CN212846622U - Airtight machine case with high radiating efficiency - Google Patents
Airtight machine case with high radiating efficiency Download PDFInfo
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- CN212846622U CN212846622U CN202021762359.XU CN202021762359U CN212846622U CN 212846622 U CN212846622 U CN 212846622U CN 202021762359 U CN202021762359 U CN 202021762359U CN 212846622 U CN212846622 U CN 212846622U
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Abstract
本实用新型公开了一种具有高散热效率的密闭机箱，包括机箱本体、热交换机构和风机机构，其中：机箱本体，包括具有一开孔的壳体，壳体内置有主芯片，主芯片正对开孔且不与壳体的内壁接触；热交换机构，位于机箱本体的外部且部分伸入开孔与主芯片接触进行热传导；风机机构，位于热交换机构的侧面或底面，用于对热交换机构或机箱本体进行散热。本实用新型将主芯片的发热直接传导到机箱外部并通过风机加快散热，实现高散热效率，结构简单轻便、工作稳定性高、使用寿命长、密封性好，适用于恶劣环境。
The utility model discloses a closed case with high heat dissipation efficiency, comprising a case body, a heat exchange mechanism and a fan mechanism, wherein: the case body comprises a casing with an opening, the casing is built with a main chip, and the main chip is positive The opening is not in contact with the inner wall of the casing; the heat exchange mechanism is located outside the chassis body and partially extends into the opening to contact the main chip for heat conduction; the fan mechanism is located on the side or bottom of the heat exchange mechanism for heat transfer. The switching mechanism or the chassis body dissipates heat. The utility model directly conducts the heat of the main chip to the outside of the case and accelerates heat dissipation through a fan to achieve high heat dissipation efficiency, simple and portable structure, high working stability, long service life and good sealing, and is suitable for harsh environments.
Description
Technical Field
The utility model belongs to the technical field of the computer heat dissipation, concretely relates to airtight quick-witted case with high radiating efficiency.
Background
Industrial or military computers often work in severe environments such as sand dust, damp and hot, mold, salt mist and the like, and the closed case can isolate poor environmental conditions and protect components such as internal board cards. However, the plate card can generate a large amount of heat during working, the sealed case is not beneficial to heat exchange between the inside and the outside of the case, the temperature inside the case is greatly increased, and the heat dissipation problem of the sealed case needs to be solved urgently.
With the continuous increase of the scale of the integrated circuit, the functions are more abundant, the SOC technology is also improved, some cases only contain one main chip, and the power consumption of the main chip usually accounts for more than 60% of the whole machine, and additional heat dissipation measures are required.
Several heat dissipation methods of the existing closed case have the following defects: the passive heat dissipation mode has insufficient heat dissipation capacity; the liquid cooling source for liquid cooling and heat dissipation is heavy and has liquid leakage risk; the quick-witted case wall is hugged closely to the big consumption integrated circuit board, can heat quick-witted incasement portion air temperature when carrying out the mode radiating efficiency low and the temperature of quick-witted case wall of forced air cooling heat dissipation in the quick-witted case wall outside rise, leads to quick-witted incasement portion temperature to rise to be unfavorable for the heat dissipation. The mode has the processes of firstly heating the case wall and the inside of the case and then transferring heat to the surrounding environment except for liquid cooling heat dissipation, and the heat dissipation efficiency is low.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to the above-mentioned problem, provide an airtight quick-witted case with high radiating efficiency, with the main chip generate heat and directly conduct quick-witted case outside, realize high radiating efficiency, simple structure is light, job stabilization nature is high, long service life, is applicable to adverse circumstances.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a pair of airtight quick-witted case with high radiating efficiency, including quick-witted case body, still include heat exchange mechanism and fan mechanism, wherein:
the case body comprises a shell with an opening, a main chip is arranged in the shell, and the main chip is opposite to the opening and is not contacted with the inner wall of the shell;
the heat exchange mechanism is positioned outside the case body, and part of the heat exchange mechanism extends into the opening to be in contact with the main chip for heat conduction;
and the fan mechanism is positioned on the side surface or the bottom surface of the heat exchange mechanism and used for dissipating heat of the heat exchange mechanism or the case body.
Preferably, still install mainboard mounting bracket and mainboard in the casing, on the mainboard was located to the main chip, mainboard and mainboard mounting bracket fixed connection, mainboard mounting bracket and casing fixed connection.
Preferably, the heat exchange mechanism comprises a heat dissipation shell, a heat radiator, a heat conduction block and a heat conduction pad, the heat dissipation shell, the heat radiator, the heat conduction block and the heat conduction pad are sequentially attached to each other and are located in the heat dissipation shell, the heat dissipation shell is of a groove structure, the heat radiator is fixedly connected with the heat dissipation shell, and the heat conduction pad is attached to the main chip.
Preferably, the heat sink is a finned heat sink.
Preferably, the heat conducting block passes through an opening of the housing.
Preferably, the connecting position of the heat conducting block and the shell is provided with a high-heat-resistance sealing ring for sealing and heat insulation.
Preferably, the heat dissipating housing is connected to the housing and forms a chamber having a vent.
Preferably, the fan mechanism is disposed opposite the vent.
Preferably, the fan mechanism comprises a fan, and the fan is an axial fan or a centrifugal fan.
Preferably, the air inlet of the fan faces the outside of the heat exchange mechanism, and the air outlet faces the inside of the heat exchange mechanism.
Compared with the prior art, the beneficial effects of the utility model are that:
1) the heat exchange mechanism directly conducts the heat of the main chip with large heat productivity to the heat exchange mechanism outside the case body, the case is not heated, high heat dissipation efficiency is realized, the heat dissipation of the heat exchange mechanism is further accelerated through the airflow action of the fan mechanism, meanwhile, the heat dissipation of other low-power components inside the case body is also accelerated, the heat dissipation efficiency is greatly improved, the working stability and the service life of equipment are improved, the structure is simple and light, and the heat exchange mechanism is suitable for severe environments;
2) adopt high thermal resistance sealing washer, can effectively seal and prevent that the heat of main chip from conducting to the casing, help improving the radiating efficiency, and help making the inner structure of casing keep apart with outside adverse circumstances, increase of service life.
Drawings
Fig. 1 is a schematic structural diagram of embodiment 1 of the present invention;
fig. 2 is a sectional view taken along line a-a of example 1 of the present invention;
fig. 3 is a B-B sectional view of embodiment 1 of the present invention;
fig. 4 is a schematic structural diagram of embodiment 2 of the present invention;
fig. 5 is a C-C sectional view of embodiment 2 of the present invention;
fig. 6 is a D-D sectional view of embodiment 2 of the present invention.
Description of reference numerals: 11. a chassis body; 12. a housing; 13. a mainboard mounting rack; 14. a main board; 15. a main chip; 21. a heat exchange mechanism; 22. a heat dissipating housing; 23. a heat sink; 24. a heat conducting block; 25. a thermally conductive pad; 26. a high thermal resistance seal ring; 31. a fan mechanism; 32. a fan bracket; 33. a fan blade; 34. an electric motor; 35. sealing the bearing; 36. the motor shaft.
Detailed Description
The technical solution of the present invention will be further described in detail with reference to the accompanying drawings and examples, and the following examples do not limit the present invention.
Example 1:
as shown in fig. 1 to 3, a sealed enclosure with high heat dissipation efficiency includes an enclosure body 11, a heat exchange mechanism 21 and a fan mechanism 31, wherein:
the case body 11 comprises a shell 12 with an opening, wherein a main chip 15 is arranged in the shell 12, and the main chip 15 is opposite to the opening and is not contacted with the inner wall of the shell 12;
a heat exchange mechanism 21 located outside the case body 11 and partially extending into the opening to contact with the main chip 15 for heat conduction;
the fan mechanism 31 is located on a side surface or a bottom surface of the heat exchange mechanism 21, and is configured to dissipate heat of the heat exchange mechanism 21 or the cabinet body 11.
In this embodiment, still install mainboard mounting bracket 13 and mainboard 14 in casing 12, on mainboard 14 was located to main chip 15, mainboard 14 and mainboard mounting bracket 13 fixed connection, mainboard mounting bracket 13 and casing 12 fixed connection.
Wherein, chassis body 11 includes square airtight casing 12, casing 12 lower wall is equipped with a trompil, be equipped with mainboard mounting bracket 13 in casing 12, mainboard 14 and main chip 15, main chip 15 welds on mainboard 14, mainboard 14 is connected with the mainboard mounting bracket 13 that two offside distribute and is used for carrying out the fixed stay to mainboard 14 and main chip 15 on it, mainboard mounting bracket 13 is connected with casing 12 and is fixed, mainboard mounting bracket 13 can be for screw fixed connection or grafting etc. with mainboard 14 or casing 12's connected mode, and mainboard mounting bracket 13 still can carry out the change of arbitrary shape and quantity according to actual conditions.
In this embodiment, the heat exchanging mechanism 21 includes a heat dissipating housing 22, a heat sink 23, a heat conducting block 24 and a heat conducting pad 25, the latter three are sequentially attached to each other and located in the heat dissipating housing, the heat dissipating housing is a groove structure, the heat sink 23 is fixedly connected to the heat dissipating housing 22, and the heat conducting pad 25 is attached to the main chip 15.
The heat exchange mechanism 21 includes a heat dissipation housing 22, a heat sink 23, a heat conduction block 24, and a heat conduction pad 25, wherein the heat dissipation housing 22 is a flat-bottomed U-shaped groove structure, the heat sink 23 is fixed at the bottom of the heat dissipation housing 22 by screws, the heat conduction block 24 is fixed on the heat sink 23 by screws, and the heat conduction pad 25 is attached to the surface of the main chip 15. The heat exchange mechanism 21 is directly attached to the main chip 15, the main chip 15 is not in contact with the shell 12, the heat of the main chip 15 can be directly transferred to the heat exchange mechanism 21, the heat conducting pad 25 can be in full contact with the main chip 15 and the heat conducting block 24 to enhance the heat transfer effect and cannot damage the main chip 15, and the heat conducting pad 25 can also be replaced by heat conducting silica gel.
In the present embodiment, the heat sink 23 is a fin heat sink.
Among them, the radiator 23 adopts a fin radiator as an optimization, and has the advantages of large radiating area, high radiating efficiency and lighter weight. The heat spreader 23 may also be a heat conductive silicone sheet, a heat conductive graphite sheet, or the like.
In this embodiment, the heat conducting block 24 passes through an opening of the housing 12.
In this embodiment, a high thermal resistance sealing ring 26 for sealing and insulating is disposed at the connecting position of the heat conducting block 24 and the housing 12.
The heat conducting block 24 passes through the opening of the casing 12 to contact with the heat conducting pad 25, and the high heat resistance sealing ring 26 is used for filling the gap between the heat conducting block 24 and the casing 12, so that the casing 12 is kept sealed, the structure in the casing 12 is isolated from the external severe environment, the problem that the heat of the main chip 15 is conducted to the casing 12 to cause the heat of the case body 11 is effectively solved, the heat radiating efficiency is further improved, and the service life is prolonged. The connection position of the heat-conducting block 24 and the housing 12 may be sealed with a sealant or the like having low thermal conductivity.
In this embodiment, the heat dissipation housing 22 is coupled to the housing 12 and forms a chamber having a vent.
The heat dissipation housing 22 is connected to the bottom surface of the housing 12 of the chassis body 11 by bolts, and is used for fixing the heat exchange mechanism 21, so that the heat conductor therein is fixedly attached to the main chip 15, a chamber with a vent is formed between the heat exchange mechanism 21 and the housing 12, and the chamber is used as a channel for air flow and performs air flow exchange between the inside and the outside through the vent.
In this embodiment, the fan mechanism 31 is disposed opposite to the ventilation opening.
The fan mechanism 31 and the ventilation opening are arranged opposite to each other to facilitate air circulation, and when the radiator 23 is a fin radiator, the air circulation should be kept parallel to the direction of fins on the fin radiator, so as to achieve an optimal heat dissipation effect.
In this embodiment, the fan mechanism 31 includes a fan, and the fan is an axial flow fan or a centrifugal fan.
The fan mechanism 31 comprises a fan support 32 and a fan, the fan is an axial flow fan, the fan comprises a fan blade 33 and a motor 34, a sealing bearing 35 and a motor shaft 36, the motor 34 is fixed in the shell 12, a hole is formed in the shell 12 corresponding to the position of the motor shaft 36 and used for installing the sealing bearing 35, the sealing bearing 35 is used for supporting the motor shaft 36, the fan blade 33 is a rotating shaft and consists of a plurality of blades circumferentially and uniformly distributed on the rotating shaft, the fan blade 33 is fixed with the motor shaft 36 and is driven to rotate by the motor 34, a hole position for installing the fan blade 33 is formed in the fan support 32, the fan support 32 is fixed on one side of the case body 11 and one side of the heat exchange mechanism 21 through bolts and is sealed with the case body 11 and the heat exchange mechanism 21 to form a cavity, the cavity with a vent formed between the. The fan mechanism 31 may also include only a fan, and the fan may be directly fixed to the side or bottom surface of the heat-dissipating housing 22. This design allows the motor 34 to be located in a closed environment inside the housing 12, isolated from the harsh environment outside, and have an extended service life.
In this embodiment, the air inlet of the fan faces the outside of the heat exchange mechanism 21, and the air outlet faces the inside of the heat exchange mechanism 21.
Wherein the fan sucks air from the outside, and the air flows through the chamber formed by the fan bracket 32, the housing 12 and the heat dissipation housing 22 and discharges the heat in the chamber to the outside from the ventilation opening. The fans in the fan mechanism 31 can be arranged in one or more ways according to space and heat dissipation requirements, and the fans can also have air inlets facing the inside of the heat exchange mechanism 21 and air outlets facing the outside of the heat exchange mechanism 21.
During operation, main chip 15 generates heat in a large number, and the heat is direct to be given radiator 23 through heat conduction pad 25 and heat conduction piece 24 transmission, and fan mechanism 31 operation forms the air current simultaneously, and the air current flows through radiator 23 and takes away the heat on radiator 23 along the vent discharge, accelerates main chip 15's radiating efficiency greatly, and the air current flows the casing 12 that the in-process can also reduce other low-power components and parts and cause and generate heat, further improves radiating efficiency, helps improve equipment job stabilization nature and life.
It should be noted that, when there are one or more components with a high total power consumption and a high specific gravity in an actual situation, one or more heat exchange mechanisms 21 may be correspondingly disposed to conduct heat to the outside of the device for heat dissipation, and according to the actual positions of the components, each part of the plurality of heat exchange mechanisms 21 may be used in combination, for example, one heat dissipation housing 22 or one heat sink 23 may be shared. The shape and location of the heat dissipation housing 22 and the fan support 32 may also be adjusted depending on the actual layout of the fan.
Example 2:
as shown in fig. 4 to 6, this embodiment is substantially the same as embodiment 1 except that: the fan mechanism 31 includes only a fan, which is a centrifugal fan. The heat dissipation housing 22 is connected to the bottom surface of the housing 12 of the chassis body 11 by bolts, and is used for fixing the heat exchange mechanism 21, so that the heat conductor therein is fixedly attached to the main chip 15, a chamber having a vent is formed between the heat exchange mechanism 21 and the housing 12, and the chamber is used as a channel for air flow and performs air flow exchange between the inside and the outside through the vent. The heat dissipation housing 22 has a flat-bottom groove structure, and a hole for installing a centrifugal fan is formed in the bottom surface. The centrifugal fan sucks air from the outside, and the air flows through the heat sink 23 and is discharged from a vent between the housing 12 and the heat-dissipating housing 22.
During operation, the heat of main chip 15 is direct to be transmitted for radiator 23 through heat conduction pad 25 and heat conduction piece 24, the cavity of fan mechanism 31 operation between heat exchange mechanism 21 and casing 12 forms the air current simultaneously, the air current flows through radiator 23 and takes away the heat on radiator 23 along the vent discharge, accelerate the radiating efficiency of main chip 15 greatly, and the air current flow in-process can also reduce the casing 12 that other low-power components and parts caused and generate heat, further improve the radiating efficiency, help improving equipment job stabilization nature and life.
It should be noted that, when there are one or more components with a high total power consumption specific gravity in an actual situation, one or more heat exchange mechanisms 21 or fan mechanisms 31 may be correspondingly disposed to conduct heat to the outside of the device for heat dissipation, and according to the actual positions of the components, each part of the plurality of heat exchange mechanisms 21 may be used in combination, for example, one heat dissipation housing 22 or one heat sink 23 may be shared. The centrifugal fan can also accelerate air circulation and heat dissipation by adopting a mode of extracting air into the heat exchange mechanism 21, and the shape and the position of the heat dissipation shell 22 can also be adjusted according to the actual layout of the fan.
The above embodiments are only used for illustrating the technical solutions of the present invention and not for limiting the same, and those skilled in the art can make various corresponding changes and modifications according to the present invention without departing from the spirit and the essence of the present invention, but these corresponding changes and modifications should fall within the protection scope of the appended claims of the present invention.
Claims (10)
1. The utility model provides a closed quick-witted case with high radiating efficiency, includes quick-witted case body (11), its characterized in that: the closed chassis with high heat dissipation efficiency further comprises a heat exchange mechanism (21) and a fan mechanism (31), wherein:
the case body (11) comprises a shell (12) with an opening, a main chip (15) is arranged in the shell (12), and the main chip (15) is opposite to the opening and is not contacted with the inner wall of the shell (12);
the heat exchange mechanism (21) is positioned outside the case body (11) and partially extends into the opening to be in contact with the main chip (15) for heat conduction;
the fan mechanism (31) is located on a side surface or a bottom surface of the heat exchange mechanism (21) and used for dissipating heat of the heat exchange mechanism (21) or the case body (11).
2. The enclosed chassis with high heat dissipation efficiency of claim 1, wherein: still install mainboard mounting bracket (13) and mainboard (14) in casing (12), main chip (15) are located on mainboard (14), mainboard (14) with mainboard mounting bracket (13) fixed connection, mainboard mounting bracket (13) with casing (12) fixed connection.
3. The enclosed chassis with high heat dissipation efficiency of claim 1, wherein: the heat exchange mechanism (21) comprises a heat dissipation shell (22), a radiator (23), a heat conduction block (24) and a heat conduction pad (25), the heat dissipation shell (22) is sequentially attached to the heat dissipation shell (22) and located in the heat dissipation shell, the heat dissipation shell (22) is of a groove structure, the radiator (23) is fixedly connected with the heat dissipation shell (22), and the heat conduction pad (25) is attached to the main chip (15).
4. The enclosed chassis with high heat dissipation efficiency as set forth in claim 3, wherein: the radiator (23) is a fin radiator.
5. The enclosed chassis with high heat dissipation efficiency as set forth in claim 3, wherein: the heat conducting block (24) passes through an opening of the housing (12).
6. The enclosed chassis with high heat dissipation efficiency of claim 5, wherein: and a high-heat-resistance sealing ring (26) for sealing and heat insulation is arranged at the connecting position of the heat conducting block (24) and the shell (12).
7. The enclosed chassis with high heat dissipation efficiency as set forth in claim 3, wherein: the heat dissipating housing (22) is connected to the housing (12) and forms a chamber having a vent.
8. The enclosed chassis with high heat dissipation efficiency of claim 7, wherein: the fan mechanism (31) is arranged opposite to the ventilation opening.
9. The enclosed cabinet with high heat dissipation efficiency as set forth in claim 1 or 7, wherein: the fan mechanism (31) comprises a fan which is an axial flow fan or a centrifugal fan.
10. The enclosed chassis with high heat dissipation efficiency of claim 9, wherein: the air inlet of the fan faces the outside of the heat exchange mechanism (21), and the air outlet of the fan faces the inside of the heat exchange mechanism (21).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021762359.XU CN212846622U (en) | 2020-08-21 | 2020-08-21 | Airtight machine case with high radiating efficiency |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021762359.XU CN212846622U (en) | 2020-08-21 | 2020-08-21 | Airtight machine case with high radiating efficiency |
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| CN212846622U true CN212846622U (en) | 2021-03-30 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202021762359.XU Active CN212846622U (en) | 2020-08-21 | 2020-08-21 | Airtight machine case with high radiating efficiency |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116540850A (en) * | 2023-05-22 | 2023-08-04 | 中国电子科技集团公司第五十二研究所 | Radiator maintenance door structure and reinforced computer |
-
2020
- 2020-08-21 CN CN202021762359.XU patent/CN212846622U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116540850A (en) * | 2023-05-22 | 2023-08-04 | 中国电子科技集团公司第五十二研究所 | Radiator maintenance door structure and reinforced computer |
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