JP2010034364A - Cooling device - Google Patents

Cooling device Download PDF

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Publication number
JP2010034364A
JP2010034364A JP2008195944A JP2008195944A JP2010034364A JP 2010034364 A JP2010034364 A JP 2010034364A JP 2008195944 A JP2008195944 A JP 2008195944A JP 2008195944 A JP2008195944 A JP 2008195944A JP 2010034364 A JP2010034364 A JP 2010034364A
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heating element
cooler
heat transfer
corrugated fin
cooling device
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JP2008195944A
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Japanese (ja)
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Kimiaki Nakano
公昭 中野
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T Rad Co Ltd
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T Rad Co Ltd
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Priority to JP2008195944A priority Critical patent/JP2010034364A/en
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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cooling device having a heat conductive sheet 6 interposed between a heat generating body 5 and a cooler 2, wherein heat is surely conducted to improve heat conductivity thereof even if the heat generating body 5 includes irregular parts at its contact portion. <P>SOLUTION: Height-directional one-end sides of corrugated fins 4 are brazed and fixed to an external surface 3 of the cooler 2, and other-end sides of the corrugated fins 4 are brought into contact with a plane of the heat generating body 5. Then the heat conductive sheet 6 is interposed between the heat generating body 5 and cooler 2 without any gap. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、パソコンのバッテリーや各種回路素子等の発熱体を冷却する冷却装置に関する。   The present invention relates to a cooling device for cooling a heating element such as a battery of a personal computer and various circuit elements.

発熱体である回路素子等の電子部品の表面と、放熱部材の表面との間に伝熱シートを介装して互いに接触したものが下記特許文献１として知られている。
また、下記特許文献２には伝熱シートを介して電子部品とヒートシンクとを接続したものが記載されている。このような伝熱シートとして、シリコン系樹脂を含むものが一般に用いられ、その伝熱シートの熱伝達率は２．０Ｗ／ｍＫ以上であると共に、絶縁破壊電圧が２．０ｋＶ以上であるものが広く用いられている。 Patent Document 1 below is known in which a heat transfer sheet is interposed between the surface of an electronic component such as a circuit element that is a heating element and the surface of a heat dissipation member.
Further, Patent Document 2 below describes an electronic component and a heat sink connected via a heat transfer sheet. As such a heat transfer sheet, a sheet containing a silicon resin is generally used. The heat transfer sheet has a heat transfer coefficient of 2.0 W / mK or more and a dielectric breakdown voltage of 2.0 kV or more. Widely used.

特開２００８−１１２８３９号公報JP 2008-112839 A 特開２００８−１０８８５８号公報JP 2008-108858 A

伝熱シートを介して発熱体と放熱器とを接続したものにおいて、発熱体の表面は必ずしも平坦ではなく、平面度が悪いことがしばしば存在する。その場合伝熱シートと発熱体との間に隙間が生じ、その場合には両者の熱伝達が低下していた。
また、その隙間を埋めるために２ｍｍ程度の厚みの伝熱シートを介装すると、比較的厚みが厚いため発熱体と冷却器との熱抵抗が大きくなり、伝熱性を低下させていた。
そこで本発明は、かかる問題点を解決することを課題とする。 In a structure in which a heating element and a radiator are connected via a heat transfer sheet, the surface of the heating element is not necessarily flat and often has poor flatness. In that case, a gap was generated between the heat transfer sheet and the heating element, and in that case, heat transfer between the two was reduced.
Further, when a heat transfer sheet having a thickness of about 2 mm is interposed in order to fill the gap, the heat resistance between the heating element and the cooler is increased because the thickness is relatively thick, and the heat transfer performance is lowered.
Accordingly, an object of the present invention is to solve such problems.

請求項１に記載の本発明は、内部に冷却液(1) が流通する冷却器(2) を有し、その平坦な外面(3) に波形フィン(4)の高さ方向の一端側がろう付けされ、その波形フィン(4)の高さ方向の他端側が発熱体(5)の平面に接して、発熱体(5)と冷却器(2)の外面との間を隙間なく伝熱シート(6)が介装されたことを特徴とする冷却装置である。   The present invention according to claim 1 has a cooler (2) through which a coolant (1) flows, and one end of the corrugated fin (4) in the height direction is brazed on the flat outer surface (3). The other end in the height direction of the corrugated fin (4) is in contact with the plane of the heating element (5), and there is no gap between the heating element (5) and the outer surface of the cooler (2). (6) is a cooling device characterized by being interposed.

請求項２に記載の本発明は、請求項１において、
前記波形フィン(4)の高さ方向の他端側が発熱体(5)の平面に圧接して、その波形フィン(4)が変形した状態で、発熱体(5)と冷却器(2)の外面との間を隙間なく伝熱シート(6)が介装されたことを特徴とする冷却装置である。
請求項３に記載の本発明は、請求項２において、
前記発熱体(5)は、前記平面に凹凸部が存在するものを対象とする冷却装置である。 The present invention according to claim 2 is the method according to claim 1,
The other end side of the corrugated fin (4) in the height direction is pressed against the flat surface of the heating element (5), and the corrugated fin (4) is deformed, and the heating element (5) and the cooler (2) The cooling device is characterized in that the heat transfer sheet (6) is interposed between the outer surface without any gap.
The present invention described in claim 3 is the method according to claim 2,
The heating element (5) is a cooling device intended for an object having uneven portions on the plane.

本発明の冷却装置は、冷却器２の外面３に一端側がろう付けされた波形フィン４の他端側を発熱体５の平面に接して、発熱体５と冷却器２との外面間に隙間なく伝熱シート６が介装されたから、冷却器２と発熱体５との伝熱性が向上する。即ち、波形フィン４と冷却器２とはろう付けされ、その波形フィン４が発熱体５の平面11に接するので、波形フィン４を介して発熱体５から冷却器２に効率よく熱伝達される。それと共に、波形フィン４と伝熱シート６との間に熱伝導が行われ、その伝熱シート６を介し発熱体５と冷却器２との間に熱伝導が行われる。   In the cooling device of the present invention, the other end side of the corrugated fin 4 whose one end side is brazed to the outer surface 3 of the cooler 2 is in contact with the plane of the heating element 5, and a gap is formed between the outer surfaces of the heating element 5 and the cooler 2. Since the heat transfer sheet 6 is interposed, the heat transfer between the cooler 2 and the heating element 5 is improved. That is, the corrugated fin 4 and the cooler 2 are brazed, and the corrugated fin 4 is in contact with the flat surface 11 of the heating element 5, so that heat is efficiently transferred from the heating element 5 to the cooler 2 via the corrugated fin 4. . At the same time, heat conduction is performed between the corrugated fins 4 and the heat transfer sheet 6, and heat conduction is performed between the heating element 5 and the cooler 2 via the heat transfer sheet 6.

上記構成において、波形フィン４を発熱体５により圧接して、波形フィン４を変形した状態にした場合には、波形フィン４と発熱体５との接触が確実に行われ、両者間の伝熱性がさらに向上する。   In the above configuration, when the corrugated fin 4 is pressed by the heating element 5 and the corrugated fin 4 is deformed, the corrugated fin 4 and the heating element 5 are reliably contacted, and the heat transfer property between the two is ensured. Is further improved.

上記構成において、発熱体５の平面11が凹凸部を有するものを対象とする場合には、波形フィン４が圧接変形することにより、その凹部または凸部において波形フィン４と発熱体５とが確実に接触し、伝熱性を向上させる。   In the above configuration, when the flat surface 11 of the heating element 5 has a concavo-convex portion, the corrugated fin 4 is deformed by pressure so that the corrugated fin 4 and the heating element 5 are securely in the concave or convex portion. To improve heat transfer.

次に、図面に基づいて本発明の実施の形態につき説明する。
図１は本発明の冷却装置の要部縦断面説明図であり、図２はその冷却器自体の要部縦断面図である。また、図３は同冷却装置の全体を示す説明図である。
この冷却装置は、内部に冷却液１が流通する冷却器２と、冷却器２の表面にろう付け固定された波形フィン４と、その波形フィン４に接触する発熱体５と、発熱体５および冷却器２間の隙間を埋める伝熱シート６とを有する。 Next, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is an explanatory view of a main part of a cooling device according to the present invention, and FIG. 2 is a vertical cross-sectional view of a main part of the cooler itself. Moreover, FIG. 3 is explanatory drawing which shows the whole cooling device.
This cooling device includes a cooler 2 in which a coolant 1 flows, a corrugated fin 4 brazed and fixed to the surface of the cooler 2, a heating element 5 in contact with the corrugated fin 4, a heating element 5 and And a heat transfer sheet 6 that fills the gaps between the coolers 2.

冷却器２は、偏平に形成され内部にインナーフィン2cを有すると共に、その両端に入口パイプ９，出口パイプ10が突設され、それを介して内部に冷却液１が流通する。即ち、冷却器２は、図１及び図２に示す如く、少なくとも一方が皿状に形成された第１プレート2aと第２プレート2bからなり、内部にインナーフィン2cが介装される。そして、この例では第１プレート2aの外表面に波形フィン４の高さ方向一端側が一体にろう付け固定され、その接触部にろうフィレット７が形成される。   The cooler 2 is formed flat and has inner fins 2c inside, and an inlet pipe 9 and an outlet pipe 10 are projected from both ends of the cooler 2, and the coolant 1 circulates therethrough. That is, as shown in FIGS. 1 and 2, the cooler 2 includes a first plate 2a and a second plate 2b, at least one of which is formed in a dish shape, and an inner fin 2c is interposed therein. In this example, one end in the height direction of the corrugated fin 4 is integrally brazed and fixed to the outer surface of the first plate 2a, and a braze fillet 7 is formed at the contact portion.

波形フィン４の高さ（振幅）は、発熱体５の平面11の凹凸部の状態に応じて設計される。一例として、その高さを１．５〜４ｍｍ程とすることができる。波形フィン４は、アルミニューム等の金属製帯状材を曲折したものであり、一例として０．０１〜０．０５ｍｍ程度の板厚のものを用いることができる。また、波形フィン４のフィンピッチは、１〜３ｍｍ程とすることができる。   The height (amplitude) of the corrugated fins 4 is designed according to the state of the concavo-convex portion of the flat surface 11 of the heating element 5. As an example, the height can be about 1.5 to 4 mm. The corrugated fin 4 is formed by bending a metal strip such as aluminum, and a plate having a thickness of about 0.01 to 0.05 mm can be used as an example. Further, the fin pitch of the corrugated fins 4 can be about 1 to 3 mm.

このような波形フィン４に伝熱シート６を介して、発熱体５の平面11を接触する。そして、発熱体５と冷却器２との間を図３の如く締結具８を用いて押圧締結する。すると波形フィン４は図１の如く変形し、その高さ方向の他端面が発熱体５の平面11に圧接し、冷却器２の外面３と発熱体５の平面11とは波形フィン４を介して熱的に接続される。それと共に、発熱体５の平面11と冷却器２の外面３との間には、伝熱シート６が隙間なく充填される。そして冷却器２内に冷却液１を流通させ、発熱体５の発熱を波形フィン４及び伝熱シート６を介し冷却液１に伝熱する。   The flat surface 11 of the heating element 5 is brought into contact with the corrugated fin 4 through the heat transfer sheet 6. And between the heat generating body 5 and the cooler 2, it press-fastens using the fastener 8 like FIG. Then, the corrugated fin 4 is deformed as shown in FIG. 1, the other end surface in the height direction is pressed against the flat surface 11 of the heating element 5, and the outer surface 3 of the cooler 2 and the flat surface 11 of the heating element 5 are interposed via the corrugated fin 4. Connected thermally. At the same time, the heat transfer sheet 6 is filled with no gap between the flat surface 11 of the heating element 5 and the outer surface 3 of the cooler 2. Then, the coolant 1 is circulated in the cooler 2, and the heat generated by the heating element 5 is transferred to the coolant 1 through the corrugated fins 4 and the heat transfer sheet 6.

本発明の冷却装置の要部縦断面図説明図。The principal part longitudinal cross-sectional view explanatory drawing of the cooling device of this invention. 同冷却装置に用いられる冷却器２の要部縦断面図。The principal part longitudinal cross-sectional view of the cooler 2 used for the cooling device. 同冷却装置の全体を示す説明図。Explanatory drawing which shows the whole cooling device.

符号の説明Explanation of symbols

１ 冷却液
２ 冷却器
2a 第１プレート
2b 第２プレート
2c インナーフィン 1 Coolant 2 Cooler
2a First plate
2b Second plate
2c Inner fin

３ 外面
４ 波形フィン
５ 発熱体
６ 伝熱シート 3 outer surface 4 corrugated fin 5 heating element 6 heat transfer sheet

７ ろうフィレット
８ 締結具
９ 入口パイプ
10 出口パイプ
11 平面 7 Braze fillet 8 Fastener 9 Entrance pipe
10 Outlet pipe
11 plane

Claims (3)

内部に冷却液(1) が流通する冷却器(2) を有し、その平坦な外面(3) に波形フィン(4)の高さ方向の一端側がろう付けされ、その波形フィン(4)の高さ方向の他端側が発熱体(5)の平面に接して、発熱体(5)と冷却器(2)の外面との間を隙間なく伝熱シート(6)が介装されたことを特徴とする冷却装置。   It has a cooler (2) through which coolant (1) flows, and one end of the corrugated fin (4) in the height direction is brazed to the flat outer surface (3) of the corrugated fin (4). The other end in the height direction is in contact with the flat surface of the heating element (5), and the heat transfer sheet (6) is interposed between the heating element (5) and the outer surface of the cooler (2) without any gap. A cooling device characterized. 請求項１において、
前記波形フィン(4)の高さ方向の他端側が発熱体(5)の平面に圧接して、その波形フィン(4)が変形した状態で、発熱体(5)と冷却器(2)の外面との間を隙間なく伝熱シート(6)が介装されたことを特徴とする冷却装置。 In claim 1,
The other end side of the corrugated fin (4) in the height direction is pressed against the flat surface of the heating element (5), and the corrugated fin (4) is deformed, and the heating element (5) and the cooler (2) A cooling device characterized in that a heat transfer sheet (6) is interposed between the outer surface without any gap. 請求項２において、
前記発熱体(5)は、前記平面に凹凸部が存在するものを対象とする冷却装置。 In claim 2,
The heating element (5) is a cooling device intended for an object having uneven portions on the plane.
JP2008195944A 2008-07-30 2008-07-30 Cooling device Pending JP2010034364A (en)

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JP2008195944A JP2010034364A (en) 2008-07-30 2008-07-30 Cooling device

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015217162A (en) * 2014-05-19 2015-12-07 オリンパス株式会社 Imaging module and endoscope
JP2016048147A (en) * 2014-08-28 2016-04-07 株式会社ケーヒン・サーマル・テクノロジー Evaporator with cold storage function

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015217162A (en) * 2014-05-19 2015-12-07 オリンパス株式会社 Imaging module and endoscope
JP2016048147A (en) * 2014-08-28 2016-04-07 株式会社ケーヒン・サーマル・テクノロジー Evaporator with cold storage function

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