TWI607197B - Method of manufacturing heat dissipation device - Google Patents

Description

Heat sink manufacturing method

The invention relates to a heat dissipating device, in particular to a heat dissipating device manufacturing method which can reduce the manufacturing steps and reduce the manufacturing cost.

As current handheld mobile devices (such as mobile phones, tablets, and PDAs) advance with technology, internal components of handheld mobile devices, such as the central government, are required to be thinner and more computationally intensive and more efficient. Processors, integrated circuits and other components, because of the extremely limited space in the device or mechanism (due to thin and light requirements) and the speed of execution or operation are too high, so the heat of the components must be dissipated first. In order to maintain the operational efficiency and service life of the components.

The hand-held mobile device having a heat dissipating structure currently comprises a heat insulating component composed of a casing, a middle frame, a heating element and a metal material or a composite material, such as a central processing unit or an integrated circuit or the like. The electronic component is disposed in the cavity of the casing and attached to the middle frame, and the heat conducting component is correspondingly engaged with the middle frame, and the manner of docking can be divided into two, one way is to utilize Epoxy (epoxy) or tape fixes its heat-conducting member to the middle frame, but it requires additional material cost for the glue or tape.

Or in the way of the heat-conducting member and the middle frame, the soldering technology can also be used for the assembly and fixing. Generally, the soldering is a kind of soldering, which is melted by metal solder, and penetrates and fills the joint of the metal parts. Welding method, while solder material (Solder) usually uses tin The base alloy does not need to melt the metal workpiece during soldering, but during the soldering process, the reconnected portion needs to be heated, and the solder is melted and then flows to the joint between the heat conducting member and the middle frame to be combined, but the technical method thereof The heat conducting member and the middle frame are subjected to high temperature contact, which easily cause mutual displacement of each other, and the welding material between the heat conducting member and the middle frame also increases the cumulative tolerance between the heat conducting member and the middle frame and the heating element. Causes difficulties in assembly.

Or, as in the prior art, the Chinese Patent No. M484134 discloses a heat dissipating device comprising a heat conducting plate and a heat pipe, the heat conducting plate having a hollow groove and an inner wall formed in the hollow groove, the surface of the inner wall The C-shaped arc surface is formed; the heat pipe is tightly embedded in the hollow groove and is positioned by the C-shaped arc surface, wherein the inner wall of the heat-conducting plate is first processed into a C-shaped arc surface, and then the outer wall of the heat pipe is The C-shaped body is embedded in the hollow groove in a flattened manner, so that the heat pipe is tightly embedded in the hollow groove and is positioned by the C-shaped curved surface. Therefore, the heat dissipation device needs to increase the manufacturing cost in manufacturing. The heat dissipating device can only use the heat pipe as its heat conducting member, and the heat conducting member without the C-shaped outer wall or the heat conducting member which cannot be deformed and shaped can not be used, which is inconvenient and troublesome in use.

Therefore, how to solve the above problems and problems in the past, that is, the inventors of this case and the relevant manufacturers engaged in this industry are eager to study the direction of improvement.

Accordingly, in order to effectively solve the above problems, the main object of the present invention is to provide a heat sink manufacturing method which can reduce the number of manufacturing steps and reduce the manufacturing cost.

Another object of the present invention is to provide a heat sink manufacturing method which can improve the compatibility of use of a heat transfer unit.

Another object of the present invention is to provide a method of manufacturing a heat sink that avoids assembly tolerances.

To achieve the above object, the present invention provides a heat sink manufacturing method, firstly providing at least one heat transfer unit, the heat transfer unit having a chamber having at least one capillary structure and a working fluid filled in the chamber Providing at least one frame to interface with the heat transfer unit; and then connecting the heat transfer unit to the frame intersection in a spot welding manner to fix the heat transfer unit to the frame; and designing the method by the method of the present invention The utility model can effectively reduce the steps of connecting the heat transfer unit and the frame and reduce the material cost and process cost of the adhesive material or the use of the adhesive tape, and at the same time avoid the assembly tolerance problem caused by the welding material.

1‧‧‧heat transfer unit

11‧‧‧ chamber

12‧‧‧Invalid end

13‧‧‧Capillary structure

14‧‧‧Working fluid

2‧‧‧Frame

21‧‧‧ first side

22‧‧‧ second side

23‧‧‧Inlay

24‧‧‧ inner wall

1 is a flow chart of a first embodiment of a method for manufacturing a heat sink according to the present invention; FIG. 2A is a schematic view showing a first embodiment of a method for manufacturing a heat sink according to the present invention; A schematic cross-sectional view of a first embodiment of a heat sink manufacturing method; FIG. 3A is a schematic view of a second embodiment of a heat sink manufacturing method of the present invention; and FIG. 3B is a heat sink manufacturing method of the present invention. 2 is a schematic exploded view of a third embodiment of the heat sink manufacturing method of the present invention; and FIG. 4B is a third embodiment of the heat sink manufacturing method of the present invention. FIG. 4C is a schematic cross-sectional view showing a third embodiment of the heat dissipation device manufacturing method of the present invention; FIG. 5A is a schematic exploded view of the fourth embodiment of the heat dissipation device manufacturing method of the present invention; 5B is a schematic cross-sectional view showing a fourth embodiment of the heat sink manufacturing method of the present invention; FIG. 6A is a fifth embodiment of the heat sink manufacturing method of the present invention. A combination cross-sectional view; FIG. 6B based on a combination of the sixth embodiment of the method of the present invention for manufacturing the heat sink schematic embodiment; seventh embodiment schematic view of the method for manufacturing the heat sink of the present invention showing a first embodiment of the system 7.

The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings.

Please refer to FIG. 1 and FIG. 2A and FIG. 2B respectively, which are a flow chart, an implementation schematic diagram and a combined cross-sectional view of a first embodiment of a heat dissipation device manufacturing method according to the present invention, and the heat dissipation device manufacturing method. , which consists of the following steps:

(100) providing at least one heat transfer unit, the heat transfer unit having a chamber having at least one capillary structure and a working fluid filled in the chamber; and a heat transfer unit 1 provided as a flat heat pipe The heat transfer unit 1 has a chamber 11 therein, and each end of the heat transfer unit 1 has an invalid end 12 for closing the chamber 11, and at least one capillary structure 13 is formed in the chamber 11. The capillary structure 13 is described in the preferred embodiment as a sintered powder body, but is not limited thereto. In a specific implementation, a groove or a metal mesh or a fiber mesh may be selected, and the chamber 11 is filled with a cavity. Working fluid 14 (such as pure water, pure water, inorganic compounds, alcohols, ketones, liquid metals, cold coal or organic compounds); in addition, the capillary structure 13 in the heat transfer unit 1 and the closed end opposite to the ends The ineffective end 12 is defined between each other, and the capillary structure 13 is not disposed at the position of the inactive end 12 for facilitating the filling of the working fluid 14 into the chamber 11, so that the inactive end of the heat transfer unit 1 is 12 This part is not heat conductive.

(101) Further providing at least one frame to interface with the heat transfer unit; the two ends of the heat transfer unit 1 are respectively the inactive end 12 at the closed end, and the invalid end 12 of the preferred embodiment is the hot leaflet In the embodiment, the heat-conducting portion is not available, and the frame 2 is an electromagnetic wave-proof material in the embodiment, and the electromagnetic wave-proof material includes a metal, and the frame 2 has a first side 21 and an opposite The second side 22 of the first side 21, wherein the first side 21 is presented in a planar manner in the present embodiment, and the heat transfer unit 1 is disposed on the first side 21 and attached to the first side Side 21.

(102) applying a spot welding manner to the heat transfer unit and the frame intersection to make it hot The transmission unit is fixed to the frame.

After the heat transfer unit 1 which is the flat heat pipe is disposed on the first side 21 of the frame 2, the heat transfer unit 1 is attached to the first side 21 and has a space between the first side 21 and the first side 21 At least one intersection, and then the spot connection of the heat transfer unit 1 and the frame 2 is spot welded, wherein the spot welding method is any one of electric resistance welding, ultrasonic welding or laser spot welding And the heat transfer unit 1 is spot-welded to the frame 2 at the ineffective end 12 at the edge position, so that the heat transfer unit 1 is fixed to the frame 2; thereby, the heat transfer unit 1 utilizes spot welding The method is connected and fixed on the frame 2, which can effectively reduce the steps of assembling the heat transfer unit 1 and the frame 2 and reduce the material cost and process cost of the adhesive material or the use of the adhesive tape, thereby reducing the process steps and reducing the process steps. The cost of manufacturing is effective, and at the same time avoids the assembly tolerance problem caused by the welding material.

FIG. 3A and FIG. 3B are schematic diagrams showing a second embodiment of the method for manufacturing a heat sink according to the present invention, and a schematic cross-sectional view of the second embodiment. The partial structure of the embodiment is the same as that of the first embodiment. Therefore, the difference between this embodiment and the foregoing first embodiment is that the heat transfer unit 1 is provided with a finished plate heat pipe or a temperature equalizing plate, and the outer side of the plate heat pipe is The inactive end 12, in a specific implementation, after the heat transfer unit 1 of the plate heat pipe is disposed on the first side 21 of the frame 2, the heat transfer unit 1 is attached to the first side 21 and The first side 21 has the intersection, and then the heat transfer unit 1 is connected to the frame 2 by spot welding, wherein the spot welding is welding, ultrasonic welding or laser welding. Spot welding any one of them, and the heat transfer unit 1 is spot welded to the frame 2 at the ineffective end 12 at the end edge position, so that the heat transfer unit 1 is fixed to the frame 2; thereby, the heat is The transfer unit 1 is connected and fixed to the frame 2 by spot welding, which can effectively reduce heat The steps of unit 1 and frame 2 are combined with the cost of material and process cost of the adhesive or the use of tape, thereby reducing the process steps and reducing the manufacturing cost, and at the same time avoiding the transmission of the material. Assembly tolerance issues.

Referring to FIG. 4A and FIG. 4B and FIG. 4C , FIG. 4 is an exploded perspective view, a schematic view of the implementation, and a schematic cross-sectional view of the third embodiment of the heat dissipation device manufacturing method of the present invention. The first embodiment is the same, so it will not be described here. However, the difference between the embodiment and the first embodiment is that the frame 2 is further formed with a recess 23, and the slot 23 extends through the first side. 21 and the second side 22, and the frame 2 has an inner wall 24 at the position of the slot 23, the inner wall 24 is perpendicular to the first side 21 and the second side 22, and the heat transfer unit 1 is disposed on The frame 2 is embedded in the groove 23, and the frame 2 is welded to the heat transfer unit 1 to be welded, so that the heat transfer unit 1 is fixed in the groove 23, and then the heat transfer unit 1 is The joint of the frame 2 is welded by spot welding, wherein the spot welding method is any one of electric resistance welding, ultrasonic welding or laser spot welding, and the heat transfer unit 1 is at the edge position. The inactive end 12 is spot welded to the frame 2 such that the heat transfer unit 1 is fixed to the frame 2; thereby, the heat transfer The unit 1 is connected and fixed on the frame 2 by spot welding, which can effectively reduce the steps of assembling the heat transfer unit 1 and the frame 2 and reduce the material cost and process cost of the adhesive material or the use of the tape, thereby achieving Reduce the efficiency of the manufacturing process and reduce the manufacturing cost, and at the same time avoid the assembly tolerance caused by the welding material.

5A and 5B are schematic views of a disassembled embodiment and a cross-sectional view of a fourth embodiment of the method for manufacturing a heat sink according to the present invention. The partial structure of the present embodiment is the same as that of the first embodiment. It will not be described again here, but the difference between this embodiment and the foregoing first embodiment is that the frame 2 is further formed with a recess 23, and the recess 23 does not penetrate the first side 21 and the second side 22 And the frame 2 has an inner wall 24 at the position of the slot 23, the inner wall 24 is perpendicular to the first side 21 and the second side 22, and the heat transfer unit 1 is disposed on the frame 2 In the groove 23, the frame 2 and the heat transfer unit 1 are welded to each other to fix the heat transfer unit 1 in the recess 23, and then the heat transfer unit 1 and the frame 2 are handed over. Connected by spot welding, wherein the spot welding method is any one of electric resistance welding, ultrasonic welding or laser spot welding, and the heat transfer thereof The unit 1 is spot-welded to the frame 2 by the ineffective end 12 at the end edge position, so that the heat transfer unit 1 is fixed to the frame 2; thereby, the heat transfer unit 1 is connected and fixed by spot welding. The frame 2 can effectively reduce the steps of assembling the heat transfer unit 1 and the frame 2 and reduce the material cost and process cost of the adhesive material or the adhesive tape, thereby reducing the process steps and reducing the manufacturing cost. At the same time, the assembly tolerance problem caused by the welding material can be avoided.

6A and 6B are schematic cross-sectional schematic views and a combined implementation diagram of the fifth and sixth embodiments of the heat dissipation device manufacturing method of the present invention, and the partial structure of the present embodiment and the first implementation described above. The example is the same, so it will not be described here. However, the difference between the embodiment and the first embodiment is that the heat transfer unit 1 is a flat heat pipe and a plate heat pipe are disposed on the first side 21 of the frame 2 at the same time. The first side 21 and the second side 22 of the frame 2 are respectively disposed on the first side 21 and the second side 22 of the frame 2, wherein in the embodiment, the heat transfer unit 1 which is a flat heat pipe is disposed on the first side 21 and The side 21 has the intersection, and then the junction of the heat transfer unit 1 and the frame 2 is spot welded, and the heat transfer unit 1 which is a plate heat pipe is disposed on the first side 21 Or the second side 22, such that the heat transfer unit 1 and the first side 21 or the second side 22 have the intersection, and then the heat transfer unit 1 and the frame 2 are placed in a spot welding manner. The spot welding method is any one of electric resistance welding, ultrasonic welding or laser spot welding. And the heat transfer unit 1 is spot-welded to the frame 2 by the ineffective end 12 at the edge position, so that the heat transfer unit 1 is fixed on the frame 2, thereby achieving the effect of reducing the manufacturing process and reducing the manufacturing cost. At the same time, the assembly tolerance problem caused by the welding material can be avoided.

Referring to FIG. 7 , it is a schematic diagram of the implementation of the seventh embodiment of the heat dissipation device manufacturing method of the present invention. The partial structure of this embodiment is the same as that of the foregoing first embodiment, and therefore will not be further described herein. The difference between this embodiment and the foregoing first embodiment is that the heat transfer unit 1 is a flat heat pipe, and the heat transfer unit 1 is disposed on the first side 21 of the two frames 2, and the two frames 2 are The junction of the heat transfer unit 1 is connected by spot welding, and the heat transfer unit 1 is invalid at the edge position The end 12 is spot-welded to the frame 2 such that the heat transfer unit 1 is fixed to the two frames 2; thereby, the heat transfer unit 1 is connected and fixed to the frame 2 by spot welding, which can effectively reduce The step of assembling the heat transfer unit 1 and the frame 2 and subtracting the material cost and process cost of the adhesive material or the use of the tape, thereby achieving the effect of reducing the process steps and reducing the manufacturing cost, and at the same time avoiding the passage of the solder material The resulting assembly tolerance problem.

Although the present invention is disclosed in the above embodiments, it is not intended to limit the present invention, and any person skilled in the art can make various changes and refinements without departing from the spirit and scope of the present invention. The scope of the patent application is subject to the provisions of the attached patent application.

Claims (7)

A heat sink manufacturing method includes: providing at least one heat transfer unit having at least one invalid end formed at an edge position, the heat transfer unit having a chamber, wherein the chamber is provided with at least one capillary structure and the cavity The chamber is filled with a working fluid, and at least one frame having a first side and a second side and a recessed groove is docked with the heat transfer unit; the ineffective end of the heat transfer unit is connected to the frame The spot welding is connected to fix the heat transfer unit to the frame to reduce manufacturing costs and avoid assembly tolerances. The heat sink manufacturing method according to claim 1, wherein the heat transfer unit is disposed in a recess of the frame, and the frame is welded to the heat transfer unit to be heated. The transmission unit is fixed in the slot. The method of manufacturing a heat sink according to claim 1, wherein the slot penetrates the first side and the second side, and the heat transfer unit is disposed in the recess of the frame, and A weld is applied to the interface of the heat transfer unit to fix the heat transfer unit in the recess. The heat sink manufacturing method according to claim 1, wherein the frame has an inner wall at a slot position, and the inner wall is perpendicular to the first side and the second side. The heat sink manufacturing method according to claim 1, wherein the heat transfer unit is a flat heat pipe or a heat conductive plate or a plate heat pipe or a temperature equalizing plate. The method of manufacturing a heat sink according to claim 1, wherein the frame is an electromagnetic wave preventing material. The method for manufacturing a heat sink according to claim 1, wherein the spot welding The mode welding is either resistance welding, ultrasonic welding or laser spot welding.