CN219202273U - Thermoelectric refrigerating device for blade server - Google Patents
Thermoelectric refrigerating device for blade server Download PDFInfo
- Publication number
- CN219202273U CN219202273U CN202222568340.7U CN202222568340U CN219202273U CN 219202273 U CN219202273 U CN 219202273U CN 202222568340 U CN202222568340 U CN 202222568340U CN 219202273 U CN219202273 U CN 219202273U
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- blade server
- thermoelectric
- air
- radiator
- heat
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- 238000005057 refrigeration Methods 0.000 claims abstract description 16
- 230000017525 heat dissipation Effects 0.000 abstract description 9
- 239000003570 air Substances 0.000 description 30
- 238000001816 cooling Methods 0.000 description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 239000000741 silica gel Substances 0.000 description 5
- 229910002027 silica gel Inorganic materials 0.000 description 5
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 239000012080 ambient air Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The utility model relates to a thermoelectric refrigerating device for a blade server, belonging to the technical field of heat dissipation of integrated circuit chips. The device comprises a thermoelectric refrigeration device, a cooler, a thermoelectric radiator, a chip radiator and an axial flow fan. The thermoelectric refrigerating device firstly utilizes the thermoelectric refrigerating device and the cooler to cool the air just entering the blade server, and refrigerates the air in the blade server case, the cold air exchanges heat with the chip radiator in the blade server, and then utilizes forced air convection formed by the axial flow fan to rapidly discharge the CPU heat absorbed by the chip radiator to the outside of the blade server case, so that the heat dissipation efficiency of the blade server can be greatly improved under the condition of reducing the rotation speed and noise of the fan.
Description
Technical Field
The utility model belongs to the technical field of heat dissipation of integrated circuit chips, and particularly relates to a thermoelectric refrigerating device for a blade server.
Background
The blade server is a server unit capable of being inserted with a plurality of cards in a rack-type chassis with standard height, is a low-cost server platform for realizing high availability and high density, and is widely used for the construction of large-scale cloud computing data centers and high-performance computing clusters at present. The blade server adopts a design scheme with high performance and high integration, so that the occupation of physical space is reduced to the greatest extent, but the power density is greatly improved, and a large amount of heat is generated in operation, so that the heat dissipation performance of the blade server becomes a key factor for determining the operation stability of the system.
The blade server is limited by physical space, the volume of the radiating fin of the CPU chip cannot be too large, the fan for forcing air to flow cannot be arranged on the radiating fin, and the radiating problem is remarkable. The existing heat dissipating device has a structure shown in fig. 1, and can only adopt the design of front panel air inlet and back panel air outlet, and take away heat generated by the CPU chip in an air convection mode. Because the blade server has a plurality of electronic units, the internal air duct structure is complex, the fluid resistance is large, and the cascade heating effect exists, so that the heat dissipation effect is poor. In order to timely take away the heat generated by the internal electronic components, the air flow entering and exiting the blade server case must be very large, and a high-power and high-rotation-speed powerful axial flow fan has to be used.
Disclosure of Invention
The utility model aims to provide a thermoelectric refrigeration device for a blade server, which improves the structure of the existing heat dissipation device of the blade server so as to enable the heat dissipation of the blade server to be more efficient.
The utility model provides a thermoelectric refrigerating device for a blade server, which comprises a chip radiator and an axial flow fan, wherein the chip radiator is adhered to a CPU chip, and the axial flow fan is fixed on an air outlet on the side wall of a chassis of the blade server 4. The cooling device is composed of a thermoelectric radiator, a thermoelectric cooling device and a cooler, wherein the cooler is arranged in a blade server to be cooled, and the bottom of the cooler is relatively fixed with the bottom of a blade server case; the cold face of the thermoelectric refrigeration device is connected with the cooler, the thermoelectric refrigeration device penetrates through the side wall of the case of the blade server case, the hot face of the thermoelectric refrigeration device is connected with the thermoelectric radiator, and the thermoelectric radiator is placed in the air.
The thermoelectric refrigerating device for the blade server has the advantages that:
according to the thermoelectric refrigerating device for the blade server, air in the server case is used for refrigerating, cold air is used for exchanging heat with the chip radiator in the blade server to cool, forced air convection is generated under the action of the axial flow fan, CPU heat absorbed by the chip radiator is rapidly transferred to the outside of the blade server case, and the heat dissipation efficiency of the blade server can be greatly improved under the condition of reducing the rotation speed and noise of the fan.
Additional aspects and advantages of the utility model will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the utility model.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It is evident that the drawings in the following description are only some embodiments of the present utility model and that other drawings may be obtained from these drawings by those of ordinary skill in the art without inventive effort.
Fig. 1 is a front view of a prior art blade server cooling structure.
Fig. 2 is a schematic diagram of a thermoelectric cooling device for a blade server according to an embodiment of the present utility model.
Fig. 3 is a schematic view of an aluminum alloy heat sink profile used for a chip heat spreader, a thermoelectric heat spreader, and a cooler in one embodiment of the present utility model.
In fig. 1 and 2, 1 is a CPU chip, 2 is a chip heat sink, 3 is an axial flow fan, 4 is a blade server chassis, 5 is a cooler, 6 is a thermoelectric refrigeration device, and 7 is a thermoelectric heat sink.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Figure 2 shows a thermoelectric cooler for a blade server in accordance with the present utility model. Fig. 2 is a top plan view of the blade server with the top cover of the blade server with the cooling device removed from the top and looking down into the interior of the blade server, and thus fig. 2 is a top plan view of the interior of the blade server.
As shown in fig. 2, the refrigerating device comprises a chip radiator 2, an axial flow fan 3 and a refrigerating device, wherein the refrigerating device comprises a thermoelectric radiator 7, a thermoelectric refrigerating device 6 and a cooler 5, the cooler 5 is arranged in a blade server to be refrigerated, and the bottom of the cooler 5 is relatively fixed with the bottom of a blade server case 4 through screws; the cold face of the thermoelectric refrigeration device 6 is connected with the cooler 5 through heat conduction silica gel, the thermoelectric refrigeration device 6 penetrates through the side wall of the blade server case 4, the hot face of the thermoelectric refrigeration device 6 is connected with the thermoelectric radiator 7 through heat conduction silica gel, and the thermoelectric radiator 7 is placed in the air. The chip radiator 2 is adhered to the CPU chip 1 through heat conduction silica gel, and the axial flow fan 3 is fixed on an air outlet of the side wall of the chassis of the blade server 4 through screws.
The thermoelectric cooling device for a blade server as shown in fig. 2, in which a chip heat sink 2 is used to absorb heat generated by a CPU chip 1, fins of the chip heat sink 2 radiate the heat into the surrounding air. The axial flow fan 3 is used for generating forced air convection in the blade server case 4, enabling cold air to enter from an air inlet at one side of the case wall, and rapidly transferring hot air after absorbing CPU heat to the outside of the blade server case 4 through an air outlet at the other side of the case wall.
Among the cooling devices, the thermoelectric cooling device 6 is used for cooling the cooler 5, and the cooler 5 is used for cooling the air just entering the blade server and cooling the air in the blade server case. The thermoelectric heat sink 7 is used for radiating heat generated by the hot face of the thermoelectric refrigeration device 6 into the surrounding air.
In one embodiment of the thermoelectric cooling device for a blade server according to the present utility model, the chip radiator 2, the thermoelectric radiator 7 and the cooler 5 are all made of aluminum alloy heat dissipation profiles as shown in fig. 3, the axial fan 3 is a 12V small axial flow dc centrifugal fan, and the thermoelectric cooling device 6 is a semiconductor cooling chip with the model TEC1-12715 manufactured by ice and snow electronics inc.
The utility model relates to a thermoelectric refrigerating device for a blade server, which has the following working principle:
when the blade server starts to work, the thermoelectric refrigeration device 6 rapidly absorbs heat from the cooler 5 connected with the cold surface through the heat conducting silica gel under the action of voltage, and the phenomena of cold surface heat absorption and hot surface heat release are formed. The cooler 5 cools the air just entering the blade server and refrigerates the air in the blade server case, and the heat generated by the thermoelectric refrigeration device 6 is dissipated into the ambient air through the fins of the thermoelectric radiator 7 connected with the thermoelectric refrigeration device by adopting the heat-conducting silica gel. When the temperature of the CPU chip 1 is gradually increased, the CPU chip 1 transmits heat to the radiating fins of the chip radiator 2, the fins on the chip radiator 2 exchange heat with ambient cold air rapidly, the heat is emitted to the ambient air, the axial flow fan 3 forms forced air convection, and air absorbing the heat of the chip radiator 2 is discharged to the outside of the blade server case rapidly.
The thermoelectric refrigerating device for the blade server firstly utilizes the thermoelectric refrigerating device to cool the air which just enters the blade server, simultaneously cools the air in the chassis of the blade server, utilizes the cold air to exchange heat with the chip radiator in the blade server for cooling, and then utilizes forced convection to rapidly discharge the CPU heat absorbed by the chip radiator out of the chassis of the blade server, thereby greatly improving the heat radiation efficiency of the blade server under the condition of reducing the rotation speed and noise of a fan, and solving the problems of pneumatic noise and rotary noise generated by the prior heat radiation device by using a high-power high-rotation-speed powerful axial flow fan.
Claims (1)
1. The thermoelectric refrigerating device for the blade server comprises a chip radiator and an axial flow fan, wherein the chip radiator is adhered to a CPU chip, and the axial flow fan is fixed on an air outlet on the side wall of a blade server case; the cold face of the thermoelectric refrigeration device is connected with the cooler, the thermoelectric refrigeration device penetrates through the side wall of the case of the blade server case, the hot face of the thermoelectric refrigeration device is connected with the thermoelectric radiator, and the thermoelectric radiator is placed in the air.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222568340.7U CN219202273U (en) | 2022-09-27 | 2022-09-27 | Thermoelectric refrigerating device for blade server |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222568340.7U CN219202273U (en) | 2022-09-27 | 2022-09-27 | Thermoelectric refrigerating device for blade server |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219202273U true CN219202273U (en) | 2023-06-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222568340.7U Active CN219202273U (en) | 2022-09-27 | 2022-09-27 | Thermoelectric refrigerating device for blade server |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219202273U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115562439A (en) * | 2022-09-27 | 2023-01-03 | 紫光股份有限公司 | Refrigerating device and blade server with same |
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2022
- 2022-09-27 CN CN202222568340.7U patent/CN219202273U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115562439A (en) * | 2022-09-27 | 2023-01-03 | 紫光股份有限公司 | Refrigerating device and blade server with same |
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