat dissipation film of base plate bottom can be accelerated the conduction of heat, accelerate the speed that heat dissipates, and then ensure the stability of electronic component.
Brief description of the drawings
Fig. 1 is profile of the present utility model.
In figure: substrate 1, wire guide plate 2, helps layer 3, insulating barrier 4, ventilation holes 5, heat dissipation film 6, protective layer 7, conductive layer 8.
Embodiment
Below in conjunction with brief description of the drawings and embodiment, the utility model is described in further detail.
Referring to Fig. 1, a kind of cooling circuit board, comprise substrate 1 and cover the wire guide plate 2 on substrate 1, on described wire guide plate 2, arrange and help layer 3 and insulating barrier 4, and help layer 3 to be positioned at the below of insulating barrier 4, described helping is provided with protective layer 7 and conductive layer 8 between layer 3 and substrate 1, described substrate 1 is porous ceramic plate, the inside of substrate 1 is provided with ventilation holes 5, the porosity of substrate 1 is 30～80%, the bottom of substrate 1 is provided with the heat dissipation film 6 that material is copper film, in the time of work, the heat of electronic component and wire guide plate and even substrate can be able to quick elimination by the ventilation holes 5 on substrate 1 and heat dissipation film 6, ensure the stability of electronic component work.
Claims (3)
1. a cooling circuit board, comprise substrate (1) and cover the wire guide plate (2) on substrate (1), the upper setting of described wire guide plate (2) helps layer (3) and insulating barrier (4), and help layer (3) to be positioned at the below of insulating barrier (4), it is characterized in that: the inside of described substrate (1) is provided with ventilation holes (5), the porosity of substrate (1) is 30～80%, and the bottom of described substrate (1) is provided with heat dissipation film (6).
2. a kind of cooling circuit board according to claim 1, is characterized in that: described substrate (1) is porous ceramic plate, and described heat dissipation film (6) is copper film.
3. a kind of cooling circuit board according to claim 1, is characterized in that: described in help and between layer (3) and substrate (1), be provided with protective layer (7) and conductive layer (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420039265.8U CN203775519U (en) | 2014-01-22 | 2014-01-22 | Heat dissipation circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420039265.8U CN203775519U (en) | 2014-01-22 | 2014-01-22 | Heat dissipation circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203775519U true CN203775519U (en) | 2014-08-13 |
Family
ID=51292659
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420039265.8U Expired - Fee Related CN203775519U (en) | 2014-01-22 | 2014-01-22 | Heat dissipation circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203775519U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104934387A (en) * | 2015-06-25 | 2015-09-23 | 周绪胜 | Silicon carbide ceramic heat sink |
-
2014
- 2014-01-22 CN CN201420039265.8U patent/CN203775519U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104934387A (en) * | 2015-06-25 | 2015-09-23 | 周绪胜 | Silicon carbide ceramic heat sink |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20151231 Address after: 518000 Guangdong city of Shenzhen province Baoan District Xixiang Huang Tian Tianjia Industrial District 16 building two floor, A District Patentee after: Shenzhen best Electronics Co., Ltd. Address before: 441300 Shenzhen Industrial Park, Suizhou Economic Development Zone, Hubei Patentee before: Hubei Mei Yadi precision circuit Co., Ltd |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140813 Termination date: 20200122 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |