CN212842313U

CN212842313U - Radial waveguide combining power amplifier module based on broadband millimeter waves

Info

Publication number: CN212842313U
Application number: CN202021974919.8U
Authority: CN
Inventors: 孟剑; 雷崇文
Original assignee: Beijing Aofengyuan Technology Co ltd
Current assignee: Beijing Aofengyuan Technology Co ltd
Priority date: 2020-09-10
Filing date: 2020-09-10
Publication date: 2021-03-30
Anticipated expiration: 2030-09-10

Abstract

The utility model provides a radial waveguide closes way power amplifier module based on broadband millimeter wave belongs to power amplifier technical field. The radial waveguide combining power amplifier module based on the broadband millimeter waves comprises a shell assembly, a heat absorption assembly and a ventilation assembly. The power amplifier and the switching power supply are fixed at the bottom end inside the shell, the semiconductor refrigeration piece is attached to the outer surface of the power amplifier, one end of the heat pipe is connected with the heat absorption piece, the two ends of the first connecting plate and the second connecting plate are connected inside the louver, the micro motor is fixed on the first connecting plate, the fan blade is rotatably connected with the output end of the micro motor, and the exhaust fan is fixed on the second connecting plate. The internal temperature of the shell is reduced and the heat dissipation efficiency in the shell is improved. The probability of damage of the integrated circuit is reduced, and the reliability of microwave communication is improved.

Description

Radial waveguide combining power amplifier module based on broadband millimeter waves

Technical Field

The utility model relates to a power amplifier field particularly, relates to radial waveguide closes way power amplifier module based on broadband millimeter wave.

Background

At present, the demand for high-efficiency and broadband high-power solid-state power amplifiers is increasing day by day, however, the power output by a single solid-state device in the microwave and millimeter wave frequency band is limited, and the demand of the system cannot be met. Therefore, the development of broadband and composite circuits is strongly promoted by studying a method of power synthesis using a plurality of solid-state devices to obtain high power output.

The power amplifier is an important component of microwave equipment, and the over-high temperature of the power amplifier easily causes the circuit failure of the microwave equipment to damage an integrated circuit, cause signal interruption and influence the reliability of microwave communication. The existing power amplifier usually has heat dissipation borne by a machine body shell and a heat radiator, so that the heat capacity is insufficient, the communication performance is easy to be unstable, and the service life is easy to be reduced. How to invent a radial waveguide combination power amplifier module based on broadband millimeter waves to improve the problems becomes a problem to be solved currently.

SUMMERY OF THE UTILITY MODEL

In order to compensate above not enough, the utility model provides a radial waveguide closes way power amplifier module based on broadband millimeter wave aims at improving thereby microwave equipment circuit trouble damage integrated circuit is leaded to easily to power amplifier's high temperature, arouses the interrupt of signalling, influences the problem of microwave communication reliability.

The utility model discloses a realize like this:

the utility model provides a radial waveguide closes way power amplifier module includes shell subassembly, heat absorption subassembly and ventilation subassembly based on broadband millimeter wave.

The housing assembly includes a housing and louvers disposed on both sides of the housing, the louvers communicating with the housing.

The heat absorption assembly comprises a power amplifier, a switching power supply, a semiconductor refrigeration piece, a heat absorption piece, a heat pipe, a phase change radiator and heat dissipation fins, the power amplifier and the switching power supply are fixed to the bottom inside the shell, the semiconductor refrigeration piece is attached to the outer surface of the power amplifier, the heat absorption piece is arranged on one side of the semiconductor refrigeration piece, one end of the heat pipe is connected with the heat absorption piece, the other end of the heat pipe penetrates through the shell, the phase change radiator is attached to the upper surface of the power amplifier, and the heat dissipation fins are fixed above the phase change radiator.

The ventilation assembly comprises a first connecting plate, a micro motor, fan blades, a second connecting plate and an exhaust fan, wherein the two ends of the first connecting plate and the second connecting plate are connected inside the shutter, the micro motor is fixed on the first connecting plate, the fan blades are connected with the output end of the micro motor in a rotating mode, and the exhaust fan is fixed on the second connecting plate.

In an embodiment of the present invention, the outer surface of the housing has a vent hole, and the outer corner of the housing is fixed with a reinforcing rib.

The utility model discloses an in the embodiment, the corner of casing is connected with the installation foot, the mounting hole has been seted up on the installation foot.

In an embodiment of the present invention, the bottom of the power amplifier is provided with a heat dissipation aluminum plate, and the heat dissipation aluminum plate is fixed to the inner bottom of the casing.

In an embodiment of the present invention, a heat-conducting silicone layer is disposed between the power amplifier and the heat-dissipating aluminum plate, and the power amplifier passes through the heat-conducting silicone layer and is fixed inside the housing.

The utility model discloses an in the embodiment, the semiconductor refrigeration piece divide into hot face and cold face, cold face with the power amplifier laminating, hot face with the heat absorbing sheet laminating.

In an embodiment of the present invention, the heat pipe has a first end and a second end, the first end is connected to the heat pipe, and the second end is connected to the heat pipe.

The utility model discloses an in the embodiment, phase change heat radiator's inside top is provided with the sand grip, phase change heat radiator's inside packing has gaseous heat dissipation working medium.

In an embodiment of the present invention, the first connecting plate is connected to a fixing block, and the micro motor passes through the fixing block and the first connecting plate are connected.

In an embodiment of the present invention, a dust screen is disposed between the first connecting plate and the louver, and a drying agent is disposed between the dust screen and the first connecting plate.

The utility model has the advantages that: the utility model discloses a radial waveguide based on broadband millimeter wave closes way power amplifier module that above-mentioned design obtained, during the use, the semiconductor refrigeration piece absorbs power amplifier's heat, and the semiconductor refrigeration piece divide into hot side and cold side, and cold side and power amplifier laminating, hot side and heat absorption piece laminating. The heat pipe absorbs the heat absorbed by the heat absorption sheet, the heat absorption sheet is cooled, the heat dissipation of the side face of the power amplifier is facilitated, the heat generated by the power amplifier is transferred to the bottom of the phase-change radiator and is transferred to the heat dissipation fins, and the heat dissipation of the upper portion of the power amplifier is facilitated. Drive the flabellum through micro motor and rotate to cooling down power amplifier, the air discharge fan is with the inside surplus heat discharge of casing, can make the air in the casing obtain the circulation through flabellum and air discharge fan simultaneously, is favorable to reducing the inside temperature of casing and improves the radiating efficiency in the casing. The probability of damage of the integrated circuit is reduced, and the reliability of microwave communication is improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

Fig. 1 is a schematic structural diagram of a radial waveguide combining power amplifier module based on broadband millimeter waves according to an embodiment of the present invention;

fig. 2 is a schematic structural view of a housing assembly according to an embodiment of the present invention;

fig. 3 is a schematic structural view of a heat absorbing assembly according to an embodiment of the present invention;

fig. 4 is a schematic structural diagram of a phase change heat sink according to an embodiment of the present invention;

fig. 5 is a schematic view of a first perspective structure of a ventilation assembly according to an embodiment of the present invention;

fig. 6 is a schematic view of a second perspective structure of the ventilation assembly according to an embodiment of the present invention.

In the figure: 100-a housing assembly; 110-a housing; 120-a shutter; 130-air holes; 140-reinforcing ribs; 150-mounting feet; 160-mounting holes; 200-a heat absorbing component; 210-a power amplifier; 220-a switching power supply; 230-a heat-dissipating aluminum plate; 240-a thermally conductive silicone layer; 250-semiconductor refrigerating sheets; 260-a heat sink sheet; 270-a heat pipe; 272-a nut; 274-heat conducting silica gel; 280-phase change heat sink; 282-ribs; 284-gas heat dissipation working medium; 290-heat dissipation fins; 300-a ventilation assembly; 310-a first connection plate; 312-fixed block; 320-a micro motor; 330-fan blades; 340-dust screen; 350-a desiccant; 360-a second connecting plate; 370-exhaust fan.

Detailed Description

To make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the drawings of the embodiments of the present invention are combined to clearly and completely describe the technical solutions of the embodiments of the present invention, and obviously, the described embodiments are some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

Examples

Referring to fig. 1-6, the present invention provides a technical solution: the radial waveguide combiner power amplifier module based on the broadband millimeter wave comprises a shell assembly 100, a heat absorption assembly 200 and a ventilation assembly 300.

Referring to fig. 1-6, the housing assembly 100 includes a housing 110 and louvers 120, the louvers 120 being disposed on both sides of the housing 110, the louvers 120 being in communication with the housing 110. The outer surface of the casing 110 is provided with an air vent 130, the air vent 130 is formed to facilitate exchange of air inside and outside the casing 110, the outer corner of the exchanged casing 110 is fixed with a reinforcing rib 140, the corner of the casing 110 is connected with a mounting leg 150, and the mounting leg 150 is provided with a mounting hole 160. The housing 110 may be fixed by the mounting legs 150 and the mounting holes 160.

Referring to fig. 1 to 6, the heat absorbing assembly 200 includes a power amplifier 210, a switching power supply 220, a semiconductor cooling plate 250, a heat absorbing plate 260, a heat pipe 270, a phase change heat sink 280 and heat dissipating fins 290, wherein the power amplifier 210 and the switching power supply 220 are fixed at the bottom of the interior of the housing 110, a heat dissipating aluminum plate 230 is disposed at the bottom of the power amplifier 210, and the heat dissipating aluminum plate 230 is fixed at the bottom of the interior of the housing 110. A heat conductive silicone layer 240 is disposed between the power amplifier 210 and the heat dissipating aluminum plate 230, and the power amplifier 210 is fixed inside the housing 110 through the heat conductive silicone layer 240. The heat-conducting silicone layer 240 bonds the power amplifier 210 to the heat-dissipating aluminum plate 230, and the bottom end of the power amplifier 210 can be heat-dissipated through the heat-conducting silicone layer 240 and the heat-dissipating aluminum plate 230, so that heat is transferred to the housing 110. The semiconductor refrigeration piece 250 is attached to the outer surface of the power amplifier 210, the heat absorption piece 260 is arranged on one side of the semiconductor refrigeration piece 250, the semiconductor refrigeration piece 250 is divided into a hot surface and a cold surface, the cold surface is attached to the power amplifier 210, and the hot surface is attached to the heat absorption piece 260. The semiconductor cooling plate 250 absorbs heat of the power amplifier 210, then transfers the heat to the heat absorbing plate 260, one end of the heat pipe 270 is connected with the heat absorbing plate 260, and the heat pipe 270 absorbs the heat absorbed by the heat absorbing plate 260 to cool the heat absorbing plate 260. The other end of the heat pipe 270 penetrates through the casing 110, a nut 272 is disposed between one end of the heat pipe 270 and the casing 110, and a heat-conducting silica gel 274 is disposed between the heat sink 260 and the heat pipe 270. The heat pipe 270 and the heat absorbing plate 260 are bonded through the heat conducting silica gel 274, and the heat pipe 270 and the shell 110 are fixed through the screw cap 272, so that the semiconductor refrigerating plate 250 and the heat absorbing plate 260 can be tightly pressed with the power amplifier 210, and heat transfer and absorption are facilitated. The phase change heat sink 280 is attached to the upper surface of the power amplifier 210, and the heat dissipation fins 290 are fixed above the phase change heat sink 280. Convex strips 282 are arranged at the top end of the phase change heat radiator 280, and a gas heat radiation working medium 284 is filled in the phase change heat radiator 280. The heat generated by the power amplifier 210 is transferred to the bottom of the phase change heat sink 280, the gas heat dissipation working medium 284 inside the phase change heat sink 280 is heated and evaporated, and is evaporated to the upper portion of the phase change heat sink 280 and transfers the heat to the heat dissipation fins 290, the gas heat dissipation working medium 284 condenses after being cooled, flows back along the protruding strips 282, absorbs the heat from the bottom of the phase change heat sink 280, and circulates in a reciprocating manner, thereby being beneficial to heat dissipation of the upper portion of the power amplifier 210.

Referring to fig. 1 to 6, the ventilation assembly 300 includes a first connecting plate 310, a micro motor 320, a fan blade 330, a second connecting plate 360, and an exhaust fan 370, two ends of the first connecting plate 310 and the second connecting plate 360 are connected to the inside of the louver 120, the micro motor 320 is fixed on the first connecting plate 310, the fan blade 330 is rotatably connected to an output end of the micro motor 320, the fan blade 330 is driven by the micro motor 320 to rotate, so as to cool the power amplifier 210, the first connecting plate 310 is connected to a fixing block 312, and the micro motor 320 is connected to the first connecting plate 310 through the fixing block 312. A dust screen 340 is disposed between the first connection plate 310 and the louver 120, a drying agent 350 is disposed between the dust screen 340 and the first connection plate 310, the dust screen 340 filters air entering the housing 110 from the outside to prevent dust from entering the housing 110, the drying agent 350 dries the air entering the housing 110, and the exhaust fan 370 is fixed on the second connection plate 360. The exhaust fan 370 exhausts the residual heat inside the casing 110, and the fan blades 330 and the exhaust fan 370 can circulate the air inside the casing 110, which is beneficial to reducing the internal temperature of the casing 110.

The working principle of the radial waveguide combining power amplifier module based on the broadband millimeter wave is as follows: during the use, can dispel the heat to power amplifier 210's bottom through heat conduction silicone grease layer 240 and heat dissipation aluminum plate 230, semiconductor refrigeration piece 250 absorbs power amplifier 210's heat, and semiconductor refrigeration piece 250 divide into hot face and cold face, and the cold face is laminated with power amplifier 210, and hot face and the laminating of heat absorption piece 260. The heat pipe 270 absorbs the heat absorbed by the heat absorbing fins 260, and cools the heat absorbing fins 260, thereby facilitating heat dissipation of the side of the power amplifier 210, the heat generated by the power amplifier 210 is transferred to the bottom of the phase change heat sink 280, the gas heat dissipation working medium 284 inside the phase change heat sink 280 is heated and evaporated, and is evaporated to the upper portion of the phase change heat sink 280 and transfers the heat to the heat dissipation fins 290, the gas heat dissipation working medium 284 is condensed after being cooled, and flows back along the protruding strips 282, and then absorbs the heat from the bottom of the phase change heat sink 280, and the cycle is repeated, thereby facilitating heat dissipation of the upper portion of the power amplifier 210. Drive flabellum 330 through micro motor 320 and rotate to power amplifier 210 cools down, dust screen 340 filters the outside air that gets into casing 110, prevent that the dust from getting into in the casing 110, drier 350 is dry to the air that gets into casing 110, exhaust fan 370 discharges the inside surplus heat of casing 110, can make the air in the casing 110 obtain the circulation through flabellum 330 and exhaust fan 370 simultaneously, be favorable to reducing the inside temperature of casing 110 and improve the radiating efficiency in the casing 110. The problem that the microwave communication reliability is influenced due to signal interruption caused by damage to an integrated circuit caused by circuit failure of microwave equipment easily caused by overhigh temperature of the power amplifier is solved.

It should be noted that the specific model specifications of the power amplifier 210, the switching power supply 220, the micro motor 320 and the exhaust fan 370 need to be determined by type selection according to the actual specification of the device, and the specific type selection calculation method adopts the prior art, so detailed description is omitted.

The power supply and the principle of the power amplifier 210, the switching power supply 220, the micro motor 320, and the exhaust fan 370 will be apparent to those skilled in the art and will not be described in detail herein.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The radial waveguide combining power amplifier module based on broadband millimeter waves is characterized by comprising

A housing assembly (100), the housing assembly (100) comprising a housing (110) and louvers (120), the louvers (120) being disposed on both sides of the housing (110), the louvers (120) being in communication with the housing (110);

a heat absorbing assembly (200), wherein the heat absorbing assembly (200) comprises a power amplifier (210), a switching power supply (220), a semiconductor refrigeration sheet (250), a heat absorbing sheet (260), a heat pipe (270), a phase change heat radiator (280) and a heat radiating fin (290), the power amplifier (210) and the switching power supply (220) are fixed at the inner bottom end of the housing (110), the semiconductor chilling plate (250) is attached to the outer surface of the power amplifier (210), the heat absorbing sheet (260) is arranged on one side of the semiconductor chilling sheet (250), one end of the heat pipe (270) is connected with the heat absorbing sheet (260), the other end of the heat pipe (270) penetrates through the shell (110), the phase change heat sink (280) is attached to the upper surface of the power amplifier (210), the heat radiating fins (290) are fixed above the phase change heat radiator (280);

ventilation assembly (300), ventilation assembly (300) includes first connecting plate (310), micro motor (320), flabellum (330), second connecting plate (360) and exhaust fan (370), first connecting plate (310) with the both ends of second connecting plate (360) are connected the inside of shutter (120), micro motor (320) are fixed on first connecting plate (310), flabellum (330) with the output of micro motor (320) rotates and is connected, exhaust fan (370) are fixed on second connecting plate (360).

2. The broadband millimeter wave based radial waveguide combiner power amplifier module as claimed in claim 1, wherein an air hole (130) is formed in an outer surface of the housing (110), and a reinforcing rib (140) is fixed to an outer corner of the housing (110).

3. The broadband millimeter wave based radial waveguide combining power amplifier module according to claim 1, wherein a mounting pin (150) is connected to a corner of the housing (110), and a mounting hole (160) is formed in the mounting pin (150).

4. The broadband millimeter wave based radial waveguide combiner power amplifier module according to claim 1, wherein a bottom end of the power amplifier (210) is provided with a heat dissipation aluminum plate (230), and the heat dissipation aluminum plate (230) is fixed at an inner bottom end of the housing (110).

5. The broadband millimeter wave based radial waveguide combiner power amplifier module according to claim 4, wherein a heat conducting silicone layer (240) is disposed between the power amplifier (210) and the heat dissipating aluminum plate (230), and the power amplifier (210) is fixed inside the housing (110) through the heat conducting silicone layer (240).

6. The broadband millimeter wave based radial waveguide combiner power amplifier module of claim 1, wherein the semiconductor chilling plate (250) is divided into a hot side and a cold side, the cold side is attached to the power amplifier (210), and the hot side is attached to the heat sink (260).

7. The broadband millimeter wave based radial waveguide combiner power amplifier module according to claim 1, wherein a nut (272) is disposed between one end of the heat pipe (270) and the housing (110), and a thermally conductive silicone (274) is disposed between the heat sink (260) and the heat pipe (270).

8. The broadband millimeter wave based radial waveguide combiner power amplifier module as claimed in claim 1, wherein a convex strip (282) is disposed at the top end of the phase change heat sink (280), and a gas heat dissipation working medium (284) is filled in the phase change heat sink (280).

9. The broadband millimeter wave based radial waveguide combiner power amplifier module according to claim 1, wherein a fixed block (312) is connected to the first connection board (310), and the micro motor (320) is connected to the first connection board (310) through the fixed block (312).

10. The broadband millimeter wave based radial waveguide combiner power amplifier module of claim 1, wherein a dust screen (340) is disposed between the first connection plate (310) and the louver (120), and a desiccant (350) is disposed between the dust screen (340) and the first connection plate (310).