CN210270712U - Novel mainboard structure - Google Patents
Novel mainboard structure Download PDFInfo
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- CN210270712U CN210270712U CN201920779000.4U CN201920779000U CN210270712U CN 210270712 U CN210270712 U CN 210270712U CN 201920779000 U CN201920779000 U CN 201920779000U CN 210270712 U CN210270712 U CN 210270712U
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 61
- 239000011229 interlayer Substances 0.000 claims abstract description 26
- 239000010410 layer Substances 0.000 claims abstract description 18
- 238000001816 cooling Methods 0.000 claims abstract description 16
- 238000000926 separation method Methods 0.000 claims abstract description 12
- 230000017525 heat dissipation Effects 0.000 claims description 7
- 230000006835 compression Effects 0.000 claims description 6
- 238000007906 compression Methods 0.000 claims description 6
- 238000005057 refrigeration Methods 0.000 claims description 6
- 239000012530 fluid Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 5
- 238000005192 partition Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000005034 decoration Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000009795 derivation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
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- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
Abstract
The utility model provides a novel mainboard structure, which comprises a body, wherein the body comprises a mainboard and a cooling device; the cooling device comprises a working medium box, a working medium pump and a heat conducting working medium, and the bottom of the main board is tightly attached to the top of the working medium box; a separation plate is arranged in the working medium box and is parallel to the top of the working medium box, and a plurality of water channel separation layers are arranged between the top of the working medium box and the separation plate in a staggered manner to form a bent heat exchange water channel; one end of the interlayer plate is provided with a water inlet, the other end of the interlayer plate is provided with a water outlet, and the heat exchange water channel is respectively communicated with the water inlet and the water outlet; the heat-conducting working medium is contained between the interlayer plate and the bottom of the working medium box, the working medium pump sinks in the heat-conducting working medium, and the working medium pump is connected with the water inlet through a water inlet pipeline. The embodiment of the utility model provides a novel mainboard structure optimizes the mainboard structure, improves the radiating effect simultaneously.
Description
Technical Field
The utility model belongs to the technical field of the computer equipment technique and specifically relates to a novel mainboard structure is related to.
Background
The computer mainboard is generally a rectangular circuit board, on which the main circuit system for forming the computer is mounted, and includes elements of BIOS chip, I/O control chip, key and panel control switch interface, indicator lamp plug-in unit, expansion slot, mainboard and direct current power supply plug-in unit of plug-in card, etc.
In the prior art, the integrated circuit and the large-scale integrated circuit are distributed on the mainboard, so that the mainboard can generate a large amount of heat during working, and if the generated heat cannot be timely and smoothly discharged, the circuit and the circuit board are easily burnt. The heat sink of the motherboard is generally composed of a heat sink attached to the motherboard or CPU and a fan that rotates to flow air, thereby dissipating heat. However, the fan draws air from the mainboard or the CPU, namely blows air from inside to outside, so that the heat dissipation effect is poor due to the limited internal space of the case and the thin air volume; in addition, the hot-blast wind that blows out still partly stays in quick-witted incasement portion because the wind speed is difficult to direct derivation to quick-witted case outside inadequately, forms heated air circulation very easily, and more hot moreover, the temperature is higher and more high, can lead to the fin local overheat, and the material plastics of fan itself is burnt in incessantly roast, arouses the fan deformation then, and the vicious circle of rotational speed decline, when more serious, can take place the fan stall, and motor circuit short circuit burns out mainboard or CPU.
SUMMERY OF THE UTILITY MODEL
The utility model provides a novel mainboard structure to optimize mainboard structure, improve the radiating effect simultaneously.
In order to solve the above technical problem, an embodiment of the present invention provides a novel main board structure, which includes a main body, wherein the main body includes a main board and a cooling device; the cooling device comprises a working medium box, a working medium pump and a heat conducting working medium, and the bottom of the main board is tightly attached to the top of the working medium box;
a separation plate is arranged in the working medium box and is parallel to the top of the working medium box, and a plurality of water channel separation layers are arranged between the top of the working medium box and the separation plate in a staggered manner to form a bent heat exchange water channel;
one end of the interlayer plate is provided with a water inlet, the other end of the interlayer plate is provided with a water outlet, and the heat exchange water channel is respectively communicated with the water inlet and the water outlet;
the heat-conducting working medium is contained between the interlayer plate and the bottom of the working medium box, the working medium pump sinks in the heat-conducting working medium, and the working medium pump is connected with the water inlet through a water inlet pipeline.
As a preferred scheme, the water inlet is arranged at one end of the heat exchange water channel, and the water outlet is arranged at the other end of the heat exchange water channel.
Preferably, a plurality of turbulence pieces are arranged in the heat exchange water channel.
Preferably, the distance between each water channel interlayer and the adjacent water channel interlayer is equal.
Preferably, the water channel partition layers are parallel to each other.
Preferably, the device further comprises a filter, and the filter is arranged at the inlet of the working medium pump.
As a preferred scheme, the outer side wall of the working medium box is provided with radiating fins.
As a preferred scheme, a plurality of water leaking ports are arranged close to the water outlet, the water leaking ports are located between the interlayer plate and the side wall of the working medium box, and radiating fins are arranged on the side wall, close to the water leaking ports, of the working medium box.
And as a preferable scheme, the system further comprises a compression type refrigeration cycle device, wherein an evaporator of the compression type refrigeration cycle cooling device is arranged in the working medium box, and heat dissipation is carried out through a condenser at the outer side.
Preferably, the evaporator is a heat dissipation coil.
Compared with the prior art, the embodiment of the utility model has the advantages that the embodiment of the utility model provides a novel mainboard structure, which comprises a body, wherein the body comprises a mainboard and a cooling device; the cooling device comprises a working medium box, a working medium pump and a heat conducting working medium, and the bottom of the main board is tightly attached to the top of the working medium box; a separation plate is arranged in the working medium box and is parallel to the top of the working medium box, and a plurality of water channel separation layers are arranged between the top of the working medium box and the separation plate in a staggered manner to form a bent heat exchange water channel; one end of the interlayer plate is provided with a water inlet, the other end of the interlayer plate is provided with a water outlet, and the heat exchange water channel is respectively communicated with the water inlet and the water outlet; the heat-conducting working medium is contained between the interlayer plate and the bottom of the working medium box, the working medium pump sinks in the heat-conducting working medium, and the working medium pump is connected with the water inlet through a water inlet pipeline. Through will the mainboard hug closely in the top of working medium case utilizes heat transfer performance of heat conduction working medium to flow lead to the working medium to absorb the heat of mainboard, thereby reach the reduction the purpose of mainboard temperature, and then do benefit to the mainboard moves steadily. The working medium box is divided into two layers, the upper layer is a heat exchange water channel, the lower layer is a liquid storage box, the top of the working medium box and the interlayer plates are parallel and sealed into a whole, the working medium box is combined with the water channel interlayer to form the heat exchange water channel, and the bent heat exchange water channel can prolong a heat exchange water channel and is beneficial to fully absorbing the heat of the mainboard. In addition, the heat conducting working medium is pumped into the heat exchange water channel through the working medium pump, so that when the heat conducting working medium is filled in the heat exchange water channel and flows, heat at the top of the working medium box can be taken away, the heat is carried to flow back to the lower layer from the water outlet to be cooled, and the circulation is carried out, the heat of the main board is taken away through the heat conducting working medium of the heat exchange water channel, the heat is cooled in the working medium box, and finally the heat is led out through the working medium box.
Drawings
Fig. 1 is a schematic structural diagram of a novel main board structure in an embodiment of the present invention;
fig. 2 is an exploded schematic view of the novel main board structure in the embodiment of the present invention;
fig. 3 is a schematic structural diagram of a cooling device of a novel main board structure in an embodiment of the present invention;
wherein the reference numbers in the drawings of the specification are as follows:
1. a main board; 2. a working medium tank; 21. a interlayer plate; 22. a water inlet; 23. a water outlet; 24. a water leakage port; 3. a water inlet pipe; 31. a working medium pump; 32. a filter; 33. a water channel interlayer; 4. a turbulence member; 5. a heat dissipating fin; 6. a heat conducting working medium.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
Referring to fig. 1 and 2, a preferred embodiment of the present invention provides a novel main board 1 structure, which includes a main body, wherein the main body includes a main board 1 and a cooling device; the cooling device comprises a working medium box 2, a working medium pump 31 and a heat conducting working medium 6, and the bottom of the main board 1 is tightly attached to the top of the working medium box 2;
a division plate 21 is arranged in the working medium box 2, the division plate 21 is parallel to the top of the working medium box 2, and a plurality of water channel division layers 33 are arranged between the top of the working medium box 2 and the division plate 21 in a staggered manner to form a bent heat exchange water channel;
a water inlet 22 is formed in one end of the interlayer plate 21, a water outlet 23 is formed in the other end of the interlayer plate 21, and the heat exchange water channel is respectively communicated with the water inlet 22 and the water outlet 23;
the heat conducting working medium 6 is accommodated between the interlayer plate 21 and the bottom of the working medium box 2, the working medium pump 31 sinks in the heat conducting working medium 6, and the working medium pump 31 is connected with the water inlet 22 through the water inlet pipeline 3.
In this embodiment, the mainboard 1 is tightly attached to the top of the working medium box 2, and the heat exchange performance of the heat conducting working medium 6 is utilized to flow so that the working medium absorbs the heat of the mainboard 1, thereby achieving the purpose of reducing the temperature of the mainboard 1 and further being beneficial to the stable operation of the mainboard 1.
The working medium box 2 is divided into two layers, the upper layer is a heat exchange water channel, the lower layer is a liquid storage box, the top of the working medium box 2 and the interlayer plates 21 are parallel and sealed into a whole, and the heat exchange water channel is formed by combining the water channel interlayer 33 and bent to prolong a heat exchange water channel, so that the heat of the mainboard 1 can be fully absorbed.
In addition, the heat conducting working medium 6 is pumped into the heat exchange water channel through the working medium pump 31, so that the heat conducting working medium 6 can take away the heat at the top of the working medium box 2 while filling the heat exchange water channel and flowing, and carries the heat to flow back to the lower layer from the water outlet 23 to cool, and the circulation is performed, the heat of the mainboard 1 is taken away through the heat conducting working medium 6 of the heat exchange water channel, the heat is cooled in the working medium box 2, and finally the heat is led out through the working medium box 2, so that the heat exchange effect of the heat conducting working medium 6 is utilized without using an existing convection fan, the temperature of the mainboard 1 can be effectively reduced compared with an air heat dissipation mode, and the stable long-term use of the mainboard 1 is facilitated.
In this embodiment, it should be noted that the main board 1 can be detachably mounted to the working medium tank 2 by means of clamping, hinging, and the like, so that on one hand, assembly and maintenance between the main board and the working medium tank are facilitated, and on the other hand, replacement of the main machine or the cooling device can be facilitated. The heat conducting working medium 6 can be water, a refrigerant and the like, and has a heat exchange effect.
The embodiment of the utility model provides an in, for making the structure rationalize, heat conduction working medium 6 can be full of the heat transfer water course to do benefit to heat conduction working medium 6 with the top of working medium case 2 carries out abundant heat transfer, water inlet 22 is located the one end of heat transfer water course, delivery port 23 is located the other end of heat transfer water course.
Preferably, the working medium box 2 is made of aluminum, and in order to avoid the conduction between the main board 1 and the working medium box 2, an insulating layer can be arranged on the top of the working medium box 2.
Referring to fig. 3, in the embodiment, a plurality of turbulence members 4 are disposed in the heat exchange water channel to slow down the flow velocity of the heat-conducting working medium 6 in the heat exchange water channel, and make the heat-conducting working medium 6 in the heat exchange water channel more turbulent, so as to increase the contact volume between the heat-conducting working medium 6 and the top of the working medium tank 2, thereby facilitating the heat-conducting working medium 6 to fully absorb heat, and further facilitating the cooling of the motherboard 1.
Referring to fig. 2, in the embodiment of the present invention, it is preferable that each of the water channel partition layers 33 is spaced apart from the adjacent water channel partition layer 33 by the same distance. The plurality of water passage partition layers 33 are parallel to each other.
Referring to fig. 1, in the embodiment of the present invention, a filter 32 is further included, and the filter 32 is installed at an inlet of the working medium pump 31.
In the embodiment of the present invention, the outer sidewall of the working medium box 2 is provided with a heat dissipating fin 5. The heat dissipation fins 5 can dissipate the heat of the heat conducting working medium 6 to the outside in an air heat dissipation manner.
Referring to fig. 3, in the embodiment of the present invention, a plurality of water leaking holes 24 are disposed near the water outlet 23, the water leaking holes 24 are located between the interlayer plate 21 and the sidewall of the working medium tank 2, and the sidewall of the working medium tank 2 near the water leaking holes 24 is provided with heat dissipating fins 5. The heat conducting working media 6 flowing out of the plurality of water leakage openings 24 flow along the side wall of the working medium box 2, and can be timely radiated by means of the side wall of the working medium box 2 and the radiating fins 5 while flowing.
The embodiment of the utility model provides an in, still include compression refrigeration cycle device, compression refrigeration cycle cooling device's evaporimeter is located in the working medium case 2, dispel the heat through the condenser in the outside. Preferably, the evaporator is a heat-radiating coil.
The foregoing is a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of improvements and decorations can be made without departing from the principle of the present invention, and these improvements and decorations are also considered as the protection scope of the present invention.
Claims (10)
1. A novel main board structure is characterized by comprising a main body, wherein the main body comprises a main board and a cooling device; the cooling device comprises a working medium box, a working medium pump and a heat conducting working medium, and the bottom of the main board is tightly attached to the top of the working medium box;
a separation plate is arranged in the working medium box and is parallel to the top of the working medium box, and a plurality of water channel separation layers are arranged between the top of the working medium box and the separation plate in a staggered manner to form a bent heat exchange water channel;
one end of the interlayer plate is provided with a water inlet, the other end of the interlayer plate is provided with a water outlet, and the heat exchange water channel is respectively communicated with the water inlet and the water outlet;
the heat-conducting working medium is contained between the interlayer plate and the bottom of the working medium box, the working medium pump sinks in the heat-conducting working medium, and the working medium pump is connected with the water inlet through a water inlet pipeline.
2. The novel motherboard structure as recited in claim 1 wherein said water inlet is disposed at one end of said heat exchange water channel and said water outlet is disposed at the other end of said heat exchange water channel.
3. A novel primary plate structure as claimed in claim 1 wherein a plurality of turbulators are provided in said heat exchange water passage.
4. A novel primary plate structure as claimed in claim 1 wherein each said channel compartment is spaced equally from adjacent channel compartments.
5. A novel primary plate structure as claimed in claim 1 or 4 wherein said plurality of said water passage compartments are parallel to one another.
6. A novel primary plate structure as claimed in claim 1, further comprising a filter mounted at the inlet of said working fluid pump.
7. The novel main plate structure as claimed in claim 1, wherein the outer side wall of the working medium tank is provided with heat radiating fins.
8. The novel main plate structure of claim 1, wherein a plurality of water leaking ports are arranged near the water outlet, the water leaking ports are positioned between the interlayer plate and the side wall of the working medium tank, and the side wall of the working medium tank near the water leaking ports is provided with radiating fins.
9. The novel main board structure according to claim 1, further comprising a compression refrigeration cycle device, wherein an evaporator of the compression refrigeration cycle cooling device is arranged in the working medium tank, and heat dissipation is performed through an external condenser.
10. A novel primary plate structure as claimed in claim 9, wherein said evaporator is a heat-dissipating coil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920779000.4U CN210270712U (en) | 2019-05-27 | 2019-05-27 | Novel mainboard structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920779000.4U CN210270712U (en) | 2019-05-27 | 2019-05-27 | Novel mainboard structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210270712U true CN210270712U (en) | 2020-04-07 |
Family
ID=70038899
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920779000.4U Expired - Fee Related CN210270712U (en) | 2019-05-27 | 2019-05-27 | Novel mainboard structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210270712U (en) |
-
2019
- 2019-05-27 CN CN201920779000.4U patent/CN210270712U/en not_active Expired - Fee Related
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200407 |