CN217305804U - Server housing and server - Google Patents
Server housing and server Download PDFInfo
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- CN217305804U CN217305804U CN202221179794.9U CN202221179794U CN217305804U CN 217305804 U CN217305804 U CN 217305804U CN 202221179794 U CN202221179794 U CN 202221179794U CN 217305804 U CN217305804 U CN 217305804U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
The application provides a server housing and a server, and belongs to the technical field of servers. The server housing comprises a server housing body. The outside cover of server casing body is equipped with cooling assembly, in above-mentioned realization process, the semiconductor refrigeration piece can carry out cooling to the coolant liquid of stock solution intracavity portion, and the coolant liquid of stock solution intracavity portion can be to two first heat-conducting plates, two second heat-conducting plates and third heat-conducting plate carry out cooling, accessible a plurality of directions carry out cooling to the inside of server casing body, cooling's effect is better, and there is not gas flow, make the difficult inside that gets into server casing body of dust in the air, can reduce the dust to the radiating influence of electrical components, make the inside difficult condition that the high temperature appears of server casing body, and then the inside electrical components of server casing body that makes is difficult for damaging because of the high temperature.
Description
Technical Field
The application relates to the field of servers, in particular to a server housing and a server.
Background
The server is a device for providing computing services, and the server needs to process and respond to service requests, and needs to provide reliable services, so that the requirements on processing capability, stability, security and the like of the server are high.
The server is at the during operation, its inside electrical components can produce the heat, therefore need carry out the heat dissipation processing, traditional radiating mode is simply at server organism internally mounted radiator fan, the louvre has been seted up on the server organism, it dispels the heat to drive the gas flow through radiator fan, the radiating effect is relatively poor, along with operating time's increase, the inside temperature of server can be ascending gradually, and the gas flow that radiator fan produced drives the dust easily and gets into inside the server, and the dust falls on electrical components can further hinder electrical components's heat dissipation, and too high heat causes electrical components's damage easily.
SUMMERY OF THE UTILITY MODEL
In order to make up for the above deficiencies, the present application provides a server housing and a server, which aims to solve the problems in the background art.
In a first aspect, an embodiment of the present application provides a server casing, including a server casing body.
The outside cover of server casing body is equipped with cooling assembly, cooling assembly includes sealed cowling, semiconductor refrigeration piece, first heat-conducting plate, second heat-conducting plate and third heat-conducting plate, the fixed cover of sealed cowling is located the outside of server casing body, the sealed cowling with be provided with the stock solution chamber between the server casing body, the cold face of semiconductor refrigeration piece run through in stock solution intracavity portion, first heat-conducting plate is provided with two, two first heat-conducting plate respectively fixed run through in the lateral wall of server casing body both sides, the second heat-conducting plate is provided with two, two the second heat-conducting plate respectively fixed run through in the roof and the diapire of server casing body, the third heat-conducting plate is fixed run through in the one side of server casing body.
In the implementation process, the semiconductor refrigerating sheet can cool the cooling liquid in the liquid storage cavity, the cooling liquid in the liquid storage cavity can cool the two first heat-conducting plates, the two second heat-conducting plates and the third heat-conducting plate, the two first heat-conducting plates can cool the inside of the server casing body from two sides of the server casing body, the two second heat-conducting plates can cool the inside of the server casing body from the upper direction and the lower direction of the server casing body, the third heat-conducting plate can cool the inside of the server casing body from one side of the server casing body, the inside of the server casing body can be cooled through multiple directions, the cooling effect is good, no gas flows exist, dust in the air is not easy to enter the inside of the server casing body, and the influence of the dust on the heat dissipation of electrical elements can be reduced, the server casing body is not easy to cause the situation of overhigh temperature, and further the electric appliance elements inside the server casing body are not easy to damage due to overhigh temperature.
In the implementation process, the top wall of the sealing cover is provided with a liquid adding part, the liquid adding part comprises a liquid adding pipe and a first valve, the bottom end of the liquid adding pipe is fixed to penetrate through the top wall of the sealing cover, the liquid adding pipe is communicated with the liquid storage cavity, and the first valve is connected with the liquid adding pipe.
In the implementation process, one side of the sealing cover is provided with a liquid discharging part, the liquid discharging part comprises a liquid outlet pipe and a second valve, the liquid outlet pipe fixedly penetrates through the bottom of one side of the sealing cover, the liquid outlet pipe is communicated with the liquid storage cavity, and the second valve is connected with the liquid outlet pipe.
In the implementation process, the cold surface of the semiconductor refrigeration piece is connected with a fourth heat-conducting plate, and the fourth heat-conducting plate is located inside the liquid storage cavity.
In the implementation process, a through groove is formed in one side of the sealing cover, the semiconductor refrigeration piece penetrates through the through groove, one surface of the fourth heat conduction plate is fixedly connected with the inner wall of one side of the sealing cover, and the through groove is sealed by the fourth heat conduction plate.
In the implementation process, the fourth heat-conducting plate is far away from one side of the semiconductor refrigeration piece is provided with the L-shaped heat-conducting fins, the L-shaped heat-conducting fins are provided with the plurality of heat-conducting fins and the plurality of heat-conducting fins, the L-shaped heat-conducting fins are evenly distributed in the liquid storage cavity, and the L-shaped heat-conducting fins are arranged at one end of each L-shaped heat-conducting fin and are located on one side, far away from the fourth heat-conducting plate, of the server case body.
In the implementation process, the cooling assembly further comprises a fan, the fan is connected with the sealing cover, and the fan is located on one side of the heat release surface of the semiconductor chilling plate.
In the implementation process, a connecting rod is fixedly arranged on the side wall of the fan, and one end of the connecting rod is fixedly connected with one side of the sealing cover.
In the implementation process, one surface of the first heat-conducting plate, one surface of the second heat-conducting plate and one surface of the third heat-conducting plate are both located in the server casing body, and the other surface of the first heat-conducting plate, the other surface of the second heat-conducting plate and the other surface of the third heat-conducting plate are both located in the liquid storage cavity.
In a second aspect, an embodiment of the present invention provides a server, including the above-mentioned server housing and a supporting base, the sealing cover is fixedly connected to the upper surface of the supporting base.
Drawings
In order to more clearly explain the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and that for those skilled in the art, other related drawings can be obtained from these drawings without inventive effort.
Fig. 1 is a schematic front view, a cross-sectional structure of a server housing and a server provided in an embodiment of the present application;
FIG. 2 is a schematic sectional front view of a server enclosure body and a cooling module according to an embodiment of the present disclosure;
fig. 3 is a schematic front sectional view of a portion of a server casing body, a first heat-conducting plate, a second heat-conducting plate and a third heat-conducting plate according to an embodiment of the present disclosure;
FIG. 4 is an enlarged schematic view of a portion A in FIG. 2 according to an embodiment of the present disclosure;
FIG. 5 is an enlarged schematic view of a structure at B in FIG. 2 according to an embodiment of the present disclosure;
fig. 6 is a schematic top sectional view of a cooling assembly according to an embodiment of the present disclosure.
In the figure: 100-a server enclosure body; 200-a cooling assembly; 210-a sealing cover; 220-semiconductor refrigerating sheet; 221-a fourth thermal conductive plate; 222-L-shaped heat conducting fins; 230-a first thermally conductive plate; 240-a second thermally conductive plate; 250-a third thermally conductive plate; 260-a liquid storage cavity; 270-liquid adding part; 271-a liquid feeding pipe; 272-a first valve; 280-a drainage member; 281-liquid outlet pipe; 282-a second valve; 290-a fan; 291-a connecting rod; 300-supporting the base.
Detailed Description
The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application.
To make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments obtained by a person of ordinary skill in the art without any inventive work based on the embodiments in the present application are within the scope of protection of the present application.
Referring to fig. 1, the present application provides a technical solution: a server casing includes a server casing body 100.
Referring to fig. 1 to 6, a cooling assembly 200 is sleeved outside the server casing body 100, the cooling assembly 200 includes a sealing cover 210, a semiconductor cooling plate 220, a first heat conducting plate 230, a second heat conducting plate 240 and a third heat conducting plate 250, the sealing cover 210 is fixedly covered outside the server casing body 100, a liquid storage cavity 260 is disposed between the sealing cover 210 and the server casing body 100, and a cooling liquid is stored in the liquid storage cavity 260.
In this embodiment, the cold surface of the semiconductor chilling plate 220 penetrates through the liquid storage cavity 260, the cold surface of the semiconductor chilling plate 220 is connected with the fourth heat conduction plate 221, the fourth heat conduction plate 221 is located inside the liquid storage cavity 260, one side of the sealing cover 210 is provided with a through groove, the semiconductor chilling plate 220 penetrates through the through groove, one surface of the fourth heat conduction plate 221 is fixedly connected with the inner wall of one side of the sealing cover 210, the through groove is sealed by the fourth heat conduction plate 221, the surface of the fourth heat conduction plate 221, which is far away from the semiconductor chilling plate 220, is provided with a plurality of L-shaped heat conduction fins 222, the plurality of L-shaped heat conduction fins 222 are uniformly distributed inside the liquid storage cavity 260, one end of each of the plurality of L-shaped heat conduction fins 222 is located on the side of the server casing body 100, which is far away from the fourth heat conduction plate 221, and the semiconductor chilling plate 220 cools the fourth heat conduction plate 221 and the L-shaped heat conduction fins 222, thereby cooling the cooling liquid in the liquid storage chamber 260.
In this embodiment, the first heat-conducting plate 230 is provided with two, the two first heat-conducting plates 230 are respectively fixed to penetrate through the side walls of the two sides of the server casing body 100, the second heat-conducting plate 240 is provided with two, the two second heat-conducting plates 240 are respectively fixed to penetrate through the top wall and the bottom wall of the server casing body 100, and the third heat-conducting plate 250 is fixed to penetrate through one side of the server casing body 100. One surfaces of the two first heat-conducting plates 230, the two second heat-conducting plates 240 and the third heat-conducting plate 250 are all located inside the server casing body 100, and the other surfaces of the two first heat-conducting plates 230, the two second heat-conducting plates 240 and the third heat-conducting plate 250 are all located inside the liquid storage cavity 260.
In this application, the top wall of sealed cowling 210 is provided with liquid feeding spare 270, and liquid feeding spare 270 includes liquid feeding pipe 271 and first valve 272, and the bottom mounting of liquid feeding pipe 271 runs through in the top wall of sealed cowling 210, and liquid feeding pipe 271 is linked together with stock solution chamber 260, and first valve 272 links to each other with liquid feeding pipe 271, opens first valve 272 alright through liquid feeding pipe 271 to stock solution chamber 260 inside with the coolant liquid.
In this embodiment, a liquid discharge member 280 is disposed on one side of the sealing cover 210, the liquid discharge member 280 includes a liquid outlet pipe 281 and a second valve 282, the liquid outlet pipe 281 is fixedly disposed at the bottom of one side of the sealing cover 210, the liquid outlet pipe 281 is communicated with the liquid storage chamber 260, the second valve 282 is connected with the liquid outlet pipe 281, and when the second valve 282 is opened, the cooling liquid in the liquid storage chamber 260 is discharged from the liquid outlet pipe 281.
In this application, the cooling assembly 200 further includes a fan 290, the fan 290 is connected to the sealing cover 210, the fan 290 is located on one side of the heat releasing surface of the semiconductor cooling plate 220, a connecting rod 291 is fixedly disposed on a side wall of the fan 290, one end of the connecting rod 291 is fixedly connected to one side of the sealing cover 210, the heat releasing surface of the semiconductor cooling plate 220 is cooled by the fan 290, and the effect of cooling the cooling liquid in the liquid storage chamber 260 by the semiconductor cooling plate 220 can be improved.
Referring to fig. 1, another embodiment of the present invention provides a server, which includes the above-mentioned server housing and a supporting base 300, and a sealing cover 210 is fixedly connected to an upper surface of the supporting base 300.
Specifically, the working principle of the server housing and the server is as follows: when in use, the semiconductor refrigeration sheet 220 and the fan 290 are opened, the fan 290 cools the heat release surface of the semiconductor refrigeration sheet 220, the semiconductor refrigeration sheet 220 cools the fourth heat conduction plate 221 and the L-shaped heat conduction fins 222, the fourth heat conduction plate 221 and the L-shaped heat conduction fins 222 cools the cooling liquid in the liquid storage cavity 260, the cooling liquid in the liquid storage cavity 260 cools the two first heat conduction plates 230, the two second heat conduction plates 240 and the third heat conduction plate 250, the two first heat conduction plates 230 cool the inside of the server casing body 100 from two sides of the server casing body 100, the two second heat conduction plates 240 cool the inside of the server casing body 100 from two directions above and below the server casing body 100, and the third heat conduction plate 250 cools the inside of the server casing body 100 from one side of the server casing body 100, cooling is carried out to server casing body 100's inside to a plurality of directions of accessible, cooling's effect is better, and there is not gas flow, make the difficult inside that gets into server casing body 100 of dust in the air, can reduce the dust and to the radiating influence of electrical components, make the inside difficult condition that the high temperature appears of server casing body 100, and then the inside electrical components of server casing body 100 that makes is difficult for damaging because of the high temperature.
It should be noted that the specific model specifications of the semiconductor cooling plate 220 and the fan 290 need to be determined by type selection according to the actual specification of the device, and the specific type selection calculation method adopts the prior art, so detailed description is omitted.
The power supply of the semiconductor cooling plate 220 and the fan 290 and the principle thereof will be apparent to those skilled in the art and will not be described in detail herein.
The above description is only an example of the present application and is not intended to limit the scope of the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (10)
1. A server enclosure, comprising
The server casing body (100), the cooling assembly (200) is sleeved outside the server casing body (100), the cooling assembly (200) comprises a sealing cover (210), a semiconductor refrigeration piece (220), a first heat-conducting plate (230), a second heat-conducting plate (240) and a third heat-conducting plate (250), the sealing cover (210) is fixedly covered outside the server casing body (100), a liquid storage cavity (260) is arranged between the sealing cover (210) and the server casing body (100), the cold surface of the semiconductor refrigeration piece (220) penetrates through the liquid storage cavity (260), the first heat-conducting plate (230) is provided with two heat-conducting plates, the two first heat-conducting plates (230) are respectively and fixedly penetrated through the side walls on the two sides of the server casing body (100), the second heat-conducting plate (240) is provided with two heat-conducting plates, and the second heat-conducting plate (240) is respectively and fixedly penetrated through the top wall and the bottom wall of the server casing body (100), the third heat-conducting plate (250) is fixedly penetrated on one surface of the server casing body (100).
2. The server enclosure according to claim 1, wherein a liquid adding member (270) is disposed on a top wall of the sealing cover (210), the liquid adding member (270) comprises a liquid adding pipe (271) and a first valve (272), a bottom end of the liquid adding pipe (271) is fixed to the top wall of the sealing cover (210) and penetrates through the top wall, the liquid adding pipe (271) is communicated with the liquid storage cavity (260), and the first valve (272) is connected with the liquid adding pipe (271).
3. The server casing according to claim 1, wherein a drain (280) is disposed on one side of the sealing cover (210), the drain (280) comprises a drain pipe (281) and a second valve (282), the drain pipe (281) is fixedly penetrated through the bottom of one side of the sealing cover (210), the drain pipe (281) is communicated with the reservoir (260), and the second valve (282) is connected with the drain pipe (281).
4. The server casing according to claim 1, wherein a fourth heat-conducting plate (221) is connected to the cold side of the semiconductor refrigeration plate (220), said fourth heat-conducting plate (221) being located inside the reservoir chamber (260).
5. The server enclosure according to claim 4, wherein a through slot is formed at one side of the sealing cover (210), the semiconductor refrigeration sheet (220) penetrates through the through slot, one surface of the fourth heat conduction plate (221) is fixedly connected with an inner wall of one side of the sealing cover (210), and the fourth heat conduction plate (221) seals the through slot.
6. The server casing according to claim 5, wherein one side of the fourth heat-conducting plate (221), which is away from the semiconductor chilling plate (220), is provided with a plurality of L-shaped heat-conducting fins (222), the plurality of L-shaped heat-conducting fins (222) are uniformly distributed inside the liquid storage cavity (260), and one ends of the plurality of L-shaped heat-conducting fins (222) are located on one side of the server casing body (100), which is away from the fourth heat-conducting plate (221).
7. The server enclosure of claim 1, wherein the cooling assembly (200) further comprises a fan (290), the fan (290) being coupled to the sealed enclosure (210), the fan (290) being located on a side of the heat-emitting surface of the semiconductor cooling fins (220).
8. The server casing according to claim 7, wherein a connecting rod (291) is fixedly provided to a side wall of the fan (290), and one end of the connecting rod (291) is fixedly connected to one side of the sealing cover (210).
9. The server casing according to claim 1, wherein one surface of the two first heat-conducting plates (230), one surface of the two second heat-conducting plates (240) and one surface of the third heat-conducting plate (250) are located inside the server casing body (100), and the other surfaces of the two first heat-conducting plates (230), the other surfaces of the two second heat-conducting plates (240) and the other surfaces of the third heat-conducting plates (250) are located inside the liquid storage chamber (260).
10. A server, characterized in that,
comprising the server casing of any one of claims 1 to 9, and a support base (300), the containment casing (210) being fixedly attached to an upper surface of the support base (300).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221179794.9U CN217305804U (en) | 2022-05-17 | 2022-05-17 | Server housing and server |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221179794.9U CN217305804U (en) | 2022-05-17 | 2022-05-17 | Server housing and server |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217305804U true CN217305804U (en) | 2022-08-26 |
Family
ID=82918582
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221179794.9U Active CN217305804U (en) | 2022-05-17 | 2022-05-17 | Server housing and server |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217305804U (en) |
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2022
- 2022-05-17 CN CN202221179794.9U patent/CN217305804U/en active Active
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