CN202511240U - LED lamp heat radiation structure and LED lamp - Google Patents
LED lamp heat radiation structure and LED lamp Download PDFInfo
- Publication number
- CN202511240U CN202511240U CN2012200913957U CN201220091395U CN202511240U CN 202511240 U CN202511240 U CN 202511240U CN 2012200913957 U CN2012200913957 U CN 2012200913957U CN 201220091395 U CN201220091395 U CN 201220091395U CN 202511240 U CN202511240 U CN 202511240U
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- China
- Prior art keywords
- led lamp
- porous foam
- heat radiation
- circuit board
- metal substrate
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- Expired - Fee Related
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Abstract
The utility model provides an LED lamp heat radiation structure and an LED lamp. The LED lamp heat radiation structure includes a circuit board and a porous foam metal substrate applied to the circuit board, a heat radiation positioning hole for the LED lamp to be installed is arranged in the circuit board, and the porous foam metal substrate is connected to a radiator. The LED lamp heat radiation structure and the LED lamp apply the circuit board to the porous foam metal substrate having high heat conduction coefficient, so the heat of the LED lamp is conducted to the radiator via the porous foam metal substrate, thereby improving the heat radiation performance of the LED lamp and saving the cost.
Description
Technical field
The utility model relates to the LED technical field of lamps, particularly a kind of LED lamp radiator structure and LED light fixture.
Background technology
At present, LED (Light Emitting Diode, light emitting diode or light-emittingdiode) lamp relies on advantages such as its good optical characteristic and length of energy-conservation life-span, has been widely used in the illumination and view brightening light fixture of every field.And the life-span of LED lamp is depended on its heat dispersion to a great extent, and promptly the caloric value of the LED lamp more effective radiator that is delivered to how prolongs LED lamp useful life.
The radiating mode major part of existing LED lamp is to conduct heat to radiator through aluminium base to dispel the heat, and owing to the cost reason, what major part adopted all is that thermal conductivity factor is at 2w/ (m
2K) aluminium base adopts the aluminium base of this cost to cause the LED lamp heat radiator of leading not yet in effect, has influence on the life-span and the light decay of LED lamp.
The utility model content
The purpose of the utility model is to propose a kind of good heat dispersion performance and lower-cost LED lamp radiator structure and LED light fixture.
For achieving the above object; The utility model provides a kind of LED lamp radiator structure; Comprise circuit board and the porous foam metal substrate of fitting with said circuit board, offer the heat radiation locating hole that supplies the LED lamp to install on the said circuit board, said porous foam metal substrate is connected in radiator.
Further, in above-mentioned LED lamp radiator structure, said porous foam metal substrate is porous foam copper base or porous foam aluminium base.
Further, in above-mentioned LED lamp radiator structure, also offer the boss in the heat radiation locating hole that can be sheathed on circuit board on the said porous foam metal substrate.
Further, in above-mentioned LED lamp radiator structure, said boss matches with the pore size of heat radiation locating hole.
Further, in above-mentioned LED lamp radiator structure, the thickness of said boss is consistent with the degree of depth of heat radiation locating hole.
The utility model also provides a kind of LED light fixture; Comprise LED lamp and LED lamp radiator structure; Said LED lamp radiator structure comprises circuit board and the porous foam metal substrate of fitting with said circuit board; Offer the heat radiation locating hole that supplies the LED lamp to install on the said circuit board, said porous foam metal substrate is connected in radiator.
Further, in above-mentioned LED light fixture, said porous foam metal substrate is porous foam copper base or porous foam aluminium base.
Further, in above-mentioned LED light fixture, also offer the boss in the heat radiation locating hole that can be sheathed on circuit board on the said porous foam metal substrate.
Further, in above-mentioned LED light fixture, said boss matches with the pore size of heat radiation locating hole.
Further, in above-mentioned LED light fixture, the thickness of said boss is consistent with the degree of depth of heat radiation locating hole.
The utility model LED lamp radiator structure and LED light fixture have the porous foam metal substrate of high thermal conductivity coefficient through circuit board is fitted; The heat of LED lamp is transmitted on the radiator through the porous foam metal substrate; Improve the heat dispersion of LED lamp, and reduced cost.
Description of drawings
Fig. 1 is the decomposition texture sketch map of the utility model LED lamp radiator structure one embodiment;
Fig. 2 is the structural representation of the utility model LED lamp radiator structure one embodiment;
Fig. 3 is that the utility model LED lamp radiator structure and LED lamp are installed the structural representation before fitting;
Fig. 4 is that the utility model LED lamp radiator structure and LED lamp are installed the structural representation after fitting.
The specific embodiment
Specify the preferred embodiment of the utility model below in conjunction with accompanying drawing.
See also Fig. 1 and Fig. 2; The utility model LED lamp radiator structure comprises circuit board 1 and the porous foam metal substrate 2 of fitting with said circuit board 1; Offer the heat radiation locating hole 12 that supplies the LED lamp to install on the said circuit board 1, said porous foam metal substrate 2 is connected in radiator (figure does not show).
Said porous foam metal substrate 2 is processed by metal materials such as porous foam copper, porous foam aluminium or other porous foam metals, and its porous foam copper has high thermal conductivity coefficient, can reach 40w/ (m
2K), but and have a processing characteristics, can extrusion modling, cutting.Can require the different porous foam metal of configuration according to different radiating, like porous foam copper base or porous foam aluminium base or other porous foam metal substrates etc.
Said porous foam metal substrate 2 can be transmitted on the radiator by the more effective heat that the LED lamp is sent, and the LED lamp life-span is prolonged.Through processing to foam copper, make it to be fit to different LED lamps, the effective more heat conduction of heat that makes the LED lamp is to radiator.
Surfacing for holding circuit plate 1; The electric contact of circuit that back LED lamp is installed is not affected; Also offer the boss 22 in the heat radiation locating hole 10 that can be sheathed on circuit board 1 on the said porous foam metal substrate 2; Said boss 22 matches with the pore size of heat radiation locating hole 12, and the thickness of said boss 22 is consistent with the degree of depth of heat radiation locating hole 10, so that the heat that LED lamp bottom is gathered can effectively be transmitted on the radiator through porous foam metal substrate 2.
Please consult Fig. 1 to Fig. 4 in the lump; The utility model also provides a kind of LED light fixture; Comprise LED lamp 100 and above-mentioned LED lamp radiator structure; Said LED lamp radiator structure comprises circuit board 1 and the porous foam metal substrate 2 of fitting with said circuit board 1, offers the heat radiation locating hole 12 that supplies LED lamp 100 to install on the said circuit board 1, and said porous foam metal substrate 2 is connected in radiator (figure does not show).
The manufacture process of the utility model LED lamp radiator structure and LED light fixture is following:
At first; Heat radiation locating hole 12 is offered in circuit board 1 applying LED lamp 100 corresponding installation positions; With the boss of offering on the said porous foam metal substrate 2 in the heat radiation locating hole 10 that can be sheathed on circuit board 1 22; Said boss 22 matches with the pore size of heat radiation locating hole 12, and the thickness of said boss 22 is consistent with the degree of depth of heat radiation locating hole 10, to keep and circuit board 1 surfacing; The electric contact of circuit that back LED lamp 100 is installed is not affected, and the heat that LED lamp 100 bottoms are gathered can effectively be transmitted on the radiator through porous foam metal substrate 2;
Then, said porous foam metal substrate 2 is fitted to circuit board 1, said boss 22 passes heat radiation locating hole 12, makes the surface of boss 22 mutually smooth with circuit board 1 surface;
At last, 100 installations of LED lamp are fitted on the heat radiation locating hole 12 of circuit board 1.
Than prior art; The utility model LED lamp radiator structure and LED light fixture have the porous foam metal substrate of high thermal conductivity coefficient through circuit board is fitted; The heat of LED lamp is transmitted on the radiator through the porous foam metal substrate; Improved the heat dispersion of LED lamp, the heat that the LED lamp is sent more effectively is transmitted on the radiator; And reduced cost, be applicable to masses more thereby the whole light fixture cost of LED is reduced.
Here description of the utility model and application is illustrative, is not to want the scope of the utility model is limited in the above-described embodiments.Here the distortion of the embodiment that is disclosed and change are possible, and the replacement of embodiment is known with the various parts of equivalence for those those of ordinary skill in the art.Those skilled in the art are noted that under the situation of spirit that does not break away from the utility model or substantive characteristics, and the utility model can be with other form, structure, layout, ratio, and realize with other assembly, material and parts.Under the situation that does not break away from the utility model scope and spirit, can carry out other distortion and change here to the embodiment that is disclosed.
Claims (10)
1. a LED lamp radiator structure is characterized in that, comprises circuit board and the porous foam metal substrate of fitting with said circuit board, offers the heat radiation locating hole that supplies the LED lamp to install on the said circuit board, and said porous foam metal substrate is connected in radiator.
2. LED lamp radiator structure according to claim 1 is characterized in that, said porous foam metal substrate is porous foam copper base or porous foam aluminium base.
3. LED lamp radiator structure according to claim 1 is characterized in that, also offers the boss in the heat radiation locating hole that can be sheathed on circuit board on the said porous foam metal substrate.
4. LED lamp radiator structure according to claim 3 is characterized in that, said boss matches with the pore size of heat radiation locating hole.
5. LED lamp radiator structure according to claim 4 is characterized in that, the thickness of said boss is consistent with the degree of depth of heat radiation locating hole.
6. LED light fixture; Comprise LED lamp and LED lamp radiator structure; It is characterized in that; Said LED lamp radiator structure comprises circuit board and the porous foam metal substrate of fitting with said circuit board, offers the heat radiation locating hole that supplies the LED lamp to install on the said circuit board, and said porous foam metal substrate is connected in radiator.
7. LED light fixture according to claim 1 is characterized in that, said porous foam metal substrate is porous foam copper base or porous foam aluminium base.
8. LED light fixture according to claim 1 is characterized in that, also offers the boss in the heat radiation locating hole that can be sheathed on circuit board on the said porous foam metal substrate.
9. LED light fixture according to claim 8 is characterized in that, said boss matches with the pore size of heat radiation locating hole.
10. LED light fixture according to claim 9 is characterized in that, the thickness of said boss is consistent with the degree of depth of heat radiation locating hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200913957U CN202511240U (en) | 2012-03-12 | 2012-03-12 | LED lamp heat radiation structure and LED lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200913957U CN202511240U (en) | 2012-03-12 | 2012-03-12 | LED lamp heat radiation structure and LED lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202511240U true CN202511240U (en) | 2012-10-31 |
Family
ID=47063724
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012200913957U Expired - Fee Related CN202511240U (en) | 2012-03-12 | 2012-03-12 | LED lamp heat radiation structure and LED lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202511240U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107747719A (en) * | 2017-11-17 | 2018-03-02 | 广州市诺思赛光电科技有限公司 | A kind of new radiator structure |
-
2012
- 2012-03-12 CN CN2012200913957U patent/CN202511240U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107747719A (en) * | 2017-11-17 | 2018-03-02 | 广州市诺思赛光电科技有限公司 | A kind of new radiator structure |
| CN107747719B (en) * | 2017-11-17 | 2023-09-22 | 广州市诺思赛光电科技有限公司 | Novel heat radiation structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121031 Termination date: 20140312 |