TWM628217U - Rapid heat dissipation device - Google Patents

Abstract

This creation relates to a rapid heat dissipation device for a heat source. The rapid heat dissipation device includes a heat conduction plate, a heat dissipation fin group, one or more heat pipes and a siphon heat dissipation structure. The heat conduction plate is thermally attached to the heat source, and the heat dissipation fins The sheet group is arranged on one side of the heat-conducting plate, and one end of the heat pipe is fixed to the heat-conducting plate and the other end is fixed to the heat-dissipating fin set; Set of cooling fins. In this way, the siphon type heat dissipation structure and the heat flow field of the heat pipe overlap up and down and have the same direction, so that the rapid heat dissipation device has the advantages of uniform heat dissipation and cooling.

Description

fast cooling device

This creation is about a heat sink, and especially a fast heat sink.

The traditional heat dissipation device mainly uses a heat conduction plate attached to the heat source, and then a heat sink such as a plurality of fins arranged on the heat conduction plate is arranged, and the heat is transferred to the fins or the heat sink through the heat conduction plate. , so as to provide the heat source to dissipate heat.

However, as the demand for heat dissipation continues to increase, under the existing structure of the heat dissipation device, in addition to providing heat dissipation by adding other external forces such as fans or using water cooling, various parts of the heat dissipation device also provide refrigerant or work through heat pipes or vapor chambers. Substances such as fluids to improve its heat dissipation or cooling effect.

However, the above structure still has the following problems. During the heat transfer process, it is inevitable that the heat will be concentrated in the heat source or the heat will be accumulated in the part of the heat dissipation device, resulting in uneven heating and heat dissipation of the heat dissipation device, so that the heat dissipation or cooling effect of the heat dissipation device cannot be fully exerted.

In view of this, the creator of the present invention has devoted himself to the research and application of the theory, and tried his best to solve the above-mentioned problems, which is the goal of the creator's improvement.

The present invention provides a rapid heat dissipation device, which utilizes the siphon heat dissipation structure and the heat flow field of the heat pipe to overlap up and down and in the same direction, so as to achieve the advantages of uniform heat dissipation and cooling of the rapid heat dissipation device.

In this creative embodiment, the present creative system provides a rapid heat dissipation device for a heat source, the rapid heat dissipation device includes: a heat conduction plate, thermally attached to the heat source; a heat dissipation fin set, disposed on the heat conduction plate one side of the heat pipe; at least one heat pipe, one end is fixed to the heat-conducting plate and the other end is fixed to the heat-dissipating fin set; and a siphon type heat-dissipating structure is stacked above the at least one heat pipe and one end is fixed to the heat-conducting plate and the other end is fixedly connected to the heat dissipation fin group.

Based on the above, the siphon type heat dissipation structure is superimposed on the heat pipe, and one end of the heat pipe and the siphon type heat dissipation structure is fixed to the heat conduction plate and the other end is fixed to the heat dissipation fin set, so that the siphon type heat dissipation structure and the heat pipe are on the heat flow field. , and the bottom overlap and the direction is the same, so as to avoid the heat concentration in the heat source or the heat accumulation in the part of the heat dissipation device during the heat transfer process, so as to achieve the advantages of uniform heat dissipation and cooling of the rapid heat dissipation device.

10: Fast cooling device

1: Thermal plate

11: Inline groove

2: Cooling fin group

21: Substrate

211: top surface

212: Underside

213: L-shaped insert groove

22: The first fin

3: Heat pipe

31: L-shaped bending section

4: Siphon heat dissipation structure

41: Evaporator

42: Condenser

421: Extension tube

422: cooling plate

423: Second Fin

43: Delivery pipe

5: C-type buckle

6: Corner

61: Groove

s: spacing

100: heat source

Figure 1 is an exploded perspective view of the rapid heat dissipation device of the present invention.

FIG. 2 is another perspective exploded view of the rapid heat dissipation device of the present invention.

Figure 3 is another three-dimensional exploded view of the rapid heat dissipation device of the present invention.

FIG. 4 is another three-dimensional exploded view of the rapid heat dissipation device of the present invention.

Figure 5 is a three-dimensional combined view of the rapid heat dissipation device of the present invention.

FIG. 6 is another three-dimensional combined view of the rapid heat dissipation device of the present invention.

Figure 7 is a cross-sectional view of the composition of the rapid heat dissipation device of the present invention.

The detailed description and technical content of this creation will be described with the drawings as follows, but the attached drawings are only for illustrative purposes and are not intended to limit this creation.

Please refer to FIG. 1 to FIG. 7 , the present invention provides a rapid heat dissipation device for a heat source 100 . The rapid heat dissipation device 10 mainly includes a heat conduction plate 1 , a heat dissipation fin set 2 , one or a plurality of heat pipes 3 and A siphon heat dissipation structure 4 .

As shown in FIG. 1 , FIG. 3 to FIG. 7 , the thermally conductive plate 1 is made of thermally conductive material, the thermally conductive plate 1 is thermally attached to the heat source 100 , and the thermally conductive plate 1 is provided with an inline groove 11 .

In addition, the heat-conducting plate 1 of this embodiment is thermally attached to the top of the heat source 100 , and the in-line groove 11 is formed from the bottom of the heat-conducting plate 1 , but it is not limited to this, and the heat source 100 can also be embedded in the heat-conducting plate. Inside 1, the inline groove 11 can also be opened from the top of the heat-conducting plate 1 or penetrate through the heat-conducting plate 1.

As shown in FIG. 1 , FIG. 3 to FIG. 7 , the heat dissipation fin group 2 is arranged on one side of the heat conduction plate 1 , and the heat dissipation fin group 2 includes a base plate 21 and is connected to the base plate 21 by extrusion, shovel teeth or welding. The plurality of first fins 22, the substrate 21 and the first fins 22 are made of thermally conductive metal materials such as aluminum or copper.

Furthermore, the substrate 21 has a top surface 211 and a bottom surface 212 . The top surface 211 of the substrate 21 in this embodiment is provided with a plurality of L-shaped insert grooves 213 extending from the middle to both sides, and the plurality of first fins 22 are connected to the substrate. The bottom surface 212 of 21, but not limited thereto.

As shown in FIG. 1 , FIG. 3 to FIG. 7 , one end of a heat pipe 3 is fixedly connected to the heat conducting plate 1 and the other end is fixedly connected to the heat dissipation fin set 2 . The number of the heat pipes 3 in this embodiment is plural, and one end of the plural heat pipes 3 is juxtaposed with each other and is embedded in the inline groove 11 , and the other end is extended with a plurality of L-shaped bending sections embedded in each L-shaped embedding groove 213 . 31 , so that heat is transferred from the middle of the base plate 21 to the two sides of the base plate 21 through the plurality of L-shaped bending sections 31 .

As shown in FIG. 2 to FIG. 7 , the siphon heat dissipation structure 4 is stacked above the heat pipe 3 , and one end is fixed to the heat conduction plate 1 and the other end is fixed to the heat dissipation fin set 2 .

The detailed description is as follows. The siphon heat dissipation structure 4 includes an evaporator 41, a condenser 42, a conveying pipe 43 and a working fluid. The evaporator 41 is stacked and fixed above the heat conducting plate 1, and the condenser 42 is stacked. And fixed on the top of the heat dissipation fin set 2 , the conveying pipe 43 is stacked above the heat pipe 3 and communicated with the evaporator 41 and the condenser 42 at both ends.

The evaporator 41 in this embodiment is a hollow shell made of thermally conductive material, the conveying pipe 43 is a hollow tubular body made of thermally conductive material, and the working fluid is filled in the evaporator 41 , the condenser 42 and the conveying pipe 43, and the evaporator 41 can be fixed on the heat conduction plate 1 by locking or welding.

In addition, the condenser 42 includes an extension pipe 421 extending from one end of the conveying pipe 43 away from the evaporator 41, a heat dissipation plate 422 fixed above the extension pipe 421, and a plurality of second fins 423 connected to the heat dissipation plate 422. The two fins 423 are sandwiched between the heat dissipation plate 422 and the heat dissipation fin group 2 , and are arranged on both sides of the extension pipe 421 , and there is a distance s between the conveying pipe 43 and the heat pipe 3 .

Furthermore, the plurality of second fins 423 in this embodiment are connected to the heat dissipation plate 422 by extrusion, shovel teeth or welding, and are sandwiched between the heat dissipation plate 422 and the top surface 211 of the base plate 21. The extension pipes 421 are connected to the heat dissipation plate 421. The plates 422 are combined with each other by welding, but not limited thereto.

As shown in FIG. 3 to FIG. 6 , the rapid heat dissipation device 10 of the present invention further includes a plurality of C-shaped buckles 5 , which are sleeved and buckled on the outside of the substrate 21 and the heat dissipation plate 422 .

In addition, the base plate 21 and the heat dissipation plate 422 of this embodiment have a plurality of corners 6 and a plurality of grooves 61 recessed from the plurality of corners 6, and the two ends of each C-shaped buckle 5 are embedded in the two upper and lower opposite recesses. The grooves 61 are formed, so that the base plate 21 and the heat dissipation plate 422 are stably stacked up and down together.

As shown in FIG. 3 to FIG. 7 , in the use state of the rapid heat dissipation device 10 of the present invention, the siphon type heat dissipation structure 4 is stacked above the heat pipe 3 , and one end of the heat pipe 3 and the siphon type heat dissipation structure 4 are both fixed to the heat conduction plate. 1 and the other end are fixedly connected to the heat dissipation fin set 2 . In this way, the heat flow fields of the siphon type heat dissipation structure 4 and the heat pipe 3 are overlapped up and down and in the same direction, thereby avoiding heat concentration in the heat source or heat accumulation in the part of the heat dissipation device during the heat transfer process, so as to achieve a fast heat dissipation device. 10 has the advantage of uniform heat dissipation and cooling.

In addition, the plurality of C-shaped buckles 5 are sleeved and buckled on the outside of the base plate 21 and the heat dissipation plate 422 , so that the heat dissipation fin group 2 and the condenser 42 are stably stacked up and down, so as to improve the performance of the rapid heat dissipation device 10 . Structural strength.

To sum up, the rapid cooling device of this creation can indeed achieve the intended purpose of use, solve the deficiencies of conventional knowledge, and has industrial applicability, novelty and progress, and fully complies with the requirements for patent application, and the application is filed in accordance with the Patent Law , please check and grant the patent in this case to protect the rights of the creator.

10: Fast cooling device

1: Thermal plate

11: Inline groove

2: Cooling fin group

21: Substrate

22: The first fin

3: Heat pipe

4: Siphon heat dissipation structure

41: Evaporator

42: Condenser

421: Extension tube

422: cooling plate

423: Second Fin

43: Delivery pipe

5: C-type buckle

61: Groove

Claims (9)

A rapid heat dissipation device is used for a heat source, the rapid heat dissipation device includes: a heat conduction plate, which is thermally attached to the heat source; a heat dissipation fin group is arranged on one side of the heat conduction plate; at least one heat pipe, one end of which is fixedly connected The heat-conducting plate and the other end are fixed to the heat-dissipating fin set; and a siphon heat-dissipating structure is stacked above the at least one heat pipe, one end is fixed to the heat-conducting plate and the other end is fixed to the heat-dissipating fin set . The rapid heat dissipation device according to claim 1, wherein the siphon heat dissipation structure comprises an evaporator, a condenser, a conveying pipe and a working fluid, the evaporator is stacked and fixed above the heat conducting plate, and the condenser The evaporator is stacked and fixed above the heat dissipation fin set, the conveying pipe is stacked above the at least one heat pipe, and both ends are connected to the evaporator and the condenser, and the working fluid is filled in the evaporator and the condenser. with the inside of the duct. The rapid heat dissipation device as claimed in claim 2, wherein the condenser comprises an extension pipe extending from an end of the conveying pipe away from the evaporator, a heat dissipation plate fixed above the extension pipe, and a plurality of heat dissipation plates connected to the heat dissipation plate Second fins, the plurality of second fins are sandwiched between the heat dissipation plate and the heat dissipation fin group and arranged on both sides of the extension pipe. The rapid heat dissipation device according to claim 3, further comprising a plurality of C-shaped buckles, the heat dissipation fin set includes a base plate and a plurality of first fins connected to the base plate, the plurality of C-shaped buckles are sleeved and buckled on the base plate. the base plate and the outside of the heat dissipation plate. The rapid heat dissipation device according to claim 4, wherein the base plate and the heat dissipation plate have a plurality of corners and a plurality of grooves are recessed from the plurality of corners, and both ends of the C-shaped buckles are embedded in the upper and lower Opposite two of the grooves. The rapid heat dissipation device as claimed in claim 4, wherein the substrate has a top surface and a bottom surface, the plurality of first fins are connected to the bottom surface, and the plurality of second fins are connected to the heat dissipation plate and sandwiched between the heat dissipation plate between the board and the top surface. The rapid heat dissipation device according to claim 6, wherein the number of heat pipes is plural, the heat conducting plate is provided with an in-line groove, the base plate is provided with a plurality of L-shaped grooves opened from the middle to both sides, the plurality of heat pipes One end is juxtaposed with each other and is embedded in the inline groove, and the other end is extended with a plurality of L-shaped bending sections embedded in each of the L-shaped grooves. The rapid heat dissipation device as claimed in claim 7, wherein the plurality of L-shaped inserting grooves are opened from the top surface of the substrate, and the straight-line inserting grooves are opened from the bottom of the heat-conducting plate. The rapid heat dissipation device according to claim 4, wherein there is a distance between the conveying pipe and the at least one heat pipe.

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