CN210781816U - Air-cooled radiator - Google Patents
Air-cooled radiator Download PDFInfo
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- CN210781816U CN210781816U CN201920869443.2U CN201920869443U CN210781816U CN 210781816 U CN210781816 U CN 210781816U CN 201920869443 U CN201920869443 U CN 201920869443U CN 210781816 U CN210781816 U CN 210781816U
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- air
- plate
- lower substrate
- upper substrate
- radiating
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Abstract
The utility model relates to an air-cooled radiator, including the infrabasal plate, the upper surface of infrabasal plate is equipped with curb plate, upper substrate and heating panel, curb plate, upper substrate, heating panel and infrabasal plate connect and form the accommodation space, place a plurality of fin in the accommodation space, each fin forms multilayer hierarchical structure on its length direction, along being close to the direction of keeping away from the heating panel, the graphic density at each level of hierarchical structure in the fin increases gradually; the heat dissipation plate is opposite to the air outlet of the electronic element, at least one placing cavity is formed in the surface of the heat dissipation plate, and a heat dissipation fan is arranged in the placing cavity. The utility model discloses can realize one-way heat conduction function, heat dispersion is good.
Description
Technical Field
The utility model relates to a radiator field especially relates to an air-cooled radiator.
Background
With the increasing requirements of reliability, performance index, power output and the like of electronic equipment, the heat dissipation requirement of the electronic equipment also needs to be correspondingly increased. The heat sink is an important heat dissipation component in electronic equipment, and is mainly used for dissipating heat generated by the heating element into ambient air so as to ensure that a heating object can work normally. The air-cooled radiator is a common radiator, is usually matched with cold air, and utilizes radiating fins on the radiator to radiate heat, so that the radiating fins with good performance can fully exert wind power, thereby achieving a good radiating effect.
The conventional air-cooled heat sink focuses on improving the heat dissipation area of the heat sink or reducing the volume of the heat sink, but the heat conduction function of the heat sink needs to be further improved.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem, the utility model aims at providing an air-cooled radiator, the utility model discloses can realize one-way heat conduction function, heat dispersion is good.
The utility model discloses an air cooling radiator, including infrabasal plate (1), the top of infrabasal plate (1) is equipped with curb plate (3), upper substrate (2) and heating panel (4), curb plate (3), upper substrate (2), heating panel (4) and infrabasal plate (1) are connected and are formed the accommodation space, place a plurality of fin (8) in the accommodation space, each fin (8) forms multilayer hierarchical structure on its length direction, along being close to the direction of keeping away from heating panel (4), the figure density at each level of hierarchical structure in fin (8) increases gradually; the heat dissipation plate (4) is opposite to the air outlet of the electronic element, at least one placing cavity is formed in the surface of the heat dissipation plate (4), and a heat dissipation fan (5) is arranged in the placing cavity.
Further, each hierarchical structure of the radiating fins (8) is a wave-shaped folded toothed sheet or a sheet-shaped fin.
Furthermore, a lower substrate inserting sheet groove (9) is arranged on the lower substrate (1), and the connecting end part of the radiating fin (8) is fixed in the lower substrate inserting sheet groove (9).
Furthermore, the upper substrate (2) is positioned right above the lower substrate (1), the upper substrate (2) is provided with a substrate inserting groove, and the other connecting end part of the radiating fin (8) is fixed in the upper substrate inserting groove.
Furthermore, a heat conducting medium is filled between the connecting end part of the radiating fin (8) and the lower substrate inserting sheet groove (9) or the upper substrate inserting sheet groove.
Further, the heat conducting medium is foam metal with a plurality of through holes.
Furthermore, the contact surface of the heat-conducting medium and the lower substrate inserting sheet groove (9) or the upper substrate inserting sheet groove is coated with bonding and fixing materials.
Furthermore, the placing cavity is in a through hole state, and a protective net (7) is arranged on the surface of one side of the placing cavity, which is opposite to the air outlet of the electronic element.
Furthermore, place to be equipped with in the cavity and place the dish, place to be equipped with rotation axis (6) on the dish, cup joint radiator fan (5) on rotation axis (6), radiator fan (5) pass through the wire and are connected with the motor.
Furthermore, the side plates (3), the upper substrate (2), the heat dissipation plate (4) and the lower substrate (1) are made of aluminum.
Borrow by above-mentioned scheme, the utility model discloses at least, have following advantage:
the utility model discloses place a plurality of fin (8) in the accommodation space, each fin (8) form multilayer hierarchical structure on its length direction, along being close to the direction of keeping away from heating panel (4), hierarchical structure's figure density at different levels increases gradually in fin (8), make fin (8) absorptive heat by keeping away from to the direction conduction of being close to heating panel (4), the heat that reaches heating panel (4) is taken away by radiator fan (5), realization electronic component's that this kind of unidirectional heat conduction effect can be better heat dissipation.
The above description is only an overview of the technical solution of the present invention, and in order to make the technical means of the present invention clearer and can be implemented according to the content of the description, the following detailed description is made with reference to the preferred embodiments of the present invention and accompanying drawings.
Drawings
Fig. 1 is a schematic structural view of the air-cooled radiator of the present invention;
fig. 2 is a schematic top view of the lower substrate of the present invention;
FIG. 3 is a schematic structural diagram of the heat sink of the present invention;
description of reference numerals:
1-lower substrate, 2-upper substrate, 3-side plate; 4-a heat dissipation plate, 5-a heat dissipation fan, 6-a rotating shaft, 7-a protective net, 8-a heat dissipation plate and 9-a lower substrate inserting sheet groove.
Detailed Description
The following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings and examples. The following examples are intended to illustrate the invention, but are not intended to limit the scope of the invention.
Referring to fig. 1, the present invention provides an air cooling radiator, which includes a lower substrate 1, a side plate 3, an upper substrate 2 and a heat dissipation plate 4 are disposed above the lower substrate 1, and the side plate 3, the upper substrate 2, the heat dissipation plate 4 and the lower substrate 1 are made of aluminum. The side plate 3, the upper substrate 2, the heat dissipation plate 4 and the lower substrate 1 are connected to form an accommodating space, and a plurality of heat dissipation fins 8 are placed in the accommodating space. The upper substrate 2 is positioned right above the lower substrate 1, the upper substrate 2 is provided with an upper substrate inserting sheet groove, the lower substrate 1 is provided with a lower substrate inserting sheet groove 9, and two connecting ends of the radiating fins 8 are respectively fixed in the upper substrate inserting sheet groove and the lower substrate inserting sheet groove 9. Each of the heat radiating fins 8 has a multi-layer hierarchical structure in the longitudinal direction thereof, and the pattern density of each of the hierarchical structures in the heat radiating fins 8 gradually increases in the direction from the vicinity to the distance from the heat radiating plate 4. Each hierarchical structure of the heat radiation fins 8 is a wave-shaped folded toothed sheet or a sheet-shaped fin. In fig. 2-3, the heat sink 8 is in the form of a plate fin. Heat conducting media are respectively filled between the connecting end part of the radiating fin 8 and the lower substrate inserting piece groove 9 or the upper substrate inserting piece groove, and bonding and fixing materials are coated on the contact surfaces of the heat conducting media and the lower substrate inserting piece groove 9 or the upper substrate inserting piece groove. The heat conducting medium is foam metal with a plurality of through holes.
The heat dissipation plate 4 is opposite to the air outlet of the electronic element, at least one placing cavity is formed in the surface of the heat dissipation plate 4, and a heat dissipation fan 5 is arranged in the placing cavity. Place to be equipped with in the cavity and place the dish, place and be equipped with rotation axis 6 on the dish, cup joint radiator fan 5 on the rotation axis 6, radiator fan 5 passes through the wire and is connected with the motor. The placing cavity is in a through hole state, and a protective net 7 is arranged on the surface of one side of the placing cavity, which is opposite to the air outlet of the electronic element.
The utility model discloses the during operation, the heat that produces in the electronic component course of work transmits for fin 8 earlier, because hierarchical structure's figure density at different levels in fin 8 crescent, by the heat of fin 8 absorption to the direction conduction of being close to heating panel 4 by keeping away from, the heat that reaches heating panel 4 is taken away by radiator fan 5 to play the effect of cooling.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and it should be noted that, for those skilled in the art, a plurality of modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the protection scope of the present invention.
Claims (10)
1. An air-cooled radiator, characterized in that: the radiating fin structure comprises a lower substrate (1), wherein a side plate (3), an upper substrate (2) and a radiating plate (4) are arranged above the lower substrate (1), the side plate (3), the upper substrate (2), the radiating plate (4) and the lower substrate (1) are connected to form an accommodating space, a plurality of radiating fins (8) are placed in the accommodating space, each radiating fin (8) forms a multi-layer hierarchical structure in the length direction of the radiating fin, and the density of each level of graph of the hierarchical structure in the radiating fins (8) is gradually increased along the direction from being close to being far away from the radiating plate (4); the heat dissipation plate (4) is over against the air outlet of the electronic element, at least one placing cavity is formed in the surface of the heat dissipation plate (4), and a heat dissipation fan (5) is arranged in the placing cavity.
2. The air-cooled heat sink of claim 1, wherein: each hierarchical structure of the radiating fin (8) is a wave-shaped folding toothed sheet or a sheet-shaped fin.
3. The air-cooled heat sink of claim 1, wherein: the lower substrate (1) is provided with a lower substrate inserting sheet groove (9), and the connecting end part of the radiating fin (8) is fixed in the lower substrate inserting sheet groove (9).
4. The air-cooled heat sink of claim 1, wherein: the upper substrate (2) is located right above the lower substrate (1), an upper substrate inserting groove is formed in the upper substrate (2), and the other connecting end portion of the radiating fin (8) is fixed in the upper substrate inserting groove.
5. The air-cooled heat sink of claim 3 or 4, wherein: and a heat-conducting medium is filled between the connecting end part of the radiating fin (8) and the lower substrate inserting sheet groove (9) or the upper substrate inserting sheet groove.
6. The air-cooled heat sink of claim 5, wherein: the heat conducting medium is foam metal with a plurality of through holes.
7. The air-cooled heat sink of claim 5, wherein: the contact surface of the heat-conducting medium and the lower substrate inserting sheet groove (9) or the upper substrate inserting sheet groove is coated with bonding and fixing materials.
8. The air-cooled heat sink of claim 1, wherein: the placing cavity is in a through hole state, and a protective net (7) is arranged on the surface of one side, opposite to the air outlet of the electronic element, of the placing cavity.
9. The air-cooled heat sink of claim 1, wherein: the placing cavity is internally provided with a placing plate, the placing plate is provided with a rotating shaft (6), the rotating shaft (6) is sleeved with the radiating fan (5), and the radiating fan (5) is connected with the motor through a wire.
10. The air-cooled heat sink of claim 1, wherein: the side plates (3), the upper substrate (2), the heat dissipation plate (4) and the lower substrate (1) are made of aluminum.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920869443.2U CN210781816U (en) | 2019-06-11 | 2019-06-11 | Air-cooled radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920869443.2U CN210781816U (en) | 2019-06-11 | 2019-06-11 | Air-cooled radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210781816U true CN210781816U (en) | 2020-06-16 |
Family
ID=71045073
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920869443.2U Active CN210781816U (en) | 2019-06-11 | 2019-06-11 | Air-cooled radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210781816U (en) |
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2019
- 2019-06-11 CN CN201920869443.2U patent/CN210781816U/en active Active
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