CN212519552U - Double-sided radiator - Google Patents
Double-sided radiator Download PDFInfo
- Publication number
- CN212519552U CN212519552U CN202021598185.8U CN202021598185U CN212519552U CN 212519552 U CN212519552 U CN 212519552U CN 202021598185 U CN202021598185 U CN 202021598185U CN 212519552 U CN212519552 U CN 212519552U
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- China
- Prior art keywords
- bottom plate
- plate
- radiating fin
- heat dissipation
- radiator
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 42
- 230000002349 favourable effect Effects 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000009423 ventilation Methods 0.000 description 3
- 238000007792 addition Methods 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Abstract
The utility model discloses all electronic components on the circuit board all with the radiating drawback of same face mounting of radiator among the prior art, provide a double-sided radiator, belong to radiator technical field, comprising a base plate, the both sides of bottom plate are provided with the curb plate respectively perpendicularly, are equipped with heat dissipation mechanism between two blocks of curb plates, should dispel the heat the radiating fin that the mechanism includes a plurality of perpendicular to bottom plates, leave the interval between the adjacent radiating fin, leave the interval between heat dissipation mechanism and the curb plate, the interval between heat dissipation mechanism and the curb plate is greater than the interval between the adjacent radiating fin, radiating fin's thickness is attenuation gradually to the other end by radiating fin and the link of bottom plate, the thickness of side plate is attenuation gradually to the other end by the link of curb plate and bottom plate. The high-power components are directly attached to the bottom plate on one side of the radiator, and the circuit board welded with the components is mounted on the bottom plate on the other side of the radiator, so that the two sides of the radiator can be simultaneously radiated, and the radiating efficiency of the radiator is improved.
Description
Technical Field
The utility model belongs to radiator art field, concretely relates to double-sided radiator.
Background
Electronic components on the circuit board can generate heat when working, and in order not to influence the use performance and the service life of the electronic components, the heat generated by the electronic components needs to be quickly and uniformly dissipated. It is common practice to mount a heat sink on the circuit board, and to carry away the heat through the heat sink and then dissipate the heat to the surrounding air through the heat sink. For example, the patent application No. 201520695039.X, named as a utility model of a circuit board radiator, includes a substrate, two sides of the substrate are respectively and vertically provided with side plates, a plurality of heat dissipation fins are vertically arranged between the two side plates on the substrate, two sides of the heat dissipation fins are respectively provided with a bump, and one side of the side plate corresponding to the heat dissipation fins is also provided with a bump; the base plate, the side plate, the radiating fins and the convex blocks are integrally formed by aluminum extrusion.
However, in the above scheme, all electronic components on the circuit board dissipate heat by using the same surface of the heat sink, and the heat sink needs to transfer heat dissipated by the electronic components on the circuit board to the heat dissipation fins and then take away the heat by cooling airflow. The more the heat dissipation fins are, the larger the heat dissipation area is, but at the same time, the width of the ventilation flow channel between the heat dissipation fins is also reduced, and the heat dissipation coefficient of the whole radiator is reduced.
Disclosure of Invention
The utility model discloses all electronic components on the circuit board all with the radiating drawback of the same face contact of radiator among the prior art, provide a double-sided radiator, the high-power components and parts of direct laminating installation on the one side bottom plate of this radiator, the circuit board of components and parts is welded in the installation on the another side bottom plate, realize the two-sided while heat dissipation of radiator, increased the radiating efficiency of radiator.
The invention aims to be realized by the following technical scheme: the utility model provides a double-sided radiator, includes the bottom plate, the both sides of bottom plate are provided with the curb plate respectively perpendicularly, are equipped with heat dissipation mechanism between two blocks of curb plates, and this heat dissipation mechanism includes the radiating fin of a plurality of perpendicular to bottom plates, leaves the interval between the adjacent radiating fin, leaves the interval between radiating mechanism and the curb plate, and the interval between radiating mechanism and the curb plate is greater than the interval between the adjacent radiating fin, radiating fin with curb plate parallel arrangement, radiating fin's thickness is become thin gradually by radiating fin and bottom plate's link to the other end, the thickness of side plate is become thin gradually by link to the other end of curb plate and bottom plate.
Among the above-mentioned scheme, electronic components's heat passes through the bottom plate conduction and gives radiating fin, and radiating fin takes away the heat through the air that flows, and the tip that radiating fin and bottom plate are connected is thicker, can be more quick comes the heat from the bottom plate conduction, and radiating fin's the other end is more and more thin, can be favorable to flowing the air more and take away the heat, and radiating fin is thinner, and the heat that exists on the radiating fin is less, the heat of giving off that can be quick more. The bottom plate can be provided with high-power components between the heat dissipation mechanism and the side plates, the interval between the heat dissipation mechanism and the side plates is larger than that between adjacent heat dissipation fins, and a large ventilation flow channel can be formed at the large interval, so that the heat dissipation of high-power electronic components is facilitated. A circuit board containing ordinary electronic components is mounted on the other side of the bottom plate of the heat sink. The two sides of the bottom plate of the radiator are used for heat conduction and heat dissipation, so that the heat dissipation is accelerated.
Preferably, the side surfaces of the two sides of the radiating fin are symmetrically distributed.
Preferably, the side plates have the same shape and height as the heat radiating fins. The heat dissipation function of the side plates is equal to that of the heat dissipation fins.
Preferably, the end of the heat dissipation fin, which is opposite to the bottom plate, is in a circular arc shape.
Preferably, the bottom plate is of a square structure, and four corner positions of the bottom plate are provided with fixing holes.
Preferably, a plurality of component pin mounting holes are formed in the bottom plate between the heat dissipation mechanism and the side plate.
Preferably, the bottom plate, the side plate and the heat dissipation fin are integrally formed.
Compared with the prior art, the utility model discloses following beneficial effect has: the shape of the radiating fin is more favorable for quick heat dissipation, the bottom plate can be provided with high-power components between the radiating mechanism and the side plate, the circuit board containing common electronic components is arranged on the other surface of the bottom plate of the radiator, and the two surfaces of the bottom plate of the radiator are both heat-conducting and radiating, so that the heat dissipation is accelerated.
Drawings
Fig. 1 is a perspective view of the present invention;
fig. 2 is a top view of the present invention;
fig. 3 is a usage state diagram of the present invention.
The labels in the figure are: 1. A base plate; 2. a side plate; 3. a heat dissipating fin; 4. a fixing hole; 5. a high-power component; 6. a circuit board.
Detailed Description
The invention will be further described with reference to the embodiments shown in the drawings to which:
example 1
As shown in fig. 1 and 2, a double-sided heat sink includes a base plate 1, side plates 2, and heat dissipation fins 3, which are integrally formed. The bottom plate 1 is of a square structure, and four corner positions of the bottom plate 1 are provided with fixing holes 4. The heat dissipation device is characterized in that side plates 2 are respectively and vertically arranged on two sides of the bottom plate 1, a heat dissipation mechanism is arranged between the two side plates 2 and comprises a plurality of heat dissipation fins 3 perpendicular to the bottom plate 1, a space is reserved between every two adjacent heat dissipation fins 3, a space is reserved between the heat dissipation mechanism and the side plates 2, the space between the heat dissipation mechanism and the side plates is larger than the space between every two adjacent heat dissipation fins 3, and a plurality of component pin mounting holes are formed in the bottom plate 1 and between the heat dissipation mechanism and the side plates 2. The radiating fins 3 and the side plates 2 are arranged in parallel, the thickness of the radiating fins 3 is gradually reduced from the connecting ends of the radiating fins 3 and the bottom plate 1 to the other ends, and the end parts, back to the bottom plate 1, of the radiating fins 3 are arc-shaped. The tip that radiating fin 3 and bottom plate 1 are connected is thicker, can be more quick comes the heat from the bottom plate conduction, and radiating fin 3's the other end is more and more thin, can be favorable to flowing air to take away the heat more, and fan heat fin 3 is thinner, and the heat that exists on radiating fin 3 is less, the more can be quick the heat of giving off. And the side surfaces of two sides of the radiating fins 3 are symmetrically distributed, and the thickness of the side plate 2 is gradually thinned from the connecting end of the side plate 2 and the bottom plate 1 to the other end. The side plates 2 have the same shape and height as the heat radiating fins 3.
As shown in fig. 3, the utility model discloses during the use, be in on the bottom plate 1 the number of the components and parts stitch mounting hole that is equipped with between heat dissipation mechanism and the curb plate 2 is decided by the number of the high-power components and parts that need the installation and the stitch number of every high-power components and parts. The high-power component 5 is arranged on the surface of the bottom plate 1 with the radiating fins 3, pins of the high-power component 5 are fixedly arranged with the bottom plate 1 through component pin mounting holes in the bottom plate 1, the high-power component 5 is arranged on the bottom plate 1 between the radiating mechanism and the side plate 2, the interval between the radiating mechanism and the side plate 2 is larger than the interval between the adjacent radiating fins 3, and a large ventilation flow channel can be formed at the large interval, so that better heat dissipation of the high-power component is facilitated. And the bottom surface and the bottom plate 1 of high-power components and parts 5 are fully laminated, and circuit board 6 passes through fixed orifices 4 and is fixed through the bolt mounting with bottom plate 1 in the one side that bottom plate 1 does not have radiating fin 3, leaves the space between circuit board 6 and the bottom plate 1, and the stitch of high-power components and parts 5 passes bottom plate 1 through components and parts stitch mounting hole, and insert circuit board 6 and circuit board 6 welding together, make full use of the utility model discloses a two sides of bottom plate 1.
The specific embodiments described herein are merely illustrative of the spirit of the invention. Various modifications, additions and substitutions for the specific embodiments described herein may be made by those skilled in the art without departing from the spirit of the invention or exceeding the scope of the invention as defined in the accompanying claims.
Claims (7)
1. The utility model provides a double-sided radiator, its characterized in that, includes bottom plate (1), the both sides of bottom plate (1) are provided with curb plate (2) respectively perpendicularly, are equipped with heat dissipation mechanism between two curb plates (2), and this heat dissipation mechanism includes radiating fin (3) of a plurality of perpendicular to bottom plate (1), leaves the interval between adjacent radiating fin (3), leaves the interval between heat dissipation mechanism and curb plate (2), and the interval between heat dissipation mechanism and the curb plate is greater than the interval between adjacent radiating fin (3), radiating fin (3) with curb plate (2) parallel arrangement, the thickness of radiating fin (3) is become thin gradually by the link to the other end of radiating fin (3) and bottom plate (1), the thickness of curb plate (2) is become thin gradually by link to the other end of curb plate (2) and bottom plate (1).
2. A double-sided heat sink according to claim 1, wherein the heat dissipating fins (3) are symmetrically arranged on both sides.
3. A double-sided heat sink according to claim 2, wherein the side plates (2) have the same shape and height as the fins (3).
4. A double-sided heat sink according to claim 2, wherein the end of the heat sink fin (3) facing away from the base plate (1) is rounded.
5. A double-sided heat sink according to claim 1, wherein the base plate (1) is of a square structure, and four corner positions of the base plate (1) are provided with fixing holes (4).
6. A double-sided heat sink according to claim 1, wherein a plurality of component pin mounting holes are formed in the bottom plate (1) between the heat sink mechanism and the side plate (2).
7. A double-sided heat sink according to claim 1, wherein the bottom plate (1), the side plates (2) and the heat dissipating fins (3) are integrally formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021598185.8U CN212519552U (en) | 2020-08-04 | 2020-08-04 | Double-sided radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021598185.8U CN212519552U (en) | 2020-08-04 | 2020-08-04 | Double-sided radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212519552U true CN212519552U (en) | 2021-02-09 |
Family
ID=74444021
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021598185.8U Active CN212519552U (en) | 2020-08-04 | 2020-08-04 | Double-sided radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212519552U (en) |
-
2020
- 2020-08-04 CN CN202021598185.8U patent/CN212519552U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A double-sided heat sink Effective date of registration: 20230331 Granted publication date: 20210209 Pledgee: Jinhua Bank Co.,Ltd. Wenchuang Sub branch Pledgor: Zhejiang Kaifu Boke Technology Co.,Ltd. Registration number: Y2023980036841 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20210209 Pledgee: Jinhua Bank Co.,Ltd. Wenchuang Sub branch Pledgor: Zhejiang Kaifu Boke Technology Co.,Ltd. Registration number: Y2023980036841 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A double-sided heat sink Granted publication date: 20210209 Pledgee: Jinhua Bank Co.,Ltd. Wenchuang Sub branch Pledgor: Zhejiang Kaifu Boke Technology Co.,Ltd. Registration number: Y2024980009391 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right |