CN218831084U - Hollow self-circulation heat dissipation system - Google Patents

Abstract

The utility model relates to a hollow self-loopa cooling system, including the radiator, be formed with first cavity in the radiator, first cavity intussuseption is filled with phase change material, it has a plurality of fins to arrange on the radiator, the inside cavity of fin forms the second cavity, the second cavity with first cavity intercommunication still includes PCBA and supports PCBA's lower casing, the heat conduction that electronic components on the PCBA produced that generates heat to first cavity, phase change material in the first cavity absorbs the heat and gasifies rapidly, and gaseous rising to the second cavity, phase change material pass through fin and the liquefaction of dispelling the heat rapidly of air contact, and capillary structure in the radiator produces capillary and makes the phase change material of liquid flow back to the bottom of first cavity and accomplish self-loopa cooling.

Description

Hollow self-circulation heat dissipation system

Technical Field

The utility model relates to an automotive electronics equipment cooling system, concretely relates to hollow self-loopa cooling system.

Background

With the progress of the times, the automobile industry is rapidly developing, the intelligent degree of the vehicle-mounted equipment is continuously improved, the power consumption of the vehicle-mounted electronic product is increasingly increased, the traditional natural heat dissipation technology cannot meet the heat dissipation requirement of the vehicle-mounted electronic equipment, and the heat dissipation of the vehicle-mounted electronic product is dependent on liquid cooling. The liquid cooling scheme is that a water pump or other devices are used for forcibly driving cooling liquid to circulate in a complex flow channel, heat is taken away when the cooling liquid passes through heating elements such as chips in the circulating process, and the heat is dissipated into the ambient air when the cooling liquid flows to a heat dissipation end. The whole process heat transfer process is chip-shell-cooling liquid-heat sink (shell) -air. The liquid cooling heat dissipation cost is high, the whole flow passage is long and complex, the required space is large, and the product weight is heavy.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a quality is light, the radiating effect is good and efficient self-loopa cooling system.

A hollow self-circulation heat dissipation system comprises a heat radiator, wherein a first cavity is formed in the heat radiator, phase-change materials are filled in the first cavity, a plurality of fins are arranged on the heat radiator, a second cavity is formed by hollowing the inside of the fins, and the second cavity is communicated with the first cavity.

In the above scheme, the phase change material filled in the first cavity has the characteristic of low boiling point, absorbs heat and instantly gasifies into gas, and rapidly liquefies when meeting cold, so that the heat dissipation efficiency of the radiator is improved, when the radiator absorbs heat, the phase change material in the first cavity is converted into gas and rises to the second cavity, the gas in the second cavity is contacted with air through the fins to dissipate heat and is converted into liquid, and the second cavity extends along the height direction of the radiator so as to facilitate the liquid to flow back to the first cavity, thereby realizing self-circulation heat dissipation.

Furthermore, the inner wall of the first cavity and the inner wall of the second cavity are both provided with capillary structures.

In the scheme, the capillary structure is formed by sintering copper powder on the surfaces of the inner wall of the first cavity and the inner wall of the second cavity, the capillary structure has high porosity, when the radiator absorbs heat, the phase-change material in the first cavity absorbs the heat and converts the heat into gas, the gas flows to the second cavity, and when the gas is converted into liquid again after the second cavity is contacted with air, the capillary structure generates capillary action to enable the liquid phase-change material to flow back to the first cavity.

Further, the surface of the fin is formed to have an undulating wave shape.

In the scheme, the fins are used for heat dissipation, the gas gasified by the phase-change material is rapidly liquefied when meeting cold after contacting with air at the positions of the fins, heat is released into the air, the fins are made into a wavy structure, the heat dissipation area can be increased, the heat dissipation effect is better, and the heat dissipation efficiency is improved.

Further, the heat sink includes an upper cover and a base, the base being connected to the upper cover.

In the above scheme, the upper cover and the base are connected to form a hollow cavity which is a first cavity, the end part of the upper cover is provided with the plurality of fins which are heat dissipation ends, the fins are hollow to form a second cavity, the weight of the electronic product can be reduced compared with that of a traditional radiator, the base absorbs heat and transfers the heat to the inner wall of the first cavity, the heat transfer way is reduced, and the heat dissipation efficiency is improved.

Furthermore, one side of the base, which is far away from the upper cover, is provided with a plurality of bosses.

In the above scheme, the radiator is applied to different electronic products, and the electronic components of the inside of electronic product can be different in size, need set up the boss at the base for better matching electronic product dispels the heat, the boss is connected with the components and parts that generate heat, with heat direct conduction to base, has improved the radiating efficiency.

Further, a hollow self-loopa cooling system still includes PCBA, be equipped with electronic components on the PCBA, electronic components with the boss butt.

In the above scheme, electronic components on the PCBA belong to the heating element, the PCBA is provided with the radiator to radiate the electronic components, the heat of the electronic components is conducted to the base, the phase-change material in the first cavity is gasified with heat, the gas rises to the second cavity, and the fins are in contact with air to be liquefied, so that the heat is radiated to the air. Different electronic equipment PCBA's overall arrangement diverse adjusts the position and the height of boss and makes the boss and the inseparable combination of electronic components on the PCBA to make radiator level place on PCBA, the radiator also can compatible multiple electronic equipment, and the range of application is wide.

Further, a heat conducting paste is coated between the lug boss and the contact surface of the electronic component.

In the above scheme, boss and electronic components direct contact carry out the heat conduction, but there is the clearance between boss and the electronic components, and the air in the clearance influences heat conduction efficiency, uses the heat conduction cream to fill the clearance at interface position and makes the heat conduction volume increase to the biggest, lets electronic components's temperature keep at the level of a steady job, prevents to cause electronic components to damage because the heat dissipation is bad, because the better conduction of heat makes the radiating effect of radiator obtain promoting to the base.

Further, a hollow self-circulating heat dissipation system also includes a lower housing for supporting the PCBA, the lower housing being connected to the PCBA.

In the above scheme, establish and be connected with the base at the lower casing of PCBA bottom and form a complete cooling system, PCBA supports to be connected with the radiator through lower casing and realizes the heat dissipation to electronic components, and the casing can play the guard action to a certain extent down simultaneously, avoids PCBA to receive the damage.

The utility model discloses a hollow self-loopa cooling system has following beneficial effect at least:

the radiator is light in weight, and the first cavity and the second cavity are both hollow, so that the radiator is lighter in weight compared with a traditional solid radiator.

Secondly, the radiating effect is good, efficient, the heat propagation route of cooling system is electronic components heat conduction to radiator, and the radiator looses the heat to the air, and the phase change material in the first cavity meets heat and gasifies rapidly, meets cold and liquefies rapidly, the wavy fin of upper cover has increased heat radiating area and has made the radiating effect good and radiating efficiency promote greatly.

And thirdly, the phase-change material can dissipate heat in a self-circulation manner, the phase-change material absorbs heat in the first cavity and is gasified, the gas rises to the second cavity, the phase-change material is in contact with air to dissipate heat and be liquefied, and the liquid phase-change material flows back to the bottom through the capillary action of the capillary structure to complete circulation, so that the self-circulation heat dissipation is realized, and the cost is greatly saved.

Drawings

Fig. 1 is a schematic structural diagram of a heat sink according to an embodiment.

Fig. 2 is an exploded view of a hollow self-circulation heat dissipation system according to an embodiment.

Fig. 3 is a schematic diagram of the PCBA board and electronic components of fig. 2.

Description of the drawings: 100. a heat sink; 110. an upper cover; 120. a base; 111. a fin; 121. a boss; 2. a first cavity; 3. a second cavity; 4. a capillary structure; 5. PCBA; 6. an electronic component; 7. heat conducting paste; 8. a lower housing.

Detailed Description

The hollow self-circulation heat dissipation system of the present invention will be described in further detail with reference to the following embodiments and accompanying drawings.

As shown in fig. 1 and fig. 2, in a preferred embodiment, the novel hollow self-circulation heat dissipation system of the present invention includes a heat sink 100, a first cavity 2 is formed in the heat sink 100, a phase change material is filled in the first cavity 2, a plurality of fins 111 are arranged on the heat sink 100, a second cavity 3 is formed in the fins 111, and the second cavity 3 is communicated with the first cavity 2. The phase change material filled in the first cavity 2 has the characteristic of low boiling point, the heat absorption is gasified into gas in the twinkling of an eye, the liquefaction rapidly meets cold, make the radiating efficiency of the radiator 100 improve, phase change material in the first cavity 2 turns into gas and rises to the second cavity 3 when the radiator 100 absorbs heat, thereby the gas at the second cavity 3 is through fin 111 and air contact heat dissipation and turn into liquid, the second cavity 3 extends along the direction of height of the radiator 100 and is convenient for liquid reflux to the first cavity 2, realize self-circulation heat dissipation, phase change material has the advantage of energy saving and environmental protection, the cost is also lower than using traditional liquid cooling scheme.

As shown in fig. 1, in some embodiments, the inner wall of the first cavity 2 and the inner wall of the second cavity 3 are both provided with capillary structures 4. Capillary structure 4 is that copper powder is sintered at the surface of first cavity 2 inner wall and second cavity 3 inner wall and is formed, high porosity has, the capillary action that capillary structure 4 produced refers to the appeal of liquid surface to solid surface, when radiator 100 absorbs heat, phase change material absorption heat in first cavity 2 turns into gas, gas can flow to second cavity 3, turn into liquid again after second cavity 3 contacts with the air when gas, capillary structure 4 produces capillary action this moment and makes liquid phase change material flow back to first cavity 2, capillary structure 4 also can play the effect of even heat conduction, self-circulation heat dissipation can make the product not rely on the liquid cooling system of whole car, be applicable to multi-functional high power's on-vehicle electronic equipment.

As shown in fig. 1 and 2, in some embodiments, the surface of the fin 111 is formed to have an undulating wave shape. The fins 111 are used for heat dissipation, the gas gasified by the phase-change material is rapidly liquefied when being in contact with air at the position of the fins 111 and then is cooled, heat is released into the air, the fins 111 are made into a wavy structure, the contact area of the phase-change material of the gas and the air is increased, the heat dissipation area is increased, the heat dissipation effect is better, the heat dissipation efficiency is improved, and besides the wavy structure, the structure can also be other raised structures capable of increasing the contact area of the air.

As shown in fig. 1 and 2, in some embodiments, the heat sink 100 includes an upper cover 110 and a base 120, the base 120 being coupled to the upper cover 110. The upper cover 110 and the base 120 are connected to form a hollow cavity as a first cavity 2, the upper cover 110 and the base 120 can be sealed by friction welding, screw sealing and glue bonding, the end of the upper cover 110 is provided with a plurality of fins 111 as heat dissipation ends, the fins 111 are hollow to form a second cavity 3, compared with the traditional heat sink 100, the heat sink is lighter in weight and can reduce the weight of an electronic product, the base 120 absorbs heat and transfers the heat to the inner wall of the first cavity 2, the heat dissipation way is reduced, the heat dissipation efficiency is improved, a heat dissipation fan in an air draft mode can be arranged above the heat dissipation ends for electronic products with large power, much heat generation and high temperature, or the fan can be arranged on the side face to ensure the air outlet direction and the heat dissipation direction of the fan to be consistent, so that the heat is accelerated to be dissipated into the surrounding air, and the heat dissipation capability is further improved.

As shown in fig. 1 and 2, in some embodiments, the base 120 is provided with a plurality of bosses 121 on a side thereof away from the upper cover 110. Radiator 100 applies to different electronic product, and electronic product's inside electronic components 6 height size can be different, need set up boss 121 at base 120 for better matching electronic product dispels the heat, and boss 121 is connected with the components and parts that generate heat, with heat direct conduction to base 120, has improved the radiating efficiency.

As shown in fig. 1 to 3, in some embodiments, the hollow self-circulation heat dissipation system further includes a PCBA5, and an electronic component 6 is disposed on the PCBA5, and the electronic component 6 abuts against the boss 121. Electronic components 6 on PCBA5 belong to heating element, install radiator 100 on PCBA5 and dispel the heat to electronic components 6, electronic components 6 conduct heat to base 120, phase change material in the first cavity 2 meets the thermal gasification, gaseous rising to second cavity 3, contact the liquefaction with the air at fin 111 and dispel the heat in the air, different electronic equipment PCBA 5's overall arrangement diverse, position and the height to boss 121 are adjusted and are made the inseparable combination of electronic components 6 on boss 121 and the PCBA5, and make radiator 100 level place on PCBA5, radiator 100 also can compatible multiple electronic equipment, and the range of application is wide.

As shown in fig. 2 and 3, in some embodiments, the thermal paste 7 is applied between the contact surfaces of the bosses 121 and the electronic component 6. The boss 121 directly contacts with the electronic component 6 for heat conduction, but a gap exists between the boss 121 and the electronic component 6, air in the gap influences heat conduction efficiency, the gap at the interface part is filled with the heat conduction paste 7, so that the heat conduction quantity is increased to the maximum, the temperature of the electronic component 6 is kept at a stable working level, the electronic component 6 is prevented from being damaged due to poor heat dissipation, the heat dissipation effect of the heat sink 100 is improved due to better heat conduction to the base 120, and the heat conduction paste 73 is used for reducing the thermal resistance between the soaking plate and the heat sink 100 compared with the traditional mode of combining the soaking plate with the heat sink 100, so that the heat conduction effect is better.

In some embodiments, a hollow, self-circulating heat dissipation system also includes a lower housing 8 for supporting the PCBA5, the lower housing 8 being attached to the PCBA5, as shown in fig. 2 and 3. Establish and be connected the formation complete cooling system at the lower casing 8 of PCBA5 bottom with base 120, PCBA5 supports through lower casing 8 and is connected the realization and is connected the heat dissipation to electronic components 6 with radiator 100, and lower casing 8 can play the guard action to a certain extent simultaneously, avoids PCBA5 to receive the damage, and cooling system can absorb heat and dispel the heat again, and the route of heat propagation is short by electronic components 6 through radiator 100 air again, has promoted the radiating efficiency.

The utility model discloses hollow self-loopa cooling system theory of operation and process, cooling system includes radiator 100, PCBA5 and lower casing 8, be formed with first cavity 2 in the radiator 100, the intussuseption of first cavity 2 is filled with phase change material, it has a plurality of fins 111 to arrange on radiator 100, the inside cavity of fin 111 forms second cavity 3, second cavity 3 and first cavity 2 intercommunication, PCBA5 facing has electronic components 6, electronic components 6 is connected with the boss 121 of base 120, the contact surface packing of electronic components 6 and boss 121 has heat conduction cream 7, the lower casing 8 and the base 120 fixed connection of PCBA5 bottom, the heat conduction that electronic components 6 generated heat to base 120, phase change material in the first cavity 2 of radiator 100 absorbs the heat and gasifies rapidly, gas rises to the second cavity 3 of the heat dissipation end of upper cover 110, the heat dissipation end is equipped with more wavy fin 111, phase change material dispels the heat through fin 111 and air contact rapid heat dissipation liquefaction, the capillary structure 4 of first cavity 2 and the inner wall of second cavity 3 produces the effect and makes the capillary phase change material backflow to first cavity 2 of liquid accomplish the circulation cavity bottom of first cavity 2.

In the description of the present invention, it is to be understood that the terms such as "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

While the invention has been described in conjunction with the specific embodiments set forth above, it is evident that many alternatives, modifications, and variations will be apparent to those skilled in the art in light of the foregoing description. Accordingly, it is intended to embrace all such alternatives, modifications, and variations that fall within the spirit and scope of the appended claims.

Claims (8)

1. A hollow self-circulation heat dissipation system is characterized by comprising a heat radiator, wherein a first cavity is formed in the heat radiator, phase-change materials are filled in the first cavity, a plurality of fins are arranged on the heat radiator, a second cavity is formed in the fins in a hollow mode, and the second cavity is communicated with the first cavity.

2. The hollow self-circulating heat dissipating system of claim 1, wherein the first and second cavity inner walls are provided with capillary structures.

3. The hollow self-circulating heat dissipating system of claim 1, wherein the surface of the fins is formed to have an undulating wave shape.

4. The hollow self-circulating heat dissipating system of claim 1 wherein said heat sink comprises an upper cover and a base, said base being attached to said upper cover.

5. The hollow self-circulating heat dissipating system of claim 4, wherein a plurality of bosses are provided on a side of the base away from the top cover.

6. A hollow self-circulating heat dissipating system according to claim 5, further comprising a PCBA, on which electronic components are provided, the electronic components abutting against the bosses.

7. The hollow self-circulating heat-dissipating system of claim 6, wherein a thermal paste is applied between the bosses and the contact surfaces of the electronic components.

8. A hollow, self-circulating heat dissipating system according to claim 6, further comprising a lower housing for supporting the PCBA, the lower housing being connected to the PCBA.

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