CN219019211U - Vehicle controller and vehicle - Google Patents
Vehicle controller and vehicle Download PDFInfo
- Publication number
- CN219019211U CN219019211U CN202223059539.3U CN202223059539U CN219019211U CN 219019211 U CN219019211 U CN 219019211U CN 202223059539 U CN202223059539 U CN 202223059539U CN 219019211 U CN219019211 U CN 219019211U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- heat
- middle frame
- chip
- heat conducting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T10/00—Road transport of goods or passengers
- Y02T10/60—Other road transportation technologies with climate change mitigation effect
- Y02T10/72—Electric energy management in electromobility
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The application discloses a vehicle controller and a vehicle. The vehicle controller comprises a box body, a circuit board and a flexible heat conduction assembly, wherein the box body comprises an upper shell, a lower shell and a middle frame, the upper shell and the lower shell are connected to form a containing space, the middle frame is arranged in the containing space, the middle frame comprises a first heat conduction surface and a second heat conduction surface which are arranged in a back-to-back mode, and an opening penetrating through the first heat conduction surface and the second heat conduction surface is formed in the middle frame. The circuit board comprises a plurality of chips arranged on two sides of the circuit board, the circuit board is arranged in the accommodating space, and the chips on one side, close to the middle frame, of the circuit board are connected to the first heat conducting surface so as to dissipate heat through the first heat conducting surface. One end of the flexible heat conduction component is connected with the chip on one side, far away from the middle frame, of the circuit board, and the other end of the flexible heat conduction component penetrates through the opening and is connected with the second heat conduction surface. On the basis of not adding additional heat dissipation modules, the heat dissipation efficiency of the circuit board is guaranteed, and then the normal operation of the vehicle controller is guaranteed.
Description
Technical Field
The present application relates to the field of vehicle technology, and more particularly, to a vehicle controller and a vehicle.
Background
At present, an on-vehicle domain controller integrates two domain control hardware PCBA in a structural shell, and the two PCBA are provided with higher and higher heating chips which need to dissipate heat, so that the heat can be dissipated through the water-cooled middle frame shell, the upper shell and the lower shell. However, the chip on the PCBA above generates more heat, and the independent housing is required to be designed specifically for natural heat dissipation, forced air cooling or water cooling, so that the vehicle-mounted domain controller has larger volume and more energy consumption.
Disclosure of Invention
The embodiment of the application provides a vehicle controller and a vehicle.
The vehicle controller according to the embodiment of the application includes:
the box body comprises an upper shell, a lower shell and a middle frame, wherein the upper shell and the lower shell are connected to form a containing space, the middle frame is arranged in the containing space and comprises a first heat conducting surface and a second heat conducting surface which are arranged in a back-to-back mode, and an opening penetrating through the first heat conducting surface and the second heat conducting surface is formed in the middle frame;
the circuit board comprises a plurality of chips arranged on two sides of the circuit board, the circuit board is arranged in the accommodating space, and the chips on one side, close to the middle frame, of the circuit board are connected to the first heat conducting surface so as to radiate heat through the first heat conducting surface;
the flexible heat conduction assembly, the one end of flexible heat conduction assembly is connected keep away from on the circuit board the chip of center one side, the other end of flexible heat conduction assembly wears to establish the opening and connects the second heat conduction face.
In the vehicle controller of the embodiment of the application, the upper case, the lower case and the middle frame form a basic structure of the case, and the circuit board may be disposed in the accommodation space such that the case may protect the circuit board from external impact and vibration. Meanwhile, the chip on the circuit board, which is close to one side of the middle frame, can be connected with the first heat conducting surface of the middle frame for heat dissipation, and the chip on the circuit board, which is far away from one side of the middle frame, conducts heat to the second heat conducting surface through the flexible heat conducting component, so that the heat dissipation efficiency of the circuit board is guaranteed on the basis of not adding an additional heat dissipation module, and the normal operation of the vehicle controller is further guaranteed.
In some embodiments, the circuit board includes a first circuit board disposed between the middle frame and the upper case, and a second circuit board disposed between the middle frame and the lower case; a part of chips on the first circuit board far away from one side of the middle frame conduct heat to the second heat conducting surface through the flexible heat conducting component, and the chips on the first circuit board near one side of the middle frame are connected with the first heat conducting surface; and a chip on one side, close to the middle frame, of the second circuit board is connected with the second heat conducting surface. So, the middle frame can divide into two with accommodation space one, and first circuit board and second circuit board can set up respectively in two spaces, that is to say, the middle frame can be with first circuit board and second circuit board separately to avoid first circuit board and second circuit board to produce heat simultaneously in same space, influence the work efficiency of chip. In addition, can set up the chip that the heat dissipation capacity is bigger on the first circuit board, the chip on the first circuit board can be directly with the center connection heat dissipation, still can be through flexible heat conduction subassembly with heat transfer for on the second heat conduction face, promote radiating efficiency.
In some embodiments, a part of the chip on the side, far away from the middle frame, of the first circuit board is attached to the side, close to the middle frame, of the upper shell so as to radiate heat through the upper shell; and a chip on one side of the second circuit board far away from the middle frame is attached to one side of the middle frame of the lower shell so as to radiate heat through the lower shell. So, epitheca and inferior valve can participate in the heat dissipation, and the epitheca can be directly with the chip direct laminating that is close to the epitheca on the first circuit board together for heat can release outside the box through the epitheca, and the inferior valve can be directly with the chip direct laminating that is close to the inferior valve on the second circuit board together, makes heat can release outside the box through the inferior valve.
In some embodiments, the middle frame includes a body and a heat dissipating boss protruding from the body for connecting the chip or the flexible heat conducting component. So, the heat dissipation boss can bulge in the body for when center and chip or flexible heat conduction subassembly are connected, can avoid the monoblock circuit board to paste completely on the center, also guarantee simultaneously that flexible heat conduction subassembly can pass through the heat transfer and give on the center, avoid center oppression or fish tail flexible heat conduction subassembly.
In some embodiments, the vehicle controller further comprises a thermally conductive medium coated between the heat dissipating boss and the chip. Therefore, heat can be conducted between the heat dissipation boss and the chip through the heat conducting medium, and insufficient contact during direct connection of the heat dissipation boss and the chip is avoided, so that heat conducting efficiency is reduced.
In some embodiments, the flexible heat-conducting component includes a first end and a second end, the first end is connected to a portion of the chip on the side of the circuit board away from the middle frame, and the second end is connected to the heat-dissipating boss on the side of the second heat-conducting surface. So, the chip can give first end with heat transfer, and flexible heat conduction subassembly can follow first end conduction to the second to give the heat dissipation boss of center with heat transfer through the second end, with the heat on guaranteeing the chip can be transmitted fast, improvement heat transfer efficiency.
In certain embodiments, the first end is attached to the chip by glue or bolts. So, first end can be connected with the chip through the mode of colloid or bolt, guarantees that first end and chip can be fixed stable.
In some embodiments, the second end and the heat dissipating boss are connected by glue or bolts or solder. Therefore, the second end can be connected with the chip in a colloid or bolt or soldering tin welding mode, and the second end and the heat dissipation boss can be fixed and stable.
In some embodiments, a heat dissipation flow passage is formed inside the body, the heat dissipation flow passage being for flowing a cooling medium. Therefore, the cooling medium can flow fast through the heat dissipation flow channel so as to take away and release the heat transferred to the middle frame fast, thereby ensuring the heat dissipation efficiency of the middle frame.
The vehicle of an embodiment of the present application includes a vehicle body and the vehicle controller of any one of the above embodiments, the vehicle controller being provided on the vehicle body.
In the vehicle controller and the vehicle that this application implemented, upper shell, inferior valve and center form the basic structure of box, and the circuit board can set up in the accommodation space for the box can protect the circuit board from external impact and vibration. Meanwhile, the chip on the circuit board, which is close to one side of the middle frame, can be connected with the first heat conducting surface of the middle frame for heat dissipation, and the chip on the circuit board, which is far away from one side of the middle frame, conducts heat to the second heat conducting surface through the flexible heat conducting component, so that the heat dissipation efficiency of the circuit board is guaranteed on the basis of not adding an additional heat dissipation module, and the normal operation of the vehicle controller is further guaranteed.
Additional aspects and advantages of the application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the application.
Drawings
The foregoing and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings, in which:
fig. 1 is a schematic structural view of a vehicle controller according to an embodiment of the present application;
fig. 2 is a schematic structural view of a vehicle according to an embodiment of the present application.
Description of main reference numerals:
a vehicle controller 100;
the heat dissipation device comprises a box body 10, an upper shell 11, a containing space 111, a lower shell 12, a middle frame 13, a first heat conducting surface 131, a second heat conducting surface 132, an opening 133, a body 134, a heat dissipation boss 135, a circuit board 20, a first circuit board 21, a second circuit board 22, a chip 23, a flexible heat conducting component 30, a first end 31, a second end 32, a vehicle 200 and a vehicle body 201.
Detailed Description
Embodiments of the present application are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application.
In this application, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, and may also include the first and second features not being in direct contact but being in contact with each other by way of additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.
The following disclosure provides many different embodiments or examples for implementing different structures of the present application. In order to simplify the disclosure of the present application, the components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit the present application. Furthermore, the present application may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not in themselves indicate a relationship between the various embodiments and/or settings discussed. In addition, the present application provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize the application of other processes and/or the use of other materials.
Referring to fig. 1, a vehicle controller 100 according to the embodiment of the present application includes a case 10, a circuit board 20 (Printed Circuit Board Assembly, PCBA board) and a flexible heat conducting component 30, where the case 10 includes an upper shell 11, a lower shell 12 and a middle frame 13, the upper shell 11 and the lower shell 12 are connected to form a containing space 111, the middle frame 13 is disposed in the containing space 111, the middle frame 13 includes a first heat conducting surface 131 and a second heat conducting surface 132 disposed opposite to each other, the middle frame 13 is further formed with an opening 133 penetrating the first heat conducting surface 131 and the second heat conducting surface 132, the circuit board 20 includes a plurality of chips 23 disposed on two sides of the circuit board 20, the circuit board 20 is disposed in the containing space 111, and the chips 23 on one side of the circuit board 20 close to the middle frame 13 are connected to the first heat conducting surface 131 to dissipate heat through the first heat conducting surface 131. One end of the flexible heat conduction component 30 is connected with the chip 23 on the side, far away from the middle frame 13, of the circuit board 20, and the other end of the flexible heat conduction component 30 penetrates through the opening 133 and is connected with the second heat conduction surface 132.
In the vehicle controller 100 of the embodiment of the present application, the upper case 11, the lower case 12, and the middle frame 13 form a basic structure of the case 10, and the circuit board 20 may be disposed in the accommodation space 111 such that the case 10 may protect the circuit board 20 from external impact and vibration. Meanwhile, the chip 23 on the side of the circuit board 20 close to the middle frame 13 can be connected with the first heat conducting surface 131 of the middle frame 13 to dissipate heat, and the chip 23 on the side of the circuit board 20 far away from the middle frame 13 can conduct heat to the second heat conducting surface 132 through the flexible heat conducting component 30, so that the heat dissipation efficiency of the circuit board 20 is guaranteed on the basis of not adding additional heat dissipation modules, and the normal operation of the vehicle controller 100 is further guaranteed.
Specifically, the flexible heat-conducting component 30 of the embodiment of the application may be bent, one end of the flexible heat-conducting component 30 is connected with the chip 23 above the circuit board 20, and the other end of the flexible heat-conducting component 30 passes through the opening 133 of the middle frame 13 to be connected with the second heat-conducting surface 132, so that the chips 23 on two sides of the circuit board 20 can radiate heat through the middle frame 13. In this way, heat is transferred through the flexible heat conduction assembly 30 without changing the original vehicle controller 100, and the heat conduction efficiency is high while the space utilization is high. The same heat dissipation module is fully utilized, a new heat dissipation module is not added, and the cost is lower.
Further, the flexible thermally conductive assembly 30 communicates heat conduction paths in a multi-dimensional space, with its high thermal conductivity and flexibility enabling heat conduction to be three-dimensional rather than conventional two-dimensional space conduction. In the present embodiment, the specific type of flexible heat transfer assembly 30 is not limited to meet different requirements. For example, the flexible heat conducting component 30 may be a flexible heat pipe, or the flexible heat conducting component 30 may be another flexible heat conducting material with a heat conducting coefficient of 4000w/mk or more, so as to ensure heat conducting efficiency.
The specific type of the vehicle controller 100 is not limited in the embodiments of the present application, and for example, the vehicle controller 100 may be an on-board domain controller to satisfy different requirements. In addition, in the present embodiment, the number of the circuit boards 20 themselves and the number of the chips 23 on the circuit boards 20 are not limited to meet different requirements. Of course, in the embodiment of the present application, the specific type of the chip 23 is not limited, for example, the chip 23 may be a separate chip 23, and may also be a chip 23 through a system in package (System In a Package, SIP) to meet various requirements. For chips 23 with different heat dissipation amounts, the chips 23 may be disposed at different positions of the circuit board 20 to ensure the overall heat dissipation effect of the vehicle controller 100.
Referring to fig. 1, in some embodiments, the circuit board 20 includes a first circuit board 21 and a second circuit board 22, the first circuit board 21 is disposed between the middle frame 13 and the upper case 11, and the second circuit board 22 is disposed between the middle frame 13 and the lower case 12; the part of the chip 23 on the side, far away from the middle frame 13, of the first circuit board 21 conducts heat to the second heat conducting surface 132 through the flexible heat conducting component 30, and the chip 23 on the side, near the middle frame 13, of the first circuit board 21 is connected with the first heat conducting surface 131; the chip 23 on the side of the second circuit board 22 close to the middle frame 13 is connected to the second heat conducting surface 132.
In this way, the middle frame 13 may divide the accommodating space 111 into two parts, and the first circuit board 21 and the second circuit board 22 may be disposed in the two spaces respectively, that is, the middle frame 13 may separate the first circuit board 21 and the second circuit board 22, so as to avoid the first circuit board 21 and the second circuit board 22 generating heat in the same space at the same time, which affects the working efficiency of the chip 23. In addition, the first circuit board 21 may be provided with a chip 23 with a larger heat dissipation capacity, and the chip 23 on the first circuit board 21 may be directly connected with the middle frame 13 for dissipating heat, and may further transfer heat to the second heat conducting surface 132 through the flexible heat conducting component 30, so as to improve heat dissipation efficiency.
Specifically, the middle frame 13 divides the accommodating space 111, the accommodating space 111 between the middle frame 13 and the upper shell 11 can be used for setting the first circuit board 21, the accommodating space 111 between the middle frame 13 and the lower shell 12 can be used for setting the second circuit board 22, two heat conducting surfaces of the middle frame 13 are fully utilized, and the space utilization rate is higher.
Referring to fig. 1, in some embodiments, a portion of a chip 23 on a side of the first circuit board 21 away from the middle frame 13 is attached to a side of the upper case 11 near the middle frame 13, so as to dissipate heat through the upper case 11; the chip 23 on the side of the second circuit board 22 away from the middle frame 13 is attached to the side of the middle frame 13 of the lower case 12 to dissipate heat through the lower case 12.
In this way, the upper case 11 and the lower case 12 may participate in heat dissipation, and the upper case 11 may be directly attached to the chip 23 on the first circuit board 21 near the upper case 11, so that heat may be released to the outside of the case 10 through the upper case 11, and the lower case 12 may be directly attached to the chip 23 on the second circuit board 22 near the lower case 12, so that heat may be released to the outside of the case 10 through the lower case 12.
Specifically, the upper case 11 and the lower case 12 may function to protect the circuit board 20 and the chip 23, and the middle frame 13 may function to protect and support the circuit board 20 and the chip 23. In the present embodiment, the specific material of the case 10 is not limited, and may be any material that can protect and conduct heat. In one example, the upper and lower cases 11 and 12 may be a metal material, and the upper and lower cases 11 and 12 may directly contact the chip 23 such that the chip 23 may transfer heat to the outside through the upper and lower cases 11 and 12.
In some embodiments, fins may be provided on the outside of the upper and lower cases 11 and 12 to increase the contact area of the upper and lower cases 11 and 12 with air, ensuring that heat transferred to the fins can be released to the outside.
Referring to fig. 1, in some embodiments, the middle frame 13 includes a body 134 and a heat dissipating boss 135 protruding from the body 134, the heat dissipating boss 135 being used to connect the chip 23 or the flexible heat conducting component 30.
Thus, the heat dissipating boss 135 may protrude from the body 134, so that when the middle frame 13 is connected with the chip 23 or the flexible heat conducting component 30, the whole circuit board 20 is prevented from being completely attached to the middle frame 13, and meanwhile, the flexible heat conducting component 30 is ensured to transfer heat to the middle frame 13, so that the middle frame 13 is prevented from pressing or scratching the flexible heat conducting component 30.
Referring to fig. 1, in some embodiments, vehicle controller 100 further includes a thermally conductive medium that is coated between heat dissipating boss 135 and chip 23.
Thus, heat can be conducted between the heat dissipation boss 135 and the chip 23 through the heat conducting medium, so that insufficient contact is avoided when the heat dissipation boss 135 and the chip 23 are directly connected, and the heat conducting efficiency is reduced.
It will be appreciated that the surfaces of the heat dissipating boss 135 and the chip 23 are hard materials, and that insufficient contact is made when the heat dissipating boss 135 and the chip 23 are directly bonded together. Accordingly, heat conduction efficiency can be ensured by coating a heat conduction medium between the heat dissipation boss 135 and the chip 23. In the present embodiment, the specific type of the heat transfer medium is not limited to meet different demands. For example, the heat conducting medium can be heat conducting paste, so that the heat conducting efficiency of the heat conducting medium is high, the thickness of the heat conducting paste can be set to be 0.5mm, and the heat conducting paste occupies a small space.
Referring to fig. 1, in some embodiments, the flexible heat-conducting component 30 includes a first end 31 and a second end 32, where the first end 31 is connected to a portion of the chip 23 on a side of the circuit board 20 remote from the middle frame 13, and the second end 32 is connected to a heat dissipating boss 135 on a side of the second heat-conducting surface 132.
In this way, the chip 23 can transfer heat to the first end 31, the flexible heat conduction component 30 can conduct heat from the first end 31 to the second end 32, and the heat is transferred to the heat dissipation boss 135 of the middle frame 13 through the second end 32, so that the heat on the chip 23 can be quickly transferred, and the heat transfer efficiency is improved. In one example, the first end 31 is connected to a portion of the chip 23 on the side of the first circuit board 21 remote from the middle frame 13, and the second end 32 is connected to a heat dissipating boss 135 on the side of the second heat conducting surface 132, so that heat on the chip 23 can be transferred to the middle frame 13 through the flexible heat conducting component 30.
Referring to fig. 1, in some embodiments, the first end 31 is coupled to the chip 23 by glue or bolts.
Thus, the first end 31 may be connected to the chip 23 by means of glue or bolts, so as to ensure that the first end 31 and the chip 23 may be fixed and stable.
Further, referring to fig. 1, in some embodiments, the second end 32 is connected to the heat dissipating boss 135 by glue or bolts or solder.
In this way, the second end 32 may be connected to the chip 23 by glue, bolts, or solder, so as to ensure that the second end 32 and the heat dissipating boss 135 may be fixed and stable.
Specifically, to ensure that the first end 31 and the second end 32 are tightly coupled to the chip 23 and the heat dissipating boss 135, respectively, they may be coupled together by glue or bolts. The second end 32 can be directly and fixedly connected with the heat dissipation boss 135 on the second heat conducting surface 132 of the middle frame 13 in a soldering manner, and after the second end 32 is connected with the middle frame 13, the first end 31 can pass through the opening 133 and be connected with the chip 23, so that the heat dissipation efficiency is ensured.
Referring to fig. 1, in some embodiments, a heat dissipation flow channel (not shown) is formed inside the body 134, and the heat dissipation flow channel is used for flowing a cooling medium.
Therefore, the cooling medium can flow fast through the heat dissipation flow channel so as to take away and release the heat transferred to the middle frame 13 fast, thereby ensuring the heat dissipation efficiency of the middle frame 13.
Referring to fig. 2, a vehicle 200 of the embodiment of the present application includes a vehicle body 201 and the vehicle controller 100 of any of the above embodiments, the vehicle controller 100 being provided on the vehicle body 201.
In the vehicle controller 100 and the vehicle 200 of the present application, the upper case 11, the lower case 12, and the middle frame 13 form a basic structure of the case 10, and the circuit board 20 may be disposed in the accommodation space 111 such that the case 10 may protect the circuit board 20 from external impact and vibration. Meanwhile, the chip 23 on the side of the circuit board 20 close to the middle frame 13 can be connected with the first heat conducting surface 131 of the middle frame 13 to dissipate heat, and the chip 23 on the side of the circuit board 20 far away from the middle frame 13 can conduct heat to the second heat conducting surface 132 through the flexible heat conducting component 30, so that the heat dissipation efficiency of the circuit board 20 is guaranteed on the basis of not adding additional heat dissipation modules, and the normal operation of the vehicle controller 100 is further guaranteed. .
In the embodiment of the application, the type of the cooling medium is not limited, and the cooling medium can be water or other aqueous solutions to meet different requirements. Meanwhile, the type of the vehicle 200 is not limited, and the vehicle 200 may be an electric vehicle or a hybrid vehicle.
In the description of embodiments of the present application, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more of the described features. In the description of the embodiments of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present application have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the present application, and that variations, modifications, alternatives, and variations may be made to the above embodiments by one of ordinary skill in the art within the scope of the present application.
Claims (10)
1. A vehicle controller, characterized by comprising:
the box body comprises an upper shell, a lower shell and a middle frame, wherein the upper shell and the lower shell are connected to form a containing space, the middle frame is arranged in the containing space and comprises a first heat conducting surface and a second heat conducting surface which are arranged in a back-to-back mode, and an opening penetrating through the first heat conducting surface and the second heat conducting surface is formed in the middle frame;
the circuit board comprises a plurality of chips arranged on two sides of the circuit board, the circuit board is arranged in the accommodating space, and the chips on one side, close to the middle frame, of the circuit board are connected to the first heat conducting surface so as to radiate heat through the first heat conducting surface;
the flexible heat conduction assembly, the one end of flexible heat conduction assembly is connected keep away from on the circuit board the chip of center one side, the other end of flexible heat conduction assembly wears to establish the opening and connects the second heat conduction face.
2. The vehicle controller of claim 1, wherein the circuit board comprises a first circuit board and a second circuit board, the first circuit board disposed between the middle frame and the upper shell, the second circuit board disposed between the middle frame and the lower shell;
a part of chips on the first circuit board far away from one side of the middle frame conduct heat to the second heat conducting surface through the flexible heat conducting component, and the chips on the first circuit board near one side of the middle frame are connected with the first heat conducting surface;
and a chip on one side, close to the middle frame, of the second circuit board is connected with the second heat conducting surface.
3. The vehicle controller according to claim 2, wherein a part of the chip on the side of the first circuit board away from the center frame is attached to the side of the upper case close to the center frame to dissipate heat through the upper case;
and a chip on one side of the second circuit board far away from the middle frame is attached to one side of the middle frame of the lower shell so as to radiate heat through the lower shell.
4. The vehicle controller of claim 1, wherein the center frame includes a body and a heat dissipating boss protruding from the body for connecting the chip or the flexible heat conducting assembly.
5. The vehicle controller of claim 4, further comprising a thermally conductive medium coated between the heat dissipating boss and the chip.
6. The vehicle controller of claim 4, wherein the flexible thermally conductive assembly includes a first end and a second end, the first end being coupled to a portion of the circuit board on a side remote from the center frame, the second end being coupled to the heat dissipating boss on a side of the second thermally conductive surface.
7. The vehicle controller of claim 6, wherein the first end is attached to the chip by glue or bolts.
8. The vehicle controller of claim 6, wherein the second end is connected to the heat dissipating boss by glue or bolts or solder.
9. The vehicle controller according to claim 4, characterized in that a heat radiation flow passage for flowing a cooling medium is formed inside the body.
10. A vehicle, characterized by comprising:
a vehicle body;
the vehicle controller according to any one of claims 1 to 9, which is provided on the vehicle body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223059539.3U CN219019211U (en) | 2022-11-16 | 2022-11-16 | Vehicle controller and vehicle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223059539.3U CN219019211U (en) | 2022-11-16 | 2022-11-16 | Vehicle controller and vehicle |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219019211U true CN219019211U (en) | 2023-05-12 |
Family
ID=86231073
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223059539.3U Active CN219019211U (en) | 2022-11-16 | 2022-11-16 | Vehicle controller and vehicle |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219019211U (en) |
-
2022
- 2022-11-16 CN CN202223059539.3U patent/CN219019211U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN212278664U (en) | Liquid cooling plate suitable for liquid cooling heat dissipation of electronic equipment and heat dissipation unit with same | |
| CN105099564B (en) | Encapsulating structure and optical module | |
| JP2018503934A (en) | Heat sink and power battery system | |
| US6639798B1 (en) | Automotive electronics heat exchanger | |
| CN104465552A (en) | Packaging structure and optical module | |
| CN109219320B (en) | Electronic equipment, heat dissipation device thereof and vehicle equipment | |
| CN104934386B (en) | Encapsulating structure and optical module | |
| CN210405997U (en) | Heat dissipation structure of electronic device | |
| CN216413231U (en) | Heat radiation structure of phased array antenna, phased array antenna and satellite platform | |
| CN216357859U (en) | Heat dissipation module and electronic equipment | |
| CN117075695A (en) | Liquid cooling assembly, liquid cooling device and server | |
| WO2014140098A1 (en) | Heat spreader with flat pipe cooling element | |
| JP6322930B2 (en) | Heat receiver, cooling unit, electronic equipment | |
| CN219019211U (en) | Vehicle controller and vehicle | |
| JP6710163B2 (en) | Power semiconductor device | |
| JP7030535B2 (en) | Power semiconductor device | |
| CN111148342B (en) | Circuit board heat abstractor and have its server | |
| JP4382651B2 (en) | Semiconductor device substrate, semiconductor module, and electric vehicle | |
| CN210630148U (en) | Heat radiation structure and mobile device | |
| CN211240288U (en) | Circuit board heat abstractor and server that has it | |
| CN114094303A (en) | Heat radiation structure of phased array antenna, phased array antenna and satellite platform | |
| JPH01270298A (en) | Cooling structure for semiconductor element | |
| CN218831084U (en) | Hollow self-circulation heat dissipation system | |
| CN216313682U (en) | Heat dissipation module, base and electronic equipment | |
| CN219979557U (en) | Chip device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |