CN219979557U - Chip device - Google Patents

Abstract

The present utility model relates to the field of chip heat dissipation technologies, and in particular, to a chip device. The chip device includes a substrate assembly, a bare chip, a thermal pad, and a heat spreader. The radiator is directly or indirectly connected with the substrate assembly and is provided with a containing groove with an opening facing the substrate assembly. The bare chip is fixedly arranged at one end of the substrate assembly, which is close to the radiator, and protrudes out of the surface of the substrate assembly, the heat conducting pad is coated on the outer side surface of the bare chip, the bare chip coated with the heat conducting pad extends into the accommodating groove through the opening of the accommodating groove, and the heat conducting pad is tightly attached to the inner wall of the accommodating groove, which is away from the outer side surface of the bare chip. The chip device provided by the utility model solves the problem of poor chip heat dissipation effect caused by small heat dissipation area of the existing chip.

Description

Chip device

Technical Field

The present utility model relates to the field of chip heat dissipation technologies, and in particular, to a chip device.

Background

With the increasing size and higher power consumption of chips, the problem to be solved is the heat dissipation problem of the chips.

In the prior art, a radiator is generally arranged above a chip, and heat conduction between the radiator and the chip is utilized, so that heat generated by the chip is rapidly dissipated, and the heat dissipation condition of the chip is improved. However, the contact area between the existing chip and the radiator is limited, so that the heat dissipation efficiency of the chip is low, and the heat dissipation effect of the chip device is affected.

Disclosure of Invention

Based on this, it is necessary to provide a chip device to solve the problem that the heat dissipation effect of the chip is poor due to the small heat dissipation area of the existing chip.

The utility model provides a chip device, which comprises a substrate assembly, a bare chip, a heat conducting pad and a radiator, wherein the radiator is directly or indirectly connected with the substrate assembly and is provided with a containing groove with an opening facing the substrate assembly; the bare chip is fixedly arranged at one end of the substrate assembly, which is close to the radiator, and protrudes out of the surface of the substrate assembly, the heat conducting pad is coated on the outer side surface of the bare chip, the bare chip coated with the heat conducting pad extends into the accommodating groove through the opening of the accommodating groove, and the heat conducting pad is tightly attached to the inner wall of the accommodating groove, and the outer wall of the heat conducting pad, which is away from the outer side surface of the bare chip, is tightly attached to the outer wall of the accommodating groove.

In one embodiment, the heat radiator comprises a heat radiating fin, a heat radiating base plate, a heat radiating boss and a heat radiating side plate, wherein the heat radiating fin is arranged at one end of the heat radiating base plate far away from the base plate assembly, the heat radiating boss is connected with one end of the heat radiating base plate near the base plate assembly and protrudes out of the surface of the heat radiating base plate, and the heat radiating side plate is arranged around the periphery of the heat radiating boss in a surrounding manner and is respectively connected with the heat radiating boss and the heat radiating base plate; the heat dissipation side plate protrudes out of one end of the heat dissipation boss, which is far away from the heat dissipation substrate, so that the heat dissipation side plate and the heat dissipation boss can be surrounded to form the accommodating groove.

By the arrangement, the use reliability of the radiator is improved.

In one embodiment, the cross sections of the accommodating groove and the bare chip are square, the length of the accommodating groove is defined as a, the length of the bare chip is defined as M, the nominal compression thickness of the heat conducting pad is L, and A, M and L meet that a=m+2l+x; defining the width of the accommodating groove as B, and the width of the bare chip as N, wherein B, N and L meet the requirement that B=N+2L+X; wherein X is more than or equal to 0.2mm and less than or equal to 2mm.

By the arrangement, the situation that the heat conduction pad is damaged due to the fact that the internal stress of the heat conduction pad is concentrated is avoided.

In one embodiment, an end of the heat dissipation side plate facing away from the heat dissipation substrate is spaced from the substrate assembly.

By the arrangement, the heat conduction pad and the bare chip are prevented from being damaged due to excessive compression of the heat conduction pad.

In one embodiment, the heat dissipation substrate, the heat dissipation boss and the heat dissipation side plate are connected by welding or bonding.

So set up, the holistic machine-shaping of radiator of being convenient for.

In one embodiment, the heat sink includes a heat dissipating substrate and a heat dissipating side plate, the heat dissipating side plate is connected to one end of the heat dissipating substrate, which is close to the substrate assembly, and protrudes from the surface of the heat dissipating substrate, and the heat dissipating side plate and the heat dissipating substrate enclose to form the accommodating groove.

By the arrangement, the overall weight of the radiator is reduced.

In one embodiment, the heat radiator comprises a heat radiating substrate and a heat radiating boss, the heat radiating boss is connected to one end of the heat radiating substrate, which is close to the substrate assembly, and protrudes out of the surface of the heat radiating substrate, and the accommodating groove is formed in one end, which is away from the heat radiating substrate, of the heat radiating boss.

By the arrangement, the processing efficiency of the accommodating groove can be improved.

In one embodiment, the heat sink includes a heat dissipation substrate, and the accommodating groove is disposed at one end of the heat dissipation substrate, which is close to the bare chip.

By the arrangement, the material cost of the radiator can be further saved.

In one embodiment, the cross-sectional shape of the bare chip is rectangular, and the cross-sectional shape of the accommodating groove is the same as the cross-sectional shape of the bare chip; or, the cross section of the bare chip is trapezoid, and the cross section of the accommodating groove is the same as that of the bare chip.

By the arrangement, the adapting capacity of the radiator is improved.

In one embodiment, the heat spreader is connected to the substrate assembly by a fastener, and the bare chip and the thermal pad are sandwiched between the heat spreader and the substrate assembly; or, the heat conducting pad is of a heat conducting colloid structure, and the radiator is adhered to the bare chip through the heat conducting pad.

By this arrangement, a direct or indirect connection between the heat sink and the substrate assembly is achieved.

Compared with the prior art, the chip device provided by the utility model has the advantages that the heat conduction pad is coated on the outer side surface of the bare chip, namely, the end surface of the bare chip far away from the substrate assembly and the side surface of the bare chip are covered by the heat conduction pad, so that the coverage area of the heat conduction pad is increased. And, through setting up the holding groove on the radiator, also provide the contact surface for the side of bare chip and the contact between the radiator for bare chip exposes terminal surface and side outside can all closely laminate with the radiator through the heat conduction pad. Further, as the heat conducting pad can reduce the contact thermal resistance between the bare chip and the radiator and has excellent heat conductivity, the heat emitted by the bare chip can be quickly transferred to the radiator through the heat conducting pad, so that the quick heat dissipation of the bare chip is realized, and the heat dissipation effect of the chip device is greatly improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments or the conventional techniques of the present utility model, the drawings required for the descriptions of the embodiments or the conventional techniques will be briefly described below, and it is apparent that the drawings in the following descriptions are only some embodiments of the present utility model, and other drawings may be obtained according to the drawings without inventive effort for those skilled in the art.

FIG. 1 is a schematic diagram of a chip device according to an embodiment of the present utility model;

FIG. 2 is an exploded view of a chip device according to an embodiment of the present utility model;

FIG. 3 is an exploded view of a chip device according to another embodiment of the present utility model;

FIG. 4 is a bottom view of a heat sink according to an embodiment of the present utility model;

FIG. 5 is an exploded view of a chip assembly according to yet another embodiment of the present utility model;

fig. 6 is an exploded view of a chip device according to still another embodiment of the present utility model.

The symbols in the drawings are as follows:

100. a chip device; 10. a substrate assembly; 11. a printed circuit board; 12. a chip substrate; 20. a bare chip; 30. a thermal pad; 40. a heat sink; 41. a receiving groove; 42. a heat radiation fin; 43. a heat-dissipating substrate; 44. a heat dissipation boss; 45. a heat radiation side plate; 50. a fastener; 51. an elastic member.

Detailed Description

In order that the above objects, features and advantages of the utility model will be readily understood, a more particular description of the utility model will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present utility model. The present utility model may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the utility model, whereby the utility model is not limited to the specific embodiments disclosed below.

It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When a component is considered to be "connected" to another component, it can be directly connected to the other component or intervening components may also be present. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and the like are used in the description of the present utility model for the purpose of illustration only and do not represent the only embodiment.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present utility model, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.

In the present utility model, unless expressly stated or limited otherwise, a first feature "up" or "down" on a second feature may be that the first feature is in direct contact with the second feature, or that the first feature and the second feature are in indirect contact through intermedial media. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely under the second feature, or simply indicating that the first feature is less level than the second feature.

Unless defined otherwise, all technical and scientific terms used in the specification of the present utility model have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used in the description of the utility model herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. The term "and/or" as used in the description of the present utility model includes any and all combinations of one or more of the associated listed items.

With the increasing size and higher power consumption of chips, the problem to be solved is the heat dissipation problem of the chips. In the prior art, a radiator is generally arranged above a chip, and heat conduction between the radiator and the chip is utilized, so that heat generated by the chip is rapidly dissipated, and the heat dissipation condition of the chip is improved. However, the contact area between the existing chip and the radiator is limited, so that the heat dissipation efficiency of the chip is low, and the heat dissipation effect of the chip device is affected.

Referring to fig. 1, in order to solve the problem of poor heat dissipation effect caused by small heat dissipation area of the conventional chip, the present utility model provides a chip device 100. The chip device 100 includes a substrate assembly 10, a bare chip 20, a heat conducting pad 30 and a heat sink 40, wherein the heat sink 40 is directly or indirectly connected to the substrate assembly 10, and the heat sink 40 is provided with a receiving groove 41 facing the substrate assembly 10. The bare chip 20 is fixedly arranged at one end of the substrate assembly 10, which is close to the radiator 40, and protrudes out of the surface of the substrate assembly 10, the heat conducting pad 30 is coated on the outer side surface of the bare chip 20, the bare chip 20 coated with the heat conducting pad 30 extends into the accommodating groove 41 through the opening of the accommodating groove 41, and the outer wall of the heat conducting pad 30, which is away from the outer side surface of the bare chip 20, is tightly attached to the inner wall of the accommodating groove 41.

By coating the heat conductive pad 30 on the outer side surface of the bare chip 20, that is, the end surface of the bare chip 20 far from the substrate assembly 10 and the side surface of the bare chip 20 are covered by the heat conductive pad 30, the coverage area of the heat conductive pad 30 is increased. Moreover, by providing the accommodating groove 41 on the heat sink 40, a contact surface is provided for the contact between the side surface of the bare chip 20 and the heat sink 40, so that the exposed end surface and the exposed side surface of the bare chip 20 can be closely attached to the heat sink 40 through the heat conducting pad 30. Further, since the thermal pad 30 can reduce the contact thermal resistance between the bare chip 20 and the heat sink 40 and has excellent thermal conductivity, the heat emitted by the bare chip 20 can be quickly transferred to the heat sink 40 through the thermal pad 30, thereby realizing quick heat dissipation of the bare chip 20 and greatly improving the heat dissipation effect of the chip device 100.

Specifically, taking a square bare chip 20 as an example, the square bare chip 20 is sized to: the length is 20mm, the width is 20mm, and the height is 1mm. Because the heat dissipation surface of the existing chip is the top surface, the heat dissipation area of the chip is 400mm at maximum ² In the chip device 100 of the present utility model, the side surface of the bare chip 20 is also covered with the heat conducting pad 30, and the heat conducting pad 30 can be in contact with the heat sink 40, so that the side surface of the bare chip 20 can also serve as a heat dissipation surface, and the heat dissipation area of the bare chip 20 can reach 480mm ² Thereby effectively increasing the heat dissipation area of the bare chip 20.

Further, in an embodiment, the cross-sectional shape of the bare chip 20 is rectangular, or the cross-sectional shape of the bare chip 20 is trapezoidal, and the cross-sectional shape of the accommodating groove 41 is the same as the cross-sectional shape of the bare chip 20. That is, when the sectional shape of the bare chip 20 is rectangular, the sectional shape of the accommodation groove 41 is also rectangular. And when the sectional shape of the bare chip 20 is trapezoidal, the sectional shape of the accommodating groove 41 is also trapezoidal.

In this way, the shape of the accommodating groove 41 is adapted to the shape of the bare chip 20, and the adapting capability of the heat spreader 40 is improved. The accommodating groove 41 with a corresponding shape can be formed for the bare chips 20 with various different shapes, and the outer side surface of the bare chips 20 is covered by the heat conducting pad 30, so that the bare chips 20 can be always attached to the inner wall of the accommodating groove 41 through the heat conducting pad 30, and the heat dissipation effect of the radiator 40 on the bare chips 20 is improved.

The cross-sectional shape of the bare chip 20 is a cross-sectional shape formed by cutting the bare chip 20 in a plane parallel to the height direction of the chip device 100. Similarly, the cross-sectional shape of the accommodating groove 41 is a cross-sectional shape formed by cutting the accommodating groove 41 in a plane parallel to the height direction of the chip device 100. The cross-sectional shape of the bare chip 20 described below is a cross-sectional shape formed by cutting the bare chip 20 in a plane perpendicular to the height direction of the chip device 100, and the cross-sectional shape of the accommodating groove 41 is a cross-sectional shape formed by cutting the accommodating groove 41 in a plane perpendicular to the height direction of the chip device 100.

In one embodiment, as shown in fig. 1, the heat spreader 40 is connected to the substrate assembly 10 by a fastener 50, and the bare chip 20 and the thermal pad 30 are sandwiched between the heat spreader 40 and the substrate assembly 10. The substrate assembly 10 includes a printed circuit board 11 and a chip substrate 12, one end of the chip substrate 12 is connected to the printed circuit board 11, the other end is connected to the bare chip 20, and the heat sink 40 is connected to the printed circuit board 11 through a fastener 50. And, the elastic member 51 is sleeved on the periphery of the fastener 50 for controlling the relative positions of the heat sink 40 and the printed circuit board 11. In this manner, a direct connection between the heat sink 40 and the substrate assembly 10 is achieved.

In another embodiment, as shown in fig. 2, the heat-conducting pad 30 is a heat-conducting colloid structure, and the heat spreader 40 is adhered to the bare chip 20 through the heat-conducting pad 30. In this way, the heat spreader 40 and the bare chip 20 are fixedly connected, and the heat spreader 40 is indirectly connected to the substrate assembly 10 through the thermal pad 30 and the bare chip 20, so that the overall structure of the chip device 100 is more compact. And, the heat transfer of the bare chip 20 is realized by utilizing the heat conduction effect of the heat conduction glue, and further, the setting of the fastener 50 and the elastic piece 51 can be canceled by adopting a bonding mode, so that the installation difficulty of the radiator 40 is reduced, and the cost of parts is saved.

It should be noted that, the present utility model is specifically described with the heat-conducting pad 30 as a solid heat-conducting material, that is, the heat-conducting pad 30 itself has no bonding property.

Example 1

In the present embodiment, as shown in fig. 1, the heat sink 40 includes heat radiating fins 42, a heat radiating base plate 43, heat radiating bosses 44, and heat radiating side plates 45. The heat dissipation fins 42 are disposed at an end of the heat dissipation substrate 43 remote from the substrate assembly 10. The heat dissipation boss 44 is connected to one end of the heat dissipation substrate 43 near the substrate assembly 10 and protrudes from the surface of the heat dissipation substrate 43, and the heat dissipation side plate 45 is surrounded on the periphery of the heat dissipation boss 44 and is respectively connected with the heat dissipation boss 44 and the heat dissipation substrate 43. The heat dissipation side plate 45 protrudes from one end of the heat dissipation boss 44 away from the heat dissipation substrate 43, so that the heat dissipation side plate 45 and the heat dissipation boss 44 can enclose to form the accommodating groove 41.

Thus, by providing the heat radiation side plate 45, the heat radiation side plate 45 can be easily fitted with the heat radiation boss 44 and the accommodation groove 41 can be formed. In addition, the inner side wall of the accommodating groove 41, that is, the inner side wall of the heat dissipation side plate 45 close to the heat dissipation boss 44 can be attached to the side surface of the bare chip 20 through the heat conducting pad 30, so that the heat dissipation area of the bare chip 20 is increased, and the heat dissipation effect of the bare chip 20 is improved. Further, the heat dissipation boss 44 improves the connection strength of the heat dissipation side plate 45, the heat dissipation side plate 45 can be firmly connected to the heat dissipation substrate 43 and the heat dissipation boss 44, so that the connection failure between the heat dissipation side plate 45 and the heat dissipation substrate 43 caused by vibration of the heat dissipation device 40 is avoided, and the use reliability of the heat dissipation device 40 is improved. And the heat dissipation fins 42 are mainly used for heat exchange with air, so that the heat dissipation efficiency of the radiator 40 is improved.

And, the heat dissipation side plate 45 can play the anti-tilting effect, through mutual spacing between the heat dissipation side plate 45 and the bare chip 20, prevent the radiator 40 from falling down due to rocking or the like in the installation or use process of the radiator 40, thereby causing impact to the bare chip 20 or the substrate assembly 10, and improving the safety of the chip device 100.

Further, in an embodiment, the heat dissipation side plate 45 is perpendicular to the heat dissipation substrate 43, i.e. the cross-sectional shape of the accommodating groove 41 is rectangular, so that the heat dissipation substrate 43 is convenient to be arranged, and the processing difficulty of the heat dissipation substrate 43 can be reduced. Of course, in other embodiments, the heat dissipation side plate 45 may be expanded in a direction away from the heat dissipation substrate 43, so that the accommodating groove 41 formed by the heat dissipation side plate 45 and the heat dissipation boss 44 is trapezoidal, so as to meet the heat dissipation requirements of the bare chips 20 with different shapes. The heat dissipating boss 44 can be adaptively changed according to different setting modes of the heat dissipating substrate 43, so as to ensure that the side wall of the heat dissipating boss 44 is tightly connected with the inner wall of the heat dissipating side plate 45.

In one embodiment, the thickness T of the heat-dissipating side plate 45 is 0.3 mm.ltoreq.T.ltoreq.10 mm. In this way, the structural strength of the heat radiation side plate 45 can be ensured, the material cost of the heat sink 40 can be controlled, and the weight of the heat sink 40 can be reduced. Further, the thickness of the heat dissipation side plate 45 can be controlled to be as small as possible under the condition that the structural strength of the heat dissipation side plate 45 is satisfied, thereby further reducing the overall weight of the heat sink 40.

Specifically, when T > 10mm, the thickness of the heat-dissipating side plate 45 is thicker, resulting in an increase in the overall weight of the heat sink 40, not only increasing the material cost, but also requiring a greater elastic force of the elastic member 51 provided on the peripheral side of the fastener 50 when the heat sink 40 and the substrate assembly 10 are connected by the fastener 50, thereby increasing the difficulty of mounting the heat sink 40. When T < 0.3mm, the heat-dissipating side plate 45 is too thin, resulting in insufficient structural strength of the heat-dissipating side plate 45, and when subjected to vibration or other collision, the heat-dissipating side plate 45 is easily deformed, thereby affecting the heat-dissipating effect of the heat sink 40. The thickness of the heat radiation side plate 45 may be 0.5mm, 1mm, 2mm, 3mm, 4mm, 5mm, 6mm, 7mm, 8mm, 9mm, or the like, which is not specifically mentioned herein.

Further, in one embodiment, the heat dissipating substrate 43, the heat dissipating boss 44 and the heat dissipating side plate 45 are connected by welding or bonding.

In this way, the heat dissipation substrate 43, the heat dissipation boss 44 and the heat dissipation side plate 45 can be processed respectively, and the processing is simpler, so that the whole processing and forming of the radiator 40 are facilitated.

In an embodiment, as shown in fig. 3 and 4, the cross sections of the accommodating groove 41 and the bare chip 20 are square, the length of the accommodating groove 41 is defined as a, the length of the bare chip 20 is defined as M, the nominal compression thickness of the thermal pad 30 is defined as L, and A, M and L satisfy a=m+2l+x. The width of the accommodation groove 41 is defined as B, and the width of the bare chip 20 is defined as N, wherein B, N and L satisfy b=n+2l+x. Wherein X is more than or equal to 0.2mm and less than or equal to 2mm.

It should be noted that, the nominal compressed thickness of the thermal pad 30 is a preset thickness of the thermal pad 30 after compression, and X is a gap value additionally set between the bare chip 20 and the inner wall of the accommodating groove 41.

In general, a predetermined gap exists between the bare chip 20 and the heat spreader 40, and the size of the predetermined gap is a fixed value. The thickness of the heat-conducting pad 30 before being uncompressed is larger than the fixed value, and after being compressed, the heat-conducting pad 30 is filled in the preset gap, namely, the thickness of the preset gap is the nominal compression thickness of the heat-conducting pad 30, so that the heat-conducting pad 30 is respectively and tightly attached to the radiator 40 and the bare chip 20, the contact thermal resistance between the radiator 40 and the bare chip 20 is reduced, and the heat dissipation efficiency of the bare chip 20 is improved. However, since the thermal pad 30 is bent to cover the peripheral side of the bare chip 20 in the present utility model, the thermal pad 30 may be damaged due to excessive internal stress if the conventional nominal compression thickness is maintained. Therefore, by additionally setting the gap value X, the gap between the bare chip 20 and the heat spreader 40 is increased, so that the compression degree of the thermal pad 30 is reduced, that is, the thickness of the thermal pad 30 after being actually compressed is larger than the nominal compression thickness of the thermal pad 30, thereby avoiding the occurrence of damage to the thermal pad 30 caused by stress concentration in the thermal pad 30 and reducing the replacement cost of the thermal pad 30.

Further, by setting 0.2mm < X < 2mm, damage caused by overlarge stress of the heat conducting pad 30 can be avoided, and the heat dissipation effect of the heat conducting pad 30 can be ensured. When X < 0.2mm, the additional increased gap value is smaller, and there is a risk of damage to the thermal pad 30 due to excessive compression. When X > 2mm, the thickness of the heat conductive pad 30 after compression is thicker, and the heat transfer rate of the heat conductive pad 30 is reduced, thereby reducing the heat dissipation effect of the bare chip 20. The value of X may be 0.5mm, 1mm, 1.5mm or the like, and is not specifically exemplified herein.

In one embodiment, an end of the heat sink side plate 45 facing away from the heat sink substrate 43 is spaced apart from the substrate assembly 10.

Since the middle of the printed circuit board 11 is easy to warp and deform towards the direction close to the heat sink 40 during the use of the chip device 100, the chip substrate 12 drives the bare chip 20 to move towards the direction close to the heat sink 40 and presses the heat conducting pad 30 and the heat sink 40. In this way, under the reaction force of the heat spreader 40, the heat conduction pad 30 is easily compressed excessively, which not only causes damage to the heat conduction pad 30, but also causes damage to the bare chip 20 due to excessive stress.

In this embodiment, the heat dissipation side plate 45 and the substrate assembly 10 are arranged at intervals, and when the printed circuit board 11 is deformed, the heat dissipation side plate 45 can stop at the substrate assembly 10, so as to prevent the bare chip 20 from continuing to move towards the heat sink 40, and avoid the heat conduction pad 30 and the bare chip 20 from being damaged due to excessive compression of the heat conduction pad 30.

Specifically, in an embodiment, the depth of the accommodating groove 41 is defined as D, and the thickness of the bare chip 20 is defined as H, where D, H and L satisfy d=h+l-Y.

Note that Y is the sum of the thickness tolerance of the bare chip 20, the nominal compression thickness tolerance of the thermal pad 30, and the height tolerance of the heat dissipating boss 44 protruding from the surface of the heat dissipating substrate 43, and the sum of the tolerances is the absolute value of the sum of the positive or negative tolerances of the parts therein.

Thus, by reasonably setting the gap value between the heat-dissipating side plate 45 and the substrate assembly 10, the difficulty of mounting the heat sink 40 is reduced.

Example two

The structure in this embodiment is substantially the same as that in the first embodiment, and the same points are not described in detail, except that:

in the present embodiment, the heat sink 40 includes a heat dissipation substrate 43 and a heat dissipation side plate 45, the heat dissipation side plate 45 is connected to one end of the heat dissipation substrate 43 near the substrate assembly 10 and protrudes from the surface of the heat dissipation substrate 43, and the heat dissipation side plate 45 and the heat dissipation substrate 43 enclose to form a receiving groove 41.

That is, compared with the first embodiment, the chip device 100 provided in this embodiment does not have the heat dissipation boss 44, which saves materials and reduces the overall weight of the heat sink 40. In addition, the heat dissipation side plate 45 and the heat dissipation substrate 43 are used to enclose the accommodating groove 41, and the bare chip 20 is closely attached to the end surface of the heat dissipation substrate 43 and the inner wall surface of the heat dissipation side plate 45 through the heat conduction pad 30, so that the heat dissipation area of the bare chip 20 is increased, and the heat dissipation effect of the chip device 100 is improved.

Example III

In this embodiment, as shown in fig. 5, the heat sink 40 includes a heat dissipation substrate 43 and a heat dissipation boss 44, the heat dissipation boss 44 is connected to an end of the heat dissipation substrate 43 close to the substrate assembly 10 and protrudes from a surface of the heat dissipation substrate 43, and the accommodating groove 41 is disposed at an end of the heat dissipation boss 44 away from the heat dissipation substrate 43.

That is, the accommodating groove 41 may be directly formed on the heat dissipating boss 44, so that the forming of the accommodating groove 41 is simpler and the processing efficiency of the accommodating groove 41 can be improved. In addition, the setting of the radiating side plate 45 is canceled, the structure of the radiator 40 is simpler, and the processing difficulty of the radiator 40 is reduced.

Example IV

In this embodiment, as shown in fig. 6, the heat sink 40 includes a heat dissipation substrate 43, and the accommodating groove 41 is disposed at an end of the heat dissipation substrate 43 near the bare chip 20.

In this way, by directly opening the accommodating groove 41 in the heat dissipation substrate 43, the material cost of the heat sink 40 can be further saved.

The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The above examples illustrate only a few embodiments of the utility model, which are described in detail and are not to be construed as limiting the scope of the claims. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of the utility model should be determined from the following claims.

Claims (10)

1. A chip device is characterized by comprising a substrate assembly (10), a bare chip (20), a heat conducting pad (30) and a heat radiator (40),

the radiator (40) is directly or indirectly connected to the substrate assembly (10), and the radiator (40) is provided with a containing groove (41) with an opening facing the substrate assembly (10);

the bare chip (20) is fixedly arranged at one end, close to the radiator (40), of the substrate assembly (10) and protrudes out of the surface of the substrate assembly (10), the heat conducting pad (30) is coated on the outer side surface of the bare chip (20), the bare chip (20) coated with the heat conducting pad (30) stretches into the accommodating groove (41) through an opening of the accommodating groove (41), and the heat conducting pad (30) is away from the outer wall of the outer side surface of the bare chip (20) and is tightly attached to the inner wall of the accommodating groove (41).

2. The chip device according to claim 1, wherein the heat sink (40) comprises a heat dissipation fin (42), a heat dissipation substrate (43), a heat dissipation boss (44) and a heat dissipation side plate (45), the heat dissipation fin (42) is disposed at one end of the heat dissipation substrate (43) away from the substrate assembly (10), the heat dissipation boss (44) is connected to one end of the heat dissipation substrate (43) close to the substrate assembly (10) and protrudes from the surface of the heat dissipation substrate (43), and the heat dissipation side plate (45) is disposed around the periphery of the heat dissipation boss (44) and is connected to the heat dissipation boss (44) and the heat dissipation substrate (43) respectively;

the heat dissipation side plate (45) protrudes out of one end, away from the heat dissipation substrate (43), of the heat dissipation boss (44), so that the heat dissipation side plate (45) and the heat dissipation boss (44) can enclose to form the accommodating groove (41).

3. The chip device according to claim 2, characterized in that the cross-sections of the receiving groove (41) and the bare chip (20) are square, defining the length of the receiving groove (41) as a, the length of the bare chip (20) as M, the nominal compressed thickness of the thermal pad (30) as L, and A, M and L satisfy, a = m+2l+x;

defining the width of the accommodating groove (41) as B, and the width of the bare chip (20) as N, wherein B, N and L meet the requirement that B=N+2L+X;

wherein X is more than or equal to 0.2mm and less than or equal to 2mm.

4. Chip arrangement according to claim 2, characterized in that an end of the heat-dissipating side plate (45) facing away from the heat-dissipating substrate (43) is arranged at a distance from the substrate assembly (10).

5. The chip device according to claim 2, wherein the heat dissipating substrate (43), the heat dissipating boss (44) and the heat dissipating side plate (45) are connected by welding or bonding.

6. The chip device according to claim 1, wherein the heat sink (40) comprises a heat dissipation substrate (43) and a heat dissipation side plate (45), the heat dissipation side plate (45) is connected to one end of the heat dissipation substrate (43) close to the substrate assembly (10) and protrudes out of the surface of the heat dissipation substrate (43), and the heat dissipation side plate (45) and the heat dissipation substrate (43) enclose to form the accommodating groove (41).

7. The chip device according to claim 1, wherein the heat sink (40) comprises a heat dissipating substrate (43) and a heat dissipating boss (44), the heat dissipating boss (44) is connected to an end of the heat dissipating substrate (43) close to the substrate assembly (10) and protrudes from a surface of the heat dissipating substrate (43), and the accommodating groove (41) is disposed at an end of the heat dissipating boss (44) away from the heat dissipating substrate (43).

8. The chip device according to claim 1, wherein the heat sink (40) includes a heat dissipation substrate (43), and the accommodating groove (41) is provided at an end of the heat dissipation substrate (43) close to the bare chip (20).

9. The chip device according to claim 1, wherein the cross-sectional shape of the bare chip (20) is rectangular, and the cross-sectional shape of the accommodation groove (41) is the same as the cross-sectional shape of the bare chip (20);

or, the cross section of the bare chip (20) is trapezoid, and the cross section of the accommodating groove (41) is the same as the cross section of the bare chip (20).

10. The chip arrangement according to claim 1, characterized in that the heat spreader (40) is connected to the substrate assembly (10) by means of a fastener (50), the bare chip (20) and the thermal pad (30) being sandwiched between the heat spreader (40) and the substrate assembly (10);

or, the heat conducting pad (30) is of a heat conducting colloid structure, and the heat radiator (40) is adhered to the bare chip (20) through the heat conducting pad (30).